TW200527719A - High power LED flattening package structure - Google Patents

High power LED flattening package structure Download PDF

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Publication number
TW200527719A
TW200527719A TW93137572A TW93137572A TW200527719A TW 200527719 A TW200527719 A TW 200527719A TW 93137572 A TW93137572 A TW 93137572A TW 93137572 A TW93137572 A TW 93137572A TW 200527719 A TW200527719 A TW 200527719A
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Taiwan
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light
emitting diode
planar
main
emitting surface
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TW93137572A
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Chinese (zh)
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TWI241043B (en
Inventor
Po-Hung Yau
Jauh-Jung Yang
Yu-Cheng Lin
I-Kai Pan
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Ind Tech Res Inst
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Priority claimed from TW092136954A external-priority patent/TW200522387A/en
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Publication of TW200527719A publication Critical patent/TW200527719A/en
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Abstract

A high power LED flattening package structure, which includes one substrate; one package material; one LED chip, which is installed on the substrate and comprises a major light-emitting surface, by means of which to provide a light source; and a plane optical modulation unit, which is equipped onto the above of the major light-emitting surface by package material to modulate optical phase for the light source; wherein the plane optical modulation unit can be modulation of refraction optical phase or modulation of diffraction optical phase to form a thin-thickness containing function of modulating optical phase and a flattening high power LED package device.

Description

200527719 九、發明說明: 【發明所屬之技術領域】 本發明係提供一種高功率發光二極體平面化封裝結構,尤指一種 透過二TL光學與平面透鏡的光學計算和光調制原理,可以設計出各種 不同焦距需求之平面透鏡,透過平面透鏡與發光二極體晶片的搭配組 合下,可形成具有各種不同放大率及光學特性之薄厚度、平面化高功 率發光二極體封裝結構。 【先前技術】 傳統的高功率發光二極體縣方式,使發光二極體燈泡200527719 IX. Description of the invention: [Technical field to which the invention belongs] The present invention provides a high-power light-emitting diode planar package structure, especially a principle of optical calculation and light modulation through two TL optics and a planar lens, which can be designed in various ways Planar lenses with different focal lengths require the combination of flat lenses and light-emitting diode chips to form thin, flat, high-power light-emitting diode packaging structures with various magnifications and optical characteristics. [Previous technology] The traditional high-power light-emitting diode county method makes light-emitting diode bulbs

(LED amp)具有良好的發衫向性’可使發光二極體晶片發出之光源達到 二好的應収率’但此觀裝方法的封裝厚度大,且對総僅有發散 二收::的縣’亚無其他特殊應用之功能,未來在應用產品趨於高亮 專1化的*求下傳統封裝方式之高裤發光二滅的光源是益 法滿足未來產品之需求的。 疋…、 加諸專利US6531328中係揭露,傳統發光二極體封裝皆以樹脂 極體燈、:::::磊晶片上覆蓋封裝完成’透鏡式_則使用發光二 功為使為晶片;發的樹脂透鏡,其主要 角之發光二極體發光中至小肢,域—具固定發散 式,⑷簡料另—歸光二減封裝的方 件達到最小厚度化=的傳崎脂透鏡縣,亦無法使料二極體元 下缺點觀Λ上所4 ’習用之高辨發光二極體封裝結構,至少存在以 鏡,使其封裝結構所佔 、由於發光二極體燈泡都是用-般的樹脂透 200527719 之體積過大,造成使用上的困難 二::r構細僅有發散光收嫌果:二之 三、 结構無法達到平面化的要求,使產品的靈活性和多樣 四、 當點光源擴大為岐源使㈣,其辆时__,且用於大 光光源,傳統發光二極體所需之數量過多,進而增加製 【發明内容】(LED amp) has a good hair shirt orientation 'can make the light source emitted by the light-emitting diode chip achieve two good yields', but the package thickness of this viewing method is large, and the opposite is only divergent :: The county's Asia has no other special application functions. In the future, in the application products tend to highlight the specialization of the light source * seeking the traditional packaging method of the high-light emitting two light source is to better meet the needs of future products. Alas ..., it is disclosed in patent US6531328 that traditional light-emitting diode packages are completed with resin electrode lamps ::::: LEI wafers are encapsulated and packaged to complete the lens type. The light-emitting diode is used as the chip; Resin lens, the main corner of the light-emitting diode emits medium to small limbs, the field-with a fixed divergence type, but also simple-the second light reduction package to minimize the thickness of the == Chuansaki lens county, also It is impossible to make the high-resolution light-emitting diode packaging structure used in the above-mentioned defect view of the material diode at least 4 ′, at least there is a mirror to make up its packaging structure, because the light-emitting diode bulbs are all used-like The volume of resin through 200527719 is too large, which makes it difficult to use. 2: The structure of r is only divergent light. The third is that the structure cannot meet the requirements of planarization, making the product flexible and diverse. 4. When the point light source Expansion into a Qiyuan messenger, its car hour __, and used for large light sources, the traditional light-emitting diodes require too much, and then increase the production system [inventive content]

古功’本_之主要目的在於提供一種 π功率發先二極體平面化封裝結構,透過二 L Ζ所設計出的平面光學調制科,來達到減少發光二極體 所佔之體積,以確實降低製作成本。 、口 以適用於各種 需求 本發明之次要目的在於提供一種高功率發光二極體平面化封裝社 構’可對光源進行各種獨放大率及光學雜_整, ° 構ϋ日目的在於提供—鶴功率發光二極體平面化封裝結 構,使其達到平面化的要求,以增加產品的靈活度和多樣性。 椹ΐ!Γ之又—目的在於提供—種高功率糾二極财面化封裝結 弁於大尺寸背光源中,透過平面微結構的光學_作用使發 體級形成影像放大的縣(光斑放大),以降低料源擴大為面 =使用時的光均勻性調·_度,並有助於減少大尺寸背 的發光二極體使用數量。 本巧之又-目的在於提供—種高功率發光二極體平面化封裝結 構,以確實提升高功率發光二極體之出光亮度。 200527719 構,苴传包括有ί 率發光二極體平面化封裝社 於該基板上,且該發光二極體晶片具有—轉其係設 發光面提m·以及—平面光學 碑由該主要 該平 設於該主要發光面上方,並對該光源進行光學相位::由裝材料 【實施方式】 為使貴審查委員能對本發明之特徵、 認 知與瞭解,兹配合圖式詳細說明如後。 力此有更進-步的 所:其係為本發明第一較佳實施㈣^ 化封裝結構,係包括有··基板⑼、封裝 / 、务光二極體晶片103、平面光學調制單元104,·其中,發光 -一極體晶片103係設於'^玄其也u x 一士㈣、, 亥基板101上,且該發光二極體晶片103具有 忠與:H〇31 ’可藉由主要發光面1031提供一光源105,又該平 =了调制單凡—104 :係藉由該封裝材料1〇2設於該主要發光面_ ’亚利用二7G光學的光相位補償原理進行計算,以對光源⑽進 ^射光學相位翻或繞射光學她_,而本發㈣—較佳實施例 中,平面光學調制單元104係、設計為菲科听議⑽鏡結構,可分為 折射光學她綱錢射光學她_兩種,其巾平面光學調制單元 〗〇4係為折射光學相位調制,亦即捨去沒有使光線偏折的厚度,截取 傳㈣鏡表面有弧度的細環組合朗平面結構,如··投影機、電視銀 ,則的放大鏡···等等皆屬於此型。平面光學調制單S 104可先以超精 技術或光车餘刻技術(Lithographic Galvanoformung and 200527719 :麵ng,UGA)製作於金屬模仁上,再配合封讀料脱以敎塵 封壯tf"方式直接與發光二極體晶片丨03結合—體成型,而且通常 十衣材料102係使用透明樹脂或高分子材料。 ,似===本發财他紐實闕巾,因大雜的元件軸同或 激於則逑貫施例,因此與基板則相同之基板2〇丨、3〇ι、仙、划, 與封裝材料102相同之封裝材料2〇2、3〇2、4〇2 要發光面则相同之主要發光面細、则、、細a、则b, 其功用結構相類似,之後便不予贅述,合先敘明。 •^參_二所示,其係為本發明第二較佳實施例之剖面示意 :、/,、平面光學卿單70 2G4亦為類似菲科透鏡結構,但其為繞 ί光3位調制,而係由—系列的軸對稱結構元件(同心環狀結構)所二 =一_,以對光源產生強度分佈重置、 f長刀波之效果,此原理乃卿結構尺寸與光波波長相近時產生之光 f波動繞·質搭配繞射微結構_製侧而達成,—般來說,當結 ^尺寸直為人射光波長之5至⑴倍時,即可產生繞射特性,直中, 調制單元綱的環距與環寬,可以依據所對應調制之光源205 身=1同而改變,或因應光源205會聚、發散需求而改變,或因繞 而改變’亦即進行分光、光束整形...等需求的應用,且 面先予早凡2〇4亦具有平面化的優點;當然,吾人亦可使用呈 =射絲相位調制之非軸雜結構树以達此目的,而該非轴對稱 、、、口構7L件之結構功效係如下所述。 圖二Α係為具有繞射光學相位_之非減稱結構元件的示音 W中當該非軸對稱繞射元件10之尺寸直徑為入射光丨波長之5 ^ 1〇倍時,其係可使該入射光1產生繞射,以將該入射光丨分成焦點⑴ 200527719 11 ^ 12 5 13 如g Γ斤 點所在。該非軸對稱結構元件丨G之立體結構係 圖^"所不,且其功效可對應參顯二C所示之能量通量圖。 ^來^參閱圖三,其係為本發明第三_實施例之 =2解_料3Q4 ^梯度折射率變化透鏡 ^ 狀的介質裡’摻人料使折鮮呈現漸層狀分佈,且対^ ====i成梯度折射率變化_ 們可以謂目的’舉例來說:我 «璃内所含之納(Na)交換離子,以改變 用=屬 梯度折射率變化透鏡結構。 、、:、’進而兀成 折射林發日种之财折鲜變化觀的示賴,並係軒 _物質材料的特性所製作而成的 )係為 面元件,其特色為該元件内部之折射2;^貝與傳統透鏡相似之平 向方向變化,如F1- Λ㈤、’羊刀佈為梯度變化形式(沿某-徑 於㈣4 )’即利用控制折射率變化分佈達成具有透 (對應傳 ===製,聚光元件(對應傳統凸透鏡)或散光元件 離之變化如f細度折射铸化透鏡之折射率隨徑向距 時,即可達成傳統凸透鏡之效果。 明多閱圖四所不,其係為本發明第 一 射封裝材料搬摻雜有複數個擴散粒子彻,=述思圖, :1Γ05散射’以達到擴散光源的效果。由封裝材料^== 達成高辨發光二極解面化職&魏來賴’且—體封裝成型, 請參閱圖五啦,梅本發·五較佳論㈣面示意圖, 200527719 ”中平面絲調鮮元5G4a、5G4b m讀應設於發光二極體 晶片抓、5㈣之主要發光面細a、则b上方,對各該光源她' 進仃光學相位調制,並使用封裝材料5〇2 —體封裳成型,以形成 高功率^光二極體陣列結構’對未來高功率發光二極體應用在大尺寸 顯不器背光模組中時,可使高功率發光二極體由點光源特性趨近於面 光源特性,進而跳脫點光源變為線光源再變為面光源的傳统席用框 架’可降低光損耗與簡化模組架構,並降低大尺寸模組應用中高功率 ,光二極體陣列使賊量,將有助於新—代液晶顯示器背光源的技術 提升二以符合未來光賴_媽、低成本、高亮度、省電等訴求。 知上所述’本發明之高功率發光二極體平面化縣結構,透過二 元光學與平面透鏡的光科算所設計出的平面光學調鮮元,可達到 平面化的目的,並對統進行各種不同放大率及光學雜的調整,更 可應用於大尺寸液晶螢幕之背光模組巾,以降低點光源擴大為面光源 使用時的光均勾性卿的雜度’更有可以量產的伽;惟以上所述 者,僅為本發明之雛實施例,當補以之關本發明的範圍,容易 聯想得到’諸如:將平面光學調制單元由同心、環結構改成同心圓結構, 或是使用其他賊裝材料料,熟悉此領域技藝者於領悟本發明之精 神後’皆可想職化實施之’即大凡依本發明帽專觀圍所做之均 等變化及修飾,仍將*失本發明之要義所在,亦賴離本發明之精神 和範圍,故都應視為本發明的進一步實施狀況。 紅上所述,本發明於習知技術領域上無相關之技術揭露,已具新 賴性;本發明之技_容可確f解決該領域之問題,且方法原理屬非 根據習知胁而㈣完成者,其功效性業已經詳述,實具進步性,誠 已符合專利法中所規定之發明專利要件,謹請貴審查委員惠予審 視,並賜准專利為禱。 10 200527719 【圖式簡單說明】 圖一 圖二 圖《—The main purpose of Gu Gong's book is to provide a π power launch diode planarized package structure. Through the planar optical modulation section designed by LZ, it can reduce the volume occupied by the light emitting diode to ensure that Reduce production costs. Applicable to various needs The secondary purpose of the present invention is to provide a high-power light-emitting diode planar packaging package structure, which can perform various unique magnifications and optical miscellaneous adjustments on the light source. ° The purpose of the next day is to provide— Crane power light-emitting diode planar packaging structure, make it meet the requirements of planarization, in order to increase product flexibility and diversity.椹 ΐ! Γ is another purpose—to provide—a kind of high-power diode-polarized surface packaged in a large-sized backlight, through the optical action of the planar microstructure, the hair-level formation of a magnified county (light spot magnification) ), In order to reduce the expansion of the source to the surface = light uniformity adjustment in use, and help reduce the number of large-scale back-emitting diodes. The purpose of the present invention is to provide a kind of high-power light-emitting diode planar packaging structure, so as to improve the brightness of the high-power light-emitting diode. 200527719 structure, the legend includes a luminescent rate diode planarization package company on the substrate, and the light emitting diode wafer has-turn its system to set the light emitting surface to raise m · and-the plane optical tablet by the main and flat It is set above the main light-emitting surface, and optically phase-shifts the light source :: material. [Embodiment] In order to enable your review committee to understand the features, cognition, and understanding of the present invention, the details are described below with reference to the drawings. This is a further step forward: it is the first preferred implementation of the present invention, a packaging structure, which includes: a substrate, a package, a light diode wafer 103, a planar optical modulation unit 104, · Among them, the light-emitting-polarity wafer 103 is provided on the substrate ^ Xuanqiye ux, and the light-emitting diode-wafer 103 has loyalty: H〇31, which can mainly emit light. The surface 1031 provides a light source 105, and the flat surface = modulation Shanfan-104: is set on the main light-emitting surface through the packaging material 102. The subphase is calculated using the principle of optical phase compensation of 7G optics. The light source enters the diffractive optical phase inversion or diffractive optical lens. In the preferred embodiment, the planar optical modulation unit 104 is designed as a Fico auditory mirror structure, which can be divided into refractive optics. Qian She Optics__ two kinds, the plane optical modulation unit of the towel〗 04 is the refractive optical phase modulation, that is, the thickness without deflection of the light is discarded, and the thin circular ring structure with an arc on the mirror surface is combined to form a Lang plane structure , ··················· etc. This type. The plane optical modulation sheet S 104 can be made on the metal mold core by ultra-precision technology or light car engraving technology (Lithographic Galvanoformung and 200527719: ng, UGA), and then combined with the sealing material to remove the dust and seal tf " directly. Combined with the light-emitting diode wafer 03, the body is molded, and usually the ten-coat material 102 is a transparent resin or a polymer material. It seems that === this rich and powerful new towel, because the component axis of the large or the same or radical, the implementation of the example, so the substrate is the same as the substrate 2〇 丨, 3〇ι, cent, and, and The same encapsulation material 102, 3202, and 402 with the same encapsulation material 102. The main light-emitting surfaces that are the same as the light-emitting surface are thin, thin, thin, and thin. Their functional structures are similar, and will not be described later. He Xianming. • ^ See _2, which is a cross-sectional schematic diagram of the second preferred embodiment of the present invention: ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,-70 2G4 , And the series of axisymmetric structural elements (concentric ring structure) are two = one, in order to produce the effect of resetting the intensity distribution of the light source, f long knife wave, this principle is produced when the structure size is close to the wavelength of the light wave The light f fluctuates around and with the diffraction microstructure _ control side to achieve, generally speaking, when the size of the knot is directly 5 to ⑴ times the wavelength of human light, diffraction characteristics can be generated, straight, modulation The ring pitch and ring width of the unit class can be changed according to the corresponding modulation of the light source 205 body = 1, or according to the convergence and divergence requirements of the light source 205, or change due to the winding, that is, beam splitting, beam shaping ... . Applications such as demand, and the surface pre-earthly 402 also has the advantage of flattening; of course, we can also use a non-axial structure tree with = phase phase modulation to achieve this purpose, and the non-axisymmetric, The structural effects of the 7L pieces are as follows. FIG. 2A is a sound recording W of a non-minus structural element with a diffractive optical phase. When the dimension diameter of the non-axisymmetric diffractive element 10 is 5 ^ 10 times the wavelength of incident light, it can make The incident light 1 is diffracted to divide the incident light 丨 into a focal point ⑴ 200527719 11 ^ 12 5 13 as the g Γ point. The three-dimensional structure of the non-axisymmetric structural element 丨 G is not shown, and its efficacy can correspond to the energy flux diagram shown in Figure 2C. ^ Come ^ refer to Figure 3, which is the third _ embodiment of the present invention = 2 solution _ material 3Q4 ^ gradient refractive index change lens ^ 'man-made materials in the medium to make the freshness show a gradual distribution, and 対^ ==== i into gradient refractive index changes_ we can call the purpose 'for example: I «contained in the glass (Na) exchange ions to change the lens structure with = gradient gradient refractive index changes. "," :, "and then Wu Cheng refracts the view of the change of the richness of the forest and the Japanese species, and it is made by the characteristics of material materials) is a surface element, which is characterized by the internal refraction of the element 2; ^ Be similar to the traditional lens in the horizontal direction change, such as F1- Λ㈤, 'Sheep knife cloth is a gradient change form (along a -diameter ㈣4)', that is, by using the control of the refractive index change distribution to achieve transparency (corresponding transmission = == system, the effect of the traditional convex lens can be achieved when the refractive index of the condensing element (corresponding to the traditional convex lens) or the astigmatic element is changed as the f-refractive index lens with the radial distance. It is the first radiation packaging material of the present invention that is doped with a plurality of diffusion particles, which is described as: 1Γ05 scattering to achieve the effect of a diffused light source. The packaging material ^ == achieves a high-resolution light-emitting dipole solution. Noodles & Wei Lailai 'and-body package molding, please refer to Figure 5, a schematic diagram of Meibenfa · Five Best Discussions, 200527719 "Medium plane silk tone fresh elements 5G4a, 5G4b m reading should be set on the light emitting two Polar body wafer grip, the main luminous surface of 5㈣ is thin a, then b For each of these light sources, she's subjected to optical phase modulation, and the packaging material is used to form a high-power ^ photodiode array structure, which is used for future high-power light-emitting diode applications. In the backlight module of the device, the high-power light-emitting diode can be changed from the point light source characteristics to the surface light source characteristics, and then the traditional mat frame used for point light sources to line light sources and surface light sources can be reduced. And simplify the module structure, and reduce the high power in large-scale module applications, the photodiode array will reduce the amount of thieves, which will help the new-generation LCD display backlight technology to improve the second to meet the future of light. Mom, low cost, Demands for high brightness, power saving, etc. Knowing the above, the planar structure of the high-power light-emitting diode of the present invention can be achieved through the planar optical freshener designed by the optical science institute of binary optics and planar lenses. For the purpose of planarization, the system can be adjusted for various magnifications and optical miscellaneous factors. It can also be applied to the backlight module towels of large-size LCD screens to reduce the uniformity of light when the point light source is expanded to the surface light source. Qing's degree of heterogeneity is more suitable for mass production; however, the above is only a rudimentary embodiment of the present invention. When it is related to the scope of the present invention, it is easy to associate with 'such as: the plane optical modulation unit is The concentric and ring structure is changed into a concentric circle structure, or other thief materials are used. Those skilled in this field will be able to implement the job after they understand the spirit of the present invention. Equivalent changes and modifications will still lose the essence of the invention and also depart from the spirit and scope of the invention, so they should be regarded as the further implementation of the invention. As mentioned above, the invention is based on conventional technology There is no related technical disclosure in the field, which is already new; the technology of the present invention can surely solve the problems in this field, and the principle of the method is not completed based on the conventional knowledge, and its efficacy has been detailed It is really progressive and has already met the requirements of the invention patent stipulated in the Patent Law. I would like to ask your review committee to review it and grant the patent as a prayer. 10 200527719 [Schematic description] Figure 1 Figure 2 Figure "—

=本發明第-較佳實施例之剖面示意圖。 ,為本發明第二較佳實施例之剖面示意圖。 係為具有繞射光學相位調制之非⑽稱結構树的示意= A schematic cross-sectional view of a first preferred embodiment of the present invention. Is a schematic sectional view of a second preferred embodiment of the present invention. Schematic representation of a non-onymous structure tree with diffractive optical phase modulation

圖B係為具有繞射光學相位調制之非轴對稱結構元件的立體 圖- C係為具有繞射光學相位糊之非軸對稱結構元件的能量通 圖^係為本發明第三較佳實施例之剖面示意圖。 圖三A係為本發明中之梯度折射率變化透鏡的示意圖。 圖四係為本發明第四較佳實施例之剖面示意圖。 圖五係為本發明第五較佳實施例之剖面示意圖。 圖號說明: 1-入射光 10-非軸對稱繞射元件 11、12、13-焦點 101、 2(Η、3(Π、4(H、501-基板 102、 202、302、402、502-封裝材料 103、 203、303、403、503a、503b-發光二極體晶片 104、 204、304、504a、504b-平面光學調制單元 4〇4_擴散粒子 1031、2031、3031、4031、5031a、5031b-主要發光面 105、 205、305、405、505a、505-光源Figure B is a perspective view of a non-axisymmetric structural element with diffractive optical phase modulation-C is an energy flow diagram of a non-axisymmetric structural element with diffractive optical phase paste ^ is a third preferred embodiment of the present invention Schematic cross-section. FIG. 3A is a schematic diagram of a gradient refractive index changing lens in the present invention. FIG. 4 is a schematic sectional view of a fourth preferred embodiment of the present invention. FIG. 5 is a schematic sectional view of a fifth preferred embodiment of the present invention. Description of drawing number: 1-incident light 10-non-axisymmetric diffractive element 11,12,13-focus 101, 2 (Η, 3 (Π, 4 (H, 501-substrate 102, 202, 302, 402, 502- Packaging materials 103, 203, 303, 403, 503a, 503b-light-emitting diode wafers 104, 204, 304, 504a, 504b-planar optical modulation unit 404_diffusion particles 1031, 2031, 3031, 4031, 5031a, 5031b -Main light emitting surface 105, 205, 305, 405, 505a, 505

Claims (1)

200527719 、申請專利範圍 1. =功率發㈣體•峨構,其係包括有: 一封裝材料; 至少一發光二極體晶片,苴 具有-主要發光面,且該發光二極體晶片 至少一平面光與 精由5亥主要發光面提供一光源;以及 上方,並對;二早70 ’其係藉由該封裝材料設於該主要發光面 _行繞射光學相位調制。 •如申5月專利乾圍第1頊戶^_ 其中該平岐學^聊面化封裝結構, 4·如申請專利範圍第1 其中該平面光風。、率發光二極體平面化封裝結構, w I千面7^予早—為非軸對稱結構。 5.如申請專利範圍第!項 其中該平面光學 门力羊毛先―極體平面化封裝結構, ·-ir 恤峨構,其係包括有: 一封裝材料; 至少一發光二極體晶片,苴 具有-主要料A 基板上,且該發光二極體晶片 至::r::射率變化透鏡結構,其係藉由; ”有主科“,並藉由社要發光 要 少一梯度折 發光面上方 徑向方 播★ V:專利视圍第6項所述之高功率發光二極俨平面化封壯社 向為梯度變化形^辜艾化魏結構之折射率分佈係沿某一徑 12 200527719 8.如申請專利範圍第6項所述之高功率發光二極體平面化封裝結 構,其中該梯度折射率變化透鏡結構係為鍍上金屬薄膜之樹脂封裝 材料。200527719 、 Applicable patent scope 1. = Power generator • E-structure, which includes: a packaging material; at least one light-emitting diode wafer, which has-a main light-emitting surface, and the light-emitting diode wafer has at least one plane Light and light provide a light source from the main light-emitting surface of the 5H; and above, and the opposite; the second morning 70 'It is set by the packaging material on the main light-emitting surface_line diffraction optical phase modulation. • If you apply for the May patent, you will be the first one in the family ^ _, where the Pingqi school ^ talk about the packaging structure, 4. If the first scope of the patent application, which is the flat light wind. The light-emitting diode planar package structure, w I thousand face 7 ^ early-is a non-axisymmetric structure. 5. If the scope of patent application is the first! In this item, the planar optical door wool first-polar body planar package structure, -ir-shirt structure, which includes: a packaging material; at least one light-emitting diode wafer, which has-the main material A on the substrate, And the light-emitting diode chip to :: r :: emissivity change lens structure, which is based on; "have a main subject", and the company needs to emit a radial gradient above the light-emitting surface by one less gradient ★ V : The high-power light-emitting diode with planar view described in item 6 of the patent is a gradient-varying shape. The refractive index distribution of the Gu Aihuawei structure is along a certain diameter. 12 200527719 8. If item 6 of the scope of patent application In the high-power light-emitting diode planar packaging structure, the gradient refractive index changing lens structure is a resin packaging material coated with a metal thin film.
TW93137572A 2003-12-26 2004-12-06 Planar package structure for high power light emitting diode TWI241043B (en)

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JP4642823B2 (en) * 2007-09-13 2011-03-02 株式会社日立製作所 Illumination device and liquid crystal display device
DE102007046520A1 (en) 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Light-emitting surface element and method for producing a light-emitting surface element
US7914174B2 (en) * 2008-12-11 2011-03-29 Visera Technologies Company Limited Method to optimize micro-optic lens in LED flashlight application
TWI458916B (en) * 2009-09-15 2014-11-01 Hon Hai Prec Ind Co Ltd Lens
CN108139517B (en) * 2015-10-09 2020-08-18 松下知识产权经营株式会社 Optical component and microlens array

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11474289B2 (en) 2020-10-30 2022-10-18 Lextar Electronics Corporation Light-emitting device and backlight module thereof
TWI789850B (en) * 2020-10-30 2023-01-11 隆達電子股份有限公司 Light-emitting device and backlight module thereof

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