JPS6445190A - Flexible double-sided wiring board - Google Patents
Flexible double-sided wiring boardInfo
- Publication number
- JPS6445190A JPS6445190A JP20249687A JP20249687A JPS6445190A JP S6445190 A JPS6445190 A JP S6445190A JP 20249687 A JP20249687 A JP 20249687A JP 20249687 A JP20249687 A JP 20249687A JP S6445190 A JPS6445190 A JP S6445190A
- Authority
- JP
- Japan
- Prior art keywords
- bonding agent
- lay
- flexing
- film cover
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
PURPOSE:To make it possible to improve a flexing characteristics and to obtain a dust-free double-side flexible printed circuit board (FPC) by the absence of the bonding agent in the flexing section. CONSTITUTION:A surface copper circuit 4 is totally laminated to the surface of a base film 1 via a surface bonding agent layer 2, and on the rear of the base film 1, while a rear copper circuit 5 is laminated via a rear bonding agent layer 3 to the non-flexing section in which a throughhole is drilled, for instance. In the part becoming the flexing section, the base film 1 per se is exposed, and only the part of the rear copper circuit 5 is covered with a film cover-lay 7' through a bonding agent 8' for the film cover-lay, with the remaining part being covered with a film cover-lay 7 through a bonding agent 8 for the film cover-lay. With this set-up, there is no dust generated due to a bonding agent or the like, and a double-side FPC rich in the flexing characteristics is obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20249687A JPH0673391B2 (en) | 1987-08-12 | 1987-08-12 | Flexible double-sided circuit board manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20249687A JPH0673391B2 (en) | 1987-08-12 | 1987-08-12 | Flexible double-sided circuit board manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6445190A true JPS6445190A (en) | 1989-02-17 |
JPH0673391B2 JPH0673391B2 (en) | 1994-09-14 |
Family
ID=16458451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20249687A Expired - Fee Related JPH0673391B2 (en) | 1987-08-12 | 1987-08-12 | Flexible double-sided circuit board manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0673391B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0389586A (en) * | 1989-08-31 | 1991-04-15 | Nippon Mektron Ltd | Flexible circuit board and manufacture thereof |
JP2011082317A (en) * | 2009-10-07 | 2011-04-21 | Sumitomo Electric Printed Circuit Inc | Flexible printed wiring board and electronic equipment with the same |
TWI384924B (en) * | 2006-05-15 | 2013-02-01 | Nippon Mektron Kk | Sided flexible circuit board |
WO2015194069A1 (en) * | 2014-06-16 | 2015-12-23 | 日本メクトロン株式会社 | Flexible printed board and flexible printed board manufacturing method |
CN107889357A (en) * | 2017-10-20 | 2018-04-06 | 泰州市博泰电子有限公司 | A kind of micro-drilling method of flexible electric circuit board |
-
1987
- 1987-08-12 JP JP20249687A patent/JPH0673391B2/en not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0389586A (en) * | 1989-08-31 | 1991-04-15 | Nippon Mektron Ltd | Flexible circuit board and manufacture thereof |
TWI384924B (en) * | 2006-05-15 | 2013-02-01 | Nippon Mektron Kk | Sided flexible circuit board |
JP2011082317A (en) * | 2009-10-07 | 2011-04-21 | Sumitomo Electric Printed Circuit Inc | Flexible printed wiring board and electronic equipment with the same |
WO2015194069A1 (en) * | 2014-06-16 | 2015-12-23 | 日本メクトロン株式会社 | Flexible printed board and flexible printed board manufacturing method |
JP2016004875A (en) * | 2014-06-16 | 2016-01-12 | 日本メクトロン株式会社 | Flexible printed circuit board and manufacturing method for the flexible printed circuit board |
CN105393645A (en) * | 2014-06-16 | 2016-03-09 | 日本梅克特隆株式会社 | Flexible printed circuit board and manufacturing method of flexible printed circuit board |
US9743532B2 (en) | 2014-06-16 | 2017-08-22 | Nippon Mektron, Ltd. | Flexible printed circuit board and manufacturing method of flexible printed circuit board |
CN107889357A (en) * | 2017-10-20 | 2018-04-06 | 泰州市博泰电子有限公司 | A kind of micro-drilling method of flexible electric circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPH0673391B2 (en) | 1994-09-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |