JP4642693B2 - 両面可撓性回路基板 - Google Patents

両面可撓性回路基板 Download PDF

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Publication number
JP4642693B2
JP4642693B2 JP2006135539A JP2006135539A JP4642693B2 JP 4642693 B2 JP4642693 B2 JP 4642693B2 JP 2006135539 A JP2006135539 A JP 2006135539A JP 2006135539 A JP2006135539 A JP 2006135539A JP 4642693 B2 JP4642693 B2 JP 4642693B2
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JP
Japan
Prior art keywords
adhesive
circuit board
flexible circuit
conductor
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006135539A
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English (en)
Japanese (ja)
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JP2007305936A (ja
JP2007305936A5 (enExample
Inventor
智 海老原
中 秀 明 田
田 隆 一 鶴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
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Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP2006135539A priority Critical patent/JP4642693B2/ja
Priority to TW96116522A priority patent/TWI384924B/zh
Priority to CN200710142160XA priority patent/CN101106865B/zh
Publication of JP2007305936A publication Critical patent/JP2007305936A/ja
Publication of JP2007305936A5 publication Critical patent/JP2007305936A5/ja
Application granted granted Critical
Publication of JP4642693B2 publication Critical patent/JP4642693B2/ja
Expired - Fee Related legal-status Critical Current
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  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
JP2006135539A 2006-05-15 2006-05-15 両面可撓性回路基板 Expired - Fee Related JP4642693B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006135539A JP4642693B2 (ja) 2006-05-15 2006-05-15 両面可撓性回路基板
TW96116522A TWI384924B (zh) 2006-05-15 2007-05-09 Sided flexible circuit board
CN200710142160XA CN101106865B (zh) 2006-05-15 2007-05-15 两面柔性电路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006135539A JP4642693B2 (ja) 2006-05-15 2006-05-15 両面可撓性回路基板

Publications (3)

Publication Number Publication Date
JP2007305936A JP2007305936A (ja) 2007-11-22
JP2007305936A5 JP2007305936A5 (enExample) 2008-08-14
JP4642693B2 true JP4642693B2 (ja) 2011-03-02

Family

ID=38839581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006135539A Expired - Fee Related JP4642693B2 (ja) 2006-05-15 2006-05-15 両面可撓性回路基板

Country Status (3)

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JP (1) JP4642693B2 (enExample)
CN (1) CN101106865B (enExample)
TW (1) TWI384924B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101932962A (zh) * 2008-02-01 2010-12-29 日立化成工业株式会社 光电混载基板和电子设备
WO2010058476A1 (ja) * 2008-11-21 2010-05-27 日立化成工業株式会社 光電気混載基板及び電子機器
JP2011230308A (ja) * 2010-04-23 2011-11-17 Panasonic Electric Works Co Ltd フレキシブル銅張積層板及びフレキシブルプリント配線板
US8628173B2 (en) * 2010-06-07 2014-01-14 Xerox Corporation Electrical interconnect using embossed contacts on a flex circuit
CN107230429B (zh) * 2017-06-08 2019-06-25 武汉天马微电子有限公司 柔性模组和柔性显示面板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0673391B2 (ja) * 1987-08-12 1994-09-14 住友電気工業株式会社 フレキシブル両面回路基板の製造方法
JP2753740B2 (ja) * 1989-08-31 1998-05-20 日本メクトロン株式会社 可撓性回路基板の製造法
JP4860185B2 (ja) * 2005-05-31 2012-01-25 日本メクトロン株式会社 可撓性回路基板

Also Published As

Publication number Publication date
CN101106865A (zh) 2008-01-16
TWI384924B (zh) 2013-02-01
TW200814895A (en) 2008-03-16
JP2007305936A (ja) 2007-11-22
CN101106865B (zh) 2012-08-08

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