TWI393186B - 用以安排金屬沈積用之基板表面的方法及整合之系統 - Google Patents
用以安排金屬沈積用之基板表面的方法及整合之系統 Download PDFInfo
- Publication number
- TWI393186B TWI393186B TW96131990A TW96131990A TWI393186B TW I393186 B TWI393186 B TW I393186B TW 96131990 A TW96131990 A TW 96131990A TW 96131990 A TW96131990 A TW 96131990A TW I393186 B TWI393186 B TW I393186B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- copper
- metal
- vacuum
- layer
- Prior art date
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/513,634 US8771804B2 (en) | 2005-08-31 | 2006-08-30 | Processes and systems for engineering a copper surface for selective metal deposition |
US11/513,446 US8747960B2 (en) | 2005-08-31 | 2006-08-30 | Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide |
US11/514,038 US8241701B2 (en) | 2005-08-31 | 2006-08-30 | Processes and systems for engineering a barrier surface for copper deposition |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200832556A TW200832556A (en) | 2008-08-01 |
TWI393186B true TWI393186B (zh) | 2013-04-11 |
Family
ID=41202298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW96131990A TWI393186B (zh) | 2006-08-30 | 2007-08-29 | 用以安排金屬沈積用之基板表面的方法及整合之系統 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP5489717B2 (ja) |
CN (2) | CN103107120B (ja) |
MY (2) | MY171542A (ja) |
SG (1) | SG174752A1 (ja) |
TW (1) | TWI393186B (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090269507A1 (en) | 2008-04-29 | 2009-10-29 | Sang-Ho Yu | Selective cobalt deposition on copper surfaces |
US8227344B2 (en) * | 2010-02-26 | 2012-07-24 | Tokyo Electron Limited | Hybrid in-situ dry cleaning of oxidized surface layers |
JP2012054306A (ja) * | 2010-08-31 | 2012-03-15 | Tokyo Electron Ltd | 半導体装置の製造方法 |
CN103081089A (zh) * | 2010-08-31 | 2013-05-01 | 东京毅力科创株式会社 | 半导体装置的制造方法 |
JP5560144B2 (ja) * | 2010-08-31 | 2014-07-23 | 東京エレクトロン株式会社 | 半導体装置の製造方法 |
CN102468265A (zh) * | 2010-11-01 | 2012-05-23 | 中芯国际集成电路制造(上海)有限公司 | 连接插塞及其制作方法 |
US8603913B1 (en) * | 2012-12-20 | 2013-12-10 | Lam Research Corporation | Porous dielectrics K value restoration by thermal treatment and or solvent treatment |
US9040385B2 (en) | 2013-07-24 | 2015-05-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mechanisms for cleaning substrate surface for hybrid bonding |
CN105682856A (zh) * | 2013-10-22 | 2016-06-15 | 东曹Smd有限公司 | 经优化的纹理化表面及优化的方法 |
EP3155655B1 (en) * | 2014-06-16 | 2021-05-12 | Intel Corporation | Selective diffusion barrier between metals of an integrated circuit device |
US9997405B2 (en) * | 2014-09-30 | 2018-06-12 | Lam Research Corporation | Feature fill with nucleation inhibition |
US9768060B2 (en) * | 2014-10-29 | 2017-09-19 | Applied Materials, Inc. | Systems and methods for electrochemical deposition on a workpiece including removing contamination from seed layer surface prior to ECD |
KR20230026514A (ko) | 2016-10-02 | 2023-02-24 | 어플라이드 머티어리얼스, 인코포레이티드 | 루테늄 라이너로 구리 전자 이동을 개선하기 위한 도핑된 선택적 금속 캡 |
JP6842159B2 (ja) * | 2016-12-13 | 2021-03-17 | サムコ株式会社 | プラズマ処理方法 |
US10438846B2 (en) | 2017-11-28 | 2019-10-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Physical vapor deposition process for semiconductor interconnection structures |
JP2019192892A (ja) | 2018-04-18 | 2019-10-31 | 東京エレクトロン株式会社 | 処理システムおよび処理方法 |
CN113166929A (zh) | 2018-12-05 | 2021-07-23 | 朗姆研究公司 | 无空隙低应力填充 |
KR102301933B1 (ko) * | 2018-12-26 | 2021-09-15 | 한양대학교 에리카산학협력단 | 반도체 소자의 제조 방법 |
TW202117075A (zh) * | 2019-09-25 | 2021-05-01 | 日商東京威力科創股份有限公司 | 基板液處理方法及基板液處理裝置 |
US11555250B2 (en) * | 2020-04-29 | 2023-01-17 | Applied Materials, Inc. | Organic contamination free surface machining |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020001929A1 (en) * | 2000-04-25 | 2002-01-03 | Biberger Maximilian A. | Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module |
US6365516B1 (en) * | 2000-01-14 | 2002-04-02 | Advanced Micro Devices, Inc. | Advanced cobalt silicidation with in-situ hydrogen plasma clean |
US6475893B2 (en) * | 2001-03-30 | 2002-11-05 | International Business Machines Corporation | Method for improved fabrication of salicide structures |
US6638564B2 (en) * | 2000-04-10 | 2003-10-28 | Sony Corporation | Method of electroless plating and electroless plating apparatus |
TW200403768A (en) * | 2002-05-03 | 2004-03-01 | Intel Corp | Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures |
US20050106865A1 (en) * | 2001-09-26 | 2005-05-19 | Applied Materials, Inc. | Integration of ALD tantalum nitride for copper metallization |
TW200526815A (en) * | 2003-11-05 | 2005-08-16 | Freescale Semiconductor Inc | Compositions and methods for the electroless deposition of NiFe on a work piece |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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US6017820A (en) * | 1998-07-17 | 2000-01-25 | Cutek Research, Inc. | Integrated vacuum and plating cluster system |
US6144099A (en) * | 1999-03-30 | 2000-11-07 | Advanced Micro Devices, Inc. | Semiconductor metalization barrier |
JP2001326192A (ja) * | 2000-05-16 | 2001-11-22 | Applied Materials Inc | 成膜方法及び装置 |
JP2003034876A (ja) * | 2001-05-11 | 2003-02-07 | Ebara Corp | 触媒処理液及び無電解めっき方法 |
JP2003142579A (ja) * | 2001-11-07 | 2003-05-16 | Hitachi Ltd | 半導体装置の製造方法および半導体装置 |
US6875693B1 (en) * | 2003-03-26 | 2005-04-05 | Lsi Logic Corporation | Via and metal line interface capable of reducing the incidence of electro-migration induced voids |
JP2004363155A (ja) * | 2003-06-02 | 2004-12-24 | Ebara Corp | 半導体装置の製造方法及びその装置 |
JP2005116630A (ja) * | 2003-10-03 | 2005-04-28 | Ebara Corp | 配線形成方法及び装置 |
JP2007042662A (ja) * | 2003-10-20 | 2007-02-15 | Renesas Technology Corp | 半導体装置 |
JP4503356B2 (ja) * | 2004-06-02 | 2010-07-14 | 東京エレクトロン株式会社 | 基板処理方法および半導体装置の製造方法 |
-
2007
- 2007-08-17 MY MYPI2012004997A patent/MY171542A/en unknown
- 2007-08-17 CN CN201310011701.0A patent/CN103107120B/zh active Active
- 2007-08-17 CN CN200780032409.XA patent/CN101558186B/zh active Active
- 2007-08-17 SG SG2011062197A patent/SG174752A1/en unknown
- 2007-08-17 MY MYPI20090714 patent/MY148605A/en unknown
- 2007-08-17 JP JP2009526621A patent/JP5489717B2/ja not_active Expired - Fee Related
- 2007-08-29 TW TW96131990A patent/TWI393186B/zh active
-
2013
- 2013-12-25 JP JP2013266333A patent/JP5820870B2/ja not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6365516B1 (en) * | 2000-01-14 | 2002-04-02 | Advanced Micro Devices, Inc. | Advanced cobalt silicidation with in-situ hydrogen plasma clean |
US6638564B2 (en) * | 2000-04-10 | 2003-10-28 | Sony Corporation | Method of electroless plating and electroless plating apparatus |
US20020001929A1 (en) * | 2000-04-25 | 2002-01-03 | Biberger Maximilian A. | Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module |
US6475893B2 (en) * | 2001-03-30 | 2002-11-05 | International Business Machines Corporation | Method for improved fabrication of salicide structures |
US20050106865A1 (en) * | 2001-09-26 | 2005-05-19 | Applied Materials, Inc. | Integration of ALD tantalum nitride for copper metallization |
TW200403768A (en) * | 2002-05-03 | 2004-03-01 | Intel Corp | Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures |
TW200526815A (en) * | 2003-11-05 | 2005-08-16 | Freescale Semiconductor Inc | Compositions and methods for the electroless deposition of NiFe on a work piece |
Also Published As
Publication number | Publication date |
---|---|
JP2010503205A (ja) | 2010-01-28 |
SG174752A1 (en) | 2011-10-28 |
JP5489717B2 (ja) | 2014-05-14 |
CN101558186A (zh) | 2009-10-14 |
JP2014099627A (ja) | 2014-05-29 |
CN103107120A (zh) | 2013-05-15 |
JP5820870B2 (ja) | 2015-11-24 |
CN101558186B (zh) | 2015-01-14 |
MY171542A (en) | 2019-10-17 |
CN103107120B (zh) | 2016-06-08 |
MY148605A (en) | 2013-05-15 |
TW200832556A (en) | 2008-08-01 |
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