JP2015230760A - Light source device, projector, and method of producing light source device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light source device which can improve light use efficiency with a simple configuration.SOLUTION: One embodiment of a light source device according to the present invention has a phosphor layer having a side face, a bottom face, and a top face facing the bottom face, a reflection member facing a side face of the phosphor layer, a substrate provided on the bottom face side of the phosphor layer, and an adhesive that has a light reflection property and bonds the phosphor layer and the substrate together. The reflection member and the adhesive are formed as an integral structure.

Description

  The present invention relates to a light source device, a projector, and a method for manufacturing the light source device.

In a light source device including a phosphor layer, it is desired to effectively use light emitted from the side surface of the phosphor layer.
On the other hand, for example, as described in Patent Document 1, the side surface of a translucent member having a phosphor is covered with a light reflecting member so that the fluorescence is emitted only from the upper surface of the translucent member. A light source device having such a structure has been proposed.

JP 2010-192629 A

However, a light source device that covers the side surface of a translucent member having a phosphor with a light reflective member like the above light source device may have a complicated manufacturing method.
In the above light source device, the adhesive sometimes comes into contact with the lower part of the side surface of the translucent member having the phosphor. In this case, there is a problem that the fluorescence emitted from the lower part of the side surface of the translucent member cannot be effectively used, and the light use efficiency cannot be sufficiently improved.

  One aspect of the present invention is made in view of the above problems, and provides a light source device capable of improving the light use efficiency with a simple configuration and a projector including such a light source device. Is one of the purposes. Another object of one embodiment of the present invention is to provide a method of manufacturing a light source device that can improve light use efficiency with a simple configuration.

  One aspect of the light source device of the present invention includes a phosphor layer having a side surface, a bottom surface, and a top surface facing the bottom surface, a reflecting member facing the side surface of the phosphor layer, and the phosphor layer A substrate provided on the bottom surface side; and an adhesive that has light reflectivity and adheres the phosphor layer and the substrate. The reflective member and the adhesive are configured in an integrated structure. It is characterized by.

  According to one aspect of the light source device of the present invention, since the reflecting member and the adhesive are configured as an integral structure, for example, the phosphor layer is pressed against the uncured adhesive applied on the substrate, A manufacturing method in which the reflective member is formed by raising the periphery of the phosphor layer of the curing adhesive can be employed. Therefore, the manufacture of the light source device is simple.

  Moreover, according to one aspect of the light source device of the present invention, since the reflecting member and the adhesive are configured in an integral structure, the reflecting member and the adhesive forming material are in contact with the side surface of the phosphor layer. Even so, since the fluorescence can be reflected from the side surface, it is possible to prevent the fluorescence from being effectively used.

  Therefore, according to one aspect of the light source device of the present invention, a light source device capable of improving the light utilization efficiency with a simple configuration can be obtained.

It is good also as a structure provided with the support part which supports the said reflection member in the opposite side to the said fluorescent substance layer of the said reflection member.
According to this configuration, since it is easy to make the height of the reflecting member larger than the height of the phosphor layer, the light utilization efficiency can be improved.

The reflection member may have a side surface facing the side surface of the phosphor layer, and a gap may be provided between the side surface of the phosphor layer and the side surface of the reflection member.
According to this configuration, the light utilization efficiency can be further improved.

The side surface of the reflecting member may have an inclined portion that increases the thickness of the gap as the distance from the substrate increases.
According to this configuration, the light utilization efficiency can be further improved.

The side surface of the reflecting member may be a concave surface that increases in thickness as the distance from the substrate increases, and is concave on the opposite side of the phosphor layer.
According to this configuration, the light utilization efficiency can be further improved.

It is good also as a structure provided with the rotation mechanism which rotates the said board | substrate.
According to this structure, it can suppress that a fluorescent substance layer becomes high temperature.

The phosphor layer may be transparent.
According to this structure, it can suppress that a fluorescent substance layer becomes high temperature locally.

The light emitted from the phosphor layer may be composed of fluorescence generated by the phosphor layer.
According to this structure, the utilization efficiency of excitation light can be improved.

  One aspect of the projector according to the invention includes a light source device that emits illumination light, a light modulation device that modulates the illumination light according to image information to form image light, and a projection optical system that projects the image light. And the light source device described above is used as the light source device.

  According to one aspect of the projector of the present invention, since the light source device is provided, a projector capable of improving the light use efficiency can be obtained.

  One aspect of the method of manufacturing the light source device of the present invention includes a phosphor layer having a side surface, a bottom surface, and a top surface facing the bottom surface, a reflecting member facing the side surface of the phosphor layer, and the fluorescence And a substrate provided on the bottom side of the body layer, the method comprising: applying an uncured adhesive material having light reflectivity on the substrate; and the uncured adhesive material. A step of pressing the phosphor layer, a step of pressing a mold against the uncured adhesive material to transfer the shape of the reflecting member, and a step of curing the uncured adhesive material. To do.

  According to one aspect of the method for manufacturing a light source device of the present invention, a light source device capable of improving the light utilization efficiency can be easily manufactured.

It is a schematic block diagram which shows the projector of 1st Embodiment. It is a figure which shows the wavelength conversion element of 1st Embodiment, Comprising: (A) is a top view, (B) is IIB-IIB sectional drawing in (A). It is sectional drawing which shows the procedure of the manufacturing method of the wavelength conversion element of 1st Embodiment. It is sectional drawing which shows the wavelength conversion element of 2nd Embodiment. It is sectional drawing which shows the procedure of the manufacturing method of the wavelength conversion element of 2nd Embodiment. It is sectional drawing which shows the wavelength conversion element of 3rd Embodiment. It is a schematic block diagram which shows the projector of 4th Embodiment. It is a figure which shows the wavelength conversion element of 4th Embodiment, Comprising: (A) is a top view, (B) is VIIIB-VIIIB sectional drawing in (A).

Hereinafter, a projector according to an embodiment of the invention will be described with reference to the drawings.
The scope of the present invention is not limited to the following embodiment, and can be arbitrarily changed within the scope of the technical idea of the present invention. Moreover, in the following drawings, in order to make each structure easy to understand, the actual structure may be different from the scale, number, or the like in each structure.

(First embodiment)
FIG. 1 is a schematic configuration diagram illustrating a projector 1000 according to the present embodiment. In FIG. 1, red light is indicated by R, green light is indicated by G, and blue light is indicated by B.
As shown in FIG. 1, the projector 1000 according to the present embodiment includes an illuminating device 10, a second illuminating device 50, a color separation / light guiding optical system 60, a liquid crystal panel 70R, a liquid crystal panel 70G, and a liquid crystal panel 70B. , A condenser lens 71R, a condenser lens 71G, a condenser lens 71B, a cross dichroic prism 72, and a projection optical system 73. The liquid crystal panel 70R, the liquid crystal panel 70G, and the liquid crystal panel 70B correspond to the light modulation device in the claims.

  The illumination device 10 includes an excitation light source 10a, a collimating optical system 20, a dichroic mirror 11, a light source device 80, a first lens array 12, a second lens array 13, a polarization conversion element 14, and a superimposing lens 15. .

  The excitation light source 10 a emits excitation light that is incident on the wavelength conversion element 30. In this embodiment, the excitation light source 10a uses a laser light source that emits blue light (having a wavelength of about 445 nm). In addition, the excitation light source 10a may be comprised with one laser light source, or may be comprised with many laser light sources. The laser light source may emit blue light that emits blue light having a wavelength other than 445 nm (eg, 460 nm).

The collimating optical system 20 includes a first lens 21 and a second lens 22.
The first lens 21 suppresses the spread of light from the excitation light source 10a.
The second lens 22 makes the light emitted from the first lens 21 substantially parallel.
In the present embodiment, each of the first lens 21 and the second lens 22 is a convex lens.
The collimating optical system 20 has a function of making the light from the excitation light source 10a substantially parallel as a whole.

  The dichroic mirror 11 has a wavelength selective transmission film that reflects light in a predetermined wavelength region and transmits light in another wavelength region on the substrate. In the present embodiment, the dichroic mirror 11 reflects the blue light component and transmits the red light component and the green light component. The dichroic mirror 11 reflects the excitation light (blue light) emitted from the excitation light source 10a by bending it by approximately 90 degrees. The excitation light reflected by the dichroic mirror 11 enters the condensing optical system 23.

The light source device 80 emits illumination light. In the present embodiment, the light source device 80 includes the condensing optical system 23 and the wavelength conversion element 30.
The condensing optical system 23 has a function of causing the blue light from the dichroic mirror 11 to be incident on the wavelength conversion element 30 in a substantially condensed state, and a function as a collimator that substantially parallelizes the fluorescence emitted from the wavelength conversion element 30. And have. The condensing optical system 23 includes a first lens 24 and a second lens 25. In the present embodiment, the first lens 24 and the second lens 25 are convex lenses.

The wavelength conversion element 30 is an optical element that converts incident excitation light into fluorescence and emits it. In the present embodiment, the wavelength conversion element 30 is a reflective wavelength conversion element, and emits fluorescence on the same side as the side on which the excitation light is incident. In the present embodiment, the wavelength conversion element 30 converts excitation light that is blue light into fluorescence that includes red light and green light. The configuration of the wavelength conversion element 30 will be described in detail later.
Fluorescence emitted from the wavelength conversion element 30, that is, red light and green light, is emitted from the light source device 80 via the condensing optical system 23 (collimator). The fluorescence emitted from the light source device 80 passes through the dichroic mirror 11 and enters the first lens array 12.

  The first lens array 12 has a plurality of first small lenses 12a for dividing incident light into a plurality of partial light beams. The plurality of first small lenses 12a are arranged in a matrix in a plane orthogonal to the optical axis of the light incident on the first lens array 12.

The second lens array 13 has a plurality of second small lenses 13 a corresponding to the plurality of first small lenses 12 a of the first lens array 12. The second lens array 13, together with the superimposing lens 15, has a function of forming an image of each first small lens 12a of the first lens array 12 in the vicinity of the image forming regions of the liquid crystal panel 70R, the liquid crystal panel 70G, and the liquid crystal panel 70B. .
The light divided by the first lens array 12 enters the polarization conversion element 14 via the second lens array 13.

The polarization conversion element 14 converts each partial light beam divided by the first lens array 12 into linearly polarized light polarized in a predetermined direction and emits it.
The superimposing lens 15 condenses the partial light beams from the polarization conversion element 14 and superimposes them in the vicinity of the image forming areas of the liquid crystal panel 70R, the liquid crystal panel 70G, and the liquid crystal panel 70B. The superimposing lens 15 may be composed of a compound lens in which a plurality of lenses are combined.

The first lens array 12, the second lens array 13, and the superimposing lens 15 constitute a lens integrator optical system that makes the illuminance distribution uniform in the illuminated area.
Note that a rod integrator optical system including an integrator rod can be used instead of the lens integrator optical system.

  The light emitted from the superimposing lens 15, that is, the light emitted from the illumination device 10 enters the color separation light guide optical system 60.

The second illumination device 50 includes a light source 50 a, a condensing optical system 51, a scattering plate 54, a polarization conversion integrator rod 55, and a condensing lens 56.
In this embodiment, the light source 50a uses a laser light source that emits blue light (having a wavelength of about 445 nm). In addition, the light source 50a may be comprised with one laser light source, or may be comprised with many laser light sources. The laser light source may emit blue light that emits blue light having a wavelength other than 445 nm (eg, 460 nm).
The light emitted from the light source 50 a is incident on the condensing optical system 51.

  The condensing optical system 51 includes a first lens 52 and a second lens 53. As a whole, the condensing optical system 51 makes the blue light incident on the scattering plate 54 in a substantially condensed state. The first lens 52 and the second lens 53 are convex lenses.

  The scattering plate 54 scatters the blue light emitted from the light source 50 a with a predetermined scattering degree and converts it into blue light having a light distribution similar to fluorescence emitted from the wavelength conversion element 30. As the scattering plate 54, for example, polished glass made of optical glass can be used.

The polarization conversion integrator rod 55 makes the in-plane light intensity distribution of the blue light emitted from the light source 50a uniform, converts the blue light into linearly polarized light polarized in a predetermined direction, and emits it. The polarization conversion integrator rod is not described in detail, but the integrator rod, the reflector disposed on the incident surface side of the integrator rod and having a small hole for blue light incidence, and the reflective type disposed on the exit surface side. A polarizing plate.
A lens integrator optical system and a polarization conversion element can be used instead of the polarization conversion integrator rod.

  The condensing lens 56 condenses the light from the polarization conversion integrator rod 55 and makes it incident on the color separation light guide optical system 60.

The color separation light guide optical system 60 includes a dichroic mirror 61, a reflection mirror 62, a reflection mirror 63, and a reflection mirror 64. The color separation light guide optical system 60 separates the light emitted from the illumination device 10 into red light and green light, guides the respective color light to the liquid crystal panels 70R and 70G to be illuminated, and the second illumination device. The blue light emitted from 50 is guided to the liquid crystal panel 70B.
A condenser lens 71R and condenser lenses 71G and 71B are disposed between the color separation light guide optical system 60 and the liquid crystal panels 70R, 70G, and 70B, respectively.

  In the dichroic mirror 61, a wavelength selective transmission film that reflects light in a predetermined wavelength region and transmits light in other wavelength regions is formed on a substrate. In the present embodiment, the dichroic mirror 61 transmits the red light component and reflects the green light component. The reflection mirror 63 reflects the red light component. The reflection mirror 62 reflects the green component. The reflection mirror 64 reflects the blue light component.

  Of the light incident from the illumination device 10, the red light transmitted through the dichroic mirror 61 is reflected by the reflection mirror 63, passes through the condenser lens 71 </ b> R, and enters the image forming region of the liquid crystal panel 70 </ b> R for red light. The green light reflected by the dichroic mirror 61 out of the light incident from the illumination device 10 is further reflected by the reflection mirror 62, passes through the condenser lens 71G, and enters the image forming area of the liquid crystal panel 70G for green light. To do.

  The blue light incident from the second illumination device 50 is reflected by the reflection mirror 64, passes through the condenser lens 71B, and enters the image forming region of the blue light liquid crystal panel 70B.

  The liquid crystal panel 70R, the liquid crystal panel 70G, and the liquid crystal panel 70B are transmissive panels in which a liquid crystal that is an electro-optical material is hermetically sealed in a pair of transparent glass substrates. On the liquid crystal panel 70R, the liquid crystal panel 70G, and the liquid crystal panel 70B, a light incident side and a light emission side polarizing plate (not shown) are provided on the light incident side and the light emitted side, respectively.

  The liquid crystal panel 70R, the liquid crystal panel 70G, and the liquid crystal panel 70B include, for example, a polysilicon TFT as a switching element, and modulate the polarization direction of linearly polarized light incident from the incident-side polarizing plate in accordance with a given image signal.

  The cross dichroic prism 72 is an optical element that forms color image light by synthesizing an optical image that is modulated for each color light by each liquid crystal panel and is emitted from the exit-side polarizing plate. The cross dichroic prism 72 has a substantially square shape in plan view in which four right-angle prisms are bonded together, and an optical multilayer film is formed on a substantially X-shaped interface in which the right-angle prisms are bonded together. The optical multilayer film formed at one of the substantially X-shaped interfaces reflects red light, and the optical multilayer film formed at the other interface reflects blue light. By these optical multilayer films, the red light and the blue light are bent and aligned with the traveling direction of the green light, so that the three color lights are synthesized.

  The color image light emitted from the cross dichroic prism 72 is enlarged and projected by the projection optical system 73 to form a projection image (color image) on the screen SCR.

Next, the wavelength conversion element 30 will be described in detail.
2A and 2B are diagrams showing the wavelength conversion element 30. FIG. FIG. 2A is a plan view. FIG. 2B is a cross-sectional view taken along the line IIB-IIB in FIG.
In this specification, the side on which the excitation light of the wavelength conversion element 30 is incident is the upper side, and the side opposite to the side on which the excitation light is incident on the wavelength conversion element 30 is the lower side.

  As shown in FIGS. 2A and 2B, the wavelength conversion element 30 of the present embodiment includes a substrate 31, a reflective adhesive member 32, and a phosphor layer 33. The phosphor layer 33 has a side surface 33b, a bottom surface 33c, and an upper surface 33a facing the bottom surface 33c.

The substrate 31 is a substantially flat member. On the upper surface 31a side of the substrate 31, as shown in FIG. 2 (B), a phosphor layer 33 and a reflective adhesive member 32 are provided. In other words, the substrate 31 is provided on the bottom surface 33 c side of the phosphor layer 33.
The substrate 31 is preferably made of a metal having high thermal conductivity such as aluminum (Al) or copper (Cu). This is because the heat of the phosphor layer 33 is easily dissipated.

The reflective adhesive member 32 adheres the phosphor layer 33 to the substrate 31 and reflects the fluorescence Lf emitted from the side surface 33 b of the phosphor layer 33.
The reflective adhesive member 32 includes a reflective portion 34 and an adhesive portion 35. The reflecting portion 34 and the bonding portion 35 are configured as an integral structure. The reflecting portion 34 corresponds to a reflecting member in the claims. The adhesive portion 35 corresponds to the adhesive in the claims.

  The reflective portion 34 is a portion provided in the reflective adhesive member 32 so as to face the side surface 33 b of the phosphor layer 33. The reflection part 34 has light reflectivity. The reflecting portion 34 is bonded and fixed on the upper surface 31 a of the substrate 31. As shown in FIG. 2A, the planar shape of the reflecting portion 34 is, for example, a rectangular ring in the present embodiment, and is provided surrounding the phosphor layer 33. The cross-sectional shape perpendicular to the upper surface 31a of the substrate 31 of the reflecting portion 34 is a shape that protrudes above the adhesive portion 35 from the upper surface 31a of the substrate 31 as shown in FIG.

  The reflector 34 has a side surface 34 a that faces the side surface 33 b of the phosphor layer 33. The side surface 34 a of the reflecting portion 34 is provided to be separated from the side surface 33 b of the phosphor layer 33. In other words, the gap 40 is provided between the side surface 33 b of the phosphor layer 33 and the side surface 34 a of the reflecting portion 34. In the present embodiment, the side surface 34 a of the reflection portion 34 is configured such that the thickness of the gap 40 increases as the distance from the substrate 31 increases. In other words, the side surface 34a has an inclined portion such that the thickness W12 of the gap 40, that is, the distance between the side surface 33b of the phosphor layer 33 and the side surface 34a of the reflecting portion 34 increases as the distance from the substrate 31 increases. .

  In the present embodiment, for example, the cross-sectional profile of the side surface 34a of the reflecting portion 34 has an inflection point at the bottom. Below the inflection point, the inclination angle of the side surface 34a of the reflecting portion 34 with respect to the upper surface 31a of the substrate 31 increases toward the upper side, and above the inflection point, the substrate 31 on the side surface 34a of the reflecting portion 34. The inclination angle with respect to the upper surface 31a becomes smaller toward the upper side.

  The bonding portion 35 is a portion of the reflective bonding member 32 that bonds the substrate 31 and the phosphor layer 33. The adhesion part 35 has light reflectivity. In the present embodiment, the adhesive portion 35 is a portion of the reflective adhesive member 32 that is located below the phosphor layer 33. In other words, the adhesive portion 35 is a portion of the reflective adhesive member 32 that overlaps the phosphor layer 33 in plan view. A bottom surface 33 c of the phosphor layer 33 is bonded to the bonding portion 35.

  The material of the reflective adhesive member 32 is not particularly limited as long as it has light reflectivity and can adhere the phosphor layer 33 to the substrate 31. The material of the reflective adhesive member 32 may be a highly reflective metal such as silver (AG) or aluminum (Al), or may be a mixed material containing these metals. Further, as the material of the reflective adhesive member 32, a resin and a metal are mixed before curing, but an adhesive that volatilizes the resin by curing may be used.

  The phosphor layer 33 generates fluorescence Lf when irradiated with excitation light Le from the excitation light source 10a. The shape of the phosphor layer 33 is not particularly limited, and may be a cylindrical shape, a quadrangular prism shape, or a frustum shape. In the present embodiment, the shape of the phosphor layer 33 is, for example, a regular quadrangular prism shape as shown in FIGS. 2 (A) and 2 (B).

  The bottom surface 33 c of the phosphor layer 33 is bonded to the bonding portion 35. In the present embodiment, the phosphor layer 33 is an optical member that emits light by being excited by light from the ultraviolet region to the blue region. Although not shown, the phosphor layer 33 includes, for example, a base material and a plurality of phosphor particles dispersed in the base material.

As the phosphor particles, rare earth phosphors, sialoid phosphors, and the like can be used. Specifically, Y ₃ Al ₅ O ₁₂ : Ce (YAG: Ce) can be used as the rare earth phosphor, and α sialoy can be used as the sialoy phosphor. The phosphor layer 33 may be a sintered body in which phosphor particles are mixed with alumina or the like as a base material, or glass or resin as a base material in which the phosphor particles are encapsulated. A sintered body made only of phosphor particles can also be used.

  When excitation light Le is incident on the phosphor layer 33 of the wavelength conversion element 30 from the upper surface 33a, the excitation light Le is converted into fluorescence Lf by the phosphor layer 33. Since the bottom surface 33c of the phosphor layer 33 is adhered to the light reflecting adhesive portion 35, the fluorescence Lf is emitted from the upper surface 33a and the side surface 33b of the phosphor layer 33. Of the fluorescence Lf emitted from the phosphor layer 33, the light emitted from the side surface 33 b is reflected by the side surface 34 a of the reflecting portion 34.

  As shown in FIG. 2 (B), the fluorescence Lf reflected by the side surface 34a of the reflecting portion 34 is reflected and jumped upward, and is emitted to the same side as the side on which the excitation light Le is incident. , And light that is reflected and re-entered into the phosphor layer 33. Specifically, in the shape of the reflecting portion 34 of the present embodiment, the fluorescence Lf reflected in the vicinity of the inflection point of the cross-sectional profile, that is, in the vicinity of the lower portion of the side surface 34a, is incident on the phosphor layer 33 again. Cheap.

  The apparent light emitting region 38 from which the fluorescence Lf is emitted in the wavelength conversion element 30 of the present embodiment is surrounded by the top 34b of the reflecting portion 34 in plan view, as shown in FIGS. 2 (A) and 2 (B). It becomes the area that was.

Next, an example of a manufacturing method of the light source device 80 of the present embodiment will be described.
Since the light source device 80 of the present embodiment can be manufactured by arranging the condensing optical system 23 with respect to the wavelength conversion element 30, only the method for manufacturing the wavelength conversion element 30 will be described in the following description.

FIG. 3A to FIG. 3C are cross-sectional views showing the procedure of the method for manufacturing the wavelength conversion element 30 of this embodiment.
The manufacturing method of the wavelength conversion element 30 of this embodiment has a coating process, a pressing process, and a hardening process.

The application process is a process of applying an uncured adhesive material 41, which is a material for forming the reflective adhesive member 32, to the upper surface 31a of the substrate 31, as shown in FIG.
The uncured adhesive material 41 has light reflectivity. The method for applying the uncured adhesive material 41 is not particularly limited, and for example, a screen printing method, a die coating method, an ink jet method, a dispenser method, a spin coating method, a slit coating method, or the like can be used. By this step, the uncured adhesive material 41 is applied in layers on the upper surface 31a of the substrate 31.

Next, the pressing step is a step of pressing the phosphor layer 33 against the uncured adhesive material 41 as shown in FIG.
The bottom surface 33 c of the phosphor layer 33 is pressed against the center of the uncured adhesive material 41 applied in a layered manner to adhere the phosphor layer 33 onto the substrate 31. At this time, when the phosphor layer 33 is pressed, the uncured adhesive material 41 below the phosphor layer 33 is pushed outward.

  Thereby, an uncured adhesive portion 44 is formed below the phosphor layer 33. In addition, the uncured adhesive material 41 extruded around the phosphor layer 33 rises, and an uncured reflecting portion 43 is formed around the phosphor layer 33. That is, the uncured reflective adhesive member 42 is formed by this process.

Next, the curing step is a step of curing the uncured adhesive material 41.
A method for curing the uncured adhesive material 41 is not particularly limited. For example, when a metal paste is used as the uncured adhesive material 41, the uncured adhesive material 41 is cured by sintering. In this case, the uncured adhesive material 41 is cured, so that the phosphor layer 33 and the substrate 31 are bonded by metal bonding. In order to increase the affinity between the phosphor layer 33 and the uncured adhesive material 41 that is a metal paste, a metal film may be provided on the bottom surface 33 c of the phosphor layer 33.

By this step, the uncured reflective adhesive member 42 is cured, and the reflective adhesive member 32 is formed as shown in FIG. That is, the uncured reflecting portion 43 and the uncured adhesive portion 44 are cured, and the reflecting portion 34 and the adhesive portion 35 are formed.
The wavelength conversion element 30 of this embodiment is manufactured by the above process.

  According to the present embodiment, the bonding portion 35 that bonds the phosphor layer 33 and the substrate 31 and the reflection portion 34 that reflects the fluorescence Lf emitted from the side surface 33b of the phosphor layer 33 are configured in an integrated structure. Therefore, a light source device that can improve the light use efficiency with a simple configuration can be obtained.

  Further, according to the present embodiment, since the side surface 34a of the reflecting portion 34 is configured such that the thickness W12 of the gap 40 increases as the distance from the substrate 31 increases, the fluorescence Lf incident on the reflecting portion 34 is on the upper side. It is easy to jump up and can improve the light utilization efficiency.

  In addition, according to the present embodiment, since the gap 40 is provided between the side surface 33 b of the phosphor layer 33 and the side surface 34 a of the reflecting portion 34, the refractive index at the interface between the phosphor layer 33 and the gap 40. The light is refracted by the difference. Thereby, when the fluorescence Lf emitted from the side surface 33b of the phosphor layer 33 is incident on the phosphor layer 33 again, the fluorescence Lf is refracted and deflected. Therefore, the fluorescence Lf that has entered the phosphor layer 33 again is easily emitted from the upper surface 33a of the phosphor layer 33 or reflected upward by the reflecting portion 34 even when it is emitted from the side surface 33b again. Therefore, according to this embodiment, it can suppress that the fluorescence Lf inject | emitted from the side 33b of the fluorescent substance layer 33 is not inject | emitted from the wavelength conversion element 30, As a result, the utilization efficiency of light can be improved.

  Moreover, according to this embodiment, since the reflection part 34 and the adhesion part 35 are integral structures, the reflection part 34 can be arrange | positioned in the position close | similar to the fluorescent substance layer 33. FIG. Thereby, the width W11 of the light emitting region 38 can be reduced, and the luminous flux diameter of the fluorescence Lf emitted from the wavelength conversion element 30 can be reduced. Therefore, according to the present embodiment, the light emitted by the optical element at the subsequent stage can be reduced, and the light utilization efficiency can be improved.

  In the present embodiment, the following configuration may be employed.

  In the above description, the planar view shape of the reflecting portion 34 is a rectangular ring shape, but is not limited thereto. In the present embodiment, the shape of the reflecting portion 34 is not particularly limited as long as the reflecting portion 34 is provided to face at least a part of the side surface 33b of the phosphor layer 33. For example, the reflecting portion 34 has an annular shape. Alternatively, it may be a polygonal ring or may not be a ring. In the present embodiment, for example, the reflecting portion 34 may have a plurality of protruding portions that protrude above the adhesive portion 35 and are spaced apart from each other.

  In the present embodiment, the gap 40 may not be provided between the side surface 33b of the phosphor layer 33 and the side surface 34a of the reflecting portion 34. That is, in the present embodiment, the reflecting portion 34 may be in contact with the side surface 33 b of the phosphor layer 33. For example, in the pressing step shown in FIG. 3B, the uncured adhesive material 41 is brought into contact with the side surface 33 b of the phosphor layer 33 so that the reflecting portion 34 is in contact with the side surface 33 b of the phosphor layer 33. Can be obtained. In the present embodiment, since the uncured adhesive material 41 has light reflectivity, even when the uncured adhesive material 41 contacts the side surface 33b of the phosphor layer 33, the uncured adhesive material 41 is emitted from the side surface 33b. Fluorescence Lf can be used effectively.

In the present embodiment, the side surface 34 a of the reflecting portion 34 may be a vertical surface that is perpendicular to the upper surface 31 a of the substrate 31.
In the present embodiment, a part of the side surface 34a of the reflecting part 34 may be a vertical surface, and the other part may be an inclined surface.
In the present embodiment, the cross-sectional profile of the side surface 34 a of the reflecting portion 34 may be a linear shape inclined with respect to the upper surface 31 a of the substrate 31.

(Second Embodiment)
The second embodiment differs from the first embodiment in the shape of the reflecting portion.
In addition, about the structure similar to the said embodiment, description may be abbreviate | omitted by attaching | subjecting the same code | symbol suitably.

FIG. 4 is a cross-sectional view showing the wavelength conversion element 130 of the present embodiment.
As shown in FIG. 4, the wavelength conversion element 130 of this embodiment includes a substrate 31, a reflective adhesive member 132, and a phosphor layer 33.
The reflective adhesive member 132 includes a reflective part 134 and an adhesive part 35. The reflection portion 134 corresponds to the reflection member in the claims.

  The reflecting portion 134 is a portion provided in the reflective adhesive member 132 so as to face the side surface 33 b of the phosphor layer 33. The reflection part 134 is bonded and fixed on the upper surface 31 a of the substrate 31. The planar view shape of the reflection unit 134 is, for example, a rectangular ring shape, like the reflection unit 34 of the first embodiment. The cross-sectional shape perpendicular to the upper surface 31a of the substrate 31 of the reflecting portion 134 is a shape that protrudes above the adhesive portion 35 from the upper surface 31a of the substrate 31 as shown in FIG.

  The reflection unit 134 includes a concave surface 314 a that faces the side surface 33 b of the phosphor layer 33. A gap 140 is provided between the concave surface 134 a and the side surface 33 b of the phosphor layer 33. The concave surface 134a is configured such that the thickness W22 of the gap 140 increases as the distance from the substrate 31 increases. The concave surface 134a is a surface that is concave on the side opposite to the phosphor layer 33 side. The cross-sectional profile of the concave surface 134a may be an arc shape or an elliptical arc shape. In the present embodiment, the cross-sectional profile of the concave surface 134a has an arc shape.

When the upper surface 31a of the substrate 31 is used as a reference for the height, the height H22 of the vertex 134b of the reflecting portion 134 is larger than the height H21 of the upper surface 33a of the phosphor layer 33.
The material of the reflective adhesive member 132 is the same as that of the reflective adhesive member 32 of the first embodiment.

  The fluorescence Lf emitted from the phosphor layer 33 is reflected by the concave surface 134a, jumped up, and emitted to the same side as the side on which the excitation light Le is incident. In the present embodiment, the apparent light emitting region 138 is a region surrounded by the upper end of the concave surface 134a, that is, the vertex 134b of the reflecting portion 134 in plan view.

Next, the manufacturing method of the light source device of this embodiment is demonstrated.
Since the light source device of this embodiment can be manufactured by arranging the condensing optical system 23 with respect to the wavelength conversion element 130 as in the first embodiment, in the following description, the manufacture of the wavelength conversion element 130 will be described. Only the method will be described.

FIG. 5A to FIG. 5D are cross-sectional views showing the procedure of the method for manufacturing the wavelength conversion element of this embodiment.
The manufacturing method of the wavelength conversion element of this embodiment has a coating process, a pressing process, a patterning process, and a hardening process.

The application process is the same as the application process described in the first embodiment.
By this step, as shown in FIG. 5A, the uncured adhesive material 41 is applied to the upper surface 31a of the substrate 31 in layers.

Next, the pressing step is the same as the pressing step described in the first embodiment.
By this step, as shown in FIG. 5B, a protruding portion 143 composed of an uncured adhesive material 41 and an uncured adhesive portion 144 are formed. The protruding portion 143 is the same portion as the uncured reflecting portion 43 shown in FIG. 3B in the first embodiment.

Next, the patterning step is a step of pressing the mold 90 against the uncured adhesive material 41 as shown in FIG.
The mold 90 is a mother mold in which a reflection part pattern 91 and a concave part 92 are formed on a processed surface.
The reflection part pattern 91 has an uneven shape obtained by inverting the shape of the reflection part 134 shown in FIG. For example, a release agent is applied to the surface of the reflection portion pattern 91 for the purpose of preventing adhesion of the uncured adhesive material 41.

  The recess 92 is formed so that the phosphor layer 33 is accommodated inside when the mold 90 is pressed against the uncured adhesive material 41. The shape of the recess 92 is not particularly limited as long as the phosphor layer 33 is accommodated. In the present embodiment, for example, the recess 92 has a rectangular shape in cross-section.

When the mold 90 is pressed against the uncured adhesive material 41, the shape of the reflection portion pattern 91 is transferred to the uncured adhesive material 41. That is, the protruding portion 143 is formed in the shape of the reflecting portion 134 by the reflecting portion pattern 91.
By this step, an uncured reflective adhesive member 142 having an uncured reflecting portion 145 is formed.

Next, the curing step is the same as the curing step described in the first embodiment.
By this step, the uncured reflective adhesive member 142 is cured, and the reflective adhesive member 132 is formed as shown in FIG. That is, the uncured reflecting portion 145 and the uncured adhesive portion 144 are cured, and the reflecting portion 134 and the adhesive portion 35 are formed.
The wavelength conversion element 130 of this embodiment is manufactured by the above process.

  According to this embodiment, since the reflecting surface 134 is provided with the concave surface 134a, the fluorescence Lf emitted from the side surface 33b of the phosphor layer 33 is easily reflected upward by the concave surface 134a. Therefore, according to the present embodiment, it is possible to suppress the fluorescence Lf reflected by the reflecting portion 134 from entering the phosphor layer 33 again.

  Further, according to the present embodiment, as in the first embodiment, since the reflecting portion 134 and the bonding portion 35 are integrated, the reflecting portion 134 can be provided close to the phosphor layer 33. Thereby, the width W21 of the light emitting region 138 can be reduced, and the light use efficiency can be improved.

  Further, according to the present embodiment, since the height H22 of the vertex 134b of the reflecting portion 134 is larger than the height H21 of the upper surface 33a of the phosphor layer 33, the fluorescence Lf emitted from the side surface 33b of the phosphor layer 33 is increased. Can easily enter the concave surface 134a of the reflecting portion 134, and the light use efficiency can be further improved.

  In addition, according to the manufacturing method of the light source device of the present embodiment, more specifically, the manufacturing method of the wavelength conversion element 130, the shape of the reflection portion 134 is formed using the mold 90, and thus the reflection portion formed on the mold 90. By adjusting the pattern 91, the shape and height H22 of the reflecting portion 134 and the width W21 of the light emitting region 138 can be arbitrarily set.

(Third embodiment)
The third embodiment is different from the first embodiment in that a support member 236 is provided on the substrate 31.
In addition, about the structure similar to the said embodiment, description may be abbreviate | omitted by attaching | subjecting the same code | symbol suitably.

FIG. 6 is a cross-sectional view showing the wavelength conversion element 230 of the present embodiment.
As shown in FIG. 6, the wavelength conversion element 230 according to the present embodiment includes a substrate 31, a support member 236, a reflective adhesive member 232, and a phosphor layer 233. The phosphor layer 233 has a side surface 233b, a bottom surface 233c, and an upper surface 233a facing the bottom surface 233c.

  The support member 236 is provided on the side opposite to the phosphor layer 233 of the reflection portion 234 of the reflective adhesive member 232 described later, and supports the reflection portion 234. The support member 236 is fixed to the upper surface 31 a of the substrate 31. The method for fixing the support member 236 is not particularly limited, and may be a method using an adhesive, a method of fixing with a screw, or pressing the support member 236 against the substrate 31 by another member. It may be a method of fixing.

  The support member 236 is provided so as to surround the phosphor layer 233 and the reflective adhesive member 232. The material of the support member 236 is not particularly limited and may be the same material as the substrate 31 or may be different.

The reflective adhesive member 232 includes a reflective portion 234 and an adhesive portion 35. The reflection portion 234 corresponds to the reflection member in the claims.
The reflection part 234 is in contact with and supported by the inner surface of the support member 236. The reflection unit 234 includes a side surface 234 a that faces the phosphor layer 233. A gap 240 is provided between the side surface 234 a of the reflecting portion 234 and the side surface 233 b of the phosphor layer 233. The side surface 234a of the reflecting portion 234 is inclined so that the thickness W32 of the gap 240 increases as the distance from the substrate 31 increases.

  The plan view shape of the inner surface of the support member 236 may be, for example, a rectangular ring shape or an annular shape, but is preferably similar to the plan view shape of the phosphor layer 233. According to this, since the thickness W32 of the gap 240 can be made substantially uniform around the periphery of the phosphor layer 233, it is easy to make the light distribution of the fluorescence Lf emitted from the wavelength conversion element 230 uniform.

When the upper surface 31a of the substrate 31 is used as a height reference, the height H32 of the upper end of the reflecting portion 234 is larger than the height H31 of the upper surface 233a of the phosphor layer 233.
In the present embodiment, the apparent light emitting region 238 is a region inside the support member 236 in plan view.

  In the present embodiment, the phosphor layer 233 is transparent. That is, the phosphor layer 233 is composed of a transparent phosphor. The phosphor layer 233 is made of, for example, a single crystal having no interface or a continuous polycrystal.

  The phosphor layer 233 is such that all of the excitation light Le is converted into fluorescence Lf until the excitation light Le incident on the phosphor layer 233 from the upper surface 233a is reflected by the bonding portion 35 and returns to the upper surface 233a again. Designed to. Thereby, in this embodiment, the light inject | emitted from the fluorescent substance layer 233 consists of the fluorescence Lf produced | generated by the fluorescent substance layer 233. FIG.

  According to the present embodiment, since the support member 236 is provided, the phosphor layer 233 is pushed out from the lower portion of the phosphor layer 233 when the manufacturing method similar to that of the first embodiment is adopted. Uncured adhesive material crawls along the inner surface of the support member 236. Thereby, it is easy to make the height H32 larger than the height H31. Thereby, according to this embodiment, since the fluorescence Lf emitted from the side surface 233b of the phosphor layer 233 can be easily incident on the side surface 234a of the reflecting portion 234, the light utilization efficiency can be improved.

  Further, according to the present embodiment, since the area inside the support member 236 in the plan view becomes the apparent light emitting area 238, the size of the area surrounded by the inner surface of the support member 236 in the plan view is adjusted. The size of the light emitting region 238 can be adjusted. Thus, according to the present embodiment, it is easy to reduce the width W31 of the light emitting region 238.

In addition, when there are crystal interfaces and air holes in the phosphor layer, the excitation light Le incident on the upper surface of the phosphor layer is scattered multiple times by the crystal interfaces and air holes. For this reason, the excitation light Le cannot travel straight through the phosphor layer and is converted into fluorescence while being multiply scattered in the vicinity of the upper surface. Therefore, the amount of fluorescence conversion is relatively large in the vicinity of the upper surface of the phosphor layer, and the amount of heat generation is locally increased in the vicinity of the upper surface. As a result, the temperature in the vicinity of the upper surface of the phosphor layer is excessively increased, which may cause temperature quenching. In addition, when the phosphor layer is made of, for example, an inorganic ceramic, the thermal conductivity decreases as the temperature rises. Therefore, heat easily accumulates inside the phosphor layer, and the temperature is increased synergistically. There was a risk of rising.
From the above, there has been a problem that the amount of excitation light Le that can be applied to the phosphor layer is limited.

  With respect to this problem, according to the present embodiment, the phosphor layer 233 is transparent because it does not have a crystal interface or air hole as a scattering component. Therefore, the excitation light Le is not easily scattered in the phosphor layer 233, and the number of components that can reach the bottom surface 233c of the phosphor layer 233 increases. Thereby, the fluorescence conversion amount is dispersed in the height direction (thickness direction) of the phosphor layer 233, and the temperature distribution in the phosphor layer 233 in the height direction becomes broad. Therefore, the upper surface 233a of the phosphor layer 233 is suppressed from becoming relatively high temperature. This also reduces the maximum temperature in the phosphor layer 233.

  As described above, according to the present embodiment, since the temperature of the phosphor layer 233 does not easily rise, the amount of the excitation light Le applied to the phosphor layer 233 can be increased. As a result, the amount of fluorescence Lf emitted from the phosphor layer 233 can be increased.

  Further, in the conventional phosphor layer, the excitation light Le incident from the upper surface is designed to be completely converted into the fluorescence Lf before hitting the bottom surface or the reflection film provided on the bottom surface. Therefore, there has been a problem that the thickness of the phosphor layer becomes large.

  With respect to this problem, according to the present embodiment, the excitation light Le incident from the upper surface 233a of the phosphor layer 233 is reflected by the adhesive portion 35 provided on the bottom surface 233c of the phosphor layer 233 and is again reflected on the upper surface 233a. All are designed to be converted into fluorescence Lf before returning. Therefore, the thickness of the phosphor layer 233 can be reduced. Therefore, according to the present embodiment, the heat path from the upper surface 233a of the phosphor layer 233 to the substrate 31 can be shortened, and the heat dissipation efficiency can be improved. As a result, an increase in the temperature of the phosphor layer 233 can be further suppressed.

  In the first and second embodiments described above, a transparent phosphor layer may be used. When a transparent phosphor layer is used, a lot of fluorescence Lf is generated near the bottom surface of the phosphor layer. Furthermore, the fluorescent light Lf generated in the phosphor layer is also easy to go straight in all directions without being scattered. Thereby, the amount of fluorescence Lf emitted from the side surface increases. Therefore, the first to third embodiments described above are particularly effective when the phosphor layer is transparent.

  In the present embodiment, the following configuration may be employed.

In the present embodiment, the support member 236 and the substrate 31 may be an integrated member.
In the above description, the support member 236 is configured to surround the reflective adhesive member 232 and the phosphor layer 233, but is not limited thereto. In the present embodiment, the support member 236 may be provided on a part of the periphery of the reflective adhesive member 232. That is, in the present embodiment, the support member 236 may be configured to support a part of the reflective portion 234 of the reflective adhesive member 232.

(Fourth embodiment)
The fourth embodiment includes a rotary wavelength conversion element.
In addition, about the structure similar to the said embodiment, description may be abbreviate | omitted by attaching | subjecting the same code | symbol suitably.

  FIG. 7 is a schematic configuration diagram showing the projector 2000 of the present embodiment. FIG. 8A and FIG. 8B are diagrams showing the wavelength conversion element 330 of the present embodiment. FIG. 8A is a plan view. FIG. 8B is a cross-sectional view taken along the line VIIIB-VIIIB in FIG.

As shown in FIG. 7, the projector 2000 of this embodiment includes an illumination device 310. The illumination device 310 includes a light source device 380.
In the present embodiment, the light source device 380 includes the condensing optical system 23 and the wavelength conversion element 330.

  As shown in FIGS. 8A and 8B, the wavelength conversion element 330 includes a disk 331, a reflective adhesive member 332, a phosphor layer 333, and a rotation mechanism 337. The disc 331 corresponds to the substrate in the claims.

  The reflective adhesive member 332 adheres the phosphor layer 333 to the disc 331 and reflects the fluorescence Lf emitted from the side surface 333b of the phosphor layer 333. The reflective adhesive member 332 includes an inner reflective portion 334, an outer reflective portion 338, and an adhesive portion 335. In the present embodiment, the inner reflection portion 334, the outer reflection portion 338, and the bonding portion 335 are configured as an integral structure. The inner reflection part 334 and the outer reflection part 338 correspond to the reflection member in the claims. The adhesive portion 335 corresponds to the adhesive in the claims.

The inner reflection portion 334 is a portion provided to face the inner side surface 333 b of the phosphor layer 333. The inner reflection portion 334 is bonded and fixed to the inner side of the phosphor layer 333 on the upper surface 331 a of the disk 331. As shown in FIG. 8A, the planar shape of the inner reflection portion 334 is, for example, an annular shape concentric with the disc 331 in this embodiment.
A gap 340 is provided between the inner side surface 333 b of the phosphor layer 333 and the inner reflection portion 334.

The outer reflecting portion 338 is a portion provided to face the outer side surface 333 d of the phosphor layer 333. The outer reflecting portion 338 is bonded and fixed to the outer side of the phosphor layer 333 on the upper surface 331 a of the disk 331. As shown in FIG. 8A, the planar shape of the outer reflecting portion 338 is, for example, an annular shape concentric with the disc 331 in this embodiment.
A gap 341 is provided between the outer side surface 333 d of the phosphor layer 333 and the outer reflection portion 338.

  The material of the reflective adhesive member 332, that is, the inner reflective portion 334, the outer reflective portion 338, and the adhesive portion 335 is the same as that of the reflective adhesive member 332 of the first embodiment.

  The bonding portion 335 is a portion that bonds the disc 331 and the phosphor layer 333. The bonding part 335 is the same as the bonding part 35 of the first embodiment except that the shape in plan view is an annular shape.

  The phosphor layer 333 includes a side surface 333b, a side surface 333d, a bottom surface 333c, and an upper surface 333a that faces the bottom surface 333c. The planar view shape of the phosphor layer 333 is an annular shape concentric with the disk 331. The cross-sectional shape perpendicular to the upper surface 333a of the phosphor layer 333 is, for example, a rectangular shape. The phosphor layer 333 is bonded to the disk 331 by the bonding portion 335. As shown in FIG. 8A, the phosphor layer 333 is provided between the inner reflecting portion 334 and the outer reflecting portion 338 in a plan view.

  As shown in FIGS. 8A and 8B, the rotation mechanism 337 includes an output shaft 337a. The output shaft 337a is inserted through and fixed to the center of the disc 331. The rotation mechanism 337 rotates the disk 331 around the output shaft 337a.

  As shown in FIG. 7, in a state where the disk 331 is rotated by the rotation mechanism 337, excitation light is irradiated to a part of the annular phosphor layer 333 provided on the disk 331, and wavelength conversion is performed. Fluorescence is emitted from the element 330. A portion irradiated with excitation light in the wavelength conversion element 330 is referred to as a wavelength conversion unit 339. The cross-sectional shape of the wavelength conversion unit 339 is the same as the cross-sectional shape of the wavelength conversion element 30 of the first embodiment, as shown in FIG. 8B.

  According to this embodiment, since the phosphor layer 333 is provided in an annular shape on the disc 331 rotated by the rotation mechanism 337, the excitation light in the phosphor layer 333 is irradiated by the rotation of the disc 331. The position to be moved moves, and the heat generation points in the phosphor layer 333 are dispersed. Thereby, it can suppress that the temperature of the fluorescent substance layer 333 rises excessively.

  In the above description, the cross-sectional shape of the wavelength conversion unit 339 is the same as the cross-sectional shape of the wavelength conversion element 30 of the first embodiment, but is not limited thereto. In the present embodiment, the cross-sectional shape of the wavelength conversion unit may be the same as the cross-sectional shape of the wavelength conversion element of the second embodiment or the third embodiment.

  In the above-described embodiment, the three liquid crystal panels 70R, 70G, and 70B are employed as the light modulation devices. However, the present invention is not limited to this, and for example, a color image can be obtained with one liquid crystal panel as the light modulation device. You may employ | adopt the liquid crystal panel which displays.

  Moreover, in said embodiment, although the fluorescent substance layer which produces | generates red light and green light was used, it is not restricted to this. For example, a phosphor layer that generates either red light or green light may be used. Moreover, you may use the fluorescent substance layer which produces | generates white light.

  In the above embodiment, the liquid crystal panel 70R, the liquid crystal panel 70G, and the liquid crystal panel 70B, which are transmission type light modulation devices, are used as the light modulation device. However, the present invention is not limited to this, and as the light modulation device, for example, Other types of light modulation devices such as a reflective light modulation device and a micromirror light modulation device can be employed. For example, a DMD (Digital Micromirror Device) can be used as the micromirror type light modulation device.

  In the above embodiment, an example in which the light source device of the present invention is applied to a projector has been described. However, the present invention is not limited to this. The light source device of the present invention can also be applied to lighting fixtures, automobile headlamps, optical disk devices, and the like.

  31 ... substrate, 33a, 233a, 333a ... upper surface, 33, 233, 333 ... phosphor layer, 33b, 233b, 333b, 333d ... side surface (side surface of phosphor layer), 33c, 233c, 333c ... bottom surface, 34, 134 , 234... Reflection part, 34, 134, 234... Reflection part (reflection member), 34a, 234a. 341 ... Gap, 41 ... Adhesive material, 70B, 70G, 70R ... Liquid crystal panel (light modulation device), 73 ... Projection optical system, 80,380 ... Light source device, 90 ... Mold, 134a, 314a ... Concave surface, 331 ... Disk (Substrate), 334... Inner reflecting portion (reflecting member), 337... Rotating mechanism, 338. 12, W22, W32 ... thickness

Claims (10)

A phosphor layer having a side surface, a bottom surface, and a top surface facing the bottom surface;
A reflective member facing the side surface of the phosphor layer;
A substrate provided on the bottom side of the phosphor layer;
An adhesive that has light reflectivity and bonds the phosphor layer and the substrate;
With
The light source device according to claim 1, wherein the reflective member and the adhesive have an integral structure.   The light source device according to claim 1, further comprising a support portion that supports the reflecting member on a side opposite to the phosphor layer of the reflecting member. The reflecting member has a side surface facing the side surface of the phosphor layer,
The light source device according to claim 1, wherein a gap is provided between the side surface of the phosphor layer and the side surface of the reflecting member.   The light source device according to claim 3, wherein the side surface of the reflecting member has an inclined portion such that the thickness of the gap increases as the distance from the substrate increases.   4. The light source device according to claim 3, wherein the side surface of the reflecting member is a concave surface that increases in thickness as the distance from the substrate increases, and is concave on the side opposite to the phosphor layer.   The light source device according to claim 1, further comprising a rotation mechanism that rotates the substrate.   The light source device according to claim 1, wherein the phosphor layer is transparent.   The light source device according to claim 7, wherein the light emitted from the phosphor layer is made of fluorescence generated in the phosphor layer. A light source device for emitting illumination light;
A light modulation device that modulates the illumination light according to image information to form image light;
A projection optical system for projecting the image light,
A projector using the light source device according to claim 1 as the light source device. A phosphor layer having a side surface, a bottom surface, and an upper surface facing the bottom surface; a reflecting member facing the side surface of the phosphor layer; and a substrate provided on the bottom surface side of the phosphor layer. A light source device manufacturing method comprising:
Applying an uncured adhesive material having light reflectivity on the substrate;
Pressing the phosphor layer against the uncured adhesive material;
A step of pressing a mold against the uncured adhesive material to transfer the shape of the reflecting member;
Curing the uncured adhesive material;
A method of manufacturing a light source device, comprising:

Images