CN102422172B - 印刷电子器件的非接触测试 - Google Patents

印刷电子器件的非接触测试 Download PDF

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Publication number
CN102422172B
CN102422172B CN201080020891.7A CN201080020891A CN102422172B CN 102422172 B CN102422172 B CN 102422172B CN 201080020891 A CN201080020891 A CN 201080020891A CN 102422172 B CN102422172 B CN 102422172B
Authority
CN
China
Prior art keywords
substrate
test circuit
light
energy
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080020891.7A
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English (en)
Chinese (zh)
Other versions
CN102422172A (zh
Inventor
R·A·邦德洛
D·E·布拉克利
K·T·加哈根
G·E·莫兹
L·R·佐勒三世
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of CN102422172A publication Critical patent/CN102422172A/zh
Application granted granted Critical
Publication of CN102422172B publication Critical patent/CN102422172B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/304—Contactless testing of printed or hybrid circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Toxicology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Electroluminescent Light Sources (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)
CN201080020891.7A 2009-05-08 2010-05-05 印刷电子器件的非接触测试 Expired - Fee Related CN102422172B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/437,779 2009-05-08
US12/437,779 US8378702B2 (en) 2009-05-08 2009-05-08 Non-contact testing of printed electronics
PCT/US2010/033650 WO2010129627A2 (en) 2009-05-08 2010-05-05 Non-contact testing of printed electronics

Publications (2)

Publication Number Publication Date
CN102422172A CN102422172A (zh) 2012-04-18
CN102422172B true CN102422172B (zh) 2015-11-25

Family

ID=43050834

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080020891.7A Expired - Fee Related CN102422172B (zh) 2009-05-08 2010-05-05 印刷电子器件的非接触测试

Country Status (6)

Country Link
US (2) US8378702B2 (enExample)
JP (1) JP5374639B2 (enExample)
KR (1) KR101579640B1 (enExample)
CN (1) CN102422172B (enExample)
TW (1) TWI428619B (enExample)
WO (1) WO2010129627A2 (enExample)

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AT507322B1 (de) * 2008-10-07 2011-07-15 Nanoident Technologies Ag Schaltvorrichtung zur elektrischen kontaktprüfung
US8742782B2 (en) * 2011-07-27 2014-06-03 International Business Machines Corporation Noncontact electrical testing with optical techniques
EP3174723A4 (en) 2014-07-31 2018-05-16 Hewlett-Packard Development Company, L.P. Ion writing calibration
US9523735B2 (en) * 2014-10-08 2016-12-20 Eastman Kodak Company Electrical test system with vision-guided alignment
TWM534337U (en) * 2015-11-18 2016-12-21 Oriental Inst Technology Electrical test equipment for flexible material
US9806828B2 (en) 2016-02-24 2017-10-31 Frontier Engineering, Llc Radio frequency generator automated test system
CN109375085A (zh) * 2018-09-03 2019-02-22 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） 非接触式板级电路中功率器件健康监测及预警系统与方法
CN111337079A (zh) * 2020-03-20 2020-06-26 深圳市同创鑫电子有限公司 一种印刷电路板生产用测试检查方法
CN115683571B (zh) * 2022-10-31 2024-10-22 苏州工业园区精泰达自动化有限公司 智能手表亮屏出厂检测工装

Citations (7)

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US6147662A (en) * 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
US6771807B2 (en) * 2000-01-18 2004-08-03 Solvision Inc. Method and system for detecting defects on a printed circuit board
US6815973B1 (en) * 2003-06-13 2004-11-09 Xilinx, Inc. Optical testing port and wafer level testing without probe cards
US6855378B1 (en) * 1998-08-21 2005-02-15 Sri International Printing of electronic circuits and components
US20070048948A1 (en) * 2005-08-25 2007-03-01 Accent Optical Technologies, Inc. Apparatus and method for non-contact assessment of a constituent in semiconductor substrates
US20070234918A1 (en) * 2006-03-31 2007-10-11 Edward Hirahara System and method for making printed electronic circuits using electrophotography
US7301458B2 (en) * 2005-05-11 2007-11-27 Alien Technology Corporation Method and apparatus for testing RFID devices

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US3956698A (en) * 1974-02-12 1976-05-11 Westinghouse Electric Corporation Contactless test method for integrated circuits
US4820916A (en) * 1987-05-05 1989-04-11 Simmonds Precision Products Optically powered sensor system
JP2588565B2 (ja) * 1988-02-16 1997-03-05 富士通株式会社 印刷配線板の導通検査装置
JPH02262071A (ja) * 1989-03-31 1990-10-24 Sekisui Chem Co Ltd 導通検査方法
US6156450A (en) * 1997-07-24 2000-12-05 Eveready Battery Company, Inc. Battery tester having printed electronic components
US6300785B1 (en) * 1998-10-20 2001-10-09 International Business Machines Corporation Contact-less probe of semiconductor wafers
US6448802B1 (en) * 1998-12-21 2002-09-10 Intel Corporation Photosensors for testing an integrated circuit
TW501293B (en) * 2001-01-06 2002-09-01 Acer Inc Method and device to raise the battery efficiency of portable electronic device
US6603302B2 (en) * 2001-08-01 2003-08-05 Frank Joseph Prineppi Circuit testers
US6859031B2 (en) * 2002-02-01 2005-02-22 Credence Systems Corporation Apparatus and method for dynamic diagnostic testing of integrated circuits
JP2004341216A (ja) * 2003-05-15 2004-12-02 Seiko Epson Corp 電気光学装置用基板及びその製造方法、並びに該電気光学装置用基板を備えた電気光学装置及び電子機器
US7057409B2 (en) * 2003-12-16 2006-06-06 Texas Instruments Incorporated Method and apparatus for non-invasively testing integrated circuits
US7215133B2 (en) * 2004-01-30 2007-05-08 International Business Machines Corporation Contactless circuit testing for adaptive wafer processing
JP5178192B2 (ja) * 2004-07-06 2013-04-10 マリミルズ オサケ ユキチュア 電界検出用センサ製品
US20060139041A1 (en) * 2004-12-23 2006-06-29 Nystrom Michael J System and method of testing and utilizing a fluid stream
US7202691B2 (en) * 2005-05-31 2007-04-10 Semiconductor Diagnostics, Inc. Non-contact method for acquiring charge-voltage data on miniature test areas of semiconductor product wafers
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US20070130490A1 (en) * 2005-12-02 2007-06-07 Shmuel Silverman Information protection using properties of a printed electronic circuit
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KR100844861B1 (ko) * 2006-08-03 2008-07-09 (주) 파루 전자잉크 제조용 조성물 및 그 제조방법
JP2008052168A (ja) * 2006-08-28 2008-03-06 Toppan Printing Co Ltd 液晶表示装置の製造方法
US20080084678A1 (en) * 2006-10-10 2008-04-10 Motorola, Inc. Printed circuit board and a method for imbedding a battery in a printed circuit board
JP2008149311A (ja) * 2006-11-21 2008-07-03 Ricoh Co Ltd 電子部品製造装置、パターン配線シート、電子デバイスシートおよびシート
US8378708B2 (en) 2007-04-17 2013-02-19 Okins Electronics Co., Ltd Inspecting method using an electro optical detector
JP2009080262A (ja) * 2007-09-26 2009-04-16 Toppan Printing Co Ltd 電気泳動表示方式記録メディアおよびそのレコーダー

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6855378B1 (en) * 1998-08-21 2005-02-15 Sri International Printing of electronic circuits and components
US6147662A (en) * 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
US6771807B2 (en) * 2000-01-18 2004-08-03 Solvision Inc. Method and system for detecting defects on a printed circuit board
US6815973B1 (en) * 2003-06-13 2004-11-09 Xilinx, Inc. Optical testing port and wafer level testing without probe cards
US7301458B2 (en) * 2005-05-11 2007-11-27 Alien Technology Corporation Method and apparatus for testing RFID devices
US20070048948A1 (en) * 2005-08-25 2007-03-01 Accent Optical Technologies, Inc. Apparatus and method for non-contact assessment of a constituent in semiconductor substrates
US20070234918A1 (en) * 2006-03-31 2007-10-11 Edward Hirahara System and method for making printed electronic circuits using electrophotography

Also Published As

Publication number Publication date
US20100283499A1 (en) 2010-11-11
TWI428619B (zh) 2014-03-01
CN102422172A (zh) 2012-04-18
WO2010129627A2 (en) 2010-11-11
KR20120027319A (ko) 2012-03-21
JP2012526284A (ja) 2012-10-25
US9360519B2 (en) 2016-06-07
WO2010129627A3 (en) 2011-02-24
JP5374639B2 (ja) 2013-12-25
US20130127487A1 (en) 2013-05-23
KR101579640B1 (ko) 2015-12-22
TW201042274A (en) 2010-12-01
US8378702B2 (en) 2013-02-19

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151125

Termination date: 20170505

CF01 Termination of patent right due to non-payment of annual fee