TWI445049B - 塗布顯影裝置、塗布顯影方法及記憶媒體 - Google Patents

塗布顯影裝置、塗布顯影方法及記憶媒體 Download PDF

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Publication number
TWI445049B
TWI445049B TW98104687A TW98104687A TWI445049B TW I445049 B TWI445049 B TW I445049B TW 98104687 A TW98104687 A TW 98104687A TW 98104687 A TW98104687 A TW 98104687A TW I445049 B TWI445049 B TW I445049B
Authority
TW
Taiwan
Prior art keywords
substrate
energy
coating
heating plate
wafer
Prior art date
Application number
TW98104687A
Other languages
English (en)
Chinese (zh)
Other versions
TW200952038A (en
Inventor
Takanori Nishi
Takahiro Kitano
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200952038A publication Critical patent/TW200952038A/zh
Application granted granted Critical
Publication of TWI445049B publication Critical patent/TWI445049B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW98104687A 2008-02-15 2009-02-13 塗布顯影裝置、塗布顯影方法及記憶媒體 TWI445049B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008035117A JP2009194242A (ja) 2008-02-15 2008-02-15 塗布、現像装置、塗布、現像方法及び記憶媒体

Publications (2)

Publication Number Publication Date
TW200952038A TW200952038A (en) 2009-12-16
TWI445049B true TWI445049B (zh) 2014-07-11

Family

ID=40956898

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98104687A TWI445049B (zh) 2008-02-15 2009-02-13 塗布顯影裝置、塗布顯影方法及記憶媒體

Country Status (3)

Country Link
JP (1) JP2009194242A (fr)
TW (1) TWI445049B (fr)
WO (1) WO2009101869A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5050018B2 (ja) 2009-08-24 2012-10-17 東京エレクトロン株式会社 塗布現像装置及び塗布現像方法
JP5348083B2 (ja) * 2010-07-16 2013-11-20 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
US8704104B2 (en) 2010-07-19 2014-04-22 Asml Netherlands B.V. Electrical connector, electrical connection system and lithographic apparatus
US9281192B2 (en) * 2014-03-13 2016-03-08 Taiwan Semiconductor Manufacturing Co., Ltd. CMP-friendly coatings for planar recessing or removing of variable-height layers
US9236446B2 (en) 2014-03-13 2016-01-12 Taiwan Semiconductor Manufacturing Co., Ltd. Barc-assisted process for planar recessing or removing of variable-height layers
JP2016086042A (ja) * 2014-10-23 2016-05-19 東京エレクトロン株式会社 基板処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム
US9829790B2 (en) * 2015-06-08 2017-11-28 Applied Materials, Inc. Immersion field guided exposure and post-exposure bake process
CN107479339B (zh) * 2017-09-01 2019-11-05 京东方科技集团股份有限公司 显影装置及其显影方法
CN112742664A (zh) * 2019-10-30 2021-05-04 聚昌科技股份有限公司 快速涂布的涂布机结构及其涂布剂的温控及阵列涂布模块
US11815816B2 (en) 2021-02-15 2023-11-14 Applied Materials, Inc. Apparatus for post exposure bake of photoresist
KR20230144083A (ko) 2021-02-15 2023-10-13 어플라이드 머티어리얼스, 인코포레이티드 포토레지스트의 노광 후 베이크 장치
CN113534616B (zh) * 2021-07-12 2024-03-26 长鑫存储技术有限公司 光刻机及光刻机的控制方法和控制系统、生产设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2555675B2 (ja) * 1988-03-18 1996-11-20 三菱電機株式会社 パターン形成方法
JPH02118647A (ja) * 1988-10-28 1990-05-02 Matsushita Electric Ind Co Ltd パターン形成方法
JPH03142918A (ja) * 1989-10-30 1991-06-18 Matsushita Electron Corp レジストパターン形成方法
JPH07253676A (ja) * 1994-03-16 1995-10-03 Fujitsu Ltd レジストパターン形成方法
JPH09312257A (ja) * 1996-03-18 1997-12-02 Fujitsu Ltd 微細加工方法及び装置
JPH11162844A (ja) * 1997-09-25 1999-06-18 Toshiba Corp パターン形成方法
JP4256038B2 (ja) * 1999-09-21 2009-04-22 株式会社東芝 熱処理方法
JP4765750B2 (ja) * 2006-04-26 2011-09-07 東京エレクトロン株式会社 熱処理装置、熱処理方法、記憶媒体

Also Published As

Publication number Publication date
TW200952038A (en) 2009-12-16
WO2009101869A1 (fr) 2009-08-20
JP2009194242A (ja) 2009-08-27

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