TWI384924B - Sided flexible circuit board - Google Patents
Sided flexible circuit board Download PDFInfo
- Publication number
- TWI384924B TWI384924B TW96116522A TW96116522A TWI384924B TW I384924 B TWI384924 B TW I384924B TW 96116522 A TW96116522 A TW 96116522A TW 96116522 A TW96116522 A TW 96116522A TW I384924 B TWI384924 B TW I384924B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- insulating resin
- elastic modulus
- conductor
- adhesive
- Prior art date
Links
- 239000010410 layer Substances 0.000 claims description 123
- 229920005989 resin Polymers 0.000 claims description 74
- 239000011347 resin Substances 0.000 claims description 74
- 239000004020 conductor Substances 0.000 claims description 56
- 239000000758 substrate Substances 0.000 claims description 41
- 239000000853 adhesive Substances 0.000 claims description 40
- 230000001070 adhesive effect Effects 0.000 claims description 39
- 239000012790 adhesive layer Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 16
- 238000011156 evaluation Methods 0.000 description 21
- 230000000052 comparative effect Effects 0.000 description 16
- 238000012360 testing method Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000010408 film Substances 0.000 description 9
- 238000005452 bending Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000010998 test method Methods 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000005336 cracking Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000012790 confirmation Methods 0.000 description 3
- 239000013039 cover film Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 150000004060 quinone imines Chemical class 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006135539A JP4642693B2 (ja) | 2006-05-15 | 2006-05-15 | 両面可撓性回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200814895A TW200814895A (en) | 2008-03-16 |
| TWI384924B true TWI384924B (zh) | 2013-02-01 |
Family
ID=38839581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96116522A TWI384924B (zh) | 2006-05-15 | 2007-05-09 | Sided flexible circuit board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4642693B2 (enExample) |
| CN (1) | CN101106865B (enExample) |
| TW (1) | TWI384924B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101932962A (zh) * | 2008-02-01 | 2010-12-29 | 日立化成工业株式会社 | 光电混载基板和电子设备 |
| WO2010058476A1 (ja) * | 2008-11-21 | 2010-05-27 | 日立化成工業株式会社 | 光電気混載基板及び電子機器 |
| JP2011230308A (ja) * | 2010-04-23 | 2011-11-17 | Panasonic Electric Works Co Ltd | フレキシブル銅張積層板及びフレキシブルプリント配線板 |
| US8628173B2 (en) * | 2010-06-07 | 2014-01-14 | Xerox Corporation | Electrical interconnect using embossed contacts on a flex circuit |
| CN107230429B (zh) * | 2017-06-08 | 2019-06-25 | 武汉天马微电子有限公司 | 柔性模组和柔性显示面板 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6445190A (en) * | 1987-08-12 | 1989-02-17 | Sumitomo Electric Industries | Flexible double-sided wiring board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2753740B2 (ja) * | 1989-08-31 | 1998-05-20 | 日本メクトロン株式会社 | 可撓性回路基板の製造法 |
| JP4860185B2 (ja) * | 2005-05-31 | 2012-01-25 | 日本メクトロン株式会社 | 可撓性回路基板 |
-
2006
- 2006-05-15 JP JP2006135539A patent/JP4642693B2/ja not_active Expired - Fee Related
-
2007
- 2007-05-09 TW TW96116522A patent/TWI384924B/zh not_active IP Right Cessation
- 2007-05-15 CN CN200710142160XA patent/CN101106865B/zh not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6445190A (en) * | 1987-08-12 | 1989-02-17 | Sumitomo Electric Industries | Flexible double-sided wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101106865A (zh) | 2008-01-16 |
| TW200814895A (en) | 2008-03-16 |
| JP2007305936A (ja) | 2007-11-22 |
| JP4642693B2 (ja) | 2011-03-02 |
| CN101106865B (zh) | 2012-08-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |