TWI241043B - Planar package structure for high power light emitting diode - Google Patents

Planar package structure for high power light emitting diode Download PDF

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Publication number
TWI241043B
TWI241043B TW93137572A TW93137572A TWI241043B TW I241043 B TWI241043 B TW I241043B TW 93137572 A TW93137572 A TW 93137572A TW 93137572 A TW93137572 A TW 93137572A TW I241043 B TWI241043 B TW I241043B
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Taiwan
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light
emitting diode
planar
light emitting
light source
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TW93137572A
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Chinese (zh)
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TW200527719A (en
Inventor
Po-Hung Yau
Jauh-Jung Yang
Yu-Cheng Lin
I-Kai Pan
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Ind Tech Res Inst
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Abstract

The present invention discloses a planar package structure for high power light emitting diode, comprising: a substrate; a package material; a light emitting diode chip disposed on the substrate, having a main light emitting surface served as a light source; and a planar optical modulation unit disposed on the package material, so that the planar optical modulation unit is above the main light emitting surface, and utilized for modulating the optical phase of the light source. The planar optical modulation unit can perform a refractive optical phase modulation or a diffractive optical phase modulation such that a thin and planar high power light emitting diode package element with optical phase modulation function is obtained.

Description

!24l〇43 九、發明說明: 【發明所屬之技術領域】 、、本發明係提供-種高功率發光二極體平面化封裝結構,尤指一種 透過—凡㈣與平面透鏡縣學計算和光調制原理,可以輯出各種 不同焦距*求之平面透鏡,透過平面透鏡與發光二極體晶片的搭配組 合下’可形成具有各種不同放大率及光學雜之薄厚度、平面化高功 率發光二極體封裝結構。 【先前技術】 傳統的高功率發光二極體封震方式,使發光二極體燈泡(led Γ^ί有良好的發光方向性,可使發光二極體晶片發出之光源達到 3=3率^此種封裝方法的封裝厚度大,且對光源僅有發散 产笼刑:Ά他特殊細之魏,未來在顧產品趨於高亮 二==求:統封裝方式之高功率一 加諸於發石65曰3=28^係揭露’傳統發光二極體封裝皆以樹脂 極體产、4,仲:日日4上復盍域完成,透鏡式封裝則使用發光二 功極_泡财都是使用—般咖旨魏,盆主要 角之發光二極體發光元件。 月又域具固疋發散 •極體 •極體封裝結構 至少存在以 綜觀以上所述,習用之高功率發光 下缺點: 、由於發光二極_都是用—般的樹脂透鏡,使其封裝結構所佔 1241043 、2積過大,造成使用上的困難,進崎低產品的自由度。 、應用=裝結構對統财發散光收斂的效果,並無其他特殊之 樣 四 =3:構無法達到平面化的要求’使產品的靈活性和多 當點光源獻為面光源使㈣,其光均自性 作成本。 、 【發明内容】 高功技術之缺失’本發明之主要目的在於提供-種 封裝結構’透過二元光學解面透鏡的光學 所平面光學調制單元,來達到減少發光二極體封裝結構 所佔之體積,以確實降低製作成本。 本(月之_人要目的在於提供—種高功率發光二極體平面化封裝結 :可對光源進行各種不解及光學特性的婦,以翻於各種 窝求。 本發明之另一目的在於提供一種高功率發光二極體平面化封裝結 構,使其達到平面化的要求,以增加產品的靈活度和多樣性。 本發明之又-目的在於提供一種高功率發光二極體平面化封裝結 構,可使用於大尺寸背光源中,透過平面微結構的光學調制作用使發 光二極體光斑形成影像放大的現象(光斑放大),以降低點光源擴大為面 光源使用時的光均勻性_的_度,财助於減少大尺寸背光源中 的發光二極體使用數量。 本發明之又-目的在於提供一種高功率發光二極體平面化封裝結 構,以確實提升高功率發光二極體之出光亮度。 1241043 為達上述目的,本發明提供一種高 構:其係包括有··一基板一封編;ί:=體千面化封裝結 於該基板上,且該發光二減晶片具有—主轉=晶f,其係設 主要發光面上方,並觸光源進行光學她糊。㈠衣 單元係可為折縣學相位調㈣繞射光學相位= :成一具光喊大效果之_、平面化之_發光二極體封= 【實施方式】 為使貴審查委員能對本發明之特徵、 認知與瞭解,魏合圖式詳細制如i 4更進步的 請參^所示’其係為本細—較佳_之麻示意圖, 二極體平面化封裝結構,係、包括有:基板⑽、封穿 材料丨02、發光二極體晶片丨〇3、平面光學調制單元刚;其中,料 103係設於該基板,01上,且該發光二極體晶片叫有 要魚先面103卜可藉由主要發光面_提供-光源105,又該平 面先學_早凡ΚΗ,係藉由該封裝材料1〇2設於該主要發光面_ 元光學的光相位補償原理進行計算,_光源⑽進 或繞射光學相位調制,而本發明第—較佳實施例 “翻早70 1G4係、設計馨科(F咖el)透鏡結構,可分為 折射光學她_或_絲她_兩種,其巾平面絲調制單元 104係為㈣光學她_,亦即捨錢树光線麟的厚度,截取! 24l〇43 IX. Description of the invention: [Technical field to which the invention belongs] The present invention provides a kind of high-power light-emitting diode planar packaging structure, especially a kind of transmission-fanfan and plane lens county calculation and light modulation Principle, you can edit a variety of plane lenses with different focal lengths *. Through the combination of the plane lens and the light-emitting diode chip, you can form a flat, high-power light-emitting diode with a variety of different magnifications and thin optical thicknesses. Package structure. [Previous technology] The traditional high-power light-emitting diode vibration isolation method makes the light-emitting diode light bulb (led Γ ^ ί has good light directivity, which can make the light source emitted by the light-emitting diode chip achieve 3 = 3 rate ^ The packaging thickness of this packaging method is large, and the light source only has a divergent production penalty: the other special fine Wei, in the future, the product tends to highlight two == seek: the high power of the unified packaging method is added to the stone 65 said that 3 = 28 ^ is to reveal that 'the traditional light-emitting diode packages are made of resin electrodes, 4, Middle: 4 days to complete the complex field, lens-type packaging uses light-emitting diodes_ bubble money are used —General coffee purpose, light emitting diode light emitting element in the main corner of the basin. Moonfield has a solid divergent, polar body, and polar body packaging structure. At least, according to the above, the shortcomings of conventional high-power light emission are: The light-emitting diodes are all made of ordinary resin lenses, which make the packaging structure occupy 1241043 and 2 too large, which makes it difficult to use, and has a low degree of freedom in the product. 、 Application = The structure of the assembly converges the divergent light of Tongcai Effect, there is no other special way 4 = 3: structure cannot be reached To the requirements of planarization, 'make the product's flexibility and multi-point light sources to be used as surface light sources, and their light is self-inflicted as a cost. [Summary of the invention] The lack of high-power technology' The main purpose of the present invention is to provide- This kind of packaging structure 'uses the planar optical modulation unit of the optical optics of the binary optical facet lens to reduce the volume occupied by the light emitting diode packaging structure, so as to truly reduce the production cost. This month's purpose is to provide— A kind of high-power light-emitting diode planar packaging junction: It is possible to perform various solutions and optical characteristics to the light source, so as to find out from various requirements. Another object of the present invention is to provide a high-power light-emitting diode planar packaging. The structure makes it meet the requirement of planarization, so as to increase the flexibility and diversity of the product. Another object of the present invention is to provide a high-power light-emitting diode planarized packaging structure, which can be used in a large-sized backlight source. The optical modulation effect of the planar microstructure makes the light-emitting diode light spot form an image enlargement phenomenon (light spot enlargement), in order to reduce the point light source to expand to the surface light source. The degree of light uniformity helps to reduce the number of light-emitting diodes used in large-sized backlights. Another object of the present invention is to provide a high-power light-emitting diode planar packaging structure to truly increase high power. The brightness of the light-emitting diode 1241043 To achieve the above-mentioned object, the present invention provides a high structure: the system includes a single substrate; one body is encapsulated on the substrate, and the light-emitting diode The two minus chip has-main rotation = crystal f, which is set above the main light emitting surface and touches the light source to optically paste it. The clothing unit can be used to adjust the phase of the optical phase. Effect _, planarization _ light-emitting diode seal = [Embodiment] In order to enable your review committee to understand the features, cognition and understanding of the present invention, the detailed scheme of Wei He's diagrams is as shown in i 4. It is a schematic diagram of this fine-preferred hemp, a planar packaging structure of a diode, including: a substrate, a sealing material, 02, a light-emitting diode chip, and a planar optical modulation unit; The material 103 is arranged on the substrate 01. The light-emitting diode chip is called the first surface of the fish 103, which can be provided by the main light-emitting surface _ provided-the light source 105, and the plane first learns _ Zaofan KK, is set on the main light-emitting by the packaging material 102 The calculation of the optical phase compensation principle of the surface_element optics, the _light source enters or diffracts the optical phase modulation, and the first-preferred embodiment of the present invention "turns early 70 1G4 series, and designs Fcael lens structure, It can be divided into two types of refracting optics _ or _ silk she _, and the towel plane silk modulation unit 104 is ㈣optical optics _, which is the thickness of the money tree.

St:有咖田環組合成的平面結構’如:投影機、電視銀 幕刚的放大I兄…寺等皆屬於此型。平面光學調制單元刚可先以超精 密加工技術或光學餘刻技術(LithGgraphie Ga丨麵f删哪_ 1241043St: There is a flat structure composed of the Katian ring, such as a projector, a TV screen, a magnifying glass, a temple, etc., all of which belong to this type. The planar optical modulation unit can just be deleted by ultra-precise machining technology or optical post-cut technology (LithGgraphie Ga 丨 face f_ 1241043

Abf0rmung,LIGA)製作於金屬模仁上,再配合封裝材料1〇2以熱壓、 射出或填模方式直接與發光二極體晶片103結合一體成型,而且通常 封裝材料102係使用透明樹脂或高分子材料。 以下所述之本發明其他較佳實施例中,因大部份的元件係相同或 類似於前述實施例,因此與基板1〇1相同之基板2〇卜3〇丨、4〇〗、5〇】, 與封裝材料102相同之封裝材料202、302、402、502,與發光二極體 晶片103相同之發光二極體晶片203、3〇3、4〇3、5〇知、5〇北及與主 要發光面1031相同之主要發光面203卜303卜403卜5031a、5031b, 其功用結構相類似,之後便不予贅述,合先敘明。 再請參閱圖二所示,其係為本發明第二較佳實施例之剖面示意 圖,其中平面光學調制單元2〇4亦為類似菲涅耳透鏡結構,但其為& 射光學相位調制,而係由-系列的軸對稱結構元件(同心環狀結構斯構 成,藉由二元繞射光學理論結合微機電製程(MEMS),達到元件結構 尺寸介於1 _〜5㈣間,以對光源產生強度分魅置、光波整形'^多 波長分波之絲’此原理乃結構尺寸與光波波餘近時產生之光 波波動繞射性質搭配繞射微結構的調製作用而達成’一般來說,當結 構尺寸直徑為人射光波長之5至〗〇倍時,即可產生繞射特性,其中, 平面光學調制單元2〇4_距與環寬,可以依據所對應調制之光源挪 的波長不同而改變,或因應光源205會聚、發散需求而改變,或因繞 射圖樣的不同而改變,亦即進行分光、光束整形等需求的應用,^ 平面光學調制單元2〇4亦具有平面化的優點;當然,吾人柯使用呈 有繞射光學相位調制之非軸對稱結構元件以達此目的,而該非轴對稱 結構7G件之結構功效係如下所述。 圖二A係為具有繞射光學相位調制之非減稱結構元件的示音 圖。其中當該非㈣稱繞射元件⑴之尺寸直徑為人射光丨波長之5 ^ 10倍時,其係可使該入射光丨產生繞射,以將該入射光丨分鈔點1!、 1241043 焦點⑴與焦點13,且該焦點u、焦點12,與焦點i3係分別 光、綠光,與藍光之焦點所在。該非軸對稱結構元件1〇之立體二 如圖二B所示,且其功效可對應參照圖二c所示之能量通量= 再來請參_三,其係為本發明第三較佳實施例之剖面示 其中平面光學調制單元3〇4為梯度折射率變化透鏡結構,其係ς 狀的介質裡’摻人㈣使折射率呈現漸層狀分佈,且設計過的適 度可造成光源305偏折至所需位置,亦即將平面光學調制單幻二 成具有某齡、距的透鏡’⑽成梯度卿率變化透鏡 二 將於圖三Α描述),並同時達成平面化整體封裝的目的,舉例、 們可以在樹脂封裝材料上鑛上金屬薄膜(金或銀)並通電壓,用金^ 跟玻璃内所含之鈉(Na)交換離子,以改變玻璃的折射率,進而 梯度折射率變化透鏡結構。 凡成 圖三A係為本發财之梯度㈣率變化透義示意圖,並係藥干 2射率隨彳蝴蹲之變化。按,梯編觸化透鏡(grin丨__ 利用物質材料的特性所製作而成的一種光學性質與傳統透鏡相似之平 =凡件,其特色為該元件内部之折射率分佈為梯度變化形式(沿某一斤 :=射如圖^斤示^即利用控制折射率變化分佈達成蝴 製作成聚光元件(對應傳統凸透鏡)或散光元件 。例如,當該梯度折射率變化透鏡之折射率隨徑向距 離之受化如圖三A巾所科,即可達成傳統凸透鏡之效果。 四所示’其絲本發日㈣吨佳實躺之勤示意圖, 摻雜有複數侧廣散粒子4〇4,且所述之擴散粒子404 早雜、趙以達到擴散光源的效果。由封裝材料4〇2與擴散 =/Γ成之結構,可哺當作透鏡來錢體封裝成型, 達成尚功率發光二極體平面化封裝結構。 5月參閱圖五所示,並#為太私明笛 /、你馮桊I月弟五較佳實施例之剖面示意圖, 1241043 ,中平面絲棚單元·、獅以—對―方式對應設於發光二極體 曰曰片503&、50313之主要發光面5〇3丨3、5〇311)上方,對各該光源5〇5&、 观進行光學她_,並個封裝獅皿—體封裝,以形成 间功率《it—極體陣列結構’對未來高功率發光二極體應用在大尺寸 顯示器背光模組巾時’可使高功树光二極體由點光源雜趨近於面 光源特性,進而跳脫點光源變為線光源再變為面光源的傳統應用框 架,可降低光娜與簡倾組_,並降低大尺寸模組制中高功率 發光二極體_使贼量,將有助於新__代液晶顯示⑼光源的技術 提升二以符合未來光源模組的輕薄、低成本、高亮度、省電等訴求。 ‘上所述’本發日月之高功率發光二極體平面化封裝結構,透過二 元光學與平面透鏡的光學計算所設計出的平面絲_料,可達到 平面化的目的,並對光源進行各種㈣放大率及光學特性的調替 可應用於大尺核晶螢幕之背絲組巾,崎低點統擴大為面光源 使用時的光均自性糊的困難度,线可財產_點;惟以上所 者,僅為本發明之較佳實糊’當不能狀關本㈣的範圍,容 聯想得到,糾:將平面光學調制單元由一環結構改朗观 或是使用其他的封裝材料等等,熟悉此領域技藝者於領悟掉明 神後,皆可朗變化實施之,即大凡依本發日斜請專纖圍卿= 等變化及修飾,仍將不失本發明之要義所在,亦不脫離本發明= 和範圍,故都應視為本發明的進一步實施狀況。 、 綜上所述,本發明於習知技術領域上無相關之技術揭露,已 穎性;本發明之技_料確實解_賴之_,且方属’ 根據習知技藝而易於完成者,其功效性紅經詳述,實魏步性^ 已符合專利法中所規定之發料利要件,謹請#^ 視,並賜准專利為禱。 —、W予審 1241043 【圖式簡單說明】 圖一係為本發明第—較佳實施例之剔面示意圖。 =係為本發明第二較佳實施例之剖面示意圖。 圖一 A係為具有繞射光學相位調制之非軸對稱結構元件的示意 圖〇 圖。圖- B係為具有繞射光學相位調制之非軸對稱結構元件的立體 量圖H—C係為具有繞射光學她調制之非軸對稱結構元件的能量通 圖=係為本發明第三較佳實施例之刹面示意圖。 圖二A係、為本發明中之梯度折射率變化透鏡的示意圖。 圖四係為本發明第四較佳實施例之剖面示意圖。 圖五係為本發明第五較佳實施例之剖面示意圖。 圖號說明: ^入射光 10-非軸對稱繞射元件 11、12、13-焦點 ⑻、2(M、3(M、40卜 501-基板 102、202、302、402、502-封裝材料 1〇3、203、303、403、503a、503b-發光二極體晶片 104、 204、304、504a、504b-平面光學調制單元 404-擴散粒子 1031、203〗、3031、4031、5031a、5031b-主要發光面 105、 205、305、405、505a、505-光源Abf0rmung (LIGA) is produced on the metal mold core, and then combined with the packaging material 102 to directly integrate with the light-emitting diode wafer 103 by hot pressing, injection or mold filling, and usually the packaging material 102 is made of transparent resin or high Molecular material. In other preferred embodiments of the present invention described below, since most of the components are the same or similar to the foregoing embodiments, the same substrates as the substrates 101, 20b, 3b, 4b, and 5b are used. ], The same packaging materials 202, 302, 402, and 502 as the packaging material 102, the same light-emitting diode wafers 203, 303, 403, 50, 50, and 50 as the same as the light-emitting diode wafer 103 The main light-emitting surfaces 203, 303, 403, and 5031a, 5031b, which are the same as the main light-emitting surface 1031, have similar functions and structures, and will not be described later. Please refer to FIG. 2 again, which is a schematic cross-sectional view of a second preferred embodiment of the present invention. The planar optical modulation unit 204 is also similar to a Fresnel lens structure, but it is & optical phase modulation. The system is composed of a series of axisymmetric structural elements (concentric ring structure). By using the theory of binary diffraction optics combined with micro-electro-mechanical process (MEMS), the size of the element structure is between 1 and 5 to produce light sources. Intensity is divided into two parts, and light wave shaping '^ multi-wavelength partial wave'. This principle is based on the structure size and the diffraction properties of light wave fluctuations generated when the light wave is near, and the modulation effect of the diffraction microstructure is achieved. Generally speaking, when Diffraction characteristics can be produced when the structure size diameter is 5 to 0 times the wavelength of human light, in which the planar optical modulation unit 204_span and ring width can be changed according to the wavelength of the corresponding modulated light source. , Or change according to the light source 205 convergence and divergence requirements, or change due to different diffraction patterns, that is, for applications such as light splitting, beam shaping, etc. ^ The plane optical modulation unit 204 also has a plane Of course, we use non-axisymmetric structural elements with diffractive optical phase modulation to achieve this purpose, and the structural efficiency of the 7G piece of non-axisymmetric structure is as follows. Figure 2A is with diffractive optics Phonogram of a phase-modulated non-minus structural element. When the dimension diameter of the non-diffractive diffractive element 为 is 5 ^ 10 times the wavelength of human light, it can cause the incident light to be diffracted to The incident light 丨 the banknote separation points 1 !, 1241043, the focal point ⑴ and the focal point 13, and the focal point u, the focal point 12, and the focal point i3 are the focal points of light, green, and blue respectively. The non-axisymmetric structural element 10 Stereo 2 is shown in Figure 2B, and its efficacy can correspond to the energy flux shown in Figure 2c = Please see _3 again, which is a cross-sectional view of the third preferred embodiment of the present invention in which the plane optical modulation is shown. The unit 304 is a gradient refractive index changing lens structure. In the system, the mixed medium is mixed with ytterbium to make the refractive index show a gradual layer distribution, and the design is moderate enough to cause the light source 305 to deflect to the desired position. Planar optical modulation The distance between the lens and the lens is changed into a gradient and the rate change lens will be described in Figure 3A), and at the same time to achieve the purpose of flat overall packaging, for example, we can mine metal thin film (gold or silver) on the resin packaging material and When the voltage is applied, gold ^ is used to exchange ions with the sodium (Na) contained in the glass to change the refractive index of the glass, and then the gradient refractive index changes the lens structure. Fan Cheng Figure 3A is a transparent illustration of the gradient rate change of the fortune, and it shows the change of the emissivity of the drug stem with the squat. Press, ladder-shaped contact lens (grin 丨 __ An optical property similar to a traditional lens produced by using the characteristics of material materials = ordinary pieces, which is characterized by a gradient change of the refractive index distribution inside the element ( Along a certain line: = shot as shown in Figure ^ shows the use of controlled refractive index change distribution to achieve a condensing element (corresponding to the traditional convex lens) or astigmatism element. For example, when the gradient index changes the refractive index of the lens with the diameter The effect of the distance is shown in Figure 3A, and the effect of the traditional convex lens can be achieved. The figure 4 shows the schematic diagram of its regular hair lying on the ground, doped with a plurality of side wide-dispersed particles 404. Moreover, the diffusion particles 404 are mixed early and Zhao to achieve the effect of a diffused light source. The structure formed by the packaging material 40 and the diffusion = / Γ can be used as a lens to encapsulate the money body to achieve high power and light emission. Polar body flat package structure. Refer to Figure 5 in May, and # is a schematic cross-sectional diagram of the preferred embodiment of Taiyi Mingdi /, You Fengyi, January 5, 1241043, mid-plane wire shed unit. —The right way corresponds to the light-emitting diode Above the main light-emitting surfaces 503 & and 50313 of the film 503 & 5013), the optical sources of each of the light sources 503 & 5 are optically packaged, and a lion dish-body package is packaged to form the inter-power " It-polar array structure 'for future high-power light-emitting diodes applied to large-sized display backlight module towels' can make high-power tree light diodes approach from point light sources to surface light source characteristics, and then escape point light sources into The linear light source becomes the traditional application frame of the surface light source, which can reduce the photon and the simple tilt group, and reduce the medium and high power light-emitting diodes of the large-scale module system. ⑼Light source technology upgrades to meet the requirements of future light source modules for lightness, thinness, low cost, high brightness, power saving, etc. The above-mentioned high-power light-emitting diode planar package structure of the sun and the moon, through the binary The plane wire material designed by the optical calculation of optics and plane lens can achieve the purpose of planarization, and the light source can be replaced with various chirp magnifications and optical characteristics. It can be applied to the back silk towel of large-scale nuclear crystal screens. , Saki low point system expanded to surface light source The degree of difficulty in self-adhesion of light during use can be attributed to points; however, the above are only the best practical paste of the present invention, when the scope of this problem can not be closed, which can be obtained by association, correction: the plane The optical modulation unit is changed from a ring structure to a different perspective, or other packaging materials are used. Those skilled in this field can change the implementation after understanding the gods. Such changes and modifications will still not lose the gist of the present invention, nor deviate from the scope and scope of the present invention, so they should be regarded as the further implementation of the present invention. In summary, the present invention is in the field of conventional technology. No related technical disclosure has been made; the technology of the present invention does not explain _ Lai's _, and the party is' easy to complete according to known skills, its efficacy is detailed in detail, and it is true that it has a good pace ^ already In line with the requirements of the Patent Law, please request # ^ to see it, and grant the patent as a prayer. -, W to review 1241043 [Brief description of the drawings] FIG. 1 is a schematic diagram of the cut surface of the first preferred embodiment of the present invention. = Is a schematic sectional view of a second preferred embodiment of the present invention. Figure A is a schematic diagram of a non-axisymmetric structural element with diffractive optical phase modulation. Figure-B is a three-dimensional view of a non-axisymmetric structural element with diffractive optical phase modulation H-C is an energy flux diagram of a non-axisymmetric structural element with diffractive optical modulation Schematic diagram of the brake surface of the preferred embodiment. FIG. 2A is a schematic diagram of a gradient index changing lens in the present invention. FIG. 4 is a schematic sectional view of a fourth preferred embodiment of the present invention. FIG. 5 is a schematic sectional view of a fifth preferred embodiment of the present invention. Explanation of drawing number: ^ Incoming light 10-Axial asymmetrical diffractive element 11, 12, 13-Focus ⑻, 2 (M, 3 (M, 40) 501-Substrate 102, 202, 302, 402, 502-Packaging material 1 〇3, 203, 303, 403, 503a, 503b-Light emitting diode wafers 104, 204, 304, 504a, 504b-Planar optical modulation unit 404-Diffusion particles 1031, 203, 3031, 4031, 5031a, 5031b-Main Light emitting surface 105, 205, 305, 405, 505a, 505-light source

Claims (1)

1241043 十、申請專利範圍: 丨·二^功恤:吻繼#,聽包括有: 一封裝材料; 至=^^^片,'其係設於該基板上,且該發光二極體晶片 至少一平面域由該主要發光面提供一光源;以及 ?上方,並對該光源進行繞射光學相位調制 塊先面 其中該平面光學調織 ^ 發光二極體平面化封裝結構, 3.如申於專利^々:Α之㈣為該光源波長之5到10倍。 口月專利粑圍第1項所述之高 其中該平面光學調制單元係為極體平面化封裝結構, 销叙高辨發光二極體平面化封裝結構, 粑圍第1項所述之高功率- -基Γ料以—極體平面化封肢構,其係包括有: 一封裝材料; 至少一發光二極體晶片,其係 :有―主要發絲,並晶片 ㈣=_化透鏡結構,___設於該主要 向為梯==射率變化透鏡結構之折射率分佈係沿某-徑向方 12 1241043 8.如申請專利範圍第6項所述之高功率發光二極體平面化封裝結 構,其中該梯度折射率變化透鏡結構係為鍍上金屬薄膜之樹脂封裝 材料。1241043 10. Scope of patent application: 丨 · Two ^ work shirt: kiss following #, listening includes: a packaging material; to = ^^^ sheet, 'It is set on the substrate, and the light-emitting diode chip is at least A plane domain is provided with a light source by the main light emitting surface; and above, and the light source is diffracted by an optical phase modulation block, in which the plane optical tuning is performed ^ a light emitting diode planar packaging structure, 3. As claimed in Patent ^ 々: Α㈣ is 5 to 10 times the wavelength of the light source. Kouyue patent said that the high-power described in the first item of the Wai Wai in which the planar optical modulation unit is a polarized flat package structure, the high-power light-emitting diode planar package structure -The base material is a polar body planarized limb structure, which includes: a packaging material; at least one light-emitting diode wafer, which includes:-a main hair, and a wafer ㈣ = lens structure, ___Set in the main direction is the ladder == emissivity change of the refractive index distribution of the lens structure along a certain radial direction 12 1241043 8. The high-power light-emitting diode planar package as described in item 6 of the scope of patent application Structure, wherein the gradient refractive index change lens structure is a resin packaging material plated with a metal thin film.
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TWI392897B (en) * 2008-12-11 2013-04-11 Visera Technologies Co Ltd Micro-optic lens, led package containing the lens, and method for designing angles of micro-optic lens
TWI396463B (en) * 2007-09-13 2013-05-11 Hitachi Ltd Illumination apparatus and liquid crystal display apparatus
US8541809B2 (en) 2007-09-28 2013-09-24 Osram Opto Semiconductors Gmbh Light-emitting surface element and method for producing a light-emitting surface element
TWI458916B (en) * 2009-09-15 2014-11-01 Hon Hai Prec Ind Co Ltd Lens
CN108139517A (en) * 2015-10-09 2018-06-08 松下知识产权经营株式会社 Optical component and microlens array

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TWI396463B (en) * 2007-09-13 2013-05-11 Hitachi Ltd Illumination apparatus and liquid crystal display apparatus
US8541809B2 (en) 2007-09-28 2013-09-24 Osram Opto Semiconductors Gmbh Light-emitting surface element and method for producing a light-emitting surface element
TWI423419B (en) * 2007-09-28 2014-01-11 Osram Opto Semiconductors Gmbh Light emitting surface element and method for producing light emitting surface element
TWI392897B (en) * 2008-12-11 2013-04-11 Visera Technologies Co Ltd Micro-optic lens, led package containing the lens, and method for designing angles of micro-optic lens
TWI458916B (en) * 2009-09-15 2014-11-01 Hon Hai Prec Ind Co Ltd Lens
CN108139517A (en) * 2015-10-09 2018-06-08 松下知识产权经营株式会社 Optical component and microlens array
CN108139517B (en) * 2015-10-09 2020-08-18 松下知识产权经营株式会社 Optical component and microlens array

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