TWI442192B - A color resist remover composition for tft-lcd preparation - Google Patents
A color resist remover composition for tft-lcd preparation Download PDFInfo
- Publication number
- TWI442192B TWI442192B TW097131776A TW97131776A TWI442192B TW I442192 B TWI442192 B TW I442192B TW 097131776 A TW097131776 A TW 097131776A TW 97131776 A TW97131776 A TW 97131776A TW I442192 B TWI442192 B TW I442192B
- Authority
- TW
- Taiwan
- Prior art keywords
- potassium
- hydroxide
- group
- glycol
- ether
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims description 62
- 229920002120 photoresistant polymer Polymers 0.000 claims description 45
- -1 alkyl ether ethers Chemical class 0.000 claims description 26
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 26
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 16
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 11
- 229910017053 inorganic salt Inorganic materials 0.000 claims description 11
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 9
- 239000002798 polar solvent Substances 0.000 claims description 9
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 8
- 239000000908 ammonium hydroxide Substances 0.000 claims description 8
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910001854 alkali hydroxide Inorganic materials 0.000 claims description 7
- 150000001412 amines Chemical class 0.000 claims description 7
- 150000001983 dialkylethers Chemical class 0.000 claims description 7
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 claims description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims description 6
- 125000005210 alkyl ammonium group Chemical group 0.000 claims description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 6
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 5
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 claims description 5
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 claims description 4
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 4
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 claims description 4
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 claims description 4
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 claims description 4
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims description 4
- SOYBEXQHNURCGE-UHFFFAOYSA-N 3-ethoxypropan-1-amine Chemical compound CCOCCCN SOYBEXQHNURCGE-UHFFFAOYSA-N 0.000 claims description 3
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 3
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 3
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 claims description 3
- KAKVFSYQVNHFBS-UHFFFAOYSA-N (5-hydroxycyclopenten-1-yl)-phenylmethanone Chemical compound OC1CCC=C1C(=O)C1=CC=CC=C1 KAKVFSYQVNHFBS-UHFFFAOYSA-N 0.000 claims description 2
- DIIIISSCIXVANO-UHFFFAOYSA-N 1,2-Dimethylhydrazine Chemical compound CNNC DIIIISSCIXVANO-UHFFFAOYSA-N 0.000 claims description 2
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical compound CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 claims description 2
- BOGFHOWTVGAYFK-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]propane Chemical compound CCCOCCOCCOCCC BOGFHOWTVGAYFK-UHFFFAOYSA-N 0.000 claims description 2
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 claims description 2
- CHHHXKFHOYLYRE-UHFFFAOYSA-M 2,4-Hexadienoic acid, potassium salt (1:1), (2E,4E)- Chemical compound [K+].CC=CC=CC([O-])=O CHHHXKFHOYLYRE-UHFFFAOYSA-M 0.000 claims description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 claims description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 2
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 claims description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 2
- IBZKBSXREAQDTO-UHFFFAOYSA-N 2-methoxy-n-(2-methoxyethyl)ethanamine Chemical compound COCCNCCOC IBZKBSXREAQDTO-UHFFFAOYSA-N 0.000 claims description 2
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 claims description 2
- FAXDZWQIWUSWJH-UHFFFAOYSA-N 3-methoxypropan-1-amine Chemical compound COCCCN FAXDZWQIWUSWJH-UHFFFAOYSA-N 0.000 claims description 2
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 claims description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 2
- ZZXDRXVIRVJQBT-UHFFFAOYSA-M Xylenesulfonate Chemical compound CC1=CC=CC(S([O-])(=O)=O)=C1C ZZXDRXVIRVJQBT-UHFFFAOYSA-M 0.000 claims description 2
- NDKBVBUGCNGSJJ-UHFFFAOYSA-M benzyltrimethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)CC1=CC=CC=C1 NDKBVBUGCNGSJJ-UHFFFAOYSA-M 0.000 claims description 2
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 claims description 2
- 229940052303 ethers for general anesthesia Drugs 0.000 claims description 2
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- 235000011056 potassium acetate Nutrition 0.000 claims description 2
- 229940057199 potassium aminobenzoate Drugs 0.000 claims description 2
- 235000010235 potassium benzoate Nutrition 0.000 claims description 2
- 239000004300 potassium benzoate Substances 0.000 claims description 2
- 229940103091 potassium benzoate Drugs 0.000 claims description 2
- GKKCIDNWFBPDBW-UHFFFAOYSA-M potassium cyanate Chemical compound [K]OC#N GKKCIDNWFBPDBW-UHFFFAOYSA-M 0.000 claims description 2
- 235000010333 potassium nitrate Nutrition 0.000 claims description 2
- 239000004323 potassium nitrate Substances 0.000 claims description 2
- 229940096992 potassium oleate Drugs 0.000 claims description 2
- KAQHZJVQFBJKCK-UHFFFAOYSA-L potassium pyrosulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OS([O-])(=O)=O KAQHZJVQFBJKCK-UHFFFAOYSA-L 0.000 claims description 2
- 235000010241 potassium sorbate Nutrition 0.000 claims description 2
- 239000004302 potassium sorbate Substances 0.000 claims description 2
- 229940069338 potassium sorbate Drugs 0.000 claims description 2
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 claims description 2
- 229910052939 potassium sulfate Inorganic materials 0.000 claims description 2
- 229940093914 potassium sulfate Drugs 0.000 claims description 2
- DPLVEEXVKBWGHE-UHFFFAOYSA-N potassium sulfide Chemical compound [S-2].[K+].[K+] DPLVEEXVKBWGHE-UHFFFAOYSA-N 0.000 claims description 2
- 235000011151 potassium sulphates Nutrition 0.000 claims description 2
- LPNYRYFBWFDTMA-UHFFFAOYSA-N potassium tert-butoxide Chemical compound [K+].CC(C)(C)[O-] LPNYRYFBWFDTMA-UHFFFAOYSA-N 0.000 claims description 2
- MLICVSDCCDDWMD-KVVVOXFISA-M potassium;(z)-octadec-9-enoate Chemical compound [K+].CCCCCCCC\C=C/CCCCCCCC([O-])=O MLICVSDCCDDWMD-KVVVOXFISA-M 0.000 claims description 2
- VLSHYHUKASKGPF-UHFFFAOYSA-M potassium;2-aminobenzoate Chemical compound [K+].NC1=CC=CC=C1C([O-])=O VLSHYHUKASKGPF-UHFFFAOYSA-M 0.000 claims description 2
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 claims description 2
- 229940048842 sodium xylenesulfonate Drugs 0.000 claims description 2
- QUCDWLYKDRVKMI-UHFFFAOYSA-M sodium;3,4-dimethylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1C QUCDWLYKDRVKMI-UHFFFAOYSA-M 0.000 claims description 2
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 claims description 2
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 claims description 2
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 claims description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 2
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 claims description 2
- 229940071104 xylenesulfonate Drugs 0.000 claims description 2
- IFZHGQSUNAKKSN-UHFFFAOYSA-N 1,1-diethylhydrazine Chemical compound CCN(N)CC IFZHGQSUNAKKSN-UHFFFAOYSA-N 0.000 claims 1
- GPWUZOFDXSYJRI-UHFFFAOYSA-N 1,2-dipropyl-9h-fluorene Chemical compound C1=CC=C2C3=CC=C(CCC)C(CCC)=C3CC2=C1 GPWUZOFDXSYJRI-UHFFFAOYSA-N 0.000 claims 1
- ASUDFOJKTJLAIK-UHFFFAOYSA-N 2-methoxyethanamine Chemical compound COCCN ASUDFOJKTJLAIK-UHFFFAOYSA-N 0.000 claims 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims 1
- HQFQTTNMBUPQAY-UHFFFAOYSA-N cyclobutylhydrazine Chemical compound NNC1CCC1 HQFQTTNMBUPQAY-UHFFFAOYSA-N 0.000 claims 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 claims 1
- LFETXMWECUPHJA-UHFFFAOYSA-N methanamine;hydrate Chemical compound O.NC LFETXMWECUPHJA-UHFFFAOYSA-N 0.000 claims 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 238000000034 method Methods 0.000 description 26
- 238000000576 coating method Methods 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 17
- 239000000758 substrate Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 12
- 238000001020 plasma etching Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 239000000049 pigment Substances 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 235000011114 ammonium hydroxide Nutrition 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- HQSLKNLISLWZQH-UHFFFAOYSA-N 1-(2-propoxyethoxy)propane Chemical compound CCCOCCOCCC HQSLKNLISLWZQH-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910019923 CrOx Inorganic materials 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910001413 alkali metal ion Inorganic materials 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 229910000423 chromium oxide Inorganic materials 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 239000012498 ultrapure water Substances 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- BQCCJWMQESHLIT-UHFFFAOYSA-N 1-propylsulfinylpropane Chemical compound CCCS(=O)CCC BQCCJWMQESHLIT-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910018503 SF6 Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 229920001688 coating polymer Polymers 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- CCAFPWNGIUBUSD-UHFFFAOYSA-N diethyl sulfoxide Chemical compound CCS(=O)CC CCAFPWNGIUBUSD-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229940093476 ethylene glycol Drugs 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- XMYQHJDBLRZMLW-UHFFFAOYSA-N methanolamine Chemical compound NCO XMYQHJDBLRZMLW-UHFFFAOYSA-N 0.000 description 1
- 229940087646 methanolamine Drugs 0.000 description 1
- QKCGXXHCELUCKW-UHFFFAOYSA-N n-[4-[4-(dinaphthalen-2-ylamino)phenyl]phenyl]-n-naphthalen-2-ylnaphthalen-2-amine Chemical compound C1=CC=CC2=CC(N(C=3C=CC(=CC=3)C=3C=CC(=CC=3)N(C=3C=C4C=CC=CC4=CC=3)C=3C=C4C=CC=CC4=CC=3)C3=CC4=CC=CC=C4C=C3)=CC=C21 QKCGXXHCELUCKW-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000004022 organic phosphonium compounds Chemical class 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000009419 refurbishment Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
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- C—CHEMISTRY; METALLURGY
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Description
本發明涉及一種用於薄膜電晶體液晶顯示器(TFT-LCD)的彩色光阻劑剝離溶液組成物,特別涉及對於濾色器工藝中發生的不良基板的彩色光阻劑和包含彩色光阻劑的覆蓋塗層具有優秀的去除效果,並且可以重新回收使用從黑膜(Black Mask)或玻璃基板去除掉的彩色光阻劑,且能夠回收使用濾色器基板的一種薄膜電晶體液晶顯示器用彩色光阻劑剝離溶液組成物。The present invention relates to a color photoresist stripping solution composition for a thin film transistor liquid crystal display (TFT-LCD), and more particularly to a color photoresist for a defective substrate which occurs in a color filter process and a color photoresist containing color resist The overcoat layer has excellent removal effect, and can re-use color photoresist removed from a black mask or a glass substrate, and can recover colored light for a thin film transistor liquid crystal display using a color filter substrate The resist strips the solution composition.
一般而言,濾色器的基板係由阻擋濾色器的紅綠藍圖案和各像素之間的漏光並用於提高對比度的黑色矩陣、作為保護膜使用的塗層以及向液晶單元施加電壓的共同電極組成。In general, the substrate of the color filter is a black matrix that blocks the red, green, and blue patterns of the color filter and light leakage between the pixels, and serves to improve contrast, a coating used as a protective film, and a common voltage applied to the liquid crystal cell. Electrode composition.
所述濾色器的製造工藝如下:首先,根據用途將作為黑色矩陣材料所使用的鉻/鉻氧化物(Cr/CrOx)或者有機材料塗敷到玻璃基板上,以此來形成圖案。在形成黑膜圖案之後,藉由光蝕刻技術形成用於顯示色彩的彩色光阻劑的圖案。將彩色光阻劑塗敷到玻璃基板上,然後進行曝光,並藉由光聚合反應來固化彩色光阻劑。當曝光結束之後,彩色光阻劑中沒有被曝光的部分藉由顯影製程來去除,然後進行焙燒過程。The manufacturing process of the color filter is as follows: First, a chromium/chromium oxide (Cr/CrOx) or an organic material used as a black matrix material is applied onto a glass substrate according to the use to form a pattern. After the black film pattern is formed, a pattern of a color photoresist for displaying colors is formed by photolithography. A color photoresist is applied onto the glass substrate, exposed, and the color photoresist is cured by photopolymerization. When the exposure is over, the portion of the color resist that is not exposed is removed by a developing process, and then the baking process is performed.
彩色光阻劑藉由顏料分散法、染色法、電沈積法等來製造,其中顏料分散法使用最廣泛。通常,如光蝕刻膠的 感光組成物,即光聚合引發劑、單體、黏合劑等上分散有顯示色彩的有機顏料。光聚合引發劑是在受光之後產生自由基(radical)的高敏感化合物,單體藉由自由基引發聚合反應之後,結合成高分子,成為不溶於顯影溶劑中的狀態。黏合劑在常溫條件下從顯影液中保護液體狀態的單體,並對顏料分散的穩定性以及紅綠藍圖案的耐熱性、耐光性、耐藥品性等的可靠性起決定作用。The color resist is produced by a pigment dispersion method, a dyeing method, an electrodeposition method, or the like, and the pigment dispersion method is most widely used. Usually, such as photoetching The photosensitive composition, that is, a photopolymerization initiator, a monomer, a binder, or the like, is dispersed with an organic pigment having a display color. The photopolymerization initiator is a highly sensitive compound which generates radicals after being subjected to light, and the monomer is polymerized by a radical, and then combined into a polymer to be in a state of being insoluble in a developing solvent. The binder protects the monomer in a liquid state from the developer under normal temperature conditions, and plays a role in determining the stability of the pigment dispersion and the reliability of heat resistance, light resistance, chemical resistance, and the like of the red, green, and blue patterns.
目前,濾色器工藝中產生的不良濾色器基板的彩色光阻劑被固化一次之後,就不能僅藉由去除錯誤圖案部分來進行整修。而且,能去除彩色光阻劑的溶劑幾乎不存在,因此大部分不良濾色器一般不經過修整等的重複作業就被廢棄。At present, after the color photoresist of the poor color filter substrate generated in the color filter process is cured once, it is not possible to perform refurbishment only by removing the erroneous pattern portion. Further, since the solvent capable of removing the color photoresist is hardly present, most of the defective color filters are generally discarded without being subjected to repeated operations such as trimming.
所述彩色光阻劑具有負型抗蝕劑的特性,通常負型抗蝕劑相對於正型抗蝕劑,其剝離難度大,因此負型抗蝕劑需要有較強的剝離性能。The color photoresist has the characteristics of a negative resist. Generally, the negative resist is difficult to peel off with respect to the positive resist, and therefore the negative resist needs to have strong peeling properties.
由於上述理由,現有技術中使用了利用無機剝離溶液或有機剝離溶液以及電漿的反應離子蝕刻(reactive ion etching,RIE)方法。但是,就所述有機剝離溶液而言,其相對於無機剝離溶液處理時間較長,並且對塗敷在濾色器上的塗敷材料進行剝離時非常困難。就無機剝離溶液而言,其相對於有機剝離溶液穩定性差,長時間使用時無機鹽會從溶液中析出來,因此在使用時需要格外小心。關於所述的有機剝離溶液,日本專利公開公報昭51-72503號中已有公開,而脫膜劑也已在歐洲專利公報第0119337號中 公開。For the above reasons, a reactive ion etching (RIE) method using an inorganic stripping solution or an organic stripping solution and a plasma is used in the prior art. However, in the case of the organic stripping solution, the treatment time with respect to the inorganic stripping solution is long, and it is very difficult to peel off the coating material applied to the color filter. In the case of the inorganic stripping solution, it is inferior to the organic stripping solution, and the inorganic salt is precipitated from the solution for a long time, so that care must be taken when using it. The organic peeling solution is disclosed in Japanese Laid-Open Patent Publication No. SHO-51-72503, and the release agent is also disclosed in European Patent Publication No. 0119337. public.
並且,為解決在有機剝離溶液中進行剝離時的困難,部分發明專利公開了藉由易溶於有機溶劑的無機鹽來提高剝離塗敷材料性能的方法,然而其剝離時間與無機剝離溶液相比較還有一定的差距。就這種有機剝離溶液而言,韓國發明專利公開第2005-0006980號中已有公開。Further, in order to solve the difficulty in performing the peeling in the organic stripping solution, some invention patents disclose a method of improving the properties of the peeling coating material by an inorganic salt which is easily soluble in an organic solvent, but the peeling time is compared with the inorganic stripping solution. There is still a certain gap. In the case of such an organic peeling solution, it is disclosed in Korean Patent Publication No. 2005-0006980.
另外,美國發明專利第5,756,239號中已經公開了一種作為使用電漿的反應離子刻蝕(reactive ion etching,RIE)的方法,藉由連續使用氧氣反應離子刻蝕(O2 -RIE)、六氟化硫反應離子刻蝕(SF6 -RIE)來去除一般濕式蝕刻方法無法去除的固化彩色光阻劑之方法。並且,美國發明專利第5,059,500號公開了如下方法:在將聚酯、聚醯胺、酚醛清漆樹脂作為吸收層,將聚矽烷、聚矽氧烷、有機矽化合物、矽石、氮化矽的混合物作為障壁層來使用的固化彩色光阻劑中,吸收層藉由使用氧氣的電漿來去除,而障壁層使用六氟化硫或者三氟化氮的反應離子刻蝕法來去除。然而,使用此類電漿的濾色器的蝕刻需要在高真空、高能量的條件下進行,因此這些條件是很難掌握的。另外,該方法還具有難以在大面積中使用和設備昂貴等的缺點。In addition, a method of reactive ion etching (RIE) using plasma has been disclosed in U.S. Patent No. 5,756,239, by continuous use of oxygen reactive ion etching (O 2 -RIE), hexafluoride. Sulfur-reactive ion etching (SF 6 -RIE) is a method of removing a cured color photoresist which cannot be removed by a general wet etching method. In addition, U.S. Patent No. 5,059,500 discloses a method in which a polyester, a polyamidamine, a novolac resin is used as an absorption layer, and a mixture of polydecane, polyoxane, an organic phosphonium compound, vermiculite, and tantalum nitride is used. In the cured color resist used as the barrier layer, the absorption layer is removed by using a plasma of oxygen, and the barrier layer is removed by reactive ion etching using sulfur hexafluoride or nitrogen trifluoride. However, the etching of a color filter using such a plasma needs to be performed under conditions of high vacuum and high energy, and thus these conditions are difficult to grasp. In addition, the method has the disadvantage that it is difficult to use in a large area and the equipment is expensive.
如上所述,現有去除彩色光阻劑的方法存在以下缺點。亦即,很難穩定地將大量的彩色光阻劑及塗敷材料去除、缺乏安全性、或者生產效率或產率下降。As described above, the existing method of removing a color photoresist has the following disadvantages. That is, it is difficult to stably remove a large amount of color photoresist and coating material, lack safety, or reduce production efficiency or productivity.
因此,極需開發一種藉由安全的方法能夠大量去除彩色光阻劑的方法。Therefore, it is highly desirable to develop a method for removing a large amount of color photoresist by a safe method.
為解決上述技術問題,本發明的目的在於提供一種藉由安全的方法能夠大量去除在薄膜電晶體液晶顯示器的濾色器製造工藝中所使用的彩色光阻劑及塗層的剝離溶液組成物。In order to solve the above technical problems, an object of the present invention is to provide a peeling solution composition capable of largely removing a color resist and a coating used in a color filter manufacturing process of a thin film transistor liquid crystal display by a safe method.
本發明的另一個目的在於提供一種能夠把剝離後廢棄的彩色光阻劑和濾色器基板重新使用的彩色光阻劑剝離溶液組成物。Another object of the present invention is to provide a color resist stripping solution composition capable of reusing a colored photoresist and a color filter substrate which are discarded after peeling.
為了達到所述目的,本發明提供一種彩色光阻劑剝離溶液組成物,其包含:(a)1至20重量百分比的選自無機鹼氫氧化物、氫氧化銨、具有C1 -C4 烷基的烷基氫氧化銨或具有C1 -C4 烷基的苯烷基氫氧化銨中的氫氧化物;(b)1至70重量百分比的從具有C1 -C4 烷基的烷撐二醇醚(alkylene glycol ether)或烷撐二醇中選擇的至少一種化合物;(c)0.5至10重量百分比的羥胺;(d)0.5至50重量百分比的烷氧基烷基胺;以及(e)餘量的水。In order to achieve the object, the present invention provides a color resist stripping solution composition comprising: (a) 1 to 20 weight percent selected from inorganic alkali hydroxides, ammonium hydroxide, having C 1 -C 4 alkane a hydroxide of a group of alkylammonium hydroxide or a phenylalkylammonium hydroxide having a C 1 -C 4 alkyl group; (b) from 1 to 70% by weight of an alkylene group having a C 1 -C 4 alkyl group At least one compound selected from the group consisting of an alkylene glycol ether or an alkylene glycol; (c) 0.5 to 10% by weight of hydroxylamine; (d) 0.5 to 50% by weight of an alkoxyalkylamine; and (e) The balance of water.
所述組成物可進一步包含選自1至30重量百分比的具有C1 -C4 烷基的二烷撐二醇二烴基醚(dialkyleneglycol dialkylether)或烷撐二醇二烴基醚(alkylene glycol dialkyl ether)、0.05至10重量百分比的無機鹽化合物或1至55重量百分比的極性溶劑中的至少一種成分。The composition may further comprise from 1 to 30% by weight of a dialkyleneglycol dialkylether having a C 1 -C 4 alkyl group or an alkylene glycol dialkyl ether And 0.05 to 10% by weight of the inorganic salt compound or at least one of 1 to 55% by weight of the polar solvent.
本發明的彩色光阻劑剝離溶液組成物具有可以在短時間內容易去除彩色光阻劑和塗層材料的優點,以及後續的 漂洗工序中不必使用如異丙醇、二甲基亞碸的有機溶劑,只要用水就可以清洗的優點。特別是,由於可以去除彩色光阻劑圖案,可以重新使用濾色器基板。The color photoresist stripping solution composition of the present invention has the advantages that the color resist and the coating material can be easily removed in a short time, and subsequent It is not necessary to use an organic solvent such as isopropyl alcohol or dimethyl hydrazine in the rinsing step, and it is possible to wash it with water. In particular, since the color photoresist pattern can be removed, the color filter substrate can be reused.
下面對本發明進行詳細描述。The invention is described in detail below.
為了比現有技術更有效地去除彩色光阻劑和塗層,並為了重新使用大部分被廢棄的濾色器基板,本發明進行了反覆研究,結果發現只要利用特定組合的剝離溶液組成物就可以容易去除彩色光阻劑及塗層,從而完成了本發明。In order to remove color photoresists and coatings more effectively than in the prior art, and in order to reuse most of the discarded color filter substrates, the present inventors conducted repeated studies and found that it is possible to utilize a specific combination of stripping solution compositions. The present invention has been completed by easily removing colored photoresist and coating.
本發明的剝離溶液組成物所使用的氫氧化物可以是選自無機鹼氫氧化物、氫氧化銨、具有C1 -C4 烷基的烷基氫氧化銨或具有C1 -C4 烷基的苯烷基氫氧化銨中的化合物。並且,濾色器工藝受殘留金屬的影響不大,因此還可以使用無機鹼氫氧化物。所述氫氧化物的含量最好是佔全部組成物的1至20重量百分比,若其含量小於1重量百分比,對於組成彩色光阻劑的高分子成分的滲透力下降,因此難以完全去除彩色光阻劑。而若超過20重量百分比,由於其他溶劑的成分比減少,反而會引起去除時間變長的不良影響。另外,由於烷基氫氧化銨和苯烷基氫氧化銨不夠穩定,因此最好是以溶於水的狀態使用。Hydroxide stripping solution composition used in the present invention may be selected from inorganic bases hydroxides, ammonium hydroxide, ammonium hydroxide having an alkyl C 1 -C 4 alkyl or C 1 -C 4 alkyl group having a compound of phenylalkylammonium hydroxide. Moreover, the color filter process is not greatly affected by the residual metal, and therefore an inorganic alkali hydroxide can also be used. The content of the hydroxide is preferably from 1 to 20% by weight based on the total composition, and if the content is less than 1% by weight, the penetration of the polymer component constituting the color resist is lowered, so that it is difficult to completely remove the colored light. Resistor. On the other hand, if it exceeds 20% by weight, the composition ratio of other solvents is reduced, which adversely affects the removal time. Further, since the alkylammonium hydroxide and the phenylalkylammonium hydroxide are not sufficiently stable, they are preferably used in a state of being dissolved in water.
優選地,所述無機鹼氫氧化物使用選自氫氧化锂(lithium hydroxide)、氫氧化鈉(sodium hydroxide)或氫氧化鉀(potassium hydroxide)中的一種或兩種以上的混合物。優 選地,所述具有C1 -C4 烷基的烷基氫氧化銨是選自四乙基氫氧化銨(tetraethyl ammonium hydroxide)、四甲基氫氧化銨(tetramethyl ammonium hydroxide)或四丁基氫氧化銨(tetrabutyl ammonium hydroxide)中的一種或兩種以上的混合物。並且,具有C1 -C4 烷基的苯烷基氫氧化銨最好是使用苄基三甲基氫氧化銨(benzyltrimethyl ammonium hydroxide)。Preferably, the inorganic alkali hydroxide is used in one or a mixture of two or more selected from the group consisting of lithium hydroxide, sodium hydroxide or potassium hydroxide. Preferably, the alkyl ammonium hydroxide having a C 1 -C 4 alkyl group is selected from the group consisting of tetraethyl ammonium hydroxide, tetramethyl ammonium hydroxide or tetrabutyl hydrogen. One or a mixture of two or more of tetrabutyl ammonium hydroxides. Further, as the phenylalkylammonium hydroxide having a C 1 -C 4 alkyl group, benzyltrimethyl ammonium hydroxide is preferably used.
選自所述具有C1 -C4 烷基的烷撐二醇醚(alkylene glycol ether)或烷撐二醇(alkylene glycol)中的至少一種化合物,由於其對彩色光阻劑的溶解性和降低表面張力的能力優秀,因此其能夠降低作用於玻璃面與從其翹起的彩色光阻劑之間的表面張力,使得彩色光阻劑能夠易於剝離,而且所述化合物還具有溶解所述被剝離的彩色光阻劑的黏合劑或聚合物等的功能。所述烷撐二醇醚(alkylene glycol ether)的使用量最好是佔全部組成物的1至70重量百分比,此時,若其含量小於1重量百分比,就不能完全去除彩色光阻劑,若超過70重量百分比,剝離溶液的極性就會下降,從而溶解塗敷材料-丙烯酸樹脂或者聚醯亞胺樹脂的能力下降。優選地,本發明中所使用的烷撐二醇醚(alkylene glycol ether)或烷撐二醇(alkylene glycol)是選自乙二醇單丁醚(ethyleneglycol monobutylether)、二乙二醇單丁醚(diethylene glycol monobutylether)、三乙二醇單丁醚(triethyleneglycol monobutylether)、乙二醇單甲醚(ethyleneglycol monomethylether)、二乙二醇單甲醚(diethyleneglycol monomethylether)、三乙二醇單甲醚(triethyleneglycol monomethylether)、乙二醇單乙醚(ethyleneglycol monoethylether)、乙二醇(ethylene glycol)、二乙二醇(diethylene glycol)、三乙二醇(triethylene glycol)、己二醇(hexylene glycol)或丙三醇(glycerol)中的一種或者兩種以上的混合物。At least one compound selected from the group consisting of alkylene glycol ethers or alkylene glycols having a C 1 -C 4 alkyl group, due to its solubility and reduction in color resists The surface tension is excellent, so that it can lower the surface tension between the glass surface and the colored photoresist lifted therefrom, so that the color resist can be easily peeled off, and the compound also has the effect of dissolving the stripped The function of a color resist for a binder or a polymer. The alkylene glycol ether is preferably used in an amount of from 1 to 70% by weight based on the total composition. In this case, if the content is less than 1% by weight, the color resist cannot be completely removed. Above 70% by weight, the polarity of the stripping solution is lowered, so that the ability to dissolve the coating material - acrylic resin or polyimide resin is decreased. Preferably, the alkylene glycol ether or alkylene glycol used in the present invention is selected from the group consisting of ethyleneglycol monobutylether and diethylene glycol monobutyl ether ( Diethylene glycol monobutylether), triethyleneglycol monobutylether, ethyleneglycol monomethylether, diethyleneglycol monomethylether, triethyleneglycol monomethylether ), ethyleneglycol monoethylether, ethylene glycol, diethylene glycol, triethylene glycol, hexylene glycol or glycerol ( One or a mixture of two or more of glycerol.
所述羥胺(hydroxylamine)具有滲透到組成彩色光阻劑的高分子內,將彩色光阻劑從玻璃基板分離的功能,並具有分解顏料成分的作用。亦即,就這種羥胺而言,若與水溶性胺一起使用,就會提供容易生成羥自由基(hydorxyl radical)或銨自由基(aminium radical)等的條件,因此能夠把不易溶解的顏料成分逐漸分解及氧化,從而縮短工藝時間。所述羥胺的使用量佔全部組成物的0.5至10重量百分比。若其含量小於0.5重量百分比,就不能保持藥液的初始功效,其結果會導致使用壽命縮短;若超過10重量百分比,就不能達到縮短工藝時間的效果。The hydroxylamine has a function of penetrating into a polymer constituting a color photoresist, separating a color photoresist from a glass substrate, and having a function of decomposing a pigment component. In other words, when the hydroxylamine is used together with a water-soluble amine, it provides a condition in which a hydorxyl radical or an aminium radical is easily formed, and thus a pigment component which is not easily soluble can be provided. It gradually decomposes and oxidizes, thus shortening the process time. The hydroxylamine is used in an amount of from 0.5 to 10% by weight based on the total composition. If the content is less than 0.5% by weight, the initial effect of the chemical solution cannot be maintained, and as a result, the service life is shortened; if it exceeds 10% by weight, the effect of shortening the process time cannot be achieved.
所述烷氧基烷基胺具有滲透到組成彩色光阻劑的高分子內,將彩色光阻劑從玻璃基板分離的功能。所述烷氧基烷基胺最好是佔全部組成物的0.5至50重量百分比。若烷氧基烷基胺的含量小於0.5重量百分比,對彩色光阻劑的滲透力就會變弱,從而彩色光阻劑不能完全被去除,會發生與無機鹼氫氧化物分層的現象;若大於50重量百分比,就會阻礙無機鹼金屬離子的活動性,其功能不能得到提高。所述烷氧基烷基胺可以是選自具有C1 -C4 烷氧基和烷基的化合物,例如乙氧基丙胺(ethoxypropyl amine)、甲氧基丙胺 (methoxypropyl amine)或甲氧基乙胺(methoxyethyl amine)中的一種或兩種以上的混合物。The alkoxyalkylamine has a function of penetrating into a polymer constituting a color photoresist and separating a color photoresist from a glass substrate. The alkoxyalkylamine is preferably from 0.5 to 50% by weight of the total composition. If the content of the alkoxyalkylamine is less than 0.5% by weight, the penetration force to the color resist is weakened, so that the color photoresist cannot be completely removed, and stratification with the inorganic alkali hydroxide occurs. If it is more than 50% by weight, the activity of the inorganic alkali metal ion is hindered, and its function cannot be improved. The alkoxyalkylamine may be selected from compounds having a C 1 -C 4 alkoxy group and an alkyl group, such as ethoxypropyl amine, methoxypropyl amine or methoxyB. One or a mixture of two or more of methoxyethyl amines.
優選地,在本發明中所使用的水是經離子交換樹脂過濾的純水(去離子水),最好是使用電阻率為18(MΩ)以上的超純水。所述水的使用量可以是剝離溶液組成物中的殘餘量,最好是佔全部組成物的4至49重量百分比。此時,若水的含量小於4重量百分比,在工藝溫度下所述組成物的組成就會發生變化,將析出無機鹼離子,從而會導致所述濾色器用剝離溶液組成物的儲存期(pot life)縮短;若超過49重量百分比,在工藝溫度條件下由於水的蒸發,會導致濾色器用的剝離溶液組成物的損失變大。Preferably, the water used in the present invention is pure water (deionized water) filtered through an ion exchange resin, and ultrapure water having a specific resistance of 18 (M?) or more is preferably used. The amount of water used may be a residual amount in the composition of the stripping solution, preferably from 4 to 49% by weight of the total composition. At this time, if the content of water is less than 4% by weight, the composition of the composition changes at the process temperature, and inorganic alkali ions are precipitated, thereby causing a storage period of the composition of the stripping solution for the color filter (pot life) Shortening; if it exceeds 49% by weight, the loss of the stripping solution composition for the color filter becomes large due to evaporation of water under the process temperature conditions.
而且,為了提高去除光阻劑的功能,本發明的組成物可以包含選自1至30重量百分比的具有C1 -C4 烷基的二烷撐二醇二烴基醚或烷撐二醇二烴基醚(alkyleneglycol dialkylether)、0.5至50重量百分比的除了烷氧基烷基胺以外的水溶性胺、0.05至10重量百分比的無機鹽化合物、或者1至55重量百分比極性溶劑中的至少一種成分。Moreover, in order to enhance the function of removing the photoresist, the composition of the present invention may comprise from 1 to 30% by weight of a dialkylene glycol dihydrocarbyl ether or an alkylene glycol dihydrocarbyl group having a C 1 -C 4 alkyl group. An alkyleneglycol dialkylether, 0.5 to 50% by weight of a water-soluble amine other than the alkoxyalkylamine, 0.05 to 10% by weight of the inorganic salt compound, or at least one of 1 to 55% by weight of the polar solvent.
所述具有C1 -C4 烷基的二烷撐二醇二烴基醚(dialkyleneglycol dialkylether)以及烷撐二醇二烴基醚(alkyleneglycol dialkylether),由於其溶解參數(Solubility Parameter)與作為塗敷材料使用的丙烯酸樹脂或醯亞胺樹脂(imide resin)相近,因此具有可穩定地溶解由藥液中玻璃基板剝離出的塗層高分子材料的作用。所述二烷撐二醇二烴基醚可以使用選自二亞甲基二醇二甲醚(dimethylene glycol dimethylether)、二乙二醇二甲醚(diethyleneglycol dimethylether)、二乙二醇二乙醚(diethyleneglycol diethylether)、二乙二醇二丁醚(diethyleneglycol dibutylether)、二乙二醇二丙醚(diethyleneglycol dipropylether)、二丁二醇二丁醚(dibutylene glycol dibutyl ether)或二丙二醇二甲醚(dipropyleneglycol dimethylether)中的一種或兩種以上的混合物。所述烷撐二醇二烴基醚(alkylene glycol dialkyl ether)可以使用選自乙二醇二甲醚(ethylene glycol dimethyl ether)、乙二醇二乙醚(ethylene glycol diethyl ether)、乙二醇二丁醚(ethylene glycol dibutyl ether)、乙二醇二丙醚(ethyleneglycol dipropylether)中的一種或兩種以上的混合物。The dialkyleneglycol dialkylether having a C 1 -C 4 alkyl group and the alkyleneglycol dialkylether due to its solubility parameter (Solubility Parameter) and use as a coating material Since the acrylic resin or the imide resin is similar, it has a function of stably dissolving the coating polymer material peeled off from the glass substrate in the chemical solution. The dialkylene glycol dihydrocarbyl ether may be selected from the group consisting of dimethylene glycol dimethylether, diethyleneglycol dimethylether, diethyleneglycol diethylether. , diethyleneglycol dibutylether, diethyleneglycol dipropylether, dibutylene glycol dibutyl ether or dipropyleneglycol dimethylether One or a mixture of two or more. The alkylene glycol dialkyl ether may be selected from the group consisting of ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dibutyl ether. (ethylene glycol dibutyl ether), ethylene glycol dipropyl ether (ethyleneglycol dipropylether) or a mixture of two or more.
優選地,所述二烷撐二醇二烴基醚或烷撐二醇二烴基醚(alkyleneglycol dialkylether)的使用量佔全部組成物的1至30重量百分比。此時,若其含量小於1重量百分比,剝離彩色光阻劑及塗敷材料的功能就會下降;若超過30重量百分比,就會阻礙無機鹼金屬離子的活動性,並產生析出,所以其功能無法得到提高。Preferably, the dialkylene glycol dialkyl ether or alkyleneglycol dialkylether is used in an amount of from 1 to 30 weight percent of the total composition. At this time, if the content is less than 1% by weight, the function of peeling off the color photoresist and the coating material is lowered; if it exceeds 30% by weight, the activity of the inorganic alkali metal ion is inhibited and precipitation occurs, so the function is Can't get improved.
所述水溶性胺可以使用選自n-甲基甲醇胺、二乙氨基丙胺(diethylamino propylamine)、雙(2-甲氧基乙基)胺(bis(2-methoxyethyl)amine)、單乙醇胺(mono ethanolamine)、1,2-乙二胺(ethylene diamine)或單甲醇胺(mono methanolamine)中的一種或兩種以上的混合物。The water-soluble amine may be selected from the group consisting of n-methylmethanolamine, diethylamino propylamine, bis(2-methoxyethyl)amine, monoethanolamine (mono) One or a mixture of two or more of ethanolamine, ethylene diamine or mono methanolamine.
本發明所使用的所述無機鹽,與所述氫氧化合物一起 使用可以提高去除光阻劑的效果。尤其是,將無機鹽和烷基氫氧化銨以及苯烷基氫氧化銨一起使用時,可以增加對作為塗層材料的丙烯酸樹脂(acrylic resin)和聚醯亞胺樹脂的滲透及溶脹特性,從而具有明顯縮短去除時間的優點。所述無機鹽的使用量最好是佔全部組成物的0.05至10重量百分比。此時,若其含量小於0.05重量百分比,就無法提高去除塗層材料的效果;若超過10重量百分比,在剝離溶液組成物中對可包含的最大量的殘餘水也超出了其飽和限度,從而析出加快,使設備發生問題。本發明使用的無機鹽最好是選自乙酸鉀(potassium acetate)、硝酸鉀(potassium nitrate)、碳酸鉀(potassium carbonate)、焦磷酸鉀(potassium pyrophosphate)、油酸鉀(potassium oleate)、苯甲酸鉀(potassium benzoate)、月桂酸鉀(potassium laurate)、叔丁醇鉀(potassium tert-butoxide)、硫酸鉀(potassium sulfate)、山梨酸鉀(potassium sorbate)、氨基苯甲酸鉀(potassium aminobenzoate)、焦硫酸鉀(potassium disulfate)、氰酸鉀(potassium cyanate)、硫化鉀(potassium sulfide)、二甲苯磺酸鉀(potassium xylenesulfonate)或二甲苯磺酸鈉(sodium xylenesulfonate)中的一種或兩種以上的混合物。The inorganic salt used in the present invention, together with the hydrate Use can improve the effect of removing the photoresist. In particular, when an inorganic salt is used together with an alkylammonium hydroxide and a phenylalkylammonium hydroxide, the permeation and swelling characteristics of an acrylic resin and a polyimide resin as a coating material can be increased, thereby It has the advantage of significantly reducing the removal time. The inorganic salt is preferably used in an amount of from 0.05 to 10% by weight based on the total of the composition. At this time, if the content is less than 0.05% by weight, the effect of removing the coating material cannot be improved; if it exceeds 10% by weight, the maximum amount of residual water that can be contained in the stripping solution composition exceeds the saturation limit thereof, thereby The precipitation speeds up and causes problems with the equipment. The inorganic salt used in the present invention is preferably selected from the group consisting of potassium acetate, potassium nitrate, potassium carbonate, potassium pyrophosphate, potassium oleate, and benzoic acid. Potassium benzoate, potassium laurate, potassium tert-butoxide, potassium sulfate, potassium sorbate, potassium aminobenzoate, coke One or a mixture of two or more of potassium disulfate, potassium cyanate, potassium sulfide, potassium xylenesulfonate or sodium xylenesulfonate .
而且,本發明所使用的所述極性溶劑,其對彩色光阻劑的滲透力和溶解度較為優秀,因此能夠滲透到彩色光阻劑的高分子之間,引起溶脹現象。極性溶劑的使用量最好是佔全部組成物的1至55重量百分比。此時,若其含量小於1重量百分比,完全去除彩色光阻劑的時間明顯變長; 若大於55重量百分比,與無機鹼氫氧化物化合物的溶解度下降,其性能不能夠得到提高。本發明中的極性溶劑最好是選自二甲基亞碸(dimethylsulfoxide)、二乙基亞碸(diethylsulfoxide)、二丙基亞碸(dipropylsulfoxide)、環丁碸(sulfolane)、n-甲基吡咯烷酮(n-methyl-2-pyrrolidone)、吡咯烷酮(pyrrolidone)或n-乙基吡咯烷酮(n-ethyl pyrrolidone)中的一種或兩種以上的混合物。Further, the polar solvent used in the present invention is excellent in the penetrating power and solubility to the color resist, and therefore can penetrate between the polymers of the color resist to cause swelling. The polar solvent is preferably used in an amount of from 1 to 55 weight percent based on the total composition. At this time, if the content is less than 1% by weight, the time for completely removing the color photoresist is significantly longer; If it is more than 55 weight%, the solubility with the inorganic alkali hydroxide compound is lowered, and the performance cannot be improved. The polar solvent in the present invention is preferably selected from the group consisting of dimethylsulfoxide, diethylsulfoxide, dipropylsulfoxide, sulfolane, and n-methylpyrrolidone. One or a mixture of two or more of (n-methyl-2-pyrrolidone), pyrrolidone or n-ethyl pyrrolidone.
如上所述,本發明使用特定含量的上述氫氧化合物、烷撐二醇醚(alkylene glycol ether)、羥胺(hydroxyl amine)、含有烷氧基烷基胺的水溶性胺、二烷撐二醇二烴基醚或烷撐二醇二烴基醚(alkyleneglycol dialkylether)以及水,並可進一步使用無機鹽化合物及極性溶劑,從而藉由各種成分的相乘作用而在短時間內較容易地去除彩色光阻劑和塗層材料,特別是對彩色光阻劑圖案的去除變得容易,所以可以回收使用過去大部分被廢棄的濾色器基板。本發明的較佳組成物可以是包含氫氧化合物、烷撐二醇醚(alkylene glycol ether)、羥胺、烷氧基烷基胺、二烷撐二醇二烴基醚(dialkylene glycol dialkyl ether)或烷撐二醇二烴基醚、無機鹽、極性溶劑及水的組成物。As described above, the present invention uses a specific content of the above-mentioned hydroxide, alkylene glycol ether, hydroxyl amine, water-soluble amine containing alkoxyalkylamine, dialkylene glycol II. a hydrocarbon ether or an alkyleneglycol dialkylether and water, and further using an inorganic salt compound and a polar solvent, thereby easily removing the color photoresist in a short time by multiplication of various components It is easy to remove the coating material, particularly the color photoresist pattern, so that most of the discarded color filter substrates can be recycled. Preferred compositions of the invention may comprise a hydroxide, an alkylene glycol ether, a hydroxylamine, an alkoxyalkylamine, a dialkylene glycol dialkyl ether or an alkane. A composition of a diol dihydrocarbyl ether, an inorganic salt, a polar solvent, and water.
下面,參照以下實施例對本發明進行詳細描述。這些實施例僅是本發明的示例性實施方式而已,本發明的權利範圍並不局限於此。Hereinafter, the present invention will be described in detail with reference to the following examples. These embodiments are merely exemplary embodiments of the invention, and the scope of the invention is not limited thereto.
以下,如果實施例中沒有特別說明,百分比和混合比均以重量為準。Hereinafter, unless otherwise specified in the examples, the percentages and mixing ratios are based on the weight.
按照表1和表2所示的比例,混合各種成分,從而製造各實施例及比較例所示的彩色光阻劑剝離溶液組成物。The components of the colored photoresist stripping solutions shown in the respective Examples and Comparative Examples were prepared by mixing the various components in the proportions shown in Tables 1 and 2.
對所述實施例1至24及比較例1至3所示的彩色光阻劑剝離溶液組成物的性能評價,是藉由使用由下面工程製 造的濾色器基板來進行的,並對彩色光阻劑進行了如下所述的去除試驗。The performance evaluation of the color resist stripping solution compositions shown in the above Examples 1 to 24 and Comparative Examples 1 to 3 was carried out by using the following engineering The color filter substrate was fabricated, and the color photoresist was subjected to the removal test as described below.
製造試樣 在其下部沈積有鉻/鉻氧化物(Cr/CrOx)的康寧液晶顯示器玻璃(LCD corning glass)上製作濾色器圖案,彩色光阻劑分別以紅、綠、藍的順序通過下面的光蝕刻工序來塗敷。對一般的彩色光阻劑組成物(東進世美肯公司生產的,商品名稱:DCR-725S)進行旋轉塗敷,並使最終薄膜的厚度達到1.7μm。然後,在90℃溫度條件下,在加熱板上對所述彩色光阻劑膜進行120秒的預烘烤(pre-bake)。接著,對其進行曝光,再用1%氫氧化鉀(KOH)顯影液在常溫條件下進行60秒的顯影處理,然後在烘箱內對已形成所述圖案的樣品以220℃溫度進行長達20分鐘的硬烘烤。 The sample was fabricated on a Corning glass having a chromium/chromium oxide (Cr/CrOx) deposited on its lower portion, and a color filter was formed in the order of red, green, and blue, respectively. The photolithography process is applied. A general color resist composition (manufactured by Tojin Seiken Co., Ltd., trade name: DCR-725S) was spin-coated, and the thickness of the final film was 1.7 μm. Then, the color photoresist film was pre-baked on a hot plate at a temperature of 90 ° C for 120 seconds. Then, it was exposed, and then developed with a 1% potassium hydroxide (KOH) developing solution under normal temperature for 60 seconds, and then the sample having formed the pattern was subjected to a temperature of 220 ° C for up to 20 in an oven. Hard baking for a minute.
如此在試樣上完成濾色器後,藉由旋轉塗敷方法再將塗層材料-聚醯亞胺或聚丙烯酸樹脂(polyacrylic resin)塗敷到所述試樣上,並使最終薄膜厚度達到3μm。然後,在加熱板上以90℃的溫度對所述彩色光阻劑膜進行120秒的預烘烤(pre-bake)。接著,對其進行曝光,再用1%氫氧化鉀(KOH)顯影液在常溫下進行60秒的顯影處理,然後在烘箱內對已形成所述圖案的試樣以220℃的溫度進行20分鐘的硬烘烤。After the color filter is completed on the sample, the coating material-polyimine or polyacrylic resin is applied to the sample by a spin coating method, and the final film thickness is reached. 3 μm. Then, the color photoresist film was pre-baked on a hot plate at a temperature of 90 ° C for 120 seconds. Then, it was exposed, and then developed with a 1% potassium hydroxide (KOH) developing solution at room temperature for 60 seconds, and then the sample in which the pattern was formed was subjected to a temperature of 220 ° C for 20 minutes in an oven. Hard baking.
彩色光阻劑的去除試驗 在70℃的溫度下,將所述製得的試樣浸漬到用於去除彩色光阻劑及塗層材料的剝離溶液組成物中,並檢測彩色 光阻劑及塗層從基板完全被剝離的時間。接著,將所述試樣從彩色光阻劑剝離溶液組成物中取出後用超純水進行水洗,並用氮氣進行乾燥。然後,用奧林巴斯顯微鏡進行擴大100倍後,對圖案內部是否殘留有彩色光阻劑進行了檢測,以此來觀察基板內是否殘留有彩色光阻劑。下表3顯示塗層材料和彩色光阻劑被完全剝離後,沒有發現殘渣為止所消耗的時間。 Color photoresist removal test The prepared sample is immersed in a stripping solution composition for removing a color photoresist and a coating material at a temperature of 70 ° C, and a color photoresist and a coating are detected. The time from when the layer is completely stripped from the substrate. Next, the sample was taken out from the composition of the color photoresist stripping solution, washed with ultrapure water, and dried with nitrogen. Then, after expanding 100 times with an Olympus microscope, it was examined whether or not a color photoresist remained in the pattern, thereby observing whether or not a color photoresist remained in the substrate. Table 3 below shows the time taken after the coating material and the color resist were completely peeled off, and no residue was found.
從上述表3可以看出,本發明實施例的去除彩色光阻劑的性能相對於比較例非常優秀,並且二乙二醇二甲醚和乙氧基丙胺等分別對提高去除性能起到了一定作用。特別是,在添加鉀鹽、二乙二醇二甲醚及乙氧基丙胺等的實施例中,可以看出其性能提高了5倍到10倍。As can be seen from the above Table 3, the performance of the color-removing agent of the embodiment of the present invention is excellent compared with the comparative example, and diethylene glycol dimethyl ether and ethoxypropylamine respectively play a role in improving the removal performance. . In particular, in the examples in which potassium salt, diethylene glycol dimethyl ether, ethoxypropylamine or the like was added, it was found that the performance was improved by 5 to 10 times.
相反,針對沒有添加鉀鹽的比較例1、2而言,其去除性能幾乎沒有得到提高。並且,比較例3由於其沒有包含胺和烷撐二醇醚(alkylene glycol ether)化合物,因此其剝離性能也有一定的差距。In contrast, in Comparative Examples 1 and 2 in which no potassium salt was added, the removal performance was hardly improved. Further, in Comparative Example 3, since it did not contain an amine and an alkylene glycol ether compound, the peeling performance was also somewhat different.
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