WO2010129627A2 - Non-contact testing of printed electronics - Google Patents

Non-contact testing of printed electronics Download PDF

Info

Publication number
WO2010129627A2
WO2010129627A2 PCT/US2010/033650 US2010033650W WO2010129627A2 WO 2010129627 A2 WO2010129627 A2 WO 2010129627A2 US 2010033650 W US2010033650 W US 2010033650W WO 2010129627 A2 WO2010129627 A2 WO 2010129627A2
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
test circuit
electronic component
energy
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2010/033650
Other languages
English (en)
French (fr)
Other versions
WO2010129627A3 (en
Inventor
Robert A Boudreau
Douglas E Brackley
Kevin T Gahagan
Gary E Merz
Leon R. Zoeller, Iii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Priority to CN201080020891.7A priority Critical patent/CN102422172B/zh
Priority to JP2012509934A priority patent/JP5374639B2/ja
Publication of WO2010129627A2 publication Critical patent/WO2010129627A2/en
Publication of WO2010129627A3 publication Critical patent/WO2010129627A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/304—Contactless testing of printed or hybrid circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance

Definitions

  • This disclosure relates to the printing of electronics on substrates, e.g., thin glass substrates, and, in particular, to non-contact testing of printed electronics on such substrates.
  • test circuit (11) includes:
  • FIG. 4 is a schematic diagram illustrating scanning of a web with a contact sensor.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Toxicology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Electroluminescent Light Sources (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)
PCT/US2010/033650 2009-05-08 2010-05-05 Non-contact testing of printed electronics Ceased WO2010129627A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201080020891.7A CN102422172B (zh) 2009-05-08 2010-05-05 印刷电子器件的非接触测试
JP2012509934A JP5374639B2 (ja) 2009-05-08 2010-05-05 プリンテッドエレクトロニクスの非接触試験

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/437,779 2009-05-08
US12/437,779 US8378702B2 (en) 2009-05-08 2009-05-08 Non-contact testing of printed electronics

Publications (2)

Publication Number Publication Date
WO2010129627A2 true WO2010129627A2 (en) 2010-11-11
WO2010129627A3 WO2010129627A3 (en) 2011-02-24

Family

ID=43050834

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/033650 Ceased WO2010129627A2 (en) 2009-05-08 2010-05-05 Non-contact testing of printed electronics

Country Status (6)

Country Link
US (2) US8378702B2 (enExample)
JP (1) JP5374639B2 (enExample)
KR (1) KR101579640B1 (enExample)
CN (1) CN102422172B (enExample)
TW (1) TWI428619B (enExample)
WO (1) WO2010129627A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT507322B1 (de) * 2008-10-07 2011-07-15 Nanoident Technologies Ag Schaltvorrichtung zur elektrischen kontaktprüfung
US8742782B2 (en) * 2011-07-27 2014-06-03 International Business Machines Corporation Noncontact electrical testing with optical techniques
EP3174723A4 (en) 2014-07-31 2018-05-16 Hewlett-Packard Development Company, L.P. Ion writing calibration
US9523735B2 (en) * 2014-10-08 2016-12-20 Eastman Kodak Company Electrical test system with vision-guided alignment
TWM534337U (en) * 2015-11-18 2016-12-21 Oriental Inst Technology Electrical test equipment for flexible material
US9806828B2 (en) 2016-02-24 2017-10-31 Frontier Engineering, Llc Radio frequency generator automated test system
CN109375085A (zh) * 2018-09-03 2019-02-22 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） 非接触式板级电路中功率器件健康监测及预警系统与方法
CN111337079A (zh) * 2020-03-20 2020-06-26 深圳市同创鑫电子有限公司 一种印刷电路板生产用测试检查方法
CN115683571B (zh) * 2022-10-31 2024-10-22 苏州工业园区精泰达自动化有限公司 智能手表亮屏出厂检测工装

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3956698A (en) * 1974-02-12 1976-05-11 Westinghouse Electric Corporation Contactless test method for integrated circuits
US4820916A (en) * 1987-05-05 1989-04-11 Simmonds Precision Products Optically powered sensor system
JP2588565B2 (ja) * 1988-02-16 1997-03-05 富士通株式会社 印刷配線板の導通検査装置
JPH02262071A (ja) * 1989-03-31 1990-10-24 Sekisui Chem Co Ltd 導通検査方法
US6156450A (en) * 1997-07-24 2000-12-05 Eveready Battery Company, Inc. Battery tester having printed electronic components
KR20010072835A (ko) * 1998-08-21 2001-07-31 추후제출 전기 회로 및 구성요소의 프린팅
US6300785B1 (en) * 1998-10-20 2001-10-09 International Business Machines Corporation Contact-less probe of semiconductor wafers
US6448802B1 (en) * 1998-12-21 2002-09-10 Intel Corporation Photosensors for testing an integrated circuit
US6147662A (en) * 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
CA2296143A1 (fr) * 2000-01-18 2001-07-18 9071 9410 Quebec Inc. Systeme d'inspection optique
TW501293B (en) * 2001-01-06 2002-09-01 Acer Inc Method and device to raise the battery efficiency of portable electronic device
US6603302B2 (en) * 2001-08-01 2003-08-05 Frank Joseph Prineppi Circuit testers
US6859031B2 (en) * 2002-02-01 2005-02-22 Credence Systems Corporation Apparatus and method for dynamic diagnostic testing of integrated circuits
JP2004341216A (ja) * 2003-05-15 2004-12-02 Seiko Epson Corp 電気光学装置用基板及びその製造方法、並びに該電気光学装置用基板を備えた電気光学装置及び電子機器
US6815973B1 (en) * 2003-06-13 2004-11-09 Xilinx, Inc. Optical testing port and wafer level testing without probe cards
US7057409B2 (en) * 2003-12-16 2006-06-06 Texas Instruments Incorporated Method and apparatus for non-invasively testing integrated circuits
US7215133B2 (en) * 2004-01-30 2007-05-08 International Business Machines Corporation Contactless circuit testing for adaptive wafer processing
JP5178192B2 (ja) * 2004-07-06 2013-04-10 マリミルズ オサケ ユキチュア 電界検出用センサ製品
US20060139041A1 (en) * 2004-12-23 2006-06-29 Nystrom Michael J System and method of testing and utilizing a fluid stream
US7301458B2 (en) * 2005-05-11 2007-11-27 Alien Technology Corporation Method and apparatus for testing RFID devices
US7202691B2 (en) * 2005-05-31 2007-04-10 Semiconductor Diagnostics, Inc. Non-contact method for acquiring charge-voltage data on miniature test areas of semiconductor product wafers
US20060279297A1 (en) * 2005-06-10 2006-12-14 Nystrom Michael J Contactless area testing apparatus and method utilizing device switching
US7410815B2 (en) * 2005-08-25 2008-08-12 Nanometrics Incorporated Apparatus and method for non-contact assessment of a constituent in semiconductor substrates
US20070130490A1 (en) * 2005-12-02 2007-06-07 Shmuel Silverman Information protection using properties of a printed electronic circuit
US20070234918A1 (en) * 2006-03-31 2007-10-11 Edward Hirahara System and method for making printed electronic circuits using electrophotography
DE102006033713A1 (de) * 2006-05-30 2007-12-06 Osram Opto Semiconductors Gmbh Organisches lichtemittierendes Bauelement, Vorrichtung mit einem organischen lichtemittierenden Bauelement und Beleuchtungseinrichtung sowie Verfahren zur Herstellung eines organischen lichtemittierenden Bauelements
KR100844861B1 (ko) * 2006-08-03 2008-07-09 (주) 파루 전자잉크 제조용 조성물 및 그 제조방법
JP2008052168A (ja) * 2006-08-28 2008-03-06 Toppan Printing Co Ltd 液晶表示装置の製造方法
US20080084678A1 (en) * 2006-10-10 2008-04-10 Motorola, Inc. Printed circuit board and a method for imbedding a battery in a printed circuit board
JP2008149311A (ja) * 2006-11-21 2008-07-03 Ricoh Co Ltd 電子部品製造装置、パターン配線シート、電子デバイスシートおよびシート
US8378708B2 (en) 2007-04-17 2013-02-19 Okins Electronics Co., Ltd Inspecting method using an electro optical detector
JP2009080262A (ja) * 2007-09-26 2009-04-16 Toppan Printing Co Ltd 電気泳動表示方式記録メディアおよびそのレコーダー

Also Published As

Publication number Publication date
US20100283499A1 (en) 2010-11-11
CN102422172B (zh) 2015-11-25
TWI428619B (zh) 2014-03-01
CN102422172A (zh) 2012-04-18
KR20120027319A (ko) 2012-03-21
JP2012526284A (ja) 2012-10-25
US9360519B2 (en) 2016-06-07
WO2010129627A3 (en) 2011-02-24
JP5374639B2 (ja) 2013-12-25
US20130127487A1 (en) 2013-05-23
KR101579640B1 (ko) 2015-12-22
TW201042274A (en) 2010-12-01
US8378702B2 (en) 2013-02-19

Similar Documents

Publication Publication Date Title
US9360519B2 (en) Non-contact testing of printed electronics
JP2012083362A (ja) 接触式画像センサを備えているウェブ検査モジュール
RO118987B1 (ro) Metodă de verificare a documentelor
US20090188405A1 (en) Printing machine and a method for producing a printed product
JP2003232737A (ja) 基板上に印刷されるポリマー量をポリマーの光学特性を利用して光学測定するための装置及び方法
EP0938664B1 (en) Device and method for marking defects
JP3177347U (ja) 紙質材料判定装置
US9927230B2 (en) Method and apparatus for detecting the fitness for circulation of a value document
JP2013092469A (ja) ワーク検査システム
TWI556980B (zh) 用於在印刷處理期間偵測基板對準的系統與方法
CN1326708C (zh) 标记判定方法及标记判定装置
US9662909B2 (en) Edge detector
KR101121680B1 (ko) 선형 엔코더를 이용한 정밀 인쇄 방법 및 장치
KR101232890B1 (ko) 선형 엔코더를 이용한 정밀 인쇄 방법 및 장치
US20070019059A1 (en) Skewing compensation method and apparatus in a laser based image-forming system
KR101294358B1 (ko) 선형 엔코더를 이용한 정밀 인쇄 방법 및 장치
CN115372249B (zh) 一种导电纳米聚合物薄膜内部损伤检测单元及装置
KR102418949B1 (ko) 레지스터 측정장치 및 이를 포함하는 인쇄 시스템
TW201207418A (en) Measurement apparatuses for conductive patterns on substrates
US20050254074A1 (en) Auto-tracking spectrophotometer
JP2006126026A (ja) 回路基板の断線検査装置
KR20140034571A (ko) 유전체 검사 장치 및 유전체 검사 방법
JPH09126859A (ja) 液面検出装置
JPH07104138B2 (ja) プリント配線板のパターン幅測定方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201080020891.7

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10772737

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2012509934

Country of ref document: JP

ENP Entry into the national phase

Ref document number: 20117029382

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 10772737

Country of ref document: EP

Kind code of ref document: A2