TWI387013B - 使用經同位素濃化矽之裝置及方法 - Google Patents

使用經同位素濃化矽之裝置及方法 Download PDF

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TWI387013B
TWI387013B TW094120350A TW94120350A TWI387013B TW I387013 B TWI387013 B TW I387013B TW 094120350 A TW094120350 A TW 094120350A TW 94120350 A TW94120350 A TW 94120350A TW I387013 B TWI387013 B TW I387013B
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doped layer
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Peter L Gammel
Bailey R Jones
Isik C Kizilyalli
Hugo F Safar
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Agere Systems Inc
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Description

使用經同位素濃化矽之裝置及方法
本發明一般係關於半導體裝置，而更明確言之，係關於一種使用一摻雜的經同位素濃化之半導體材料來促進除熱之裝置及方法。
眾所皆知，矽係一般用於製造半導體晶圓之元素。在天然存在形式中，矽係由約92.2%的矽28(2 8 Si)、4.7%的矽29(2 9 Si)及3.1%的矽30(3 0 Si)組成。在天然存在的半導體(例如，矽及鍺)中，該材料之導熱性受同位素物種(例如，Si2 9 、Si3 0 )濃度之限制。半導體裝置中的熱量分佈及去除受其製作材料的導熱性所限制。低導熱性限制該等電晶體在一半導體晶圓上的堆集密度或在不引起裝置故障之條件下一裝置中所能產生的功率量。
此係由於特別適用於高功率應用的半導體裝置之使用期期間的限制因素之一係裝置使用期較短，此係因該裝置中的功率消耗引起較高溫度而造成該電晶體劣化所致。其他限制因素包括，因遷移率減小而洩漏增加所致的性能劣化以及因電遷移、閘極氧化物崩潰、閂鎖及熱散逸所致的可靠性降低。
在半導體裝置中，尤其係矽裝置中，在塑膠包裝之情況下，該矽溫度需不超過200℃或150℃。此溫度(100℃標稱溫度)降低7℃便會引起使用期增加二倍。因此，許多製造商已轉向使用外部冷卻方法，例如散熱片，來限制該裝置之溫度升高。為耗散積聚的熱量而作的其他嘗試包括：擴展該裝置之主動區域，藉由閘極控制的時脈來進行功率管理，多個臨界電壓單元，動態基板偏壓，包裝解決方式除熱以及讓晶圓變薄。但是，在冷卻技術中需要作進一步改進以允許該些裝置用於各種應用，例如微處理器、數位信號處理器及積體電路。
因此，此項技術中所需要的係一種用以製造不會表現出先前技術中的限制之半導體裝置之方法及裝置。
為解決上面論述的先前技術之缺點，本發明在一項具體實施例中提供一種用以製造一半導體裝置之方法。在此項具體實施例中，該方法包括，在一基底基板上形成經同位素濃化矽之一第一摻雜層，在該第一摻雜層上形成一經同位素濃化半導體材料之一第二層，以及在該第二層上構造主動裝置。
在另一項具體實施例中，本發明提供一種半導體裝置。在此項具體實施例之一方面中，該半導體裝置包括一經同位素濃化半導體材料之一第一摻雜層與位於該第一摻雜層上之一經同位素濃化半導體材料的一第二層、及位於該第二層上之主動裝置。
在另一項具體實施例中，提供一種積體電路。在此項特定具體實施例中，該積體電路包括經同位素濃化矽之一第一摻雜層、經同位素濃化矽之一第二摻雜層以及位於該第二摻層上面或內部之主動裝置。介電層係位於該主動裝置上，而互連係位於介電層中並將該等主動裝置互連以形成一可操作的積體電路。
上文已概述本發明之較佳特徵，以便熟習此項技術者可更佳地瞭解以下本發明之詳細說明。下面將說明本發明之額外特徵，其形成本發明之申請專利範圍之主題。熟習此項技術者會明白其可輕易地將所揭示的概念及特定具體實施例用作依據，來設計或修改用以實行本發明的相同目的之其他結構。熟習此項技術者還應認識到此類等效構造並不脫離本發明之範疇。
本發明確認使用一經同位素濃化半導體材料之第一層係有益的，該第一層係摻雜層且在其上形成一同位素濃化半導體材料之第二層。該第二層係用作一主動裝置層，在該層上面及內部構造主動裝置。由於該第一經同位素濃化層係摻雜層，其可充當用於該等半導體裝置之一背部電連接，該等半導體裝置係形成於該第二經同位素濃化層上，且因此，該第一經同位素濃化層還能充當該等半導體裝置之基底層。與二層中的經同位素濃化材料皆有關聯的散熱優點還允許裝置具有更長的使用期及更少的洩漏，進而增加可靠性。此外，在半導體工業目前實施的其他散熱作法外，可以額外方式來輕易地使用本發明。
經同位素濃化矽28(2 8 Si)所顯示出的導熱性比天然存在的矽高出60%至600%，後者在以下文獻中有說明：Capinski等人的"經同位素濃化矽之導熱性"，應用物理學刊第71期第2109－11頁(1997年)；以及，Ruf等人的"經同位素濃化矽之導熱性"，固態通訊學(Solid State Communications)第115期第243－47頁(2000年)，此等二案之全部內容皆係以引用的方式併入於此。經同位素濃化表示該矽的多個矽同位素中之一同位素所佔比例比天然存在的矽中之比例更高。在一範例中，其由至少98%2 8 Si組成。
同位素純鍺也已證明其導熱性比天然存在的鍺晶體更高，後者在以下文獻中有說明：Ozhogin等人的"鍺單晶之導熱性中的同位素效應"，JETP學刊第63卷第6期第490至494頁(1996)；以及Asen－Palmer等人的"具有不同的同位素成分之鍺晶體之導熱性"，物理評論B第56卷第15期第9431至9447頁(1997)，其全部內容係以引用的方式併入於此。在鍺之情況下，經同位素濃化表示該濃化鍺的多個鍺同位素中之一同位素所占比例比在天然存在的鍺(例如，其係由至少80%的鍺74(7 4 Ge)組成)中之所占比例更高。
首先來看圖1，其中說明依據本發明而製造之一半導體裝置100之一斷面圖。在所說明的具體實施例中，該半導體裝置100包括一經同位素濃化的半導體基板110。該基板110摻雜有一或多個摻雜劑。一磊晶(epi)或裝置層115位於該基板110上，且其亦係由一經同位素濃化半導體材料組成，而在一項具體實施例中，其係由與組成該基板110者相同的同位素濃化半導體材料組成。裝置層115較佳的係包括摻雜劑。該半導體裝置100進一步包括形成於該裝置層115內的井120及源極/汲極區域125。該等井120係藉由以傳統方法形成的隔離結構130而電絕緣。閘極135位於該裝置層115上且藉由一介電層145與該井120及源極/汲極125隔離。該閘極135還包括間隔物150。該等井120、源極/汲極區域125、該等閘極135及介電層145皆形成主動裝置155之至少一部分。
該半導體裝置100之設計可能依據其目的應用而變化。例如，該半導體裝置100可能係配置成一互補金屬氧化物半導體(CMOS)裝置而作為一射頻橫向摻雜的金屬氧化物半導體(RFLDMOS)裝置、作為一雙極裝置或用於形成一積體電路之其他裝置。但是，應瞭解的係，本發明可應用於許多不同類型的電晶體及裝置設計，且本發明不限於任一特定的設計。至此已總體上介紹該半導體裝置100，現在將對其製造及併入一積體電路加以論述。
現在來看圖2，其中說明一晶圓200之一斷面圖，在該晶圓200上可形成如上面簡要論述之半導體裝置。視該項具體實施例而定，該晶圓200之基板210可能由矽、鍺或者其組合或合金組成。但是，僅舉例而言，本文之論述將係關於使用矽來構造該基板210之一項具體實施例。如上面所提及，天然矽係由若干矽同位素組成，而更明確言之，係由約92.2%的矽28(2 8 Si)、4.7%的矽29(2 9 Si)及3.1%的矽30(3 0 Si)組成。該基板210之厚度可能稍有變化，但一般的係，該基板210之厚度約為625微米。在傳統基板中，該基板210充當一基底，一天然矽磊晶層形成於其上且係適當摻雜為形成用於主動裝置(例如，電晶體)之井及源極/汲極。但是，在本發明中，該基板210可能或可能不充當用於該半導體裝置之最終基底或基座層；因為，在某些具體實施例中，必須移除該基板210。
現在來看圖3，其中說明在沈積一第一經同位素濃化層315後該晶圓200之一斷面圖，該第一經同位素濃化層315包括一經同位素濃化半導體材料(例如2 8 Si、7 4 Ge)或者其組合或合金。在一項具體實施例中，該經同位素濃化半導體材料係2 8 Si。一方面，2 8 Si說明該第一經同位素濃化層315中存在的矽中至少約有93%係2 8 Si，而在其他具體實施例中，其說明該第一經同位素濃化層315中存在的矽中至少約有99.9%係2 8 Si。
該第一經同位素濃化層315還摻雜有一摻雜劑。例如，摻雜劑之範例包括p型摻雜劑或n型摻雜劑。該摻雜劑之濃度可變化，但在2 8 Si係一半導體材料而硼係該摻雜劑之一項具體實施例中，該摻雜劑濃度範圍從約1E18至約1E20個原子/cm3 ，而更佳的係約1E19個原子/cm3 。但是，在其他具體實施例中，熟習此項技術者會瞭解使用哪些具有任何給定應用所需要的經同位素濃化半導體材料及對應的摻雜劑濃度之摻雜劑。在一項具體實施例中，該沈積期間摻雜第一經同位素濃化層315。
可藉由熟習此項技術者熟知的技術，例如化學汽相沈積、分子束磊晶、汽相磊晶、液相磊晶、原子層沈積或物理汽相沈積技術或者其他在半導體晶圓製造技術中已知的方法，來製造該第一經同位素濃化層315。該第一經同位素濃化層315之厚度可能變化，但在一項具體實施例中，該沈積一直繼續至達到約40微米之厚度。
可藉由此項技術中廣為人知的任何可用商用方法，其中包括，高速離心機、氣體擴散、雷射輔助磁性分離及各種化學萃取技術，來濃化該第一經同位素濃化層315。對一特定技術之選擇取決於諸多因素，例如成本、欲分離的元素之質量以及產量要求。純化的矽(例如，28 Si)或鍺(例如，74 Ge)同位素係藉由從天然存在的來源中提煉同位素而獲得。用於矽的可接收之初始材料係經同位素濃化氣體，其中包括矽烷、單氯矽烷、雙氯矽烷、三氯矽烷、四氯化矽或四氟化矽。對於鍺來說，可接受的初始材料包括四氯化鍺、氯化鍺或四氟化鍺。可使用美國專利案第6,103,942號(其全部內容係以引用的方式併入於此)中說明的同位素分離方法來製備該些初始材料。
現在來看圖4，其中顯示在沈積一第二經同位素濃化層420後圖3之晶圓200。再次，將主要針對使用經同位素濃化矽之具體實施例進行論述，但亦可以類似的方式使用上面論述的其他半導體材料。在此項特定具體實施例中，使用如上面針對該第一經同位素濃化層315而論述者相同之方法來沈積該28 Si，且在一項具體實施例中該28 Si在存在於該第二經同位素濃化層420中的矽中至少佔約93%。但在另一項具體實施例中，該28 Si在存在於該第二經同位素濃化層420中的矽中至少佔約99.9%。事實上，在一項具體實施例中，該第二經同位素濃化層420之形成可能僅係用來形成該第一經同位素濃化層315的沈積程序之一繼續。但在此情況下，該第二經同位素濃化層420並非有意摻雜。應瞭解，儘管該第二經同位素濃化層420並非有意摻雜，但其可能變成摻雜有與用來摻雜該第一經同位素濃化層315的摻雜劑類型相同之摻雜劑，或者，替代性的係其可能係有意摻雜。再次，所產生的摻雜劑濃度可能改變，但在該摻雜劑係硼之一項具體實施例中，該摻雜濃度之範圍可能從約1E13至約2E15個原子/cm3 或更小，而在特定情況下該濃度將約為1E15個原子/cm3 。如同該第一經同位素濃化層315之情況一樣，該第二經同位素濃化層420之厚度可能改變，但在一方面，所產生的厚度約為10微米(增減範圍在±5微米內)。
該第二經同位素濃化層420充當該主動裝置或磊晶層，如上面圖1中所示及上面之論述，其內部或其上面可能形成主動裝置。可使用傳統技術來磊晶生長該磊晶層。仍認為一裝置形成於該第二經同位素濃化層420上，即使薄材料層(例如，薄絕緣層)可能將該主動裝置之部分與該第二經同位素濃化層420分離。此外，儘管僅顯示二個經同位素濃化層315、420，但其他具體實施例意圖使用多個同位素層。
在形成該第二經同位素濃化層420後，接著在該第二經同位素濃化層420上面及內部以傳統方法形成主動裝置425(如上面論述且顯示於圖1中)，如圖所示。在以傳統方法形成該等主動裝置425後，可藉使用傳統程序(例如，化學或機械研磨/蝕刻程序)來移除該基板210。但是，此步驟係可選的，而在某些具體實施例中不一定會實施。但是，在移除該基板210之該些具體實施例中，該第一經同位素濃化層315因其係摻雜而可用作該主動裝置425之一背側電接頭。移除該基板210會形成如圖1所示之具體實施例。
現在來看圖5，其中說明可併入圖4所示的主動裝置之一積體電路500。該積體電路500包括主動裝置505，例如電晶體。該閘極508係設計成在其個別的設計操作電壓下操作。該等閘極508係藉由一閘極介電質512而各自電絕緣。該等主動裝置505皆還包括形成於井520中且可能係按需要而摻雜的源極/汲極515。傳統的隔離結構525將該等主動裝置505彼此分離且電絕緣。層間介電層530位於該等主動裝置505上，而互連535形成於其中以將各種主動裝置505互連以形成一可操作的積體電路。該等主動裝置係形成於該第二經同位素濃化層540上以及該第一經同位素濃化層545上方，如上面之論述。按照本申請案之原理，熟習此項技術者會知道如何形成如圖5所示之可操作的積體電路。
儘管已詳細說明本發明，但熟習此項技術者應瞭解其能在不脫離本發明之範疇之條件下作各種變化、替代及更改。
100．．．半導體裝置
110．．．經同位素濃化的半導體基板
115．．．磊晶或裝置層
120．．．井
125．．．源極/汲極區域
130．．．以傳統方法形成的隔離結構
135．．．閘極
145．．．介電層
150‧‧‧間隔物
155‧‧‧主動裝置
200‧‧‧晶圓
210‧‧‧基板
315‧‧‧第一經同位素濃化層
420‧‧‧第二經同位素濃化層
425‧‧‧主動裝置
500‧‧‧積體電路
505‧‧‧主動裝置
508‧‧‧閘極
512‧‧‧閘極介電質
515‧‧‧源極/汲極
520‧‧‧井
525‧‧‧傳統的隔離結構
530‧‧‧層間介電層
535‧‧‧互連
540‧‧‧第二經同位素濃化層
545‧‧‧第一經同位素濃化層
結合附圖來閱讀上面的詳細說明，可更佳地瞭解本發明。應注意，依據半導體工業中的標準實務，各種特徵不一定係按比例繪製。事實上，為了論述簡潔，可任意增加或減小各種特徵之尺寸。現在參考上面結合附圖所作的說明，其中：圖1說明由一項具體實施例提供之一半導體裝置之一斷面圖；圖2說明上面可能沈積有經同位素濃化半導體材料層之一天然半導體基板之斷面圖；以及圖3說明在已沈積一摻雜的經同位素濃化材料層之後，圖2的基板之一斷面圖。
圖4說明在已沈積一第二經同位素濃化材料層並已在該第二經同位素濃化材料層上面及內部形成主動裝置之後，圖3的基板之一斷面圖；以及圖5顯示將圖4的基板及主動裝置併入其中之一積體電路之一部分斷面圖。
100．．．半導體裝置
110．．．經同位素濃化的半導體基板
115．．．磊晶或裝置層
120．．．井
125．．．源極/汲極區域
130．．．以傳統方法形成的隔離結構
135．．．閘極
145．．．介電層
150．．．間隔物
155．．．主動裝置

Claims (10)

  1. 一種用於製造半導體裝置之方法，其包含：在一基底基板上形成一經同位素濃化半導體材料之一第一摻雜層，該第一摻雜層具有一第一摻雜濃度；在該第一摻雜層上形成經同位素濃化半導體材料之一第二摻雜層，且該第二摻雜層與該第一摻雜層接觸，該第二摻雜層具有與第一摻雜層不同之一摻雜濃度；以及在該第二層上構造主動裝置。
  2. 如請求項1之方法，其中該第一摻雜層與該第二層係採用矽28(28 Si)之同位素濃化。
  3. 如請求項2之方法，其中該28 Si在該第一摻雜層與該第二摻雜層之每一層中存在的矽中佔約93%以上。
  4. 如請求項1之方法，其中該第一摻雜層及該第二摻雜層係磊晶沈積於該基底基板上，而該第一摻雜層係摻雜於該磊晶沈積期間。
  5. 如請求項1之方法，其中形成該第一摻雜層包括將該第一摻雜層的摻雜劑濃度摻雜為約1E18至約1E20個原子/cm3 之範圍，而該第二摻雜層的濃度係摻雜成約1E13至約2E15個原子/cm3 之範圍。
  6. 一種積體電路，其包含：一第一摻雜層，其係同位素濃化矽，該第一摻雜層具有一第一摻雜濃度；一第二摻雜層，其係經同位素濃化矽且位於該第一摻雜層上並與該第一摻雜層接觸，該第二摻雜層具有與第 一摻雜層不同之一摻雜濃度；複數個主動裝置，其位於該第二摻雜層上面或內部；介電層，其位於該等主動裝置上；以及互連，其位於介電層中並將該等主動裝置互連以形成一可操作的積體電路。
  7. 如請求項6之積體電路，其中該第一摻雜層係一基座層並係用於該積體電路之一背部電接頭。
  8. 如請求項6之積體電路，其中該第一摻雜層及該第二摻雜層係採用矽28(28 Si)之同位素濃化矽。
  9. 如請求項6之積體電路，其中該第一摻雜層的摻雜劑濃度係摻雜成約1E19個原子/cm3 。
  10. 如請求項6之積體電路，其中該第一摻雜層之一厚度約為40微米，而該第二摻雜層之一厚度約為10微米。
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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5144409A (en) * 1990-09-05 1992-09-01 Yale University Isotopically enriched semiconductor devices

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5593256A (en) * 1979-01-10 1980-07-15 Sony Corp Semiconductor device
JPS63141375A (ja) * 1986-12-03 1988-06-13 Fuji Electric Co Ltd 絶縁ゲ−ト電界効果トランジスタ
JPS63269573A (ja) * 1987-04-27 1988-11-07 Nippon Telegr & Teleph Corp <Ntt> ヘテロ接合を有する半導体装置
JP2911694B2 (ja) * 1992-10-29 1999-06-23 信越半導体株式会社 半導体基板及びその製造方法
US5891242A (en) * 1997-06-13 1999-04-06 Seh America, Inc. Apparatus and method for determining an epitaxial layer thickness and transition width
JP3401561B2 (ja) * 1999-03-29 2003-04-28 独立行政法人物質・材料研究機構 高純度同位体シリコン結晶膜の製造方法
US7119400B2 (en) * 2001-07-05 2006-10-10 Isonics Corporation Isotopically pure silicon-on-insulator wafers and method of making same
US6653658B2 (en) * 2001-07-05 2003-11-25 Isonics Corporation Semiconductor wafers with integrated heat spreading layer
JP2004039735A (ja) * 2002-07-01 2004-02-05 Fujitsu Ltd 半導体基板及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5144409A (en) * 1990-09-05 1992-09-01 Yale University Isotopically enriched semiconductor devices

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