TWI391724B - Processing chamber and processing device - Google Patents
Processing chamber and processing device Download PDFInfo
- Publication number
- TWI391724B TWI391724B TW094134347A TW94134347A TWI391724B TW I391724 B TWI391724 B TW I391724B TW 094134347 A TW094134347 A TW 094134347A TW 94134347 A TW94134347 A TW 94134347A TW I391724 B TWI391724 B TW I391724B
- Authority
- TW
- Taiwan
- Prior art keywords
- side walls
- processing chamber
- thickness
- chamber
- processing
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims description 87
- 239000000758 substrate Substances 0.000 claims description 46
- 230000003014 reinforcing effect Effects 0.000 claims description 40
- 238000012546 transfer Methods 0.000 claims description 19
- 239000011521 glass Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 11
- 230000007723 transport mechanism Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 230000032258 transport Effects 0.000 description 17
- 230000001965 increasing effect Effects 0.000 description 9
- 238000012423 maintenance Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000009489 vacuum treatment Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Liquid Crystal (AREA)
- Surface Treatment Of Glass (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005103654A JP4767574B2 (ja) | 2005-03-31 | 2005-03-31 | 処理チャンバおよび処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200634369A TW200634369A (en) | 2006-10-01 |
| TWI391724B true TWI391724B (zh) | 2013-04-01 |
Family
ID=37030593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094134347A TWI391724B (zh) | 2005-03-31 | 2005-09-30 | Processing chamber and processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4767574B2 (enExample) |
| KR (1) | KR100722026B1 (enExample) |
| CN (1) | CN100405535C (enExample) |
| TW (1) | TWI391724B (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4791110B2 (ja) * | 2005-09-02 | 2011-10-12 | 東京エレクトロン株式会社 | 真空チャンバおよび真空処理装置 |
| KR100948860B1 (ko) * | 2007-11-21 | 2010-03-22 | 주식회사 에스에프에이 | 화학 기상 증착 장치의 로드락 챔버 |
| TWI438829B (zh) * | 2007-11-21 | 2014-05-21 | Sfa Engineering Corp | 用於化學氣相沈積設備的裝載室 |
| US8677925B2 (en) | 2007-12-14 | 2014-03-25 | Ulvac, Inc. | Chamber and film forming apparatus |
| JP5062057B2 (ja) | 2008-06-25 | 2012-10-31 | 東京エレクトロン株式会社 | 真空処理装置 |
| KR20110067939A (ko) * | 2009-12-15 | 2011-06-22 | 주식회사 테스 | 로드락 챔버 |
| KR101308389B1 (ko) * | 2011-03-14 | 2013-09-16 | 엘아이지에이디피 주식회사 | 기판처리장치의 챔버 |
| JP6230021B2 (ja) * | 2014-02-06 | 2017-11-15 | ナビタス株式会社 | 熱転写装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0819765A (ja) * | 1994-07-07 | 1996-01-23 | Kaijo Corp | 超音波洗浄槽 |
| TW467765B (en) * | 2000-08-28 | 2001-12-11 | Tokyo Kakoki Co Ltd | Cap of treating chamber |
| TW200415091A (en) * | 2002-10-17 | 2004-08-16 | Daihachikasei Kk | Storage container for receiving precision substrates such as wafers |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61161378A (ja) * | 1985-01-07 | 1986-07-22 | 科学技術庁長官官房会計課長 | 大形ｆｒｐ製デユワ− |
| JP2743471B2 (ja) * | 1989-05-19 | 1998-04-22 | 日本電気株式会社 | ▲ｉｉｉ▼―ｖ族化合物半導体の気相成長装置 |
| US5121531A (en) * | 1990-07-06 | 1992-06-16 | Applied Materials, Inc. | Refractory susceptors for epitaxial deposition apparatus |
| JPH06176895A (ja) * | 1992-12-01 | 1994-06-24 | Ishikawajima Harima Heavy Ind Co Ltd | 粒子加速器の真空チェンバーおよびその製造方法 |
| SE9703420D0 (sv) * | 1997-09-22 | 1997-09-22 | Formcook Ab | Cooking process |
| US6121581A (en) * | 1999-07-09 | 2000-09-19 | Applied Materials, Inc. | Semiconductor processing system |
| JP2001029917A (ja) * | 1999-07-22 | 2001-02-06 | Jiro Sasaoka | 有機廃物加熱再利用法と装置 |
| JP4540796B2 (ja) * | 2000-04-21 | 2010-09-08 | 東京エレクトロン株式会社 | 石英ウインドウ、リフレクタ及び熱処理装置 |
| JP4084293B2 (ja) * | 2002-12-05 | 2008-04-30 | 株式会社アドヴァンスド・ディスプレイ・プロセス・エンジニアリング | Ｆｐｄ製造装置 |
| KR100564044B1 (ko) | 2004-10-06 | 2006-03-29 | 주식회사 에이디피엔지니어링 | 진공처리장치 |
-
2005
- 2005-03-31 JP JP2005103654A patent/JP4767574B2/ja not_active Expired - Fee Related
- 2005-09-30 TW TW094134347A patent/TWI391724B/zh active
- 2005-10-14 CN CNB2005101129364A patent/CN100405535C/zh not_active Expired - Fee Related
-
2006
- 2006-01-31 KR KR1020060009413A patent/KR100722026B1/ko active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0819765A (ja) * | 1994-07-07 | 1996-01-23 | Kaijo Corp | 超音波洗浄槽 |
| TW467765B (en) * | 2000-08-28 | 2001-12-11 | Tokyo Kakoki Co Ltd | Cap of treating chamber |
| TW200415091A (en) * | 2002-10-17 | 2004-08-16 | Daihachikasei Kk | Storage container for receiving precision substrates such as wafers |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100405535C (zh) | 2008-07-23 |
| KR20060106636A (ko) | 2006-10-12 |
| KR100722026B1 (ko) | 2007-05-25 |
| TW200634369A (en) | 2006-10-01 |
| CN1841648A (zh) | 2006-10-04 |
| JP4767574B2 (ja) | 2011-09-07 |
| JP2006283096A (ja) | 2006-10-19 |
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