JP5374639B2 - プリンテッドエレクトロニクスの非接触試験 - Google Patents

プリンテッドエレクトロニクスの非接触試験 Download PDF

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Publication number
JP5374639B2
JP5374639B2 JP2012509934A JP2012509934A JP5374639B2 JP 5374639 B2 JP5374639 B2 JP 5374639B2 JP 2012509934 A JP2012509934 A JP 2012509934A JP 2012509934 A JP2012509934 A JP 2012509934A JP 5374639 B2 JP5374639 B2 JP 5374639B2
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JP
Japan
Prior art keywords
region
test circuit
substrate
light
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012509934A
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English (en)
Japanese (ja)
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JP2012526284A (ja
JP2012526284A5 (enExample
Inventor
エイ ブードロー，ロバート
イー ブラックリー，ダグラス
ティー ガーガン，ケヴィン
イー メルツ，ゲーリー
アール サード ゾイラー，レオン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of JP2012526284A publication Critical patent/JP2012526284A/ja
Publication of JP2012526284A5 publication Critical patent/JP2012526284A5/ja
Application granted granted Critical
Publication of JP5374639B2 publication Critical patent/JP5374639B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/304—Contactless testing of printed or hybrid circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Toxicology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Electroluminescent Light Sources (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)
JP2012509934A 2009-05-08 2010-05-05 プリンテッドエレクトロニクスの非接触試験 Expired - Fee Related JP5374639B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/437,779 2009-05-08
US12/437,779 US8378702B2 (en) 2009-05-08 2009-05-08 Non-contact testing of printed electronics
PCT/US2010/033650 WO2010129627A2 (en) 2009-05-08 2010-05-05 Non-contact testing of printed electronics

Publications (3)

Publication Number Publication Date
JP2012526284A JP2012526284A (ja) 2012-10-25
JP2012526284A5 JP2012526284A5 (enExample) 2013-05-30
JP5374639B2 true JP5374639B2 (ja) 2013-12-25

Family

ID=43050834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012509934A Expired - Fee Related JP5374639B2 (ja) 2009-05-08 2010-05-05 プリンテッドエレクトロニクスの非接触試験

Country Status (6)

Country Link
US (2) US8378702B2 (enExample)
JP (1) JP5374639B2 (enExample)
KR (1) KR101579640B1 (enExample)
CN (1) CN102422172B (enExample)
TW (1) TWI428619B (enExample)
WO (1) WO2010129627A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
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AT507322B1 (de) * 2008-10-07 2011-07-15 Nanoident Technologies Ag Schaltvorrichtung zur elektrischen kontaktprüfung
US8742782B2 (en) * 2011-07-27 2014-06-03 International Business Machines Corporation Noncontact electrical testing with optical techniques
EP3174723A4 (en) 2014-07-31 2018-05-16 Hewlett-Packard Development Company, L.P. Ion writing calibration
US9523735B2 (en) * 2014-10-08 2016-12-20 Eastman Kodak Company Electrical test system with vision-guided alignment
TWM534337U (en) * 2015-11-18 2016-12-21 Oriental Inst Technology Electrical test equipment for flexible material
US9806828B2 (en) 2016-02-24 2017-10-31 Frontier Engineering, Llc Radio frequency generator automated test system
CN109375085A (zh) * 2018-09-03 2019-02-22 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） 非接触式板级电路中功率器件健康监测及预警系统与方法
CN111337079A (zh) * 2020-03-20 2020-06-26 深圳市同创鑫电子有限公司 一种印刷电路板生产用测试检查方法
CN115683571B (zh) * 2022-10-31 2024-10-22 苏州工业园区精泰达自动化有限公司 智能手表亮屏出厂检测工装

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US3956698A (en) * 1974-02-12 1976-05-11 Westinghouse Electric Corporation Contactless test method for integrated circuits
US4820916A (en) * 1987-05-05 1989-04-11 Simmonds Precision Products Optically powered sensor system
JP2588565B2 (ja) * 1988-02-16 1997-03-05 富士通株式会社 印刷配線板の導通検査装置
JPH02262071A (ja) * 1989-03-31 1990-10-24 Sekisui Chem Co Ltd 導通検査方法
US6156450A (en) * 1997-07-24 2000-12-05 Eveready Battery Company, Inc. Battery tester having printed electronic components
KR20010072835A (ko) * 1998-08-21 2001-07-31 추후제출 전기 회로 및 구성요소의 프린팅
US6300785B1 (en) * 1998-10-20 2001-10-09 International Business Machines Corporation Contact-less probe of semiconductor wafers
US6448802B1 (en) * 1998-12-21 2002-09-10 Intel Corporation Photosensors for testing an integrated circuit
US6147662A (en) * 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
CA2296143A1 (fr) * 2000-01-18 2001-07-18 9071 9410 Quebec Inc. Systeme d'inspection optique
TW501293B (en) * 2001-01-06 2002-09-01 Acer Inc Method and device to raise the battery efficiency of portable electronic device
US6603302B2 (en) * 2001-08-01 2003-08-05 Frank Joseph Prineppi Circuit testers
US6859031B2 (en) * 2002-02-01 2005-02-22 Credence Systems Corporation Apparatus and method for dynamic diagnostic testing of integrated circuits
JP2004341216A (ja) * 2003-05-15 2004-12-02 Seiko Epson Corp 電気光学装置用基板及びその製造方法、並びに該電気光学装置用基板を備えた電気光学装置及び電子機器
US6815973B1 (en) * 2003-06-13 2004-11-09 Xilinx, Inc. Optical testing port and wafer level testing without probe cards
US7057409B2 (en) * 2003-12-16 2006-06-06 Texas Instruments Incorporated Method and apparatus for non-invasively testing integrated circuits
US7215133B2 (en) * 2004-01-30 2007-05-08 International Business Machines Corporation Contactless circuit testing for adaptive wafer processing
JP5178192B2 (ja) * 2004-07-06 2013-04-10 マリミルズ オサケ ユキチュア 電界検出用センサ製品
US20060139041A1 (en) * 2004-12-23 2006-06-29 Nystrom Michael J System and method of testing and utilizing a fluid stream
US7301458B2 (en) * 2005-05-11 2007-11-27 Alien Technology Corporation Method and apparatus for testing RFID devices
US7202691B2 (en) * 2005-05-31 2007-04-10 Semiconductor Diagnostics, Inc. Non-contact method for acquiring charge-voltage data on miniature test areas of semiconductor product wafers
US20060279297A1 (en) * 2005-06-10 2006-12-14 Nystrom Michael J Contactless area testing apparatus and method utilizing device switching
US7410815B2 (en) * 2005-08-25 2008-08-12 Nanometrics Incorporated Apparatus and method for non-contact assessment of a constituent in semiconductor substrates
US20070130490A1 (en) * 2005-12-02 2007-06-07 Shmuel Silverman Information protection using properties of a printed electronic circuit
US20070234918A1 (en) * 2006-03-31 2007-10-11 Edward Hirahara System and method for making printed electronic circuits using electrophotography
DE102006033713A1 (de) * 2006-05-30 2007-12-06 Osram Opto Semiconductors Gmbh Organisches lichtemittierendes Bauelement, Vorrichtung mit einem organischen lichtemittierenden Bauelement und Beleuchtungseinrichtung sowie Verfahren zur Herstellung eines organischen lichtemittierenden Bauelements
KR100844861B1 (ko) * 2006-08-03 2008-07-09 (주) 파루 전자잉크 제조용 조성물 및 그 제조방법
JP2008052168A (ja) * 2006-08-28 2008-03-06 Toppan Printing Co Ltd 液晶表示装置の製造方法
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Also Published As

Publication number Publication date
US20100283499A1 (en) 2010-11-11
CN102422172B (zh) 2015-11-25
TWI428619B (zh) 2014-03-01
CN102422172A (zh) 2012-04-18
WO2010129627A2 (en) 2010-11-11
KR20120027319A (ko) 2012-03-21
JP2012526284A (ja) 2012-10-25
US9360519B2 (en) 2016-06-07
WO2010129627A3 (en) 2011-02-24
US20130127487A1 (en) 2013-05-23
KR101579640B1 (ko) 2015-12-22
TW201042274A (en) 2010-12-01
US8378702B2 (en) 2013-02-19

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