JPS6445190A - Flexible double-sided wiring board - Google Patents

Flexible double-sided wiring board

Info

Publication number
JPS6445190A
JPS6445190A JP20249687A JP20249687A JPS6445190A JP S6445190 A JPS6445190 A JP S6445190A JP 20249687 A JP20249687 A JP 20249687A JP 20249687 A JP20249687 A JP 20249687A JP S6445190 A JPS6445190 A JP S6445190A
Authority
JP
Japan
Prior art keywords
bonding agent
lay
flexing
film cover
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20249687A
Other languages
Japanese (ja)
Other versions
JPH0673391B2 (en
Inventor
Yutaka Hibino
Toshihide Kimura
Ken Okazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP20249687A priority Critical patent/JPH0673391B2/en
Publication of JPS6445190A publication Critical patent/JPS6445190A/en
Publication of JPH0673391B2 publication Critical patent/JPH0673391B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To make it possible to improve a flexing characteristics and to obtain a dust-free double-side flexible printed circuit board (FPC) by the absence of the bonding agent in the flexing section. CONSTITUTION:A surface copper circuit 4 is totally laminated to the surface of a base film 1 via a surface bonding agent layer 2, and on the rear of the base film 1, while a rear copper circuit 5 is laminated via a rear bonding agent layer 3 to the non-flexing section in which a throughhole is drilled, for instance. In the part becoming the flexing section, the base film 1 per se is exposed, and only the part of the rear copper circuit 5 is covered with a film cover-lay 7' through a bonding agent 8' for the film cover-lay, with the remaining part being covered with a film cover-lay 7 through a bonding agent 8 for the film cover-lay. With this set-up, there is no dust generated due to a bonding agent or the like, and a double-side FPC rich in the flexing characteristics is obtained.
JP20249687A 1987-08-12 1987-08-12 Flexible double-sided circuit board manufacturing method Expired - Fee Related JPH0673391B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20249687A JPH0673391B2 (en) 1987-08-12 1987-08-12 Flexible double-sided circuit board manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20249687A JPH0673391B2 (en) 1987-08-12 1987-08-12 Flexible double-sided circuit board manufacturing method

Publications (2)

Publication Number Publication Date
JPS6445190A true JPS6445190A (en) 1989-02-17
JPH0673391B2 JPH0673391B2 (en) 1994-09-14

Family

ID=16458451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20249687A Expired - Fee Related JPH0673391B2 (en) 1987-08-12 1987-08-12 Flexible double-sided circuit board manufacturing method

Country Status (1)

Country Link
JP (1) JPH0673391B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0389586A (en) * 1989-08-31 1991-04-15 Nippon Mektron Ltd Flexible circuit board and manufacture thereof
JP2011082317A (en) * 2009-10-07 2011-04-21 Sumitomo Electric Printed Circuit Inc Flexible printed wiring board and electronic equipment with the same
TWI384924B (en) * 2006-05-15 2013-02-01 Nippon Mektron Kk Sided flexible circuit board
WO2015194069A1 (en) * 2014-06-16 2015-12-23 日本メクトロン株式会社 Flexible printed board and flexible printed board manufacturing method
CN107889357A (en) * 2017-10-20 2018-04-06 泰州市博泰电子有限公司 A kind of micro-drilling method of flexible electric circuit board

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0389586A (en) * 1989-08-31 1991-04-15 Nippon Mektron Ltd Flexible circuit board and manufacture thereof
TWI384924B (en) * 2006-05-15 2013-02-01 Nippon Mektron Kk Sided flexible circuit board
JP2011082317A (en) * 2009-10-07 2011-04-21 Sumitomo Electric Printed Circuit Inc Flexible printed wiring board and electronic equipment with the same
WO2015194069A1 (en) * 2014-06-16 2015-12-23 日本メクトロン株式会社 Flexible printed board and flexible printed board manufacturing method
JP2016004875A (en) * 2014-06-16 2016-01-12 日本メクトロン株式会社 Flexible printed circuit board and manufacturing method for the flexible printed circuit board
CN105393645A (en) * 2014-06-16 2016-03-09 日本梅克特隆株式会社 Flexible printed circuit board and manufacturing method of flexible printed circuit board
US9743532B2 (en) 2014-06-16 2017-08-22 Nippon Mektron, Ltd. Flexible printed circuit board and manufacturing method of flexible printed circuit board
CN107889357A (en) * 2017-10-20 2018-04-06 泰州市博泰电子有限公司 A kind of micro-drilling method of flexible electric circuit board

Also Published As

Publication number Publication date
JPH0673391B2 (en) 1994-09-14

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees