TWI388691B - 氣相沉積之二維孔陣列 - Google Patents
氣相沉積之二維孔陣列 Download PDFInfo
- Publication number
- TWI388691B TWI388691B TW096101619A TW96101619A TWI388691B TW I388691 B TWI388691 B TW I388691B TW 096101619 A TW096101619 A TW 096101619A TW 96101619 A TW96101619 A TW 96101619A TW I388691 B TWI388691 B TW I388691B
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- Prior art keywords
- holes
- substrate
- ranging
- apertures
- deposition
- Prior art date
Links
- 238000007740 vapor deposition Methods 0.000 title description 20
- 239000000758 substrate Substances 0.000 claims description 127
- 238000000034 method Methods 0.000 claims description 56
- 239000000463 material Substances 0.000 claims description 37
- 210000003746 feather Anatomy 0.000 claims description 25
- 230000005855 radiation Effects 0.000 claims description 15
- 239000011148 porous material Substances 0.000 claims description 13
- 239000011364 vaporized material Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000011368 organic material Substances 0.000 claims description 6
- 230000001788 irregular Effects 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 3
- 238000000151 deposition Methods 0.000 description 59
- 230000008021 deposition Effects 0.000 description 54
- 238000005229 chemical vapour deposition Methods 0.000 description 30
- 239000012159 carrier gas Substances 0.000 description 23
- 239000007789 gas Substances 0.000 description 17
- 230000000694 effects Effects 0.000 description 15
- 238000009826 distribution Methods 0.000 description 14
- 239000000203 mixture Substances 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 9
- 239000012530 fluid Substances 0.000 description 8
- 238000002309 gasification Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 238000003491 array Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000000427 thin-film deposition Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000002207 thermal evaporation Methods 0.000 description 2
- 238000005019 vapor deposition process Methods 0.000 description 2
- 238000001947 vapour-phase growth Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000010793 Steam injection (oil industry) Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000003542 behavioural effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010839 body fluid Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005325 percolation Methods 0.000 description 1
- 230000005476 size effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000006200 vaporizer Substances 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
- C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/333,111 US7645483B2 (en) | 2006-01-17 | 2006-01-17 | Two-dimensional aperture array for vapor deposition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200732506A TW200732506A (en) | 2007-09-01 |
| TWI388691B true TWI388691B (zh) | 2013-03-11 |
Family
ID=37913591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096101619A TWI388691B (zh) | 2006-01-17 | 2007-01-16 | 氣相沉積之二維孔陣列 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7645483B2 (enExample) |
| EP (1) | EP1977025B1 (enExample) |
| JP (1) | JP5260312B2 (enExample) |
| KR (2) | KR101326147B1 (enExample) |
| TW (1) | TWI388691B (enExample) |
| WO (1) | WO2007084275A1 (enExample) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070221128A1 (en) * | 2006-03-23 | 2007-09-27 | Soo Young Choi | Method and apparatus for improving uniformity of large-area substrates |
| EP2425470A2 (en) * | 2009-05-01 | 2012-03-07 | Kateeva, Inc. | Method and apparatus for organic vapor printing |
| TWI472639B (zh) | 2009-05-22 | 2015-02-11 | Samsung Display Co Ltd | 薄膜沉積設備 |
| TWI475124B (zh) * | 2009-05-22 | 2015-03-01 | Samsung Display Co Ltd | 薄膜沉積設備 |
| KR20130048677A (ko) * | 2009-05-26 | 2013-05-10 | 엥떼르위니베르시테르 미크로엘렉트로니카 쌍트륌 베제드두블르베 | 기판에 유기 재료 층을 형성시키는 방법 |
| US8882920B2 (en) | 2009-06-05 | 2014-11-11 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
| US8882921B2 (en) * | 2009-06-08 | 2014-11-11 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
| KR101074792B1 (ko) * | 2009-06-12 | 2011-10-19 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
| KR101117719B1 (ko) * | 2009-06-24 | 2012-03-08 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
| KR101127575B1 (ko) * | 2009-08-10 | 2012-03-23 | 삼성모바일디스플레이주식회사 | 증착 가림막을 가지는 박막 증착 장치 |
| JP5328726B2 (ja) * | 2009-08-25 | 2013-10-30 | 三星ディスプレイ株式會社 | 薄膜蒸着装置及びこれを利用した有機発光ディスプレイ装置の製造方法 |
| JP5677785B2 (ja) | 2009-08-27 | 2015-02-25 | 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． | 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法 |
| US8696815B2 (en) | 2009-09-01 | 2014-04-15 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
| US8876975B2 (en) | 2009-10-19 | 2014-11-04 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
| JP4974036B2 (ja) | 2009-11-19 | 2012-07-11 | 株式会社ジャパンディスプレイセントラル | 有機ｅｌ装置の製造方法 |
| KR101084184B1 (ko) | 2010-01-11 | 2011-11-17 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
| KR101174875B1 (ko) | 2010-01-14 | 2012-08-17 | 삼성디스플레이 주식회사 | 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
| KR101193186B1 (ko) * | 2010-02-01 | 2012-10-19 | 삼성디스플레이 주식회사 | 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
| KR101156441B1 (ko) | 2010-03-11 | 2012-06-18 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
| KR101202348B1 (ko) | 2010-04-06 | 2012-11-16 | 삼성디스플레이 주식회사 | 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법 |
| US8894458B2 (en) | 2010-04-28 | 2014-11-25 | Samsung Display Co., Ltd. | Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method |
| KR101223723B1 (ko) | 2010-07-07 | 2013-01-18 | 삼성디스플레이 주식회사 | 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
| KR101673017B1 (ko) | 2010-07-30 | 2016-11-07 | 삼성디스플레이 주식회사 | 박막 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조 방법 |
| KR101565920B1 (ko) | 2010-10-21 | 2015-11-05 | 비코 에이엘디 인코포레이티드 | 원자층 증착을 이용한 장치상의 배리어 층 형성 |
| KR101723506B1 (ko) | 2010-10-22 | 2017-04-19 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
| KR101738531B1 (ko) | 2010-10-22 | 2017-05-23 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
| KR20120045865A (ko) | 2010-11-01 | 2012-05-09 | 삼성모바일디스플레이주식회사 | 유기층 증착 장치 |
| KR20120065789A (ko) | 2010-12-13 | 2012-06-21 | 삼성모바일디스플레이주식회사 | 유기층 증착 장치 |
| KR101760897B1 (ko) | 2011-01-12 | 2017-07-25 | 삼성디스플레이 주식회사 | 증착원 및 이를 구비하는 유기막 증착 장치 |
| KR101852517B1 (ko) | 2011-05-25 | 2018-04-27 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
| KR101840654B1 (ko) | 2011-05-25 | 2018-03-22 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
| KR101857249B1 (ko) | 2011-05-27 | 2018-05-14 | 삼성디스플레이 주식회사 | 패터닝 슬릿 시트 어셈블리, 유기막 증착 장치, 유기 발광 표시장치제조 방법 및 유기 발광 표시 장치 |
| KR101826068B1 (ko) | 2011-07-04 | 2018-02-07 | 삼성디스플레이 주식회사 | 유기층 증착 장치 |
| KR20140118551A (ko) | 2013-03-29 | 2014-10-08 | 삼성디스플레이 주식회사 | 증착 장치, 유기 발광 표시 장치 제조 방법 및 유기 발광 표시 장치 |
| KR102037376B1 (ko) | 2013-04-18 | 2019-10-29 | 삼성디스플레이 주식회사 | 패터닝 슬릿 시트, 이를 구비하는 증착장치, 이를 이용한 유기발광 디스플레이 장치 제조방법 및 유기발광 디스플레이 장치 |
| CN105849867A (zh) | 2013-12-27 | 2016-08-10 | 3M创新有限公司 | 均匀成形制品的三维阵列上的均匀化学气相沉积涂层 |
| CN109190199B (zh) * | 2018-08-15 | 2023-05-05 | 中国人民解放军92942部队 | 确定排气孔二维排布方式的方法、装置，打孔方法，排气装置 |
| WO2025191947A1 (ja) * | 2024-03-11 | 2025-09-18 | 株式会社ニューフレアテクノロジー | 整流板、成膜装置、及びその評価方法 |
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| US5316793A (en) * | 1992-07-27 | 1994-05-31 | Texas Instruments Incorporated | Directed effusive beam atomic layer epitaxy system and method |
| US5268034A (en) | 1991-06-25 | 1993-12-07 | Lsi Logic Corporation | Fluid dispersion head for CVD appratus |
| US5286519A (en) | 1991-06-25 | 1994-02-15 | Lsi Logic Corporation | Fluid dispersion head |
| JP3735452B2 (ja) | 1997-10-24 | 2006-01-18 | 松下電器産業株式会社 | 誘電体薄膜形成装置及び誘電体薄膜形成方法 |
| US6337102B1 (en) | 1997-11-17 | 2002-01-08 | The Trustees Of Princeton University | Low pressure vapor phase deposition of organic thin films |
| US6050506A (en) | 1998-02-13 | 2000-04-18 | Applied Materials, Inc. | Pattern of apertures in a showerhead for chemical vapor deposition |
| US6565661B1 (en) | 1999-06-04 | 2003-05-20 | Simplus Systems Corporation | High flow conductance and high thermal conductance showerhead system and method |
| DE50100603D1 (de) | 2000-02-04 | 2003-10-16 | Aixtron Ag | Vorrichtung und verfahren zum abscheiden einer oder mehrerer schichten auf ein substrat |
| JP2002141290A (ja) | 2000-11-06 | 2002-05-17 | Hitachi Ltd | 半導体製造装置 |
| US20030015140A1 (en) * | 2001-04-26 | 2003-01-23 | Eastman Kodak Company | Physical vapor deposition of organic layers using tubular sources for making organic light-emitting devices |
| US7744957B2 (en) | 2003-10-23 | 2010-06-29 | The Trustees Of Princeton University | Method and apparatus for depositing material |
| TWI264473B (en) | 2001-10-26 | 2006-10-21 | Matsushita Electric Works Ltd | Vacuum deposition device and vacuum deposition method |
| JP3735287B2 (ja) * | 2001-10-26 | 2006-01-18 | 松下電工株式会社 | 真空蒸着装置及び真空蒸着方法 |
| US7524532B2 (en) | 2002-04-22 | 2009-04-28 | Aixtron Ag | Process for depositing thin layers on a substrate in a process chamber of adjustable height |
| JP2003324072A (ja) | 2002-05-07 | 2003-11-14 | Nec Electronics Corp | 半導体製造装置 |
| US20040144321A1 (en) * | 2003-01-28 | 2004-07-29 | Eastman Kodak Company | Method of designing a thermal physical vapor deposition system |
| JP2007500794A (ja) * | 2003-05-16 | 2007-01-18 | エスブイティー アソーシエイツ インコーポレイテッド | 薄膜蒸着エバポレーター |
| US20050103265A1 (en) | 2003-11-19 | 2005-05-19 | Applied Materials, Inc., A Delaware Corporation | Gas distribution showerhead featuring exhaust apertures |
| US7785672B2 (en) | 2004-04-20 | 2010-08-31 | Applied Materials, Inc. | Method of controlling the film properties of PECVD-deposited thin films |
-
2006
- 2006-01-17 US US11/333,111 patent/US7645483B2/en active Active
-
2007
- 2007-01-05 EP EP07709614.7A patent/EP1977025B1/en active Active
- 2007-01-05 JP JP2008551285A patent/JP5260312B2/ja active Active
- 2007-01-05 KR KR1020087017307A patent/KR101326147B1/ko active Active
- 2007-01-05 WO PCT/US2007/000425 patent/WO2007084275A1/en not_active Ceased
- 2007-01-05 KR KR1020137015088A patent/KR20130079647A/ko not_active Withdrawn
- 2007-01-16 TW TW096101619A patent/TWI388691B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JP5260312B2 (ja) | 2013-08-14 |
| EP1977025A1 (en) | 2008-10-08 |
| WO2007084275A1 (en) | 2007-07-26 |
| EP1977025B1 (en) | 2013-04-10 |
| US20070163497A1 (en) | 2007-07-19 |
| US7645483B2 (en) | 2010-01-12 |
| KR20130079647A (ko) | 2013-07-10 |
| KR101326147B1 (ko) | 2013-11-06 |
| KR20080093991A (ko) | 2008-10-22 |
| TW200732506A (en) | 2007-09-01 |
| JP2009523915A (ja) | 2009-06-25 |
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