TWI423419B - 發光表面元件及用於製造發光表面元件之方法 - Google Patents
發光表面元件及用於製造發光表面元件之方法 Download PDFInfo
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- 239000000109 continuous material Substances 0.000 claims 1
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- 239000004065 semiconductor Substances 0.000 description 3
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- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0065—Manufacturing aspects; Material aspects
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/002—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
- G02B6/0021—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces for housing at least a part of the light source, e.g. by forming holes or recesses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0091—Positioning aspects of the light source relative to the light guide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Led Device Packages (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Planar Illumination Modules (AREA)
Description
本發明涉及一種發光的平面式元件及其製造方法。
發光的平面式元件在最近已變得更重要。不只以平面方式來照明例如作為顯示元件之表面時的位置上,而且在不同形式的顯示器中都期望各種發光的平面式元件。因此,特別是將一種值設定在發光的平面之均勻的發光分佈上,使相同範圍中的全部區域都可被查覺。長久以來例如已出現LCD-監視器或TFT-顯示器,其需要平面式照明。然而,光源通常是點狀或線狀者,平面式照明用的光必須分佈在平面上。於此,平面式光導體已為人所知,其藉由適當的表面處理以適應於光源的距離,光源使光由光導體耦合而出以形成輻射。
特別是為了節省能量而尋求使用一般的半導體元件以產生光,此乃因半導體元件具有高的效率。此種半導體元件亦稱為發光二極體。
本發明的目的是提供一種發光的平面式元件及其製造方法,其在較小的輻射損耗下能以較高的可靠度來製成。此目的藉由申請專利範圍各項中所述的措施來達成。
特別是藉由射出成型方法來製造平面式發光元件,則產生光的元件和連接裝置可埋置於導光元件中,以便一方面使互相干擾的界面不會形成而儘可能以高的效率將光耦
合至該導光元件中,且另一方面在平面式導光元件和由連接裝置和光產生裝置所形成的配置之間形成穩定的連接。
其它有利的佈置描述在申請專利範圍各附屬項中。
藉由將光產生元件設置成“晶片級封裝(Chip Size Package)”,則可容易地安裝該光產生元件以及避免了妨礙此安裝的接合線,且有空出的面積可供使用,經由此空出的面積可將光耦合至平面式導光元件中。
藉由設置一發光二極體以作為光產生元件,則可藉由適當的選擇而以所期望的彩色來產生光,以便能以相同的平面式導光元件來達成不同彩色的發光面且只須保持著一相對應的發光二極體。
藉由將一轉換元件施加在該以“晶片級封裝”方式安裝在連接裝置上的發光二極體上,則已安裝的配置在射出成型時可受到保護而不會受損。此外,配色在很後段的生產時點才被決定。
本發明以下將參考圖式以依據實施例來說明。各圖中相同的元件設有相同的參考符號,但未依比例繪出。
第1圖顯示一種設有可撓性帶形材料7之實施例,該帶形材料在固定的距離中具有貫通口9。帶形材料7上施加由導電材料構成的導電線路6。此種施加例如藉由壓印技術或積層技術來達成。於此,首先在整面上塗佈著導電線路6且然後例如藉由蝕刻方法來獲得所期望的形式或同樣塗佈著所期望的形式。特別是對壓印技術而言通常推薦
後者。
此外,設有產生光的元件,例如,LED 3,其以所謂“晶片級封裝(CSP)1”來形成。於此,此種CSP 1由一種載體2所構成,載體2上形成LED 3。載體2上設有LED 3之連接接觸區(未詳細顯示)。載體2另具有多個連接接觸區,其例如經由可撓性的凸塊5而與導電線路6相連接。在操作時,LED 3應由遠離載體2之此側發出可見的電磁輻射。
另一可選擇的設計方式是,在發光的表面上塗佈一轉換層4,其使光的配色改變。這表示:所發出的光之波長已轉換成另一波長的光。以此種方式,則可高效率地使由一LED所發出的藍光轉換成白光。
目前所述之由CSP 1構成的配置以及設有導電線路6的帶形材料7由一種平面式導光元件8所圍繞著,使此配置可埋置於平面式導光元件8中。此種埋置較佳是在一種模中進行,使由CSP 1和帶形材料7所構成的預安裝的配置可安裝在一射出成型模中且然後以一種熱塑性材料填入至該射出成型模中。在射出成型時,熱塑性材料穿過各貫通口9,使該材料在硬化之後在該平面式導光元件8和帶形材料7之間形成一種緊密且穩定的連接。
第2圖顯示上述配置在旋轉90度一次之後的情況。於第2圖中可辨認出:該平面式導光元件8大約具有CSP 1之厚度。該平面式導光元件8可繼續到達該帶形材料7之遠離CSP之此側上的某一處,這只與機械上的先決條件有
關。
由於光由LED 3之遠離載體的此側發出,則光不會在帶形材料7下方繼續傳送。然而,由於穩定上的原因或造型上的原因,則期望該射出成型材料不只可穿過該帶形材料且亦可超過該帶形材料的範圍,如第2圖所示。
在該平面式導光元件8之表面上顯示出二個小的凸起10,其是一種表面造型,藉此可使光發出。光通常是由LED發出且只要此光在外邊緣上受到干擾而又向內反射時,則此光將導入至該平面式導光元件8中。若此光到達以參考符號10所示的位置且該位置使表面發生改變,則由內部而來的光在該表面上的入射角將發生變化,使光不再向內反射而是向外發出。以此種方式,則藉由表面之相對應的形式可調整該平面式導光元件之表面上的發射。
第3圖顯示該具有貫通口9之帶形材料7之俯視圖。導電線路6以成對的方式在均等的距離中受到導引,導電線路6在安裝著CSP 1之位置處較密地受到導引。當帶形材料7來自一滾筒且然後又被捲繞時,則貫通口9具有超過其在第1,2圖中所示的功能時亦是有利的。各貫通口9用來對該帶形材料7進行準確的輸送或準確的定位。這當然亦適用於當該帶形材料7安裝在射出成型模中且定位在該處時。窗口11用來在射出成型時使該平面式導光元件可圍繞該帶形材料7而延伸且如第2圖所示只有少量的帶形材料7仍由CSP 1突出。
第5圖中簡單地顯示第1圖所對應的視圖中由第3圖
所形成的一種連續的配置。該平面式導光元件可像一種帶一樣連續地形成且以所期望的距離相隔開以便在硬化之後可被劃分。依據第5圖,在二個CSPs 1之間的中央分別顯示一隔離間隙10,沿著此隔離間隙10而將個別的平面式導光元件予以切離。這例如藉由一適當的切割方法來進行。
然而,亦可對一個別的發光的平面式元件使用一射出成型模,或佈置該射出成型模,使其具有多個變細區或隔離壁,以便在第5圖中以參考符號10所示的位置處藉由折斷而將個別的發光的平面式元件予以劃分。
然而,對每一發光的平面式元件未必只設有一個別的產生光的CSP 1,其數目最後是與所期望的光強度和即將形成的發光面之大小有關。依據第4圖,該圖中表示:在第4圖所示的實施例中選取三個CSP 1。
參考第1圖,其顯示一轉換層4塗佈在LED 3上,以使由LED所產生的自然光轉換成所期望的光。在第6圖所示的佈置中,該配置不同於第1圖所示的配置之處只在於缺少該轉換層4。取而代之的是,一轉換覆蓋物4a圍繞著該CSP 1。這例如可以滴劑來形成或以射出成型法塗佈而成。“最後選取何種方法”只與技術上的可能方式有關且與該CSP 1在安裝在該帶形材料上之前應在何種狀態下預先測試有關。
1‧‧‧CSP,產生光的元件
2‧‧‧載體
3‧‧‧LED,發光二極體晶片
4‧‧‧轉換層
4a‧‧‧轉換覆蓋物
5‧‧‧凸塊
6‧‧‧導電線路
7‧‧‧帶形材料
8‧‧‧導光元件
9‧‧‧貫通口
10‧‧‧凸起
11‧‧‧隔離間隙
第1圖 發光的平面式元件之一部份的側視圖。
第2圖 顯示第1圖之發光的平面式元件旋轉90度後的一
部份之視圖。
第3圖 帶形的連接裝置上之發光二極體配置的俯視圖。
第4圖 具有多個發光二極體之發光的平面式元件之圖解。
第5圖 第3圖所示的帶形材料所射出成型的平面式導光元件。
第6圖 第1圖所示之佈置的另一形式。
1‧‧‧CSP,產生光的元件
2‧‧‧載體
3‧‧‧LED,發光二極體晶片
4‧‧‧轉換層
5‧‧‧凸塊
6‧‧‧導電線路
7‧‧‧帶形材料
8‧‧‧導光元件
10‧‧‧凸起
Claims (10)
- 一種發光的平面式元件,包括:至少一平面式導光元件(8)、連接裝置(7,6)和一產生光的元件(1),其中該產生光的元件(1)具有至少二個連接端(5),其與連接裝置(7,6)上所屬的連接導線(6)導電性地相連接著,且該平面式導光元件(8)以射出成型方法而埋置一由連接裝置(6,7)和該產生光的元件(1)所構成的配置。
- 如申請專利範圍第1項之發光的平面式元件,其中該產生光的元件(1)是以“晶片級封裝”來形成的發光二極體。
- 如申請專利範圍第2項之發光的平面式元件,其中該“晶片級封裝”(1)包括具有連接元件(5)的一載體(2)和一與連接元件(5)以彼此相對的方式位在該載體(2)上並導電性地相連接的發光二極體晶片(3)。
- 如申請專利範圍第1至3項中任一項之發光的平面式元件,其中該產生光的元件之一發光區域是由轉換元件(4;4a)所覆蓋著,該轉換元件(4;4a)將該產生光的元件(3)所發出的第一波長的光轉換成一種與第一波長不同的光。
- 如申請專利範圍第4項之發光的平面式元件,其中該轉換元件(4)以一種層來形成,其覆蓋該晶片3上的發光區域。
- 如申請專利範圍第4項之發光的平面式元件,其中該轉換元件(4a)覆蓋該載體上的“晶片級封裝”(1)。
- 如申請專利範圍第1、2或3項之發光的平面式元件,其中該連接裝置由一帶形材料(7)和配置在該帶形材料上的 連接導線(6)所形成且沿著縱向延伸而在規則的距離中具有貫通口(9),該平面式導光元件(8)以單件方式穿過該貫通口(9)。
- 如申請專利範圍第1項之發光的平面式元件,其中將多個該產生光的元件(1)設置在連接裝置上。
- 一種發光的平面式元件之製造方法,須製備一連接裝置,其上配置一產生光的元件且須以射出成型方法來製成一平面式導光元件,使該產生光的元件和該連接裝置的至少一部份埋置於該導光元件中。
- 如申請專利範圍第9項之製造方法,其中該連接裝置以“連續材料”來製備,且個別的發光的平面式元件在射出成型之發光的各平面式元件硬化之後被劃分。
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DE102007046520A DE102007046520A1 (de) | 2007-09-28 | 2007-09-28 | Lichtemittierendes Flächenelement und Verfahren zum Herstellen eines lichtemittierenden Flächenelementes |
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US (1) | US8541809B2 (zh) |
EP (1) | EP2191324B1 (zh) |
JP (1) | JP2010541225A (zh) |
KR (1) | KR20100081328A (zh) |
CN (1) | CN101809490A (zh) |
DE (1) | DE102007046520A1 (zh) |
TW (1) | TWI423419B (zh) |
WO (1) | WO2009039846A1 (zh) |
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TWI480962B (zh) * | 2009-04-09 | 2015-04-11 | Lextar Electronics Corp | 發光二極體封裝以及發光二極體晶圓級封裝製程 |
FR3011941B1 (fr) * | 2013-10-16 | 2016-01-01 | Gb Dev | Procede de fabrication rapide d'un guide de lumiere, guide de lumiere et appareil obtenus |
DE102016121047B4 (de) * | 2015-11-06 | 2021-07-01 | Lisa Dräxlmaier GmbH | Herstellungsverfahren für eine beleuchtungseinrichtung |
DE102018119538A1 (de) | 2018-08-10 | 2020-02-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches halbleiterbauteil und herstellungsverfahren für optoelektronische halbleiterbauteile |
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- 2008-09-26 JP JP2010526164A patent/JP2010541225A/ja active Pending
- 2008-09-26 KR KR1020107009243A patent/KR20100081328A/ko not_active Application Discontinuation
- 2008-09-26 WO PCT/DE2008/001589 patent/WO2009039846A1/de active Application Filing
- 2008-09-26 US US12/679,774 patent/US8541809B2/en not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
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TW200921896A (en) | 2009-05-16 |
KR20100081328A (ko) | 2010-07-14 |
EP2191324A1 (de) | 2010-06-02 |
EP2191324B1 (de) | 2017-04-05 |
US8541809B2 (en) | 2013-09-24 |
CN101809490A (zh) | 2010-08-18 |
WO2009039846A1 (de) | 2009-04-02 |
JP2010541225A (ja) | 2010-12-24 |
DE102007046520A1 (de) | 2009-04-02 |
US20100193819A1 (en) | 2010-08-05 |
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