KR20120117817A - 광전자 반도체 소자 - Google Patents
광전자 반도체 소자 Download PDFInfo
- Publication number
- KR20120117817A KR20120117817A KR1020127018022A KR20127018022A KR20120117817A KR 20120117817 A KR20120117817 A KR 20120117817A KR 1020127018022 A KR1020127018022 A KR 1020127018022A KR 20127018022 A KR20127018022 A KR 20127018022A KR 20120117817 A KR20120117817 A KR 20120117817A
- Authority
- KR
- South Korea
- Prior art keywords
- radiation
- semiconductor chip
- transducer element
- semiconductor device
- optoelectronic semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 176
- 230000005693 optoelectronics Effects 0.000 title claims abstract description 58
- 230000005855 radiation Effects 0.000 claims abstract description 96
- 238000000576 coating method Methods 0.000 claims abstract description 83
- 239000011248 coating agent Substances 0.000 claims abstract description 82
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 38
- 238000010168 coupling process Methods 0.000 claims abstract description 7
- 238000005859 coupling reaction Methods 0.000 claims abstract description 7
- 239000012790 adhesive layer Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 22
- 239000002245 particle Substances 0.000 claims description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- 150000002118 epoxides Chemical class 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 6
- -1 BaSO 4 Inorganic materials 0.000 claims description 5
- 238000001228 spectrum Methods 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 4
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
- H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/147—Shapes of bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
Landscapes
- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009058006.9A DE102009058006B4 (de) | 2009-12-11 | 2009-12-11 | Optoelektronisches Halbleiterbauteil |
| DE102009058006.9 | 2009-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20120117817A true KR20120117817A (ko) | 2012-10-24 |
Family
ID=43536571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127018022A Ceased KR20120117817A (ko) | 2009-12-11 | 2010-11-17 | 광전자 반도체 소자 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9029907B2 (enExample) |
| EP (1) | EP2510558B1 (enExample) |
| JP (1) | JP5863665B2 (enExample) |
| KR (1) | KR20120117817A (enExample) |
| CN (2) | CN105023999B (enExample) |
| DE (1) | DE102009058006B4 (enExample) |
| TW (1) | TWI419377B (enExample) |
| WO (1) | WO2011069791A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010048162A1 (de) | 2010-10-11 | 2012-04-12 | Osram Opto Semiconductors Gmbh | Konversionsbauteil |
| DE102012101102A1 (de) | 2012-02-10 | 2013-08-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Anordnung mit einer Mehrzahl von derartigen Bauelementen |
| DE102012113003A1 (de) | 2012-12-21 | 2014-04-03 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil |
| DE202013101400U1 (de) * | 2013-04-02 | 2014-07-03 | Zumtobel Lighting Gmbh | Anordnung zum Konvertieren des von einer LED-Lichtquelle emittierten Lichts |
| DE102013220790A1 (de) * | 2013-10-15 | 2015-04-16 | Osram Opto Semiconductors Gmbh | Herstellung eines optoelektronischen Bauelements |
| JP2015109337A (ja) * | 2013-12-04 | 2015-06-11 | 日東電工株式会社 | 光半導体装置用熱硬化性樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、ならびに光半導体装置 |
| WO2015104648A1 (en) * | 2014-01-09 | 2015-07-16 | Koninklijke Philips N.V. | Light emitting device with reflective sidewall |
| DE102014114914A1 (de) * | 2014-10-14 | 2016-04-14 | Osram Opto Semiconductors Gmbh | Herstellung eines optoelektronischen Bauelements |
| DE102016105988A1 (de) * | 2016-04-01 | 2017-10-05 | Osram Opto Semiconductors Gmbh | Konverter zur teilweisen Konversion einer Primärstrahlung und lichtemittierendes Bauelement |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3789747B2 (ja) * | 2000-11-15 | 2006-06-28 | 三洋電機株式会社 | 発光装置の製造方法 |
| JP2006173271A (ja) * | 2004-12-14 | 2006-06-29 | Matsushita Electric Ind Co Ltd | 半導体発光装置、照明装置、携帯通信機器、及びカメラ |
| US7341878B2 (en) | 2005-03-14 | 2008-03-11 | Philips Lumileds Lighting Company, Llc | Wavelength-converted semiconductor light emitting device |
| JP2006294925A (ja) | 2005-04-12 | 2006-10-26 | Seiko Epson Corp | 発光素子、発光素子の製造方法および発光装置 |
| JP2007019096A (ja) * | 2005-07-05 | 2007-01-25 | Toyoda Gosei Co Ltd | 発光装置及びその製造方法 |
| US20100283074A1 (en) * | 2007-10-08 | 2010-11-11 | Kelley Tommie W | Light emitting diode with bonded semiconductor wavelength converter |
| RU2489774C2 (ru) | 2007-11-29 | 2013-08-10 | Нития Корпорейшн | Светоизлучающее устройство и способ его изготовления |
| US8049237B2 (en) * | 2007-12-28 | 2011-11-01 | Nichia Corporation | Light emitting device |
| JP5224173B2 (ja) | 2008-03-07 | 2013-07-03 | スタンレー電気株式会社 | 半導体発光装置 |
| EP2269239A2 (en) * | 2008-03-21 | 2011-01-05 | Koninklijke Philips Electronics N.V. | A luminous device |
| DE102008025159A1 (de) * | 2008-05-26 | 2009-12-10 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement, Reflexlichtschranke und Verfahren zur Herstellung eines Gehäuses |
| DE102008025923B4 (de) * | 2008-05-30 | 2020-06-18 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung |
| DE102008050538B4 (de) | 2008-06-06 | 2022-10-06 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
| WO2010035206A1 (en) * | 2008-09-25 | 2010-04-01 | Koninklijke Philips Electronics N.V. | Coated light emitting device and method for coating thereof |
| TWM357028U (en) | 2009-01-08 | 2009-05-11 | Jmk Optoelectronic Co Ltd | Packaging structure for light emitting diode |
-
2009
- 2009-12-11 DE DE102009058006.9A patent/DE102009058006B4/de active Active
-
2010
- 2010-11-17 US US13/515,256 patent/US9029907B2/en active Active
- 2010-11-17 CN CN201510315781.8A patent/CN105023999B/zh active Active
- 2010-11-17 CN CN201080056260.0A patent/CN102652369B/zh active Active
- 2010-11-17 EP EP10788035.3A patent/EP2510558B1/de active Active
- 2010-11-17 JP JP2012542430A patent/JP5863665B2/ja active Active
- 2010-11-17 WO PCT/EP2010/067707 patent/WO2011069791A1/de not_active Ceased
- 2010-11-17 KR KR1020127018022A patent/KR20120117817A/ko not_active Ceased
- 2010-12-08 TW TW099142775A patent/TWI419377B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| US9029907B2 (en) | 2015-05-12 |
| CN102652369B (zh) | 2015-07-01 |
| EP2510558A1 (de) | 2012-10-17 |
| US20120299041A1 (en) | 2012-11-29 |
| JP2013513934A (ja) | 2013-04-22 |
| DE102009058006A1 (de) | 2011-06-16 |
| CN102652369A (zh) | 2012-08-29 |
| JP5863665B2 (ja) | 2016-02-16 |
| TWI419377B (zh) | 2013-12-11 |
| EP2510558B1 (de) | 2019-06-26 |
| TW201131822A (en) | 2011-09-16 |
| WO2011069791A1 (de) | 2011-06-16 |
| DE102009058006B4 (de) | 2022-03-31 |
| CN105023999A (zh) | 2015-11-04 |
| CN105023999B (zh) | 2018-07-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20120711 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20151005 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20160824 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20170227 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20160824 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |