TWI451551B - 於多元件封裝中的互連體 - Google Patents

於多元件封裝中的互連體 Download PDF

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Publication number
TWI451551B
TWI451551B TW097126735A TW97126735A TWI451551B TW I451551 B TWI451551 B TW I451551B TW 097126735 A TW097126735 A TW 097126735A TW 97126735 A TW97126735 A TW 97126735A TW I451551 B TWI451551 B TW I451551B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
connection block
layer
forming
polymer layer
Prior art date
Application number
TW097126735A
Other languages
English (en)
Chinese (zh)
Other versions
TW200913206A (en
Inventor
唐金邦
達勒Ｒ. 腓爾
威廉Ｈ. 利多
Original Assignee
飛思卡爾半導體公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 飛思卡爾半導體公司 filed Critical 飛思卡爾半導體公司
Publication of TW200913206A publication Critical patent/TW200913206A/zh
Application granted granted Critical
Publication of TWI451551B publication Critical patent/TWI451551B/zh

Links

Classifications

    • H10W70/614—
    • H10P72/74—
    • H10W44/20—
    • H10W70/09—
    • H10W70/60—
    • H10W70/611—
    • H10W70/635—
    • H10W72/0198—
    • H10W74/114—
    • H10W90/00—
    • H10W90/401—
    • H10P72/743—
    • H10W44/212—
    • H10W44/248—
    • H10W44/501—
    • H10W74/019—
    • H10W74/129—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Details Of Aerials (AREA)
TW097126735A 2007-08-29 2008-07-15 於多元件封裝中的互連體 TWI451551B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/846,874 US7838420B2 (en) 2007-08-29 2007-08-29 Method for forming a packaged semiconductor device

Publications (2)

Publication Number Publication Date
TW200913206A TW200913206A (en) 2009-03-16
TWI451551B true TWI451551B (zh) 2014-09-01

Family

ID=40406108

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097126735A TWI451551B (zh) 2007-08-29 2008-07-15 於多元件封裝中的互連體

Country Status (7)

Country Link
US (1) US7838420B2 (enExample)
EP (1) EP2195840A4 (enExample)
JP (1) JP5397962B2 (enExample)
KR (1) KR20100065305A (enExample)
CN (1) CN101790788A (enExample)
TW (1) TWI451551B (enExample)
WO (1) WO2009032398A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI652775B (zh) 2016-01-11 2019-03-01 矽品精密工業股份有限公司 電子封裝件

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US8407890B2 (en) 2010-01-25 2013-04-02 Freescale Semiconductor Inc. Method of manufacting an electronic device module with integrated antenna structure
US9142502B2 (en) 2011-08-31 2015-09-22 Zhiwei Gong Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits
US8916421B2 (en) 2011-08-31 2014-12-23 Freescale Semiconductor, Inc. Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits
US8597983B2 (en) 2011-11-18 2013-12-03 Freescale Semiconductor, Inc. Semiconductor device packaging having substrate with pre-encapsulation through via formation
JP5834907B2 (ja) * 2011-12-28 2015-12-24 富士通株式会社 半導体装置、半導体装置の製造方法及び電子装置
US8810024B2 (en) * 2012-03-23 2014-08-19 Stats Chippac Ltd. Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units
US9837303B2 (en) 2012-03-23 2017-12-05 STATS ChipPAC Pte. Ltd. Semiconductor method and device of forming a fan-out device with PWB vertical interconnect units
US9842798B2 (en) 2012-03-23 2017-12-12 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming a PoP device with embedded vertical interconnect units
US10049964B2 (en) 2012-03-23 2018-08-14 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
CN103311141B (zh) * 2013-07-05 2016-01-20 北京理工大学 一种同轴垂直互连导电体的制作方法
US8822268B1 (en) 2013-07-17 2014-09-02 Freescale Semiconductor, Inc. Redistributed chip packages containing multiple components and methods for the fabrication thereof
US9362234B2 (en) 2014-01-07 2016-06-07 Freescale Semiconductor, Inc. Shielded device packages having antennas and related fabrication methods
US10354958B2 (en) 2014-10-01 2019-07-16 Nxp Usa, Inc. Through package circuit in fan-out wafer level package
US9666930B2 (en) 2014-10-23 2017-05-30 Nxp Usa, Inc. Interface between a semiconductor die and a waveguide, where the interface is covered by a molding compound
US10236260B2 (en) 2016-06-30 2019-03-19 Nxp Usa, Inc. Shielded package with integrated antenna
WO2019039335A1 (ja) * 2017-08-21 2019-02-28 株式会社村田製作所 電子部品の製造方法及び電子部品
US11557565B2 (en) 2020-10-06 2023-01-17 Nxp Usa, Inc. Semiconductor device assembly and method therefor
US11502054B2 (en) 2020-11-11 2022-11-15 Nxp Usa, Inc. Semiconductor device assembly and method therefor
CN114243287B (zh) * 2021-12-10 2025-08-29 上海微波技术研究所（中国电子科技集团公司第五十研究所） 毫米波相控阵天线阵列集成转换接头
US20240088068A1 (en) * 2022-09-08 2024-03-14 Nxp Usa, Inc. Semiconductor device with through package via and method therefor
US20250218977A1 (en) * 2023-12-29 2025-07-03 International Business Machines Corporation Coaxial through insulator via between chiplets

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US20020155692A1 (en) * 2000-06-16 2002-10-24 Chartered Semiconductor Manufacturing Ltd. Three dimensional TC package module
US6593644B2 (en) * 2001-04-19 2003-07-15 International Business Machines Corporation System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face
US6753600B1 (en) * 2003-01-28 2004-06-22 Thin Film Module, Inc. Structure of a substrate for a high density semiconductor package
US20040159932A1 (en) * 2003-02-18 2004-08-19 Hiroto Watanabe Semiconductor device
US20050161789A1 (en) * 2004-01-23 2005-07-28 Steven Towle Package substrate pattern to accommodate optical waveguide
US20050167797A1 (en) * 2004-01-29 2005-08-04 Advanpack Solutions Pte Ltd Structure package
US20060087004A1 (en) * 2004-10-22 2006-04-27 Nec Electronics Corporation Semiconductor device including metal-insulator-metal capacitor arrangement
US20060226415A1 (en) * 2004-11-22 2006-10-12 Masaaki Nishijima Semiconductor integrated circuit device and vehicle-mounted radar system using the same
US7190080B1 (en) * 2000-10-13 2007-03-13 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal pillar

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JP2003188340A (ja) * 2001-12-19 2003-07-04 Matsushita Electric Ind Co Ltd 部品内蔵モジュールとその製造方法
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US6921975B2 (en) * 2003-04-18 2005-07-26 Freescale Semiconductor, Inc. Circuit device with at least partial packaging, exposed active surface and a voltage reference plane
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Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6081989A (en) * 1998-04-30 2000-07-04 Lockheed Martin Corporation Fabrication of circuit modules with a transmission line
EP1111674A2 (en) * 1999-12-20 2001-06-27 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module, radio device having the same, and method for producing the same
US6931725B2 (en) * 1999-12-20 2005-08-23 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module, radio device having the same, and method for producing the same
US20020155692A1 (en) * 2000-06-16 2002-10-24 Chartered Semiconductor Manufacturing Ltd. Three dimensional TC package module
US7190080B1 (en) * 2000-10-13 2007-03-13 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal pillar
US6593644B2 (en) * 2001-04-19 2003-07-15 International Business Machines Corporation System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face
US6753600B1 (en) * 2003-01-28 2004-06-22 Thin Film Module, Inc. Structure of a substrate for a high density semiconductor package
US20040159932A1 (en) * 2003-02-18 2004-08-19 Hiroto Watanabe Semiconductor device
US20050161789A1 (en) * 2004-01-23 2005-07-28 Steven Towle Package substrate pattern to accommodate optical waveguide
US20050167797A1 (en) * 2004-01-29 2005-08-04 Advanpack Solutions Pte Ltd Structure package
US20060087004A1 (en) * 2004-10-22 2006-04-27 Nec Electronics Corporation Semiconductor device including metal-insulator-metal capacitor arrangement
US20060226415A1 (en) * 2004-11-22 2006-10-12 Masaaki Nishijima Semiconductor integrated circuit device and vehicle-mounted radar system using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI652775B (zh) 2016-01-11 2019-03-01 矽品精密工業股份有限公司 電子封裝件

Also Published As

Publication number Publication date
WO2009032398A1 (en) 2009-03-12
EP2195840A4 (en) 2011-01-19
US7838420B2 (en) 2010-11-23
CN101790788A (zh) 2010-07-28
JP5397962B2 (ja) 2014-01-22
EP2195840A1 (en) 2010-06-16
US20090057849A1 (en) 2009-03-05
KR20100065305A (ko) 2010-06-16
JP2010538463A (ja) 2010-12-09
TW200913206A (en) 2009-03-16

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