TWI389969B - Epoxy resin composition for semiconductor sealing and semiconductor device - Google Patents

Epoxy resin composition for semiconductor sealing and semiconductor device Download PDF

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Publication number
TWI389969B
TWI389969B TW95114556A TW95114556A TWI389969B TW I389969 B TWI389969 B TW I389969B TW 95114556 A TW95114556 A TW 95114556A TW 95114556 A TW95114556 A TW 95114556A TW I389969 B TWI389969 B TW I389969B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
mass
group
parts
resin composition
Prior art date
Application number
TW95114556A
Other languages
English (en)
Chinese (zh)
Other versions
TW200708560A (en
Inventor
Shoichi Osada
Yasuo Kimura
Eiichi Asano
Toshio Shiobara
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200708560A publication Critical patent/TW200708560A/zh
Application granted granted Critical
Publication of TWI389969B publication Critical patent/TWI389969B/zh

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  • Chemical & Material Sciences (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
TW95114556A 2005-04-25 2006-04-24 Epoxy resin composition for semiconductor sealing and semiconductor device TWI389969B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005125950 2005-04-25
JP2006105251A JP4844726B2 (ja) 2005-04-25 2006-04-06 半導体封止用エポキシ樹脂組成物及び半導体装置

Publications (2)

Publication Number Publication Date
TW200708560A TW200708560A (en) 2007-03-01
TWI389969B true TWI389969B (zh) 2013-03-21

Family

ID=37550384

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95114556A TWI389969B (zh) 2005-04-25 2006-04-24 Epoxy resin composition for semiconductor sealing and semiconductor device

Country Status (3)

Country Link
JP (1) JP4844726B2 (ja)
KR (1) KR101191537B1 (ja)
TW (1) TWI389969B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5470680B2 (ja) 2007-02-06 2014-04-16 日亜化学工業株式会社 発光装置及びその製造方法並びに成形体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3137202B2 (ja) * 1990-10-30 2001-02-19 大日本インキ化学工業株式会社 エポキシ樹脂、その製造方法及びエポキシ樹脂組成物
JP2705527B2 (ja) * 1993-05-25 1998-01-28 松下電工株式会社 エポキシ樹脂組成物
JP3022135B2 (ja) * 1994-01-26 2000-03-15 信越化学工業株式会社 エポキシ樹脂組成物
JP3824064B2 (ja) * 2001-11-06 2006-09-20 信越化学工業株式会社 半導体封止用難燃性エポキシ樹脂組成物及び半導体装置
JP3824063B2 (ja) * 2001-11-06 2006-09-20 信越化学工業株式会社 半導体封止用難燃性エポキシ樹脂組成物及び半導体装置
JP4661033B2 (ja) * 2003-06-27 2011-03-30 Ｄｉｃ株式会社 エポキシ樹脂組成物、半導体封止材料及び半導体装置

Also Published As

Publication number Publication date
KR101191537B1 (ko) 2012-10-15
TW200708560A (en) 2007-03-01
JP2006328363A (ja) 2006-12-07
KR20060111852A (ko) 2006-10-30
JP4844726B2 (ja) 2011-12-28

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