TW202334505A - Stripper composition for removing color resist and insulating layer - Google Patents
Stripper composition for removing color resist and insulating layer Download PDFInfo
- Publication number
- TW202334505A TW202334505A TW111150825A TW111150825A TW202334505A TW 202334505 A TW202334505 A TW 202334505A TW 111150825 A TW111150825 A TW 111150825A TW 111150825 A TW111150825 A TW 111150825A TW 202334505 A TW202334505 A TW 202334505A
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid composition
- stripping liquid
- potassium
- ether
- aprotic polar
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 91
- -1 salt compound Chemical class 0.000 claims abstract description 105
- 239000002798 polar solvent Substances 0.000 claims abstract description 61
- 239000002904 solvent Substances 0.000 claims abstract description 38
- 150000007529 inorganic bases Chemical class 0.000 claims abstract description 30
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims abstract description 17
- 125000004433 nitrogen atom Chemical group N* 0.000 claims abstract description 17
- 125000005210 alkyl ammonium group Chemical group 0.000 claims abstract description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims description 81
- 229920002120 photoresistant polymer Polymers 0.000 claims description 55
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 54
- 238000005260 corrosion Methods 0.000 claims description 20
- 230000007797 corrosion Effects 0.000 claims description 16
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical class OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 15
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 12
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 claims description 10
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 claims description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 9
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 claims description 9
- 239000003112 inhibitor Substances 0.000 claims description 9
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 8
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 8
- SOYBEXQHNURCGE-UHFFFAOYSA-N 3-ethoxypropan-1-amine Chemical compound CCOCCCN SOYBEXQHNURCGE-UHFFFAOYSA-N 0.000 claims description 7
- FAXDZWQIWUSWJH-UHFFFAOYSA-N 3-methoxypropan-1-amine Chemical compound COCCCN FAXDZWQIWUSWJH-UHFFFAOYSA-N 0.000 claims description 7
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000010 aprotic solvent Substances 0.000 claims description 7
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 claims description 7
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical group CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 claims description 6
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 claims description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 6
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 claims description 6
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 claims description 6
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 6
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims description 6
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 claims description 6
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 claims description 6
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 claims description 6
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 claims description 6
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 claims description 5
- 235000011056 potassium acetate Nutrition 0.000 claims description 5
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 claims description 4
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 claims description 4
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 claims description 4
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 4
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 4
- 239000012964 benzotriazole Substances 0.000 claims description 4
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 claims description 4
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 4
- KERBAAIBDHEFDD-UHFFFAOYSA-N n-ethylformamide Chemical compound CCNC=O KERBAAIBDHEFDD-UHFFFAOYSA-N 0.000 claims description 4
- 239000011591 potassium Substances 0.000 claims description 4
- 229910052700 potassium Inorganic materials 0.000 claims description 4
- 235000011118 potassium hydroxide Nutrition 0.000 claims description 4
- 239000001632 sodium acetate Substances 0.000 claims description 4
- 235000017281 sodium acetate Nutrition 0.000 claims description 4
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims description 4
- KAKVFSYQVNHFBS-UHFFFAOYSA-N (5-hydroxycyclopenten-1-yl)-phenylmethanone Chemical compound OC1CCC=C1C(=O)C1=CC=CC=C1 KAKVFSYQVNHFBS-UHFFFAOYSA-N 0.000 claims description 3
- 150000005206 1,2-dihydroxybenzenes Chemical class 0.000 claims description 3
- JPIGSMKDJQPHJC-UHFFFAOYSA-N 1-(2-aminoethoxy)ethanol Chemical compound CC(O)OCCN JPIGSMKDJQPHJC-UHFFFAOYSA-N 0.000 claims description 3
- GODZNYBQGNSJJN-UHFFFAOYSA-N 1-aminoethane-1,2-diol Chemical compound NC(O)CO GODZNYBQGNSJJN-UHFFFAOYSA-N 0.000 claims description 3
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 claims description 3
- FQXRXTUXSODUFZ-UHFFFAOYSA-N 1h-imidazol-2-ylmethanethiol Chemical compound SCC1=NC=CN1 FQXRXTUXSODUFZ-UHFFFAOYSA-N 0.000 claims description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 3
- CHHHXKFHOYLYRE-UHFFFAOYSA-M 2,4-Hexadienoic acid, potassium salt (1:1), (2E,4E)- Chemical compound [K+].CC=CC=CC([O-])=O CHHHXKFHOYLYRE-UHFFFAOYSA-M 0.000 claims description 3
- GIAFURWZWWWBQT-UHFFFAOYSA-N 2-(2-aminoethoxy)ethanol Chemical compound NCCOCCO GIAFURWZWWWBQT-UHFFFAOYSA-N 0.000 claims description 3
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 3
- MTVLEKBQSDTQGO-UHFFFAOYSA-N 2-(2-ethoxypropoxy)propan-1-ol Chemical compound CCOC(C)COC(C)CO MTVLEKBQSDTQGO-UHFFFAOYSA-N 0.000 claims description 3
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 claims description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 3
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 claims description 3
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 claims description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 3
- IBZKBSXREAQDTO-UHFFFAOYSA-N 2-methoxy-n-(2-methoxyethyl)ethanamine Chemical compound COCCNCCOC IBZKBSXREAQDTO-UHFFFAOYSA-N 0.000 claims description 3
- ASUDFOJKTJLAIK-UHFFFAOYSA-N 2-methoxyethanamine Chemical compound COCCN ASUDFOJKTJLAIK-UHFFFAOYSA-N 0.000 claims description 3
- HMWXCSCBUXKXSA-UHFFFAOYSA-N 2-propoxyethanamine Chemical compound CCCOCCN HMWXCSCBUXKXSA-UHFFFAOYSA-N 0.000 claims description 3
- PWGVOCGNHYMDLS-UHFFFAOYSA-N 3-(2-methoxyethoxy)propan-1-amine Chemical compound COCCOCCCN PWGVOCGNHYMDLS-UHFFFAOYSA-N 0.000 claims description 3
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 claims description 3
- VHYUNSUGCNKWSO-UHFFFAOYSA-N 3-propan-2-yloxypropan-1-amine Chemical compound CC(C)OCCCN VHYUNSUGCNKWSO-UHFFFAOYSA-N 0.000 claims description 3
- LRUDIIUSNGCQKF-UHFFFAOYSA-N 5-methyl-1H-benzotriazole Chemical compound C1=C(C)C=CC2=NNN=C21 LRUDIIUSNGCQKF-UHFFFAOYSA-N 0.000 claims description 3
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 3
- 239000005977 Ethylene Substances 0.000 claims description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 3
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 claims description 3
- 239000004111 Potassium silicate Substances 0.000 claims description 3
- 239000004115 Sodium Silicate Substances 0.000 claims description 3
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 3
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 claims description 3
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 claims description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- ZZXDRXVIRVJQBT-UHFFFAOYSA-M Xylenesulfonate Chemical compound CC1=CC=CC(S([O-])(=O)=O)=C1C ZZXDRXVIRVJQBT-UHFFFAOYSA-M 0.000 claims description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 3
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 claims description 3
- 229940043279 diisopropylamine Drugs 0.000 claims description 3
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 claims description 3
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 claims description 3
- 239000004300 potassium benzoate Substances 0.000 claims description 3
- 235000010235 potassium benzoate Nutrition 0.000 claims description 3
- 229940103091 potassium benzoate Drugs 0.000 claims description 3
- 239000011736 potassium bicarbonate Substances 0.000 claims description 3
- 235000015497 potassium bicarbonate Nutrition 0.000 claims description 3
- 229910000028 potassium bicarbonate Inorganic materials 0.000 claims description 3
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 3
- 235000011181 potassium carbonates Nutrition 0.000 claims description 3
- GKKCIDNWFBPDBW-UHFFFAOYSA-M potassium cyanate Chemical compound [K]OC#N GKKCIDNWFBPDBW-UHFFFAOYSA-M 0.000 claims description 3
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 claims description 3
- 239000004323 potassium nitrate Substances 0.000 claims description 3
- 235000010333 potassium nitrate Nutrition 0.000 claims description 3
- 229940096992 potassium oleate Drugs 0.000 claims description 3
- KAQHZJVQFBJKCK-UHFFFAOYSA-L potassium pyrosulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OS([O-])(=O)=O KAQHZJVQFBJKCK-UHFFFAOYSA-L 0.000 claims description 3
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 claims description 3
- 235000019353 potassium silicate Nutrition 0.000 claims description 3
- 229910052913 potassium silicate Inorganic materials 0.000 claims description 3
- 239000004302 potassium sorbate Substances 0.000 claims description 3
- 235000010241 potassium sorbate Nutrition 0.000 claims description 3
- 229940069338 potassium sorbate Drugs 0.000 claims description 3
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 claims description 3
- 229910052939 potassium sulfate Inorganic materials 0.000 claims description 3
- 229940093914 potassium sulfate Drugs 0.000 claims description 3
- DPLVEEXVKBWGHE-UHFFFAOYSA-N potassium sulfide Chemical compound [S-2].[K+].[K+] DPLVEEXVKBWGHE-UHFFFAOYSA-N 0.000 claims description 3
- 235000011151 potassium sulphates Nutrition 0.000 claims description 3
- MLICVSDCCDDWMD-KVVVOXFISA-M potassium;(z)-octadec-9-enoate Chemical compound [K+].CCCCCCCC\C=C/CCCCCCCC([O-])=O MLICVSDCCDDWMD-KVVVOXFISA-M 0.000 claims description 3
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 claims description 3
- 235000011121 sodium hydroxide Nutrition 0.000 claims description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 3
- 235000019794 sodium silicate Nutrition 0.000 claims description 3
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 3
- 235000011152 sodium sulphate Nutrition 0.000 claims description 3
- 229940048842 sodium xylenesulfonate Drugs 0.000 claims description 3
- QUCDWLYKDRVKMI-UHFFFAOYSA-M sodium;3,4-dimethylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1C QUCDWLYKDRVKMI-UHFFFAOYSA-M 0.000 claims description 3
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 claims description 3
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 claims description 3
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 claims description 3
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 claims description 3
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 claims description 3
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 3
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 claims description 3
- 229940071104 xylenesulfonate Drugs 0.000 claims description 3
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 claims description 2
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 2
- UICGXCCDQFJUFM-UHFFFAOYSA-N 1-ethylpyrrolidin-2-one Chemical compound C(C)N1C(CCC1)=O.C(C)N1C(CCC1)=O UICGXCCDQFJUFM-UHFFFAOYSA-N 0.000 claims description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 2
- BTOVVHWKPVSLBI-UHFFFAOYSA-N 2-methylprop-1-enylbenzene Chemical compound CC(C)=CC1=CC=CC=C1 BTOVVHWKPVSLBI-UHFFFAOYSA-N 0.000 claims description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 claims description 2
- 229940006116 lithium hydroxide Drugs 0.000 claims description 2
- 229940057199 potassium aminobenzoate Drugs 0.000 claims description 2
- 229940093932 potassium hydroxide Drugs 0.000 claims description 2
- VLSHYHUKASKGPF-UHFFFAOYSA-M potassium;2-aminobenzoate Chemical compound [K+].NC1=CC=CC=C1C([O-])=O VLSHYHUKASKGPF-UHFFFAOYSA-M 0.000 claims description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 2
- 235000017550 sodium carbonate Nutrition 0.000 claims description 2
- 229940083608 sodium hydroxide Drugs 0.000 claims description 2
- 239000004317 sodium nitrate Substances 0.000 claims description 2
- 235000010344 sodium nitrate Nutrition 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 2
- DDBYLRWHHCWVID-UHFFFAOYSA-N 2-ethylbut-1-enylbenzene Chemical compound CCC(CC)=CC1=CC=CC=C1 DDBYLRWHHCWVID-UHFFFAOYSA-N 0.000 claims 1
- JEFLWDWJZNCEEM-UHFFFAOYSA-N 2-propylpent-1-enylbenzene Chemical compound CCCC(CCC)=CC1=CC=CC=C1 JEFLWDWJZNCEEM-UHFFFAOYSA-N 0.000 claims 1
- LNTHITQWFMADLM-UHFFFAOYSA-N anhydrous gallic acid Natural products OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 claims 1
- 229940074391 gallic acid Drugs 0.000 claims 1
- 235000004515 gallic acid Nutrition 0.000 claims 1
- XMYQHJDBLRZMLW-UHFFFAOYSA-N methanolamine Chemical compound NCO XMYQHJDBLRZMLW-UHFFFAOYSA-N 0.000 claims 1
- 229940087646 methanolamine Drugs 0.000 claims 1
- YNOGYQAEJGADFJ-UHFFFAOYSA-N oxolan-2-ylmethanamine Chemical class NCC1CCCO1 YNOGYQAEJGADFJ-UHFFFAOYSA-N 0.000 claims 1
- CUQOHAYJWVTKDE-UHFFFAOYSA-N potassium;butan-1-olate Chemical compound [K+].CCCC[O-] CUQOHAYJWVTKDE-UHFFFAOYSA-N 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 9
- 239000002184 metal Substances 0.000 abstract description 9
- 150000001875 compounds Chemical class 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 79
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 67
- 239000010410 layer Substances 0.000 description 36
- 239000000758 substrate Substances 0.000 description 24
- 230000000052 comparative effect Effects 0.000 description 21
- 230000000694 effects Effects 0.000 description 18
- 238000000034 method Methods 0.000 description 16
- 238000011156 evaluation Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 13
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 230000008961 swelling Effects 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000010828 elution Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 229910021642 ultra pure water Inorganic materials 0.000 description 3
- 239000012498 ultrapure water Substances 0.000 description 3
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 235000015424 sodium Nutrition 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 2
- RKBCYCFRFCNLTO-UHFFFAOYSA-N triisopropylamine Chemical compound CC(C)N(C(C)C)C(C)C RKBCYCFRFCNLTO-UHFFFAOYSA-N 0.000 description 2
- RMAXIISWSVEHMU-UHFFFAOYSA-N C(CCC)OCCOCCO.COCCOC Chemical compound C(CCC)OCCOCCO.COCCOC RMAXIISWSVEHMU-UHFFFAOYSA-N 0.000 description 1
- BAVYZALUXZFZLV-UHFFFAOYSA-O Methylammonium ion Chemical compound [NH3+]C BAVYZALUXZFZLV-UHFFFAOYSA-O 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 1
- 229910017053 inorganic salt Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical group CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- VWBWQOUWDOULQN-UHFFFAOYSA-N nmp n-methylpyrrolidone Chemical compound CN1CCCC1=O.CN1CCCC1=O VWBWQOUWDOULQN-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229960003975 potassium Drugs 0.000 description 1
- 235000007686 potassium Nutrition 0.000 description 1
- LPNYRYFBWFDTMA-UHFFFAOYSA-N potassium tert-butoxide Chemical compound [K+].CC(C)(C)[O-] LPNYRYFBWFDTMA-UHFFFAOYSA-N 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 230000002522 swelling effect Effects 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
本發明係關於一種回收使用在TFT-LCD、OLED製程等產生的不良基板，可去除彩色光阻、絕緣膜的剝離液組合物。The present invention relates to a stripping liquid composition that can recycle defective substrates produced in TFT-LCD, OLED processes, etc., and can remove color photoresist and insulating films.
為實現各圖元的顏色，TFT-LCD及OLED需要紅色、綠色及藍色圖案的彩色濾光片層。In order to realize the color of each picture element, TFT-LCD and OLED require color filter layers with red, green and blue patterns.
在上部基板上製造綠色氣的製程如下：以TFT-LCD為例，在TFT結構物上塗布彩色光阻並進行曝光，以通過光聚合反應固化彩色光阻。結束曝光之後，彩色光阻去除不被顯影曝光的部分，並經過燒成過程。在此過程中，在彩色光阻上產生不良的情況下，現有技術中不回收使用不良基板，大部分做廢棄處理。因此，用於去除不良彩色光阻，回收使用基板的剝離液組合物的需求逐漸增加。The process of producing green gas on the upper substrate is as follows: taking TFT-LCD as an example, a color photoresist is coated on the TFT structure and exposed to solidify the color photoresist through a photopolymerization reaction. After the exposure is completed, the color photoresist removes the parts that are not exposed by development and undergoes a firing process. During this process, when defects occur on the color photoresist, the existing technology does not recycle the defective substrates, and most of them are discarded. Therefore, the demand for stripper compositions for removing defective color photoresists and recycling used substrates is gradually increasing.
關於用於剝離彩色光阻或有機絕緣膜的剝離液組合物的大韓民國註冊專利10-1488265號，雖然公開包含氫氧化物類化合物、亞烯乙二醇烷基醚類化合物、烷醇胺類化合物、無機鹽化合物及餘量的水的用於去除彩色光阻的剝離液，但在高溫製程時，因揮發在長期使用時，存在去除性降低的問題，而且存在無法實現快速去除彩色光阻及有機絕緣膜的效果的問題。Korean registered patent No. 10-1488265 regarding a stripping liquid composition for stripping color photoresist or organic insulating films discloses that it contains hydroxide compounds, alkylene glycol alkyl ether compounds, and alkanolamine compounds. , inorganic salt compounds and the remaining water are used to remove color photoresist. However, due to volatilization during high-temperature processes, there is a problem of reduced removability during long-term use, and it is impossible to quickly remove color photoresist and The problem of the effect of organic insulating films.
發明要解決的問題：Problems to be solved by the invention:
本發明的目的在於提供一種在不損傷下部膜質的同時，可快速、容易去除彩色光阻及有機絕緣膜，有機絕緣膜的去除性尤為優秀的剝離液組合物。The object of the present invention is to provide a stripping liquid composition that can quickly and easily remove color photoresist and organic insulating films without damaging the underlying film quality, and has particularly excellent removability for organic insulating films.
本發明的另一目的在於提供一種在去除彩色光阻及有機絕緣膜的過程中，不產生對作為矽類下部膜質的氮化矽（SiN x）、氧化矽（SiO x）等的損傷的剝離液組合物。 Another object of the present invention is to provide a peeling method that does not cause damage to silicon nitride ( SiN liquid composition.
解決問題的方法：How to solve the problem:
為達到上述目的，根據本發明一實施例的剝離液組合物，包括：溶劑，包括包含氮原子（N）的第一非質子性極性溶劑及第二非質子性極性溶劑；乙二醇醚化合物；無機鹼基或其鹽化合物；鏈型胺化合物；及烷基銨化合物；上述第一非質子性極性溶劑和第二非質子性極性溶劑的分子量不同；上述第一非質子性極性溶劑和第二非質子性極性溶劑的重量比為1：1至1：40。In order to achieve the above object, a stripping liquid composition according to an embodiment of the present invention includes: a solvent, including a first aprotic polar solvent and a second aprotic polar solvent containing nitrogen atoms (N); a glycol ether compound ; Inorganic base or salt compound thereof; chain amine compound; and alkylammonium compound; the above-mentioned first aprotic polar solvent and the second aprotic polar solvent have different molecular weights; the above-mentioned first aprotic polar solvent and the third aprotic polar solvent The weight ratio of the two aprotic polar solvents is 1:1 to 1:40.
上述第一非質子性極性溶劑和上述第二非質子性極性溶劑的分子量差異為5至65g/mol。The molecular weight difference between the above-mentioned first aprotic polar solvent and the above-mentioned second aprotic polar solvent is 5 to 65 g/mol.
上述第一非質子性極性溶劑包括選自N-乙基-2-吡咯烷酮（N-ethyl-2-pyrrolidone）、N-甲基-2-吡咯烷酮（N-Methyl-2-Pyrrolidone）、N-乙基甲醯胺（N-Ethylformamide）、N-甲基甲醯胺（N-Methylformamide）及吡咯烷酮（pyrrolidone)中的任何一種以上。The above-mentioned first aprotic polar solvent includes N-ethyl-2-pyrrolidone (N-ethyl-2-pyrrolidone), N-methyl-2-pyrrolidone (N-Methyl-2-Pyrrolidone), N-ethyl Any one or more of N-Ethylformamide, N-Methylformamide and pyrrolidone.
上述第二非質子性極性溶劑的分子量為70至140g/mol。The molecular weight of the above-mentioned second aprotic polar solvent is 70 to 140 g/mol.
上述第二非質子性極性溶劑包括選自二甲基亞碸、二乙基亞碸、二丙基亞碸及環丁碸中的任何一種以上。The above-mentioned second aprotic polar solvent includes any one or more selected from the group consisting of dimethyl turions, diethyl turions, dipropyl turions and cyclotetranes.
上述第一非質子性極性溶劑為N-乙基-2-吡咯烷酮。The above-mentioned first aprotic polar solvent is N-ethyl-2-pyrrolidone.
在上述剝離液組合物中，相對於上述溶劑100重量份，上述乙二醇醚化合物包含10至100重量份。The above-mentioned stripping liquid composition contains 10 to 100 parts by weight of the above-mentioned glycol ether compound with respect to 100 parts by weight of the above-mentioned solvent.
上述乙二醇醚化合物包括選自乙二醇、丙二醇、二乙二醇、三乙二醇、四乙二醇、乙二醇甲基醚、乙二醇乙基醚、乙二醇丁基醚、二乙二醇甲基醚、二乙二醇乙基醚、二乙二醇丁基醚、三乙二醇甲基醚、三乙二醇乙基醚、三乙二醇丁基醚、二乙二醇二甲基醚、二丙二醇甲基醚、二丙二醇乙基醚、乙二醇二甲基醚、二丙二醇二甲基醚、三乙二醇二甲基醚、乙二醇二乙基醚、二乙二醇二乙基醚及二乙二醇甲基乙基醚中的任何一種以上。The above-mentioned glycol ether compounds include ethylene glycol, propylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, ethylene glycol methyl ether, ethylene glycol ethyl ether, and ethylene glycol butyl ether. , diethylene glycol methyl ether, diethylene glycol ethyl ether, diethylene glycol butyl ether, triethylene glycol methyl ether, triethylene glycol ethyl ether, triethylene glycol butyl ether, diethylene glycol butyl ether Ethylene glycol dimethyl ether, dipropylene glycol methyl ether, dipropylene glycol ethyl ether, ethylene glycol dimethyl ether, dipropylene glycol dimethyl ether, triethylene glycol dimethyl ether, ethylene glycol diethyl Any one or more of ether, diethylene glycol diethyl ether and diethylene glycol methyl ethyl ether.
另外，在上述剝離液組合物中，相對於上述溶劑100重量份，上述無機鹼基或其鹽化合物包含0.001至0.05重量份。In addition, the above-mentioned stripping liquid composition contains 0.001 to 0.05 parts by weight of the above-mentioned inorganic base or its salt compound with respect to 100 parts by weight of the above-mentioned solvent.
上述無機鹼基或其鹽化合物包括選自乙酸鉀、硝酸鉀、碳酸鉀、焦磷酸鉀、油酸鉀、苯甲酸鉀、月桂酸鉀、叔丁醇鉀、硫酸鉀、山梨酸鉀、氨基苯甲酸鉀、焦硫酸鉀、氰酸鉀、硫化鉀、二甲苯磺酸鉀、二甲苯磺酸鈉、氫氧化鋰、氫氧化鈉、氫氧化鉀、碳酸鈉、碳酸氫鈉、碳酸氫鉀、硝酸鈉、硫酸鈉、乙酸鈉、矽酸鈉及矽酸鉀中的任何一種以上。The above-mentioned inorganic base or its salt compound includes potassium acetate, potassium nitrate, potassium carbonate, potassium pyrophosphate, potassium oleate, potassium benzoate, potassium laurate, potassium tert-butoxide, potassium sulfate, potassium sorbate, aminobenzene Potassium formate, potassium pyrosulfate, potassium cyanate, potassium sulfide, potassium xylene sulfonate, sodium xylene sulfonate, lithium hydroxide, sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, potassium bicarbonate, nitric acid Any one or more of sodium, sodium sulfate, sodium acetate, sodium silicate and potassium silicate.
在上述剝離液組合物中，相對於上述溶劑100重量份，上述鏈型胺化合物及上述烷基銨化合物包含20至145重量份。In the stripping liquid composition, the chain amine compound and the alkylammonium compound include 20 to 145 parts by weight relative to 100 parts by weight of the solvent.
另外，在上述剝離液組合物中，相對於上述剝離液組合物全部重量，上述烷基銨化合物包含15至29重量%。Moreover, in the said stripping liquid composition, the said alkylammonium compound contains 15 to 29 weight% with respect to the whole weight of the said stripping liquid composition.
在上述剝離液組合物中，以1：1,000至1：20,000的重量比包含上述無機鹼基或其鹽化合物和上述烷基銨化合物。The above-mentioned stripping liquid composition contains the above-mentioned inorganic base or its salt compound and the above-mentioned alkylammonium compound in a weight ratio of 1:1,000 to 1:20,000.
上述鏈型胺化合物包括選自氨基乙醇、二乙醇胺、N-甲基乙醇胺、三乙醇胺、乙二醇胺、二乙二醇胺、羥胺、甲基胺、乙基胺、異丙基胺、單異丙基胺、二乙基胺、二異丙基胺、二丁基胺、乙烯二胺、三甲基胺、三乙基胺、三異丙基胺、三丁基胺、單異丙醇胺、氨基乙氧基乙醇、丙氧基乙基胺、異丙氧基丙基胺、甲氧基乙氧基丙基胺、氨基乙基乙二醇、甲氧基乙基胺、甲氧基丙基胺、乙氧基丙基胺、3-甲氧基丙基胺、3-乙氧基丙基胺、n-甲基甲醇胺、單甲醇胺、單乙醇胺、二乙基氨基丙基胺、二2-甲氧基乙基胺、丙二胺、1,3-丙二胺、1,2-丙二胺、二亞乙基三胺、二己烯三胺、三亞乙基四胺、四乙基五胺、氧戊環-2-基-甲烷胺、（氧戊環-2-基-甲基）丁烷-1-胺及甲基氧戊環-2-基-甲烷胺中的任何一種以上。The above-mentioned chain amine compound includes aminoethanol, diethanolamine, N-methylethanolamine, triethanolamine, ethylene glycolamine, diethylene glycolamine, hydroxylamine, methylamine, ethylamine, isopropylamine, mono Isopropylamine, diethylamine, diisopropylamine, dibutylamine, ethylenediamine, trimethylamine, triethylamine, triisopropylamine, tributylamine, monoisopropyl alcohol Amine, aminoethoxyethanol, propoxyethylamine, isopropoxypropylamine, methoxyethoxypropylamine, aminoethylglycol, methoxyethylamine, methoxy Propylamine, ethoxypropylamine, 3-methoxypropylamine, 3-ethoxypropylamine, n-methylmethanolamine, monomethanolamine, monoethanolamine, diethylaminopropylamine , di-2-methoxyethylamine, propylenediamine, 1,3-propylenediamine, 1,2-propylenediamine, diethylenetriamine, dihexenetriamine, triethylenetetramine, In tetraethylpentamine, oxopentan-2-yl-methaneamine, (oxopentan-2-yl-methyl)butane-1-amine and methyloxypentan-2-yl-methaneamine Any of the above.
上述烷基銨化合物包括選自氫氧化四甲基銨、氫氧化四乙基銨、氫氧化四丙基銨及氫氧化四丁基銨中的任何一種以上。The above-mentioned alkylammonium compound includes any one or more selected from the group consisting of tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide and tetrabutylammonium hydroxide.
上述剝離液組合物還包括腐蝕抑制劑，相對於上述溶劑100重量份，上述腐蝕抑制劑包含0.2至25重量份。The above-mentioned stripping liquid composition further includes a corrosion inhibitor, and the above-mentioned corrosion inhibitor contains 0.2 to 25 parts by weight relative to 100 parts by weight of the above-mentioned solvent.
此時，上述腐蝕抑制劑包括選自甲基苯駢三氮唑、苯並三唑、巰基甲基咪唑、鄰苯二酚系化合物及沒食子酸烷基酯類化合物中的任何一種以上。In this case, the corrosion inhibitor includes at least one selected from the group consisting of tolutriazole, benzotriazole, mercaptomethylimidazole, catechol compounds, and alkyl gallate compounds.
上述剝離液組合物用於除去彩色光阻及絕緣膜。The above-mentioned stripping liquid composition is used for removing color photoresist and insulating film.
根據本發明另一實施例的矽氧化膜用剝離液組合物，包括：乙二醇醚化合物；無機鹼基或其鹽化合物；鏈型胺化合物；烷基銨化合物；及非質子性溶劑；相對於上述溶劑100重量份，上述無機鹼基或其鹽化合物包含0.001至0.05重量份。A stripper composition for silicon oxide film according to another embodiment of the present invention includes: a glycol ether compound; an inorganic base or its salt compound; a chain amine compound; an alkylammonium compound; and an aprotic solvent; relatively The above-mentioned inorganic base or its salt compound contains 0.001 to 0.05 parts by weight based on 100 parts by weight of the above-mentioned solvent.
發明效果：Invention effect:
本發明的剝離液組合物，在不損傷作為下部膜質的無機絕緣膜及各種金屬配線的前提下，不僅可以快速去除彩色光阻，而且，還可以去除陰性及陽性有機絕緣膜，從而可回收使用彩色濾光片基板及薄膜電晶體（TFT，Thin Film Transistor）基板。The stripping liquid composition of the present invention can not only quickly remove the color photoresist without damaging the inorganic insulating film and various metal wirings as the underlying film, but also can remove the negative and positive organic insulating films, so that it can be recycled Color filter substrate and thin film transistor (TFT, Thin Film Transistor) substrate.
本發明的剝離液組合物，不僅對由SiNx構成的無機絕緣膜，還對由SiOx構成的無機絕緣膜，在剝離過程中幾乎不發生因腐蝕導致的損傷。The stripping liquid composition of the present invention hardly causes damage due to corrosion to not only the inorganic insulating film made of SiNx but also the inorganic insulating film made of SiOx during the stripping process.
本發明的剝離液組合物，可在短時間內容易去除彩色光阻及有機絕緣膜，而且在後續的沖洗製程中，無需使用異丙醇、二甲基亞碸等有機溶劑，只用水即可完成沖洗，尤其是因去除光致抗蝕圖案，從而可回收使用彩色濾光片基板。The stripping liquid composition of the present invention can easily remove color photoresist and organic insulating film in a short time, and in the subsequent rinsing process, there is no need to use organic solvents such as isopropyl alcohol and dimethyl styrene, and only water can be used The processing is completed, especially by removing the photoresist pattern, so that the color filter substrate can be recycled.
首先，用於本說明書及發明申請專利範圍的術語不受詞典中定義的限制，而在發明人可為以最佳方式說明自己的發明而適當定義術語的概念的原則上，需解釋為符合本發明的技術思想的意思和概念。First of all, the terms used in this specification and the patentable scope of the invention are not limited by the definitions in the dictionary, but on the principle that the inventor can appropriately define the concept of the terms to describe his invention in the best way, they need to be interpreted as consistent with this concept. The meaning and concept of technical ideas of invention.
因此，記載於本說明書的實施例及製造例中的結構只是本發明的最佳實施例，而非完全變現本發明的技術思想，因此，在申請本發明時，可存在可替代的各種均等物和變形例。Therefore, the structures described in the embodiments and production examples of this specification are only the best embodiments of the present invention, and do not fully realize the technical idea of the present invention. Therefore, when applying the present invention, there may be various equivalents that can be substituted. and modifications.
下面，對本發明的實施例進行詳細說明，以幫助本發明所屬領域中具有通常知識者容易實施本發明。本發明可通過各種不同的形式實現而不受在此說明的製造例及實施例的限制。Below, the embodiments of the present invention are described in detail to help those with ordinary knowledge in the field to which the present invention belongs to easily implement the present invention. The present invention can be implemented in various forms without being limited by the manufacturing examples and embodiments described here.
本發明涉及在不損傷基板上的無機絕緣膜及金屬配線等下部膜層的同時，容易去除彩色光阻（Color Resist，CR）及有機絕緣膜（Over Coat，OC）等的剝離液組合物。The present invention relates to a stripping liquid composition that can easily remove color resist (Color Resist, CR), organic insulating film (Over Coat, OC), etc. without damaging lower layers such as inorganic insulating films and metal wiring on a substrate.
本發明一方面的剝離液組合物為利用存在分子量差異的兩種以上的極性溶劑，增加對基板上的彩色光阻及有機絕緣膜的溶解力，以容易剝離彩色光阻及有機絕緣膜的組合物，具體而言，上述極性溶劑包括包含氮原子（N）的第一非質子性極性溶劑及與第一非質子性極性溶劑不同分子量的第二非質子性極性溶劑。即根據本發明一方面的剝離液組合物是在對上述彩色光阻及有機絕緣膜的溶解力好的溶劑中，混合乙二醇醚化合物、無機鹼基或其鹽化合物、鏈型胺化合物及烷基銨化合物而成的。The stripping liquid composition in one aspect of the present invention uses two or more polar solvents with different molecular weights to increase the dissolving power of the color photoresist and the organic insulating film on the substrate, so as to easily peel off the color photoresist and the organic insulating film. Specifically, the above-mentioned polar solvent includes a first aprotic polar solvent containing nitrogen atoms (N) and a second aprotic polar solvent having a different molecular weight from the first aprotic polar solvent. That is, the stripping liquid composition according to one aspect of the present invention is a solvent that has good solubility for the above-mentioned color photoresist and organic insulating film, and is mixed with a glycol ether compound, an inorganic base or its salt compound, a chain amine compound and Made of alkylammonium compounds.
另外，此時包含氮原子（N）的第一非質子性極性溶劑和第二非質子性極性溶劑的重量比為1：1至1：40，以有利於提高剝離液的彩色光阻及有機絕緣膜溶解力，在超出該範圍時，存在有機絕緣膜溶解力有可能降低，剝離液組合物的經時性能（維持性能的時間）減少的缺點。In addition, at this time, the weight ratio of the first aprotic polar solvent containing nitrogen atoms (N) to the second aprotic polar solvent is 1:1 to 1:40, which is beneficial to improving the color photoresist and organic properties of the stripping solution. When the solubility of the insulating film exceeds this range, there is a disadvantage that the solubility of the organic insulating film may decrease and the time-dependent performance (time to maintain performance) of the stripping liquid composition may decrease.
在上述存在分子量差異的第一非質子性溶劑或第二非質子性極性溶劑中，分子量小的溶劑在溶解外敷層和彩色光阻層的過程中，第一次滲透至固化的外敷層及彩色光阻層，張開高分子之間的間隙（第一步驟），分子量大的溶劑第二次滲透，以斷開分子間的結合，而斷開結合的外敷層和彩色光阻層粒子被溶劑包圍，以穩定的狀態被溶解（第二步驟）。因上述第一步驟及第二步驟的剝離過程，溶劑對外敷層和彩色光阻層的溶解力好。Among the first aprotic solvent or the second aprotic polar solvent with different molecular weights, the solvent with a small molecular weight first penetrates into the cured overcoat layer and color photoresist layer during the process of dissolving the overcoat layer and the color photoresist layer. The photoresist layer opens the gaps between the polymers (the first step), and the solvent with a large molecular weight penetrates for the second time to break the bonds between the molecules, and the broken outer coating layer and color photoresist layer particles are surrounded by the solvent. Dissolved in a stable state (second step). Due to the above-mentioned stripping process of the first step and the second step, the solvent has good dissolving power for the outer coating layer and the color photoresist layer.
在溶劑中，在上述包含氮原子（N）的第一非質子性極性溶劑的分子量和第二非質子性極性溶劑的分子量差異處於特定範圍時，在剝離過程中，有機絕緣層（外敷層）的第一次分離更容易發生，具體而言，可存在5至65g/mol的差異，更具體而言，可存在5至55g/mol的差異。在溶劑中，在上述包含氮原子（N）的第一非質子性極性溶劑和第二非質子性極性溶劑的分子量差異大於5時，才能通過上述兩個步驟的剝離過程表現出溶解力上升效果，在溶劑中，在上述包含氮原子（N）的第一非質子性極性溶劑和第二非質子性極性溶劑的分子量差異大於65g/mol時，在剝離步驟之後的清洗步驟中，有可能發生清洗能力降低的問題。上述包含氮原子（N）的第一非質子性極性溶劑的分子量也可大於第二非質子性極性溶劑的分子量，相反，第二非質子性極性溶劑的分子量也可大於包含氮原子（N）的第一非質子性極性溶劑的分子量。另外，在上述包含氮原子（N）的第一非質子性極性溶劑的分子量和第二非質子性極性溶劑的分子量差異達到5至55g/mol時，可實現最有效的剝離。In the solvent, when the molecular weight difference between the first aprotic polar solvent containing nitrogen atoms (N) and the molecular weight of the second aprotic polar solvent is within a specific range, the organic insulating layer (overcoat layer) is removed during the peeling process. The first separation is more likely to occur, specifically, there can be a difference of 5 to 65 g/mol, more specifically, a difference of 5 to 55 g/mol can exist. Among the solvents, when the difference in molecular weight between the first aprotic polar solvent containing nitrogen atoms (N) and the second aprotic polar solvent is greater than 5, the effect of increasing the solubility power through the above two-step stripping process can be demonstrated. , in the solvent, when the molecular weight difference between the first aprotic polar solvent and the second aprotic polar solvent containing nitrogen atoms (N) is greater than 65g/mol, in the cleaning step after the stripping step, it is possible to occur The problem of reduced cleaning ability. The molecular weight of the first aprotic polar solvent containing nitrogen atoms (N) may also be greater than the molecular weight of the second aprotic polar solvent. Conversely, the molecular weight of the second aprotic polar solvent may also be greater than the molecular weight of the second aprotic polar solvent containing nitrogen atoms (N). The molecular weight of the first aprotic polar solvent. In addition, when the molecular weight difference between the first aprotic polar solvent containing nitrogen atoms (N) and the molecular weight of the second aprotic polar solvent reaches 5 to 55 g/mol, the most effective peeling can be achieved.
具體而言，上述包含氮原子（N）的第一非質子性極性溶劑的分子量可以為50至120g/mol，可包括選自例如N-乙基-2-吡咯烷酮（N-ethyl-2-pyrrolidone）、N-甲基-2-吡咯烷酮（N-Methyl-2-Pyrrolidinone）、N-乙基甲醯胺（N-Ethylformamide）、N-甲基甲醯胺（N-Methylformamide）及吡咯烷酮（pyrrolidone)中的任何一種以上。Specifically, the molecular weight of the first aprotic polar solvent containing nitrogen atoms (N) may be 50 to 120 g/mol, and may include, for example, N-ethyl-2-pyrrolidone. ), N-Methyl-2-Pyrrolidinone, N-Ethylformamide, N-Methylformamide and pyrrolidone any of the above.
另外，上述第二非質子性極性溶劑只要是與第二非質子性極性溶劑存在差異的非質子性極性溶劑沒有特別的限制，但考慮到使用性，可包含氮原子（N）或硫原子（S），分子量具體可以為70至140g/mol。滿足上述條件的上述第二非質子性極性溶劑可包括選自例如二甲基亞碸、二乙基亞碸、二丙基亞碸及環丁碸中的任何一種以上。第二非質子性極性溶劑與上述包含氮原子（N）的第一非質子性極性溶劑一同使用，在使用分子量為70至140g/mol的非質子性極性溶劑的情況下，對彩色光阻及有機絕緣膜的溶脹（swelling）效果良好，不僅通過優秀的溶解性能增加剝離力，而且碎片去除效果也好。In addition, the above-mentioned second aprotic polar solvent is not particularly limited as long as it is an aprotic polar solvent different from the second aprotic polar solvent. However, in consideration of usability, it may contain a nitrogen atom (N) or a sulfur atom ( S), the molecular weight can specifically be 70 to 140g/mol. The second aprotic polar solvent that satisfies the above conditions may include, for example, any one or more selected from the group consisting of dimethylsterine, diethylsterine, dipropylsterene, and cyclotenine. The second aprotic polar solvent is used together with the above-mentioned first aprotic polar solvent containing nitrogen atoms (N). In the case of using an aprotic polar solvent with a molecular weight of 70 to 140 g/mol, the color photoresist and the The swelling effect of the organic insulating film is good. It not only increases the peeling force through excellent dissolution performance, but also has a good debris removal effect.
作為上述包含氮原子（N）的第一非質子性極性溶劑，N-乙基-2-吡咯烷酮在具有113.16g/mol的高分子量的同時，包含環形結構，從而因對溶質的溶解能力好而適合作為溶劑，通過環形的相對大的分子結構，對外敷層的溶解力尤其好，因此，作為包含氮原子（N）的第一非質子性極性溶劑可以使用N-乙基-2-吡咯烷酮。As the above-mentioned first aprotic polar solvent containing nitrogen atoms (N), N-ethyl-2-pyrrolidone has a high molecular weight of 113.16g/mol and contains a cyclic structure, so it has good solute dissolving ability. It is suitable as a solvent and has particularly good dissolving power for the outer coating due to its relatively large ring-shaped molecular structure. Therefore, N-ethyl-2-pyrrolidone can be used as the first aprotic polar solvent containing nitrogen atoms (N).
在本發明的剝離液組合物中，乙二醇醚化合物起到包含於剝離液的各種組合均勻溶解於溶劑的緩衝作用，在剝離步驟之後的清洗步驟中，在超純水清洗時，起到殘留於基板上的剝離液組合物不與雜質吸附，順利被清洗掉的作用。剝離液組合物中，相對於溶劑100重量份，乙二醇醚化合物包含10至100重量份時，上述緩衝作用能夠很好發揮出來，尤其是相對於溶劑100重量份，乙二醇醚化合物包含12至50重量份時，上述緩衝作用能夠發揮的非常優秀。在剝離液組合物中，若包含的乙二醇醚化合物小於上述重量份，則無機鹼基或其鹽化合物、胺化合物及烷基銨化合物等無法均勻混合，而且因胺化合物及烷基銨化合物未均勻混合，有可能存在剝離後基板的狀態不平整的問題，而在剝離液組合物中，若包含的乙二醇醚化合物超過上述重量份，反而因無剝離性能的物質的比例增加，有可能存在剝離效果降低的問題。In the stripping liquid composition of the present invention, the glycol ether compound plays a buffering role so that various combinations included in the stripping liquid are uniformly dissolved in the solvent, and plays a role in the cleaning step after the stripping step, when washing with ultrapure water. The stripping liquid composition remaining on the substrate is not adsorbed by impurities and can be smoothly washed away. In the stripping liquid composition, when the glycol ether compound contains 10 to 100 parts by weight relative to 100 parts by weight of the solvent, the above buffering effect can be well exerted, especially when the glycol ether compound contains 100 parts by weight of the solvent. When the content is 12 to 50 parts by weight, the above-mentioned buffering effect can be exerted very well. If the glycol ether compound contained in the stripping liquid composition is less than the above-mentioned weight part, the inorganic base or its salt compound, amine compound, alkylammonium compound, etc. cannot be mixed uniformly, and the amine compound and alkylammonium compound will not be mixed uniformly. If the mixture is not uniformly mixed, there may be a problem that the state of the substrate after peeling is uneven. If the glycol ether compound contained in the peeling liquid composition exceeds the above weight part, the proportion of substances without peeling performance will increase, causing problems. There may be a problem of reduced peeling effect.
上述乙二醇醚化合物包括例如選自乙二醇、丙二醇、二乙二醇、三乙二醇、四乙二醇、乙二醇甲基醚、乙二醇乙基醚、乙二醇丁基醚、二乙二醇甲基醚、二乙二醇乙基醚、二乙二醇丁基醚、三乙二醇甲基醚、三乙二醇乙基醚、三乙二醇丁基醚、二乙二醇二甲基醚、二丙二醇甲基醚、二丙二醇乙基醚、乙二醇二甲基醚、二丙二醇二甲基醚、三乙二醇二甲基醚、乙二醇二乙基醚、二乙二醇二乙基醚及二乙二醇甲基乙基醚中的任何一種以上。The above-mentioned glycol ether compounds include, for example, selected from the group consisting of ethylene glycol, propylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, ethylene glycol methyl ether, ethylene glycol ethyl ether, and ethylene glycol butyl. Ether, diethylene glycol methyl ether, diethylene glycol ethyl ether, diethylene glycol butyl ether, triethylene glycol methyl ether, triethylene glycol ethyl ether, triethylene glycol butyl ether, Diethylene glycol dimethyl ether, dipropylene glycol methyl ether, dipropylene glycol ethyl ether, ethylene glycol dimethyl ether, dipropylene glycol dimethyl ether, triethylene glycol dimethyl ether, ethylene glycol diethyl ether Any one or more of diethylene glycol diethyl ether, diethylene glycol diethyl ether and diethylene glycol methyl ethyl ether.
在本發明的剝離液組合物中，無機鹼基或其鹽化合物為與烷基銨化合物一同包含於剝離液，從而可快速剝離被溶劑溶解的外敷層和彩色光阻層的組成，起到強化剝離液的剝離（stripping）能力的作用。另外，無機鹼基或其鹽化合物即使在剝離液組合物中包含少量，也可以提高下部膜的耐腐蝕性，而且還可通過與剝離液組合物中的其他成分的相互作用，實現優秀的剝離效果。具體而言，在剝離液組合物中，相對於溶劑100重量份，無機鹼基或其鹽化合物包含少量的0.001至0.05重量份也能夠發揮上述效果，在無機鹼基或其鹽化合物大於0.001重量份，上述剝離能力強化效果達到顯著的水準，但若超過0.05重量份，則因過度的剝離效果，有可能導致對彩色光阻下部的無機絕緣膜的腐蝕。尤其是，相對於溶劑100重量份，無機鹼基或其鹽化合物包含0.002至0.04重量份的情況下，剝離液的彩色光阻及有機絕緣膜去除能力將變得更加優秀。In the stripping liquid composition of the present invention, the inorganic base or its salt compound is included in the stripping liquid together with the alkylammonium compound, so that the outer coating layer and the color photoresist layer dissolved by the solvent can be quickly peeled off and strengthened. The role of the stripping ability of the stripping liquid. In addition, even if the inorganic base or its salt compound is contained in a small amount in the stripper composition, the corrosion resistance of the lower film can be improved, and excellent peeling can be achieved through interaction with other components in the stripper composition. Effect. Specifically, in the stripping liquid composition, the above-mentioned effect can be exerted even if the inorganic base or its salt compound contains a small amount of 0.001 to 0.05 parts by weight relative to 100 parts by weight of the solvent. When the inorganic base or its salt compound exceeds 0.001 parts by weight The above-mentioned peeling ability enhancement effect reaches a significant level. However, if it exceeds 0.05 parts by weight, the excessive peeling effect may cause corrosion of the inorganic insulating film under the color photoresist. In particular, when the inorganic base or its salt compound contains 0.002 to 0.04 parts by weight relative to 100 parts by weight of the solvent, the removal ability of the color photoresist and organic insulating film of the stripper becomes even more excellent.
上述無機鹼基或其鹽化合物例如可以為鹼金屬鹽，具體而言，包括選自乙酸鉀、硝酸鉀、碳酸鉀、焦磷酸鉀、油酸鉀、苯甲酸鉀、月桂酸鉀、叔丁醇鉀、硫酸鉀、山梨酸鉀、氨基苯甲酸鉀、焦硫酸鉀、氰酸鉀、硫化鉀、二甲苯磺酸鉀、二甲苯磺酸鈉、氫氧化鋰、氫氧化鈉、氫氧化鉀、碳酸鈉、碳酸氫鈉、碳酸氫鉀、硝酸鈉、硫酸鈉、乙酸鈉、矽酸鈉及矽酸鉀中的任何一種以上。尤其在作為無機鹼基或其鹽化合物使用乙酸鈉（Potassium Acetate）的情況下，剝離液組合物的剝離效果將變得更加優秀，可進一步提高多下部無機絕緣膜的防腐效果。The above-mentioned inorganic base or its salt compound may be, for example, an alkali metal salt, and specifically includes potassium acetate, potassium nitrate, potassium carbonate, potassium pyrophosphate, potassium oleate, potassium benzoate, potassium laurate, and tert-butyl alcohol. Potassium, potassium sulfate, potassium sorbate, potassium aminobenzoate, potassium pyrosulfate, potassium cyanate, potassium sulfide, potassium xylene sulfonate, sodium xylene sulfonate, lithium hydroxide, sodium hydroxide, potassium hydroxide, carbonic acid Any one or more of sodium, sodium bicarbonate, potassium bicarbonate, sodium nitrate, sodium sulfate, sodium acetate, sodium silicate and potassium silicate. Especially when sodium acetate (Potassium Acetate) is used as the inorganic base or its salt compound, the peeling effect of the stripping liquid composition will become more excellent, and the anti-corrosion effect of the lower inorganic insulating film can be further improved.
包含於剝離液組合物的溶劑的包含氮原子（N）的第一非質子性極性溶劑雖然提高對外敷層的溶解力，但與此不同，溶解於溶劑的鏈型胺化合物和烷基銨化合物，作為溶質起到直接剝離彩色光阻和外敷層的作用。The first aprotic polar solvent containing a nitrogen atom (N) included in the solvent of the stripping liquid composition improves the solubility of the outer coating layer, but unlike this, the chain amine compound and the alkylammonium compound dissolved in the solvent , as a solute, it plays the role of directly peeling off the color photoresist and overcoat layer.
在剝離液組合物中，若相對於溶劑100重量份，鏈型胺化合物及烷基銨化合物的重量和包含20至145重量份，則對外敷層和彩色光阻的溶脹（swelling）更容易出現，更容易發生剝離（stripping）。尤其是，若相對於溶劑100重量份，鏈型胺化合物及烷基銨化合物的重量和包含30至80重量份，則上述溶脹和剝離將更容易發生。In the stripper composition, if the total weight of the chain amine compound and the alkylammonium compound is 20 to 145 parts by weight relative to 100 parts by weight of the solvent, swelling of the overcoat layer and the color photoresist is more likely to occur. , stripping is more likely to occur. In particular, if the total weight of the chain amine compound and the alkylammonium compound contains 30 to 80 parts by weight relative to 100 parts by weight of the solvent, the above-mentioned swelling and peeling will be more likely to occur.
為了提高彩色光阻及有機絕緣膜去除性能，剝離液組合物包含烷基銨化合物，具體而言，在相對於剝離液組合物全部重量，烷基銨化合物包含大於15重量%的情況下，剝離液組合物的彩色光阻及有機絕緣膜去除性能可大幅提高。但是，在相對於剝離液組合物全部重量，烷基銨化合物包含大於29重量%的情況下，有可能產生下部膜的腐蝕。尤其是，相對於剝離液組合物全部重量，烷基銨化合物包含15至20重量%的情況下，剝離液的彩色光阻及有機絕緣膜去除能力將變得更加優秀。In order to improve the removal performance of color photoresist and organic insulating film, the stripping liquid composition contains an alkylammonium compound. Specifically, when the alkylammonium compound contains more than 15% by weight relative to the total weight of the stripping liquid composition, the stripping liquid composition contains The color photoresist and organic insulating film removal performance of the liquid composition can be greatly improved. However, when the alkylammonium compound is contained in an amount of more than 29% by weight based on the total weight of the stripping liquid composition, corrosion of the lower film may occur. In particular, when the alkylammonium compound is contained in an amount of 15 to 20% by weight relative to the total weight of the stripping liquid composition, the color photoresist and organic insulating film removal ability of the stripping liquid becomes even more excellent.
上述烷基銨化合物起到通過外敷層和彩色光阻的溶脹（swelling）及起皮（peeling）有效實現剝離（stripping）的作用，因此，需要調節與賦予剝離特性的無機鹼基或其鹽化合物的總量相關的含量。在考慮到剝離液組合中包含少量的無機鹼基或其鹽化合物，以1：1,000至1：20,000的重量比包含無機鹼基或其鹽化合物和烷基銨化合物，有利於獲得優秀的剝離特性。在剝離液組合物中，在無機鹼基或其鹽化合物和烷基銨化合物的比率處於上述重量比範圍時，能夠維持優秀的彩色光阻及有機絕緣膜（外敷層）的去除性能，對包含SiO x的無機絕緣膜的防腐蝕效果也好，但在超出上述重量比範圍時，即使剝離液組合物揮發，也因殘存殘留析出物，有可能妨礙基板的性能。 The above-mentioned alkyl ammonium compound functions to effectively achieve stripping through swelling and peeling of the outer coating and color photoresist. Therefore, an inorganic base or a salt compound thereof is required to adjust and impart stripping properties. The content related to the total amount. Considering that the stripping liquid combination contains a small amount of inorganic base or its salt compound, it is beneficial to obtain excellent stripping characteristics by including the inorganic base or its salt compound and the alkylammonium compound in a weight ratio of 1:1,000 to 1:20,000. . In the stripper composition, when the ratio of the inorganic base or its salt compound and the alkylammonium compound is within the above weight ratio range, excellent removal performance of the color photoresist and the organic insulating film (overcoat layer) can be maintained, and the removal performance of the color photoresist and the organic insulating film (overcoat layer) can be maintained. The inorganic insulating film of SiO
上述鏈型胺化合物包括選自例如氨基乙醇、二乙醇胺、N-甲基乙醇胺、三乙醇胺、乙二醇胺、二乙二醇胺、羥胺、甲基胺、乙基胺、異丙基胺、單異丙基胺、二乙基胺、二異丙基胺、二丁基胺、乙烯二胺、三甲基胺、三乙基胺、三異丙基胺、三丁基胺、單異丙醇胺、氨基乙氧基乙醇、丙氧基乙基胺、異丙氧基丙基胺、甲氧基乙氧基丙基胺、氨基乙基乙二醇、甲氧基乙基胺、甲氧基丙基胺、乙氧基丙基胺、3-甲氧基丙基胺、3-乙氧基丙基胺、n-甲基甲醇胺、單甲醇胺、單乙醇胺、二乙基氨基丙基胺、二2-甲氧基乙基胺、丙二胺、1,3-丙二胺、1,2-丙二胺、二亞乙基三胺、二己烯三胺、三亞乙基四胺、四乙基五胺、氧戊環-2-基-甲烷胺、（氧戊環-2-基-甲基）丁烷-1-胺及甲基氧戊環-2-基-甲烷胺中的任何一種以上，尤其在使用單乙醇胺、3-乙氧基丙基胺、n-甲基甲醇胺、羥胺、單異丙醇胺或3-甲氧基丙基胺時，剝離效果將變得更優秀。The above-mentioned chain amine compound includes, for example, aminoethanol, diethanolamine, N-methylethanolamine, triethanolamine, ethylene glycolamine, diethylene glycolamine, hydroxylamine, methylamine, ethylamine, isopropylamine, Monoisopropylamine, diethylamine, diisopropylamine, dibutylamine, ethylenediamine, trimethylamine, triethylamine, triisopropylamine, tributylamine, monoisopropylamine Alcoholamine, aminoethoxyethanol, propoxyethylamine, isopropoxypropylamine, methoxyethoxypropylamine, aminoethylglycol, methoxyethylamine, methoxy Propylamine, ethoxypropylamine, 3-methoxypropylamine, 3-ethoxypropylamine, n-methylmethanolamine, monomethanolamine, monoethanolamine, diethylaminopropyl Amine, di-2-methoxyethylamine, propylenediamine, 1,3-propylenediamine, 1,2-propylenediamine, diethylenetriamine, dihexenetriamine, triethylenetetramine , tetraethylpentamine, oxopentan-2-yl-methaneamine, (oxopentan-2-yl-methyl)butane-1-amine and methyloxypentan-2-yl-methaneamine Any one or more of them, especially when using monoethanolamine, 3-ethoxypropylamine, n-methylmethanolamine, hydroxylamine, monoisopropanolamine or 3-methoxypropylamine, the peeling effect will become Better.
上述烷基銨化合物可包括選自氫氧化四甲基銨、氫氧化四乙基銨、氫氧化四丙基銨及氫氧化四丁基銨中的任何一種以上，尤其是，在使用氫氧化四甲基銨時，能夠使溶脹（swelling）及起皮（peeling）效果變得更好。The above-mentioned alkylammonium compound may include any one or more selected from the group consisting of tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide and tetrabutylammonium hydroxide. In particular, when using tetramethylammonium hydroxide, Methyl ammonium can make the swelling and peeling effects better.
本發明的剝離液組合物還可包括腐蝕抑制劑，以在剝離製程中，防止彩色光阻下部的無機絕緣膜及金屬配線等下部膜層的腐蝕。The stripping liquid composition of the present invention may also include a corrosion inhibitor to prevent corrosion of the lower film layers such as the inorganic insulating film and metal wiring under the color photoresist during the stripping process.
在包含腐蝕抑制劑的情況下，相對於溶劑100重量份，包含0.2重量份以上才能獲得上述下部膜層的顯著的防腐效果，在超過25重量份時，有可能妨礙剝離特性，在剝離液組合物中，相對於溶劑100重量份，包含0.3至15重量份時，上述下部膜層的防腐效果變得尤其好。When a corrosion inhibitor is included, the significant anti-corrosion effect of the lower film layer must be obtained when it is contained at least 0.2 parts by weight relative to 100 parts by weight of the solvent. When it exceeds 25 parts by weight, the peeling properties may be hindered. In the combination of the stripping liquid When the solvent contains 0.3 to 15 parts by weight relative to 100 parts by weight of the solvent, the anti-corrosion effect of the lower film layer becomes particularly good.
腐蝕抑制劑包括選自甲基苯駢三氮唑、苯並三唑、巰基甲基咪唑、鄰苯二酚系化合物及沒食子酸烷基酯類化合物中的任何一種以上，尤其在使用甲基苯駢三氮唑時，能夠使上述下部膜層防腐效果變得更加優秀。Corrosion inhibitors include any one or more selected from the group consisting of tolutriazole, benzotriazole, mercaptomethylimidazole, catechol compounds and alkyl gallate compounds, especially when using methylbenzotriazole. When using benzotriazole, the anti-corrosion effect of the above-mentioned lower film layer can be made more excellent.
為提高鹽化合物的活性，本發明的剝離液組合物除上述組合物還可包括水，具體為蒸餾水，水的含量為上述組合物的剩餘量，相對於剝離液組合物全部重量包含30至35重量%，以能夠實現有效剝離。In order to improve the activity of the salt compound, the stripping liquid composition of the present invention may also include water, specifically distilled water, in addition to the above composition. The content of water is the remaining amount of the above composition, which includes 30 to 35% based on the total weight of the stripping liquid composition. % by weight to enable effective peeling.
本發明一個方面的矽氧化膜用剝離液組合物，包括一種以上的非質子性溶劑、乙二醇醚化合物、無機鹼基或其鹽化合物、鏈型胺化合物及烷基銨化合物，相對於上述溶劑100重量份，上述無機鹼基或其鹽化合物包含很少量的0.001至0.05重量份，以在利用剝離液組合物完全去除彩色光阻及作為有機絕緣膜的外敷層之後，也能完整地維持彩色光阻下部的無機絕緣膜及金屬配線等下部膜層，尤其在剝離製程中，在作為下部膜質包含容易發生腐蝕的矽氧化膜（SiO x）的情況下，也能夠完整地維持下部膜質。此時，上述矽氧化膜用剝離液組合物的非質子性溶劑可以包括上述第一非質子性溶劑或第二非質子性極性溶劑中的一種以上，乙二醇醚化合物、無機鹼基或其鹽化合物、鏈型胺化合物及烷基銨化合物，可使用上述各具體示例中的組合。 The stripping liquid composition for silicon oxide film according to one aspect of the present invention includes one or more aprotic solvents, glycol ether compounds, inorganic base or salt compounds, chain amine compounds and alkylammonium compounds. Compared with the above 100 parts by weight of the solvent, the above-mentioned inorganic base or its salt compound contains a very small amount of 0.001 to 0.05 parts by weight, so that after the stripping liquid composition is used to completely remove the color photoresist and the overcoat layer as the organic insulating film, it can also be completely removed Maintains the lower film layers such as the inorganic insulating film and metal wiring under the color photoresist, especially during the peeling process, even when the lower film quality includes a silicon oxide film (SiO x ) that is prone to corrosion, the quality of the lower film can be maintained intact . At this time, the aprotic solvent of the silicon oxide film stripper composition may include at least one of the first aprotic solvent or the second aprotic polar solvent, a glycol ether compound, an inorganic base or other As the salt compound, the chain amine compound and the alkylammonium compound, a combination of the above specific examples can be used.
下面，對本發明的實施例進行詳細說明，以幫助本發明所屬領域中具有通常知識者容易實施本發明。本發明可通過各種不同的形式實現而不受在此說明的實施例的限制。Below, the embodiments of the present invention are described in detail to help those with ordinary knowledge in the field to which the present invention belongs to easily implement the present invention. The present invention may be implemented in various forms without being limited to the embodiments described herein.
[製造例：剝離液組合物的製造][Manufacture example: Production of stripping liquid composition]
按照下表1的組合混合各成分，製造用於比較根據本發明的實施例的剝離液組合物及效果的比較例。各成分的含量，以第一及第二溶劑的總量作為100重量份，將各成分的含量記載為重量份。
[表1]
[實驗例：剝離液組合物的物性評價][Experimental example: Physical property evaluation of stripping liquid composition]
彩色光阻及絕緣膜的去除評價，使用了紅色（Red）彩色光阻、綠色（Green）彩色光阻、藍色（Blue）彩色光阻及有機絕緣膜全部形成的基板。For the evaluation of removal of color photoresist and insulating film, a substrate composed of red (Red) color photoresist, green (Green) color photoresist, blue (Blue) color photoresist and organic insulating film was used.
＜實驗例：去除性能評價＞<Experimental example: Evaluation of removal performance>
為確認彩色光阻及有機絕緣膜的去除性能，將在上述實施例及比較例中製造的剝離液組合物升溫至75℃的溫度之後，浸泡基板並測量完全剝離的時間。接著，將上述基板從剝離液組合物中取出之後，使用超純水清洗，氮氣乾燥之後，利用光學顯微鏡確認在圖案內是否殘留彩色光阻及有機絕緣膜。按一下標準進行評價並將結果示於表2中。In order to confirm the removal performance of color photoresist and organic insulating film, the stripper composition prepared in the above examples and comparative examples was heated to a temperature of 75°C, the substrate was immersed, and the time for complete stripping was measured. Next, after the above-mentioned substrate is taken out from the stripping liquid composition, it is washed with ultrapure water and dried with nitrogen, and then an optical microscope is used to confirm whether the color photoresist and organic insulating film remain in the pattern. The evaluation was performed according to the criteria and the results are shown in Table 2.
◎：2分鐘之內完全去除的情況◎: Complete removal within 2 minutes
○：4分鐘之內完全去除的情況○: Complete removal within 4 minutes
△：6分鐘之內完全去除的情況△: Complete removal within 6 minutes
X：6分鐘之內未被去除的情況X: Situation that has not been removed within 6 minutes
＜實驗例2：下部膜損傷（Damage）評價1 - SEM＞<Experimental Example 2: Lower Film Damage (Damage) Evaluation 1 - SEM>
在進行上述去除性能評價的同時，通過SEM確認下部膜（無機絕緣膜）的損毀（腐蝕程度）。按一下標準進行評價並將結果示於表2及圖2、圖4中。While performing the above removal performance evaluation, the damage (corrosion degree) of the lower film (inorganic insulating film) was confirmed by SEM. The evaluation was carried out according to the standard and the results are shown in Table 2 and Figures 2 and 4.
○：60分鐘為止無厚度變化○: No change in thickness up to 60 minutes
△：30分鐘之內無厚度變化△: No thickness change within 30 minutes
X：5分鐘之內無厚度變化X: No thickness change within 5 minutes
＜實驗例3：下部膜損傷（Damage）評價2 - E/R＞<Experimental Example 3: Lower Membrane Damage (Damage) Evaluation 2 - E/R>
在升溫至75℃的溫度的上述實施例及比較例的剝離液組合物中浸泡基板60分鐘。將上述基板從剝離液組合物取出，使用超純水清洗，氮氣乾燥之後，利用SEM測量下部膜（SiOX）的厚度。利用如下數式計算E/R（蝕刻率，etch rate）並將其結果示於下表2。The substrate was immersed in the stripping liquid composition of the above-mentioned Example and Comparative Example whose temperature was raised to 75° C. for 60 minutes. The above-mentioned substrate was taken out from the stripping liquid composition, washed with ultrapure water, and dried with nitrogen, and then the thickness of the lower film (SiOX) was measured using SEM. E/R (etch rate) was calculated using the following equation and the results are shown in Table 2 below.
- E/R（etch rate）=（浸泡前下部膜厚度-浸泡後下部膜厚度）/60min- E/R (etch rate) = (lower film thickness before soaking - lower film thickness after soaking)/60min
＜實驗例4：下部膜損傷（Damage）評價3 - Si洗脫量＞<Experimental Example 4: Lower Membrane Damage (Damage) Evaluation 3 - Si Elution Amount>
在升溫至75℃的溫度的上述實施例及比較例的剝離液組合物中浸泡基板60分鐘。去除上述基板之後，利用洗脫評價測量設備（ICP-OES，Thermo Scientific公司）測量從玻璃組合物洗脫的的Si的量，並將其結果示於下表2。
[表2]
通過上表2可知，實施例1至15及比較例1至7都在下部膜損傷評價（實驗例2至4）中獲得良好的結果，但在彩色光阻及有機絕緣膜的去除性能方面，比較例和實施例存在很大的差異。本發明的實施例1至15都表現出優秀的彩色光阻及有機絕緣膜的去除性能，但比較例1至7的彩色光阻及有機絕緣膜的去除性能很差，難以用作剝離液組合物。尤其是，實施例2至5、10、11、14不僅剝離液組合物的去除性能非常優秀，而且下部膜損傷評價結果也很好，由此可知，本發明一實施例的剝離液組合物，不僅剝離液組合物去除性能優秀，而且也不損傷下部膜質。另外，相對於剝離液組合物全部重量，烷基銨化合物包含15重量%以上的實施例10、11及14，相對於烷基銨化合物包含15重量%以下的實施例12及13，去除性能更加優秀。As can be seen from Table 2 above, Examples 1 to 15 and Comparative Examples 1 to 7 all obtained good results in the lower film damage evaluation (Experimental Examples 2 to 4), but in terms of removal performance of color photoresist and organic insulating film, There is a big difference between the comparative examples and the examples. Examples 1 to 15 of the present invention all show excellent removal performance of color photoresist and organic insulating film. However, the removal performance of color photoresist and organic insulating film of Comparative Examples 1 to 7 is very poor, making it difficult to use as a stripping solution combination. things. In particular, Examples 2 to 5, 10, 11, and 14 not only have excellent removal performance of the stripping liquid composition, but also have excellent lower film damage evaluation results. From this, it can be seen that the stripping liquid composition of one embodiment of the present invention, The peeling liquid composition not only has excellent removal performance, but also does not damage the underlying membrane quality. In addition, Examples 10, 11, and 14 in which the alkylammonium compound contains 15% by weight or more of the total weight of the stripping liquid composition, and compared to Examples 12 and 13 in which the alkylammonium compound contains 15% by weight or less, the removal performance is better. Excellent.
圖1為用SEM拍攝形成有剝離前彩色光阻（Color Layer）及有機絕緣膜（Over Coat，OC）的TFT基板的照片。圖2的（a）為利用SEM放大拍攝金屬配線（Cu）、無機絕緣膜（SiO x）及彩色光阻（Color layer）層疊的部分的照片，而圖2的（b）為利用SEM拍攝的利用在上述製造例中製造的實施例1的剝離液組合物，通過上述方法剝離後，彩色光阻及有機絕緣膜（OC）完全被去除，有機絕緣膜（SiO x）完整保留的照片。 Figure 1 is a photo taken by SEM of a TFT substrate formed with color photoresist (Color Layer) and organic insulating film (Over Coat, OC) before peeling off. Figure 2 (a) is an enlarged SEM photograph of the laminated portion of the metal wiring (Cu), inorganic insulating film (SiO x ), and color photoresist (Color layer), and Figure 2 (b) is an SEM photograph. Using the stripping liquid composition of Example 1 produced in the above production example, after peeling off by the above method, the color photoresist and the organic insulating film (OC) are completely removed, and the organic insulating film (SiO x ) is completely retained.
圖4為利用SEM拍攝的通過相同的方法，利用按照本發明的實施例製造的剝離液組合物剝離基板之後的照片，一併表示剩餘無機絕緣膜（SiOx）的厚度。圖3為形成彩色光阻（Color Layer）及有機絕緣膜層（OC）之前的基板，是利用SEM放大拍攝形成有金屬配線（Cu）和無機絕緣膜（SiO x）的部分的照片，可以看到形成有522nm的無機絕緣膜（SiO x）。請參考圖3及圖4，可確認在使用本發明的實施例的剝離液組合物的情況下（圖4），雖然彩色光阻（Color Layer）及有機絕緣膜層（OC）完全被去除，但能夠良好的維持無機絕緣膜（SiO x）的厚度，而在實施例1至3的情況下，無機絕緣膜（SiO x）的厚度為522nm，表明剝離評價之後完全沒有發生無機絕緣膜的損傷。 FIG. 4 is a photograph taken by SEM after the substrate was peeled off using the peeling liquid composition produced according to the embodiment of the present invention using the same method, and also shows the thickness of the remaining inorganic insulating film (SiOx). Figure 3 shows the substrate before forming the color photoresist (Color Layer) and the organic insulating film layer (OC). It is a SEM magnified photo of the part where the metal wiring (Cu) and the inorganic insulating film (SiO x ) are formed. You can see To form an inorganic insulating film (SiO x ) of 522nm. Please refer to Figures 3 and 4. It can be confirmed that when using the stripper composition according to the embodiment of the present invention (Figure 4), although the color photoresist (Color Layer) and the organic insulating film layer (OC) are completely removed, However , the thickness of the inorganic insulating film (SiO .
上述實施例僅用以說明本發明而非限制，本領域的普通技術人員應當理解，可以對本發明進行修改、變形或者等同替換，而不脫離本發明的精神和範圍，其均應涵蓋在本發明的申請專利範圍當中。The above embodiments are only used to illustrate the present invention and not to limit it. Those of ordinary skill in the art will understand that the present invention can be modified, deformed or equivalently substituted without departing from the spirit and scope of the present invention. All of them should be covered by the present invention. within the scope of patent applications.
無without
圖1為用SEM（掃描電子顯微鏡）拍攝形成有剝離前彩色光阻（Color Layer）及有機絕緣膜層（Over Coat，OC）的TFT基板的照片； 圖2為放大圖1的SEM照片（a）及利用實施例1的剝離液組合物剝離後的SEM照片（b）； 圖3為形成彩色光阻（Color Layer）及有機絕緣膜層（Over Coat，OC）之前，形成有金屬配線和下部膜層（無機絕緣膜，SiO x）的基板的SEM照片及下部膜層的厚度示意圖； 圖4為利用根據本發明的實施例的剝離液組合物剝離彩色光阻（Color Layer）及有機絕緣膜層（Over Coat，OC）之後，形成有金屬配線和下部膜層（無機絕緣膜，SiO x）的基板的SEM照片及下部膜層的厚度示意圖。 Figure 1 is a SEM (scanning electron microscope) photo of a TFT substrate formed with a color photoresist (Color Layer) and an organic insulating film layer (Over Coat, OC) before peeling off; Figure 2 is an enlarged SEM photo of Figure 1 (a ) and the SEM photo (b) after peeling off using the stripping liquid composition of Example 1; Figure 3 shows the metal wiring and the lower part before forming the color photoresist (Color Layer) and the organic insulating film layer (Over Coat, OC). SEM photos of the substrate with the film layer (inorganic insulating film, SiO After the Over Coat (OC) layer, a SEM photo of the substrate with metal wiring and a lower film layer (inorganic insulating film, SiO x ) formed and a schematic diagram of the thickness of the lower film layer.
Claims (20)
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|---|---|---|---|
| KR10-2021-0194449 | 2021-12-31 | ||
| KR1020210194449A KR20230103515A (en) | 2021-12-31 | 2021-12-31 | Stripper composition for removing color resist and insulating layer |
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| TW202334505A true TW202334505A (en) | 2023-09-01 |
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| TW111150825A TW202334505A (en) | 2021-12-31 | 2022-12-30 | Stripper composition for removing color resist and insulating layer |
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| KR (1) | KR20230103515A (en) |
| CN (1) | CN116382046A (en) |
| TW (1) | TW202334505A (en) |
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| KR20230103515A (en) | 2023-07-07 |
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