TWI437267B - A projection optical system, an exposure apparatus, and a device manufacturing method - Google Patents
A projection optical system, an exposure apparatus, and a device manufacturing method Download PDFInfo
- Publication number
- TWI437267B TWI437267B TW099128858A TW99128858A TWI437267B TW I437267 B TWI437267 B TW I437267B TW 099128858 A TW099128858 A TW 099128858A TW 99128858 A TW99128858 A TW 99128858A TW I437267 B TWI437267 B TW I437267B
- Authority
- TW
- Taiwan
- Prior art keywords
- optical system
- magnification
- mirror
- lens
- projection optical
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2008—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70225—Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Lenses (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009232865A JP5595001B2 (ja) | 2009-10-06 | 2009-10-06 | 投影光学系、露光装置及びデバイス製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201118419A TW201118419A (en) | 2011-06-01 |
TWI437267B true TWI437267B (zh) | 2014-05-11 |
Family
ID=43886431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099128858A TWI437267B (zh) | 2009-10-06 | 2010-08-27 | A projection optical system, an exposure apparatus, and a device manufacturing method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5595001B2 (ja) |
KR (1) | KR101476871B1 (ja) |
CN (1) | CN102033315B (ja) |
TW (1) | TWI437267B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI825339B (zh) * | 2019-09-04 | 2023-12-11 | 日商佳能股份有限公司 | 曝光裝置,及物品的製造方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012205096B3 (de) | 2012-03-29 | 2013-08-29 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage mit mindestens einem Manipulator |
JP6041541B2 (ja) * | 2012-06-04 | 2016-12-07 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
CN106168738B (zh) * | 2012-06-04 | 2019-08-13 | 应用材料公司 | 光学投影阵列曝光系统 |
JP6410406B2 (ja) * | 2012-11-16 | 2018-10-24 | キヤノン株式会社 | 投影光学系、露光装置および物品の製造方法 |
JP6386896B2 (ja) | 2014-12-02 | 2018-09-05 | キヤノン株式会社 | 投影光学系、露光装置、および、デバイス製造方法 |
JP6896404B2 (ja) * | 2016-11-30 | 2021-06-30 | キヤノン株式会社 | 露光装置及び物品の製造方法 |
JP7005364B2 (ja) * | 2018-01-29 | 2022-01-21 | キヤノン株式会社 | 投影光学系、露光装置、物品の製造方法及び調整方法 |
JP2023004358A (ja) | 2021-06-25 | 2023-01-17 | キヤノン株式会社 | 投影光学系、露光装置、および物品の製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6235620A (ja) * | 1985-08-09 | 1987-02-16 | Canon Inc | 光学倍率補正装置 |
JP3445021B2 (ja) * | 1995-04-28 | 2003-09-08 | キヤノン株式会社 | 光学装置 |
JP3884098B2 (ja) * | 1996-03-22 | 2007-02-21 | 株式会社東芝 | 露光装置および露光方法 |
JP2002329651A (ja) * | 2001-04-27 | 2002-11-15 | Nikon Corp | 露光装置、露光装置の製造方法、及びマイクロデバイスの製造方法 |
JP3465793B2 (ja) * | 2002-10-24 | 2003-11-10 | 株式会社ニコン | 投影露光装置及び投影露光方法 |
JP4195674B2 (ja) * | 2004-03-31 | 2008-12-10 | 株式会社オーク製作所 | 投影光学系および投影露光装置 |
JP2006337528A (ja) * | 2005-05-31 | 2006-12-14 | Fujifilm Holdings Corp | 画像露光装置 |
JP5118407B2 (ja) * | 2007-07-31 | 2013-01-16 | キヤノン株式会社 | 光学系、露光装置及びデバイス製造方法 |
JP2009098467A (ja) * | 2007-10-18 | 2009-05-07 | Adtec Engineeng Co Ltd | 露光装置 |
-
2009
- 2009-10-06 JP JP2009232865A patent/JP5595001B2/ja active Active
-
2010
- 2010-08-27 TW TW099128858A patent/TWI437267B/zh active
- 2010-09-27 CN CN2010102979545A patent/CN102033315B/zh active Active
- 2010-09-28 KR KR1020100093681A patent/KR101476871B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI825339B (zh) * | 2019-09-04 | 2023-12-11 | 日商佳能股份有限公司 | 曝光裝置,及物品的製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101476871B1 (ko) | 2014-12-26 |
JP5595001B2 (ja) | 2014-09-24 |
TW201118419A (en) | 2011-06-01 |
JP2011082311A (ja) | 2011-04-21 |
KR20110037857A (ko) | 2011-04-13 |
CN102033315B (zh) | 2012-12-12 |
CN102033315A (zh) | 2011-04-27 |
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