TWI428619B - 印刷電子部件之非接觸式測試 - Google Patents
印刷電子部件之非接觸式測試 Download PDFInfo
- Publication number
- TWI428619B TWI428619B TW099114679A TW99114679A TWI428619B TW I428619 B TWI428619 B TW I428619B TW 099114679 A TW099114679 A TW 099114679A TW 99114679 A TW99114679 A TW 99114679A TW I428619 B TWI428619 B TW I428619B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- test
- light
- test circuit
- printing
- Prior art date
Links
- 238000012360 testing method Methods 0.000 title claims description 116
- 238000007639 printing Methods 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 24
- 230000003287 optical effect Effects 0.000 claims description 20
- 230000008859 change Effects 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 description 14
- 230000004044 response Effects 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 238000012546 transfer Methods 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 238000010998 test method Methods 0.000 description 5
- 230000004913 activation Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 239000000976 ink Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000013086 organic photovoltaic Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000010191 image analysis Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001208 nuclear magnetic resonance pulse sequence Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- OBAJPWYDYFEBTF-UHFFFAOYSA-N 2-tert-butyl-9,10-dinaphthalen-2-ylanthracene Chemical compound C1=CC=CC2=CC(C3=C4C=CC=CC4=C(C=4C=C5C=CC=CC5=CC=4)C4=CC=C(C=C43)C(C)(C)C)=CC=C21 OBAJPWYDYFEBTF-UHFFFAOYSA-N 0.000 description 1
- DIVZFUBWFAOMCW-UHFFFAOYSA-N 4-n-(3-methylphenyl)-1-n,1-n-bis[4-(n-(3-methylphenyl)anilino)phenyl]-4-n-phenylbenzene-1,4-diamine Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)N(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 DIVZFUBWFAOMCW-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002650 laminated plastic Substances 0.000 description 1
- 230000004298 light response Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004876 x-ray fluorescence Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/304—Contactless testing of printed or hybrid circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Toxicology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Testing Of Optical Devices Or Fibers (AREA)
- Tests Of Electronic Circuits (AREA)
- Electroluminescent Light Sources (AREA)
- Accessory Devices And Overall Control Thereof (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/437,779 US8378702B2 (en) | 2009-05-08 | 2009-05-08 | Non-contact testing of printed electronics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201042274A TW201042274A (en) | 2010-12-01 |
| TWI428619B true TWI428619B (zh) | 2014-03-01 |
Family
ID=43050834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099114679A TWI428619B (zh) | 2009-05-08 | 2010-05-07 | 印刷電子部件之非接觸式測試 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US8378702B2 (enExample) |
| JP (1) | JP5374639B2 (enExample) |
| KR (1) | KR101579640B1 (enExample) |
| CN (1) | CN102422172B (enExample) |
| TW (1) | TWI428619B (enExample) |
| WO (1) | WO2010129627A2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT507322B1 (de) * | 2008-10-07 | 2011-07-15 | Nanoident Technologies Ag | Schaltvorrichtung zur elektrischen kontaktprüfung |
| US8742782B2 (en) * | 2011-07-27 | 2014-06-03 | International Business Machines Corporation | Noncontact electrical testing with optical techniques |
| EP3174723A4 (en) | 2014-07-31 | 2018-05-16 | Hewlett-Packard Development Company, L.P. | Ion writing calibration |
| US9523735B2 (en) * | 2014-10-08 | 2016-12-20 | Eastman Kodak Company | Electrical test system with vision-guided alignment |
| TWM534337U (en) * | 2015-11-18 | 2016-12-21 | Oriental Inst Technology | Electrical test equipment for flexible material |
| US9806828B2 (en) | 2016-02-24 | 2017-10-31 | Frontier Engineering, Llc | Radio frequency generator automated test system |
| CN109375085A (zh) * | 2018-09-03 | 2019-02-22 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | 非接触式板级电路中功率器件健康监测及预警系统与方法 |
| CN111337079A (zh) * | 2020-03-20 | 2020-06-26 | 深圳市同创鑫电子有限公司 | 一种印刷电路板生产用测试检查方法 |
| CN115683571B (zh) * | 2022-10-31 | 2024-10-22 | 苏州工业园区精泰达自动化有限公司 | 智能手表亮屏出厂检测工装 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3956698A (en) * | 1974-02-12 | 1976-05-11 | Westinghouse Electric Corporation | Contactless test method for integrated circuits |
| US4820916A (en) * | 1987-05-05 | 1989-04-11 | Simmonds Precision Products | Optically powered sensor system |
| JP2588565B2 (ja) * | 1988-02-16 | 1997-03-05 | 富士通株式会社 | 印刷配線板の導通検査装置 |
| JPH02262071A (ja) * | 1989-03-31 | 1990-10-24 | Sekisui Chem Co Ltd | 導通検査方法 |
| US6156450A (en) * | 1997-07-24 | 2000-12-05 | Eveready Battery Company, Inc. | Battery tester having printed electronic components |
| KR20010072835A (ko) * | 1998-08-21 | 2001-07-31 | 추후제출 | 전기 회로 및 구성요소의 프린팅 |
| US6300785B1 (en) * | 1998-10-20 | 2001-10-09 | International Business Machines Corporation | Contact-less probe of semiconductor wafers |
| US6448802B1 (en) * | 1998-12-21 | 2002-09-10 | Intel Corporation | Photosensors for testing an integrated circuit |
| US6147662A (en) * | 1999-09-10 | 2000-11-14 | Moore North America, Inc. | Radio frequency identification tags and labels |
| CA2296143A1 (fr) * | 2000-01-18 | 2001-07-18 | 9071 9410 Quebec Inc. | Systeme d'inspection optique |
| TW501293B (en) * | 2001-01-06 | 2002-09-01 | Acer Inc | Method and device to raise the battery efficiency of portable electronic device |
| US6603302B2 (en) * | 2001-08-01 | 2003-08-05 | Frank Joseph Prineppi | Circuit testers |
| US6859031B2 (en) * | 2002-02-01 | 2005-02-22 | Credence Systems Corporation | Apparatus and method for dynamic diagnostic testing of integrated circuits |
| JP2004341216A (ja) * | 2003-05-15 | 2004-12-02 | Seiko Epson Corp | 電気光学装置用基板及びその製造方法、並びに該電気光学装置用基板を備えた電気光学装置及び電子機器 |
| US6815973B1 (en) * | 2003-06-13 | 2004-11-09 | Xilinx, Inc. | Optical testing port and wafer level testing without probe cards |
| US7057409B2 (en) * | 2003-12-16 | 2006-06-06 | Texas Instruments Incorporated | Method and apparatus for non-invasively testing integrated circuits |
| US7215133B2 (en) * | 2004-01-30 | 2007-05-08 | International Business Machines Corporation | Contactless circuit testing for adaptive wafer processing |
| JP5178192B2 (ja) * | 2004-07-06 | 2013-04-10 | マリミルズ オサケ ユキチュア | 電界検出用センサ製品 |
| US20060139041A1 (en) * | 2004-12-23 | 2006-06-29 | Nystrom Michael J | System and method of testing and utilizing a fluid stream |
| US7301458B2 (en) * | 2005-05-11 | 2007-11-27 | Alien Technology Corporation | Method and apparatus for testing RFID devices |
| US7202691B2 (en) * | 2005-05-31 | 2007-04-10 | Semiconductor Diagnostics, Inc. | Non-contact method for acquiring charge-voltage data on miniature test areas of semiconductor product wafers |
| US20060279297A1 (en) * | 2005-06-10 | 2006-12-14 | Nystrom Michael J | Contactless area testing apparatus and method utilizing device switching |
| US7410815B2 (en) * | 2005-08-25 | 2008-08-12 | Nanometrics Incorporated | Apparatus and method for non-contact assessment of a constituent in semiconductor substrates |
| US20070130490A1 (en) * | 2005-12-02 | 2007-06-07 | Shmuel Silverman | Information protection using properties of a printed electronic circuit |
| US20070234918A1 (en) * | 2006-03-31 | 2007-10-11 | Edward Hirahara | System and method for making printed electronic circuits using electrophotography |
| DE102006033713A1 (de) * | 2006-05-30 | 2007-12-06 | Osram Opto Semiconductors Gmbh | Organisches lichtemittierendes Bauelement, Vorrichtung mit einem organischen lichtemittierenden Bauelement und Beleuchtungseinrichtung sowie Verfahren zur Herstellung eines organischen lichtemittierenden Bauelements |
| KR100844861B1 (ko) * | 2006-08-03 | 2008-07-09 | (주) 파루 | 전자잉크 제조용 조성물 및 그 제조방법 |
| JP2008052168A (ja) * | 2006-08-28 | 2008-03-06 | Toppan Printing Co Ltd | 液晶表示装置の製造方法 |
| US20080084678A1 (en) * | 2006-10-10 | 2008-04-10 | Motorola, Inc. | Printed circuit board and a method for imbedding a battery in a printed circuit board |
| JP2008149311A (ja) * | 2006-11-21 | 2008-07-03 | Ricoh Co Ltd | 電子部品製造装置、パターン配線シート、電子デバイスシートおよびシート |
| US8378708B2 (en) | 2007-04-17 | 2013-02-19 | Okins Electronics Co., Ltd | Inspecting method using an electro optical detector |
| JP2009080262A (ja) * | 2007-09-26 | 2009-04-16 | Toppan Printing Co Ltd | 電気泳動表示方式記録メディアおよびそのレコーダー |
-
2009
- 2009-05-08 US US12/437,779 patent/US8378702B2/en not_active Expired - Fee Related
-
2010
- 2010-05-05 CN CN201080020891.7A patent/CN102422172B/zh not_active Expired - Fee Related
- 2010-05-05 WO PCT/US2010/033650 patent/WO2010129627A2/en not_active Ceased
- 2010-05-05 KR KR1020117029382A patent/KR101579640B1/ko not_active Expired - Fee Related
- 2010-05-05 JP JP2012509934A patent/JP5374639B2/ja not_active Expired - Fee Related
- 2010-05-07 TW TW099114679A patent/TWI428619B/zh not_active IP Right Cessation
-
2013
- 2013-01-18 US US13/744,841 patent/US9360519B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20100283499A1 (en) | 2010-11-11 |
| CN102422172B (zh) | 2015-11-25 |
| CN102422172A (zh) | 2012-04-18 |
| WO2010129627A2 (en) | 2010-11-11 |
| KR20120027319A (ko) | 2012-03-21 |
| JP2012526284A (ja) | 2012-10-25 |
| US9360519B2 (en) | 2016-06-07 |
| WO2010129627A3 (en) | 2011-02-24 |
| JP5374639B2 (ja) | 2013-12-25 |
| US20130127487A1 (en) | 2013-05-23 |
| KR101579640B1 (ko) | 2015-12-22 |
| TW201042274A (en) | 2010-12-01 |
| US8378702B2 (en) | 2013-02-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI428619B (zh) | 印刷電子部件之非接觸式測試 | |
| US20100202925A1 (en) | Titer plate with thin-film-light sensor | |
| JP2006078473A (ja) | 接触式画像センサを備えているウェブ検査モジュール | |
| US7997200B2 (en) | Printing machine and a method for producing a printed product | |
| JP2006078473A5 (enExample) | ||
| US20110241721A1 (en) | Switching apparatus for electrical contact testing | |
| SE511822C2 (sv) | Anordning och metod för att markera defekter på en transparent remsa | |
| US9927230B2 (en) | Method and apparatus for detecting the fitness for circulation of a value document | |
| JP2013092469A (ja) | ワーク検査システム | |
| CN109870887A (zh) | 纸张传感器装置及图像形成装置 | |
| TWI556980B (zh) | 用於在印刷處理期間偵測基板對準的系統與方法 | |
| WO2015058795A1 (en) | Edge detector | |
| KR101121680B1 (ko) | 선형 엔코더를 이용한 정밀 인쇄 방법 및 장치 | |
| KR101232890B1 (ko) | 선형 엔코더를 이용한 정밀 인쇄 방법 및 장치 | |
| KR102418949B1 (ko) | 레지스터 측정장치 및 이를 포함하는 인쇄 시스템 | |
| KR101294358B1 (ko) | 선형 엔코더를 이용한 정밀 인쇄 방법 및 장치 | |
| KR100853861B1 (ko) | 잉크젯 ｐｃｂ 회로패턴의 결함 검사 장치 및 방법 | |
| TW201207418A (en) | Measurement apparatuses for conductive patterns on substrates | |
| CN206192920U (zh) | 一种印刷检测装置 | |
| CN106827808A (zh) | 一种智能化烫金效果检验装置 | |
| JP2001157000A (ja) | 位置検知方法およびイメージング装置 | |
| JP2024148644A (ja) | 画像解析装置、画像解析方法、及びプログラム | |
| CN115372249A (zh) | 一种导电纳米聚合物薄膜内部损伤检测单元及装置 | |
| Qiao et al. | Research and Development of Print Quality Inspection System of Biochips | |
| KR20140034571A (ko) | 유전체 검사 장치 및 유전체 검사 방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |