CN101790788A - 多元件封装中的互连 - Google Patents

多元件封装中的互连 Download PDF

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Publication number
CN101790788A
CN101790788A CN200880104602.4A CN200880104602A CN101790788A CN 101790788 A CN101790788 A CN 101790788A CN 200880104602 A CN200880104602 A CN 200880104602A CN 101790788 A CN101790788 A CN 101790788A
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CN
China
Prior art keywords
connector block
semiconductor device
layer
polymer layer
forming
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Pending
Application number
CN200880104602.4A
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English (en)
Chinese (zh)
Inventor
唐金榜
D·R·福莱亚
W·H·莱特尔
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NXP USA Inc
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Freescale Semiconductor Inc
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Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of CN101790788A publication Critical patent/CN101790788A/zh
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Details Of Aerials (AREA)
CN200880104602.4A 2007-08-29 2008-07-09 多元件封装中的互连 Pending CN101790788A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/846,874 2007-08-29
US11/846,874 US7838420B2 (en) 2007-08-29 2007-08-29 Method for forming a packaged semiconductor device
PCT/US2008/069516 WO2009032398A1 (en) 2007-08-29 2008-07-09 Interconnect in a multi-element package

Publications (1)

Publication Number Publication Date
CN101790788A true CN101790788A (zh) 2010-07-28

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CN200880104602.4A Pending CN101790788A (zh) 2007-08-29 2008-07-09 多元件封装中的互连

Country Status (7)

Country Link
US (1) US7838420B2 (enExample)
EP (1) EP2195840A4 (enExample)
JP (1) JP5397962B2 (enExample)
KR (1) KR20100065305A (enExample)
CN (1) CN101790788A (enExample)
TW (1) TWI451551B (enExample)
WO (1) WO2009032398A1 (enExample)

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US8407890B2 (en) * 2010-01-25 2013-04-02 Freescale Semiconductor Inc. Method of manufacting an electronic device module with integrated antenna structure
US8916421B2 (en) 2011-08-31 2014-12-23 Freescale Semiconductor, Inc. Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits
US9142502B2 (en) 2011-08-31 2015-09-22 Zhiwei Gong Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits
US8597983B2 (en) 2011-11-18 2013-12-03 Freescale Semiconductor, Inc. Semiconductor device packaging having substrate with pre-encapsulation through via formation
JP5834907B2 (ja) * 2011-12-28 2015-12-24 富士通株式会社 半導体装置、半導体装置の製造方法及び電子装置
US8810024B2 (en) * 2012-03-23 2014-08-19 Stats Chippac Ltd. Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units
US9842798B2 (en) 2012-03-23 2017-12-12 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming a PoP device with embedded vertical interconnect units
US9837303B2 (en) 2012-03-23 2017-12-05 STATS ChipPAC Pte. Ltd. Semiconductor method and device of forming a fan-out device with PWB vertical interconnect units
US10049964B2 (en) 2012-03-23 2018-08-14 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
CN103311141B (zh) * 2013-07-05 2016-01-20 北京理工大学 一种同轴垂直互连导电体的制作方法
US8822268B1 (en) 2013-07-17 2014-09-02 Freescale Semiconductor, Inc. Redistributed chip packages containing multiple components and methods for the fabrication thereof
US9362234B2 (en) 2014-01-07 2016-06-07 Freescale Semiconductor, Inc. Shielded device packages having antennas and related fabrication methods
US10354958B2 (en) 2014-10-01 2019-07-16 Nxp Usa, Inc. Through package circuit in fan-out wafer level package
US9666930B2 (en) 2014-10-23 2017-05-30 Nxp Usa, Inc. Interface between a semiconductor die and a waveguide, where the interface is covered by a molding compound
TWI652775B (zh) 2016-01-11 2019-03-01 矽品精密工業股份有限公司 電子封裝件
US10236260B2 (en) 2016-06-30 2019-03-19 Nxp Usa, Inc. Shielded package with integrated antenna
CN111034376B (zh) 2017-08-21 2023-02-21 株式会社村田制作所 电子部件的制造方法以及电子部件
US11557565B2 (en) 2020-10-06 2023-01-17 Nxp Usa, Inc. Semiconductor device assembly and method therefor
US11502054B2 (en) 2020-11-11 2022-11-15 Nxp Usa, Inc. Semiconductor device assembly and method therefor
CN114243287B (zh) * 2021-12-10 2025-08-29 上海微波技术研究所（中国电子科技集团公司第五十研究所） 毫米波相控阵天线阵列集成转换接头
US20240088068A1 (en) * 2022-09-08 2024-03-14 Nxp Usa, Inc. Semiconductor device with through package via and method therefor
US20250218977A1 (en) * 2023-12-29 2025-07-03 International Business Machines Corporation Coaxial through insulator via between chiplets

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US7838420B2 (en) 2010-11-23
EP2195840A4 (en) 2011-01-19
TWI451551B (zh) 2014-09-01
WO2009032398A1 (en) 2009-03-12
EP2195840A1 (en) 2010-06-16
TW200913206A (en) 2009-03-16
JP5397962B2 (ja) 2014-01-22
JP2010538463A (ja) 2010-12-09

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