TWI425101B - Cu-Ni-Si alloy excellent in bending workability - Google Patents
Cu-Ni-Si alloy excellent in bending workability Download PDFInfo
- Publication number
- TWI425101B TWI425101B TW100108504A TW100108504A TWI425101B TW I425101 B TWI425101 B TW I425101B TW 100108504 A TW100108504 A TW 100108504A TW 100108504 A TW100108504 A TW 100108504A TW I425101 B TWI425101 B TW I425101B
- Authority
- TW
- Taiwan
- Prior art keywords
- surface layer
- bending
- less
- precipitates
- thickness
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010083736A JP5281031B2 (ja) | 2010-03-31 | 2010-03-31 | 曲げ加工性に優れたCu−Ni−Si系合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201202445A TW201202445A (en) | 2012-01-16 |
TWI425101B true TWI425101B (zh) | 2014-02-01 |
Family
ID=44762511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100108504A TWI425101B (zh) | 2010-03-31 | 2011-03-14 | Cu-Ni-Si alloy excellent in bending workability |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5281031B2 (is) |
KR (1) | KR101377391B1 (is) |
CN (1) | CN102666891B (is) |
TW (1) | TWI425101B (is) |
WO (1) | WO2011125558A1 (is) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5631847B2 (ja) * | 2011-11-07 | 2014-11-26 | Jx日鉱日石金属株式会社 | 圧延銅箔 |
JP5683432B2 (ja) * | 2011-11-07 | 2015-03-11 | Jx日鉱日石金属株式会社 | 圧延銅箔 |
EP2796577B1 (en) * | 2011-12-22 | 2018-05-02 | Mitsubishi Shindoh Co., Ltd. | Cu-Ni-Si BASED COPPER ALLOY SHEET HAVING HIGH DIE ABRASION RESISTANCE AND GOOD SHEAR PROCESSABILITY AND METHOD FOR PRODUCING SAME |
JP2013205052A (ja) * | 2012-03-27 | 2013-10-07 | Yazaki Corp | 気体サンプル室及びガス濃度測定装置 |
JP6196429B2 (ja) * | 2012-08-23 | 2017-09-13 | Jx金属株式会社 | 放熱性及び繰り返し曲げ加工性に優れた銅合金板 |
CN103205600A (zh) * | 2013-04-18 | 2013-07-17 | 大连理工大学 | 一种高强导电Cu-Ni-Si-M合金 |
CN103643080A (zh) * | 2013-12-25 | 2014-03-19 | 海门市江滨永久铜管有限公司 | 高强、高延性、高导电的铜镍硅合金棒材及生产方法 |
WO2015146981A1 (ja) | 2014-03-25 | 2015-10-01 | 古河電気工業株式会社 | 銅合金板材、コネクタ、および銅合金板材の製造方法 |
JP6317967B2 (ja) * | 2014-03-25 | 2018-04-25 | Dowaメタルテック株式会社 | Cu−Ni−Co−Si系銅合金板材およびその製造方法並びに通電部品 |
JP6185870B2 (ja) * | 2014-03-27 | 2017-08-23 | 株式会社神戸製鋼所 | 溶接構造部材用アルミニウム合金鍛造材およびその製造方法 |
WO2016059707A1 (ja) * | 2014-10-16 | 2016-04-21 | 三菱電機株式会社 | Cu-Ni-Si合金及びその製造方法 |
CN104388748A (zh) * | 2014-11-27 | 2015-03-04 | 恒吉集团有限公司 | 易切削、耐腐蚀、可热锻的锡青铜 |
DE102015014856A1 (de) * | 2015-11-17 | 2017-05-18 | Wieland-Werke Ag | Kupfer-Nickel-Zink-Legierung und deren Verwendung |
KR101627696B1 (ko) * | 2015-12-28 | 2016-06-07 | 주식회사 풍산 | 자동차 및 전기전자 부품용 동합금재 및 그의 제조 방법 |
CN107012357B (zh) * | 2017-03-22 | 2018-11-06 | 合肥达户电线电缆科技有限公司 | 一种铜合金线材及其制备方法 |
JP6670277B2 (ja) * | 2017-09-14 | 2020-03-18 | Jx金属株式会社 | 金型摩耗性に優れたCu−Ni−Si系銅合金 |
JP6762333B2 (ja) * | 2018-03-26 | 2020-09-30 | Jx金属株式会社 | Cu−Ni−Si系銅合金条 |
JP2020158817A (ja) * | 2019-03-26 | 2020-10-01 | Jx金属株式会社 | 強度と圧延平行方向および圧延直角方向の曲げ加工性に優れたCu−Ni−Si系合金条 |
CN115652136B (zh) * | 2022-10-31 | 2023-12-15 | 宁波金田铜业(集团)股份有限公司 | 一种易切削铜镍硅棒材及其制备方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200533768A (en) * | 2004-04-14 | 2005-10-16 | Mitsubishi Shindo Kk | Copper alloy and method of manufacturing the same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06100984A (ja) * | 1992-09-22 | 1994-04-12 | Nippon Steel Corp | バネ限界値と形状凍結性に優れたバネ用材料及びその製造方法 |
JP3977376B2 (ja) * | 2004-02-27 | 2007-09-19 | 古河電気工業株式会社 | 銅合金 |
TW200704790A (en) * | 2005-03-29 | 2007-02-01 | Nippon Mining Co | Sn-plated strip of cu-ni-si-zn-based alloy |
JP4810704B2 (ja) * | 2006-01-10 | 2011-11-09 | Dowaメタルテック株式会社 | 耐応力腐食割れ性に優れたCu−Ni−Si−Zn系銅合金の製造法 |
JP4006468B1 (ja) * | 2006-09-22 | 2007-11-14 | 株式会社神戸製鋼所 | 高強度、高導電率および曲げ加工性に優れた銅合金 |
JP4440313B2 (ja) * | 2008-03-31 | 2010-03-24 | 日鉱金属株式会社 | 電子材料用Cu−Ni−Si−Co−Cr系合金 |
-
2010
- 2010-03-31 JP JP2010083736A patent/JP5281031B2/ja active Active
-
2011
- 2011-03-14 TW TW100108504A patent/TWI425101B/zh active
- 2011-03-25 KR KR1020127009920A patent/KR101377391B1/ko active IP Right Grant
- 2011-03-25 WO PCT/JP2011/057441 patent/WO2011125558A1/ja active Application Filing
- 2011-03-25 CN CN201180004521.9A patent/CN102666891B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200533768A (en) * | 2004-04-14 | 2005-10-16 | Mitsubishi Shindo Kk | Copper alloy and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
CN102666891B (zh) | 2014-05-14 |
JP5281031B2 (ja) | 2013-09-04 |
TW201202445A (en) | 2012-01-16 |
CN102666891A (zh) | 2012-09-12 |
KR20120053087A (ko) | 2012-05-24 |
JP2011214087A (ja) | 2011-10-27 |
WO2011125558A1 (ja) | 2011-10-13 |
KR101377391B1 (ko) | 2014-03-25 |
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