TWI419377B - 光電半導體組件 - Google Patents
光電半導體組件 Download PDFInfo
- Publication number
- TWI419377B TWI419377B TW099142775A TW99142775A TWI419377B TW I419377 B TWI419377 B TW I419377B TW 099142775 A TW099142775 A TW 099142775A TW 99142775 A TW99142775 A TW 99142775A TW I419377 B TWI419377 B TW I419377B
- Authority
- TW
- Taiwan
- Prior art keywords
- conversion element
- semiconductor wafer
- radiation
- semiconductor component
- optoelectronic semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 167
- 238000006243 chemical reaction Methods 0.000 claims description 128
- 230000005855 radiation Effects 0.000 claims description 77
- 230000005693 optoelectronics Effects 0.000 claims description 49
- 230000005670 electromagnetic radiation Effects 0.000 claims description 37
- 239000012790 adhesive layer Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 25
- 239000002245 particle Substances 0.000 claims description 16
- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 claims description 13
- 239000010410 layer Substances 0.000 claims description 10
- 150000002118 epoxides Chemical class 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 6
- 238000004382 potting Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 claims description 5
- -1 BaSO 4 Inorganic materials 0.000 claims description 4
- 238000001228 spectrum Methods 0.000 claims description 4
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 150000002576 ketones Chemical class 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 235000019646 color tone Nutrition 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
- H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/147—Shapes of bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
Landscapes
- Led Device Packages (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009058006.9A DE102009058006B4 (de) | 2009-12-11 | 2009-12-11 | Optoelektronisches Halbleiterbauteil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201131822A TW201131822A (en) | 2011-09-16 |
| TWI419377B true TWI419377B (zh) | 2013-12-11 |
Family
ID=43536571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099142775A TWI419377B (zh) | 2009-12-11 | 2010-12-08 | 光電半導體組件 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9029907B2 (enExample) |
| EP (1) | EP2510558B1 (enExample) |
| JP (1) | JP5863665B2 (enExample) |
| KR (1) | KR20120117817A (enExample) |
| CN (2) | CN105023999B (enExample) |
| DE (1) | DE102009058006B4 (enExample) |
| TW (1) | TWI419377B (enExample) |
| WO (1) | WO2011069791A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010048162A1 (de) | 2010-10-11 | 2012-04-12 | Osram Opto Semiconductors Gmbh | Konversionsbauteil |
| DE102012101102A1 (de) | 2012-02-10 | 2013-08-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Anordnung mit einer Mehrzahl von derartigen Bauelementen |
| DE102012113003A1 (de) | 2012-12-21 | 2014-04-03 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil |
| DE202013101400U1 (de) * | 2013-04-02 | 2014-07-03 | Zumtobel Lighting Gmbh | Anordnung zum Konvertieren des von einer LED-Lichtquelle emittierten Lichts |
| DE102013220790A1 (de) * | 2013-10-15 | 2015-04-16 | Osram Opto Semiconductors Gmbh | Herstellung eines optoelektronischen Bauelements |
| JP2015109337A (ja) * | 2013-12-04 | 2015-06-11 | 日東電工株式会社 | 光半導体装置用熱硬化性樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、ならびに光半導体装置 |
| WO2015104648A1 (en) * | 2014-01-09 | 2015-07-16 | Koninklijke Philips N.V. | Light emitting device with reflective sidewall |
| DE102014114914A1 (de) * | 2014-10-14 | 2016-04-14 | Osram Opto Semiconductors Gmbh | Herstellung eines optoelektronischen Bauelements |
| DE102016105988A1 (de) * | 2016-04-01 | 2017-10-05 | Osram Opto Semiconductors Gmbh | Konverter zur teilweisen Konversion einer Primärstrahlung und lichtemittierendes Bauelement |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM357028U (en) * | 2009-01-08 | 2009-05-11 | Jmk Optoelectronic Co Ltd | Packaging structure for light emitting diode |
| US20090166657A1 (en) * | 2007-12-28 | 2009-07-02 | Nichia Corporation | Light emitting device |
| TW200947755A (en) * | 2007-11-29 | 2009-11-16 | Nichia Corp | Light-emitting device and its manufacturing method |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3789747B2 (ja) * | 2000-11-15 | 2006-06-28 | 三洋電機株式会社 | 発光装置の製造方法 |
| JP2006173271A (ja) * | 2004-12-14 | 2006-06-29 | Matsushita Electric Ind Co Ltd | 半導体発光装置、照明装置、携帯通信機器、及びカメラ |
| US7341878B2 (en) | 2005-03-14 | 2008-03-11 | Philips Lumileds Lighting Company, Llc | Wavelength-converted semiconductor light emitting device |
| JP2006294925A (ja) | 2005-04-12 | 2006-10-26 | Seiko Epson Corp | 発光素子、発光素子の製造方法および発光装置 |
| JP2007019096A (ja) * | 2005-07-05 | 2007-01-25 | Toyoda Gosei Co Ltd | 発光装置及びその製造方法 |
| US20100283074A1 (en) * | 2007-10-08 | 2010-11-11 | Kelley Tommie W | Light emitting diode with bonded semiconductor wavelength converter |
| JP5224173B2 (ja) | 2008-03-07 | 2013-07-03 | スタンレー電気株式会社 | 半導体発光装置 |
| EP2269239A2 (en) * | 2008-03-21 | 2011-01-05 | Koninklijke Philips Electronics N.V. | A luminous device |
| DE102008025159A1 (de) * | 2008-05-26 | 2009-12-10 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement, Reflexlichtschranke und Verfahren zur Herstellung eines Gehäuses |
| DE102008025923B4 (de) * | 2008-05-30 | 2020-06-18 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung |
| DE102008050538B4 (de) | 2008-06-06 | 2022-10-06 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
| WO2010035206A1 (en) * | 2008-09-25 | 2010-04-01 | Koninklijke Philips Electronics N.V. | Coated light emitting device and method for coating thereof |
-
2009
- 2009-12-11 DE DE102009058006.9A patent/DE102009058006B4/de active Active
-
2010
- 2010-11-17 US US13/515,256 patent/US9029907B2/en active Active
- 2010-11-17 CN CN201510315781.8A patent/CN105023999B/zh active Active
- 2010-11-17 CN CN201080056260.0A patent/CN102652369B/zh active Active
- 2010-11-17 EP EP10788035.3A patent/EP2510558B1/de active Active
- 2010-11-17 JP JP2012542430A patent/JP5863665B2/ja active Active
- 2010-11-17 WO PCT/EP2010/067707 patent/WO2011069791A1/de not_active Ceased
- 2010-11-17 KR KR1020127018022A patent/KR20120117817A/ko not_active Ceased
- 2010-12-08 TW TW099142775A patent/TWI419377B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200947755A (en) * | 2007-11-29 | 2009-11-16 | Nichia Corp | Light-emitting device and its manufacturing method |
| US20090166657A1 (en) * | 2007-12-28 | 2009-07-02 | Nichia Corporation | Light emitting device |
| TWM357028U (en) * | 2009-01-08 | 2009-05-11 | Jmk Optoelectronic Co Ltd | Packaging structure for light emitting diode |
Also Published As
| Publication number | Publication date |
|---|---|
| US9029907B2 (en) | 2015-05-12 |
| KR20120117817A (ko) | 2012-10-24 |
| CN102652369B (zh) | 2015-07-01 |
| EP2510558A1 (de) | 2012-10-17 |
| US20120299041A1 (en) | 2012-11-29 |
| JP2013513934A (ja) | 2013-04-22 |
| DE102009058006A1 (de) | 2011-06-16 |
| CN102652369A (zh) | 2012-08-29 |
| JP5863665B2 (ja) | 2016-02-16 |
| EP2510558B1 (de) | 2019-06-26 |
| TW201131822A (en) | 2011-09-16 |
| WO2011069791A1 (de) | 2011-06-16 |
| DE102009058006B4 (de) | 2022-03-31 |
| CN105023999A (zh) | 2015-11-04 |
| CN105023999B (zh) | 2018-07-17 |
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