DK1049362T3 - Conductor plate and method for its placement - Google Patents

Conductor plate and method for its placement

Info

Publication number
DK1049362T3
DK1049362T3 DK00108615T DK00108615T DK1049362T3 DK 1049362 T3 DK1049362 T3 DK 1049362T3 DK 00108615 T DK00108615 T DK 00108615T DK 00108615 T DK00108615 T DK 00108615T DK 1049362 T3 DK1049362 T3 DK 1049362T3
Authority
DK
Denmark
Prior art keywords
carrier
placement
conductor plate
topside
board
Prior art date
Application number
DK00108615T
Other languages
Danish (da)
Inventor
Jan Dr Kostelnik
Original Assignee
Wuerth Elektronik Rot Am See G
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuerth Elektronik Rot Am See G filed Critical Wuerth Elektronik Rot Am See G
Application granted granted Critical
Publication of DK1049362T3 publication Critical patent/DK1049362T3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

A carrier (1) has the shape of a flat plate. On the carrier's topside a printed circuit board (4) is bonded with an adhesive foil (3). This board has a coupling area containing multiple micro-vias (6) passing through from the open topside (7) to the bottom s (8) turned to the carrier.
DK00108615T 1999-04-30 2000-04-20 Conductor plate and method for its placement DK1049362T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19919781A DE19919781A1 (en) 1999-04-30 1999-04-30 Printed circuit board and method of mounting it

Publications (1)

Publication Number Publication Date
DK1049362T3 true DK1049362T3 (en) 2006-09-11

Family

ID=7906467

Family Applications (1)

Application Number Title Priority Date Filing Date
DK00108615T DK1049362T3 (en) 1999-04-30 2000-04-20 Conductor plate and method for its placement

Country Status (6)

Country Link
EP (1) EP1049362B1 (en)
AT (1) ATE328466T1 (en)
DE (2) DE19919781A1 (en)
DK (1) DK1049362T3 (en)
ES (1) ES2265828T3 (en)
PT (1) PT1049362E (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10214363A1 (en) * 2002-03-30 2003-10-16 Bosch Gmbh Robert Cooling arrangement and electrical device with a cooling arrangement
FR2838915B1 (en) * 2002-04-22 2005-09-30 Cit Alcatel IMPROVED METHOD FOR ASSEMBLING COMPONENTS ON A RADIOFREQUENCY TERMINAL UNIT BASE PLATE
DE20300626U1 (en) 2002-11-19 2003-05-28 electronic service willms GmbH & Co. KG, 52223 Stolberg Chip card for Light Emitting Diode has heat bridges between top mounting surface and cooling baseplate and has central mounting for Light Emitting Diode
DE10352711B4 (en) * 2003-11-06 2015-05-13 Würth Elektronik Rot am See GmbH & Co. KG Printed circuit board assembly
DE102004040596A1 (en) * 2004-08-21 2006-02-23 Robert Bosch Gmbh Electrical device with a housing and a heat sink
DE102005063281A1 (en) * 2005-12-30 2007-07-05 Robert Bosch Gmbh Integrated electronic component, has printed circuit board, and electronic power components that are arranged on board, where board has inner layer, which is made of heat conducting material e.g. solid copper
GB2460124A (en) * 2008-05-21 2009-11-25 Nujira Ltd Printed circuit board with co-planar plate
JP2010245174A (en) * 2009-04-02 2010-10-28 Denso Corp Electronic control unit and method of manufacturing the same
DE102012012914A1 (en) * 2012-06-28 2014-01-02 Wabco Gmbh Circuit board, control unit, device with a device controllable by the control unit and motor vehicle, and method for producing the printed circuit board, the Stuergeräts and the device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4396936A (en) * 1980-12-29 1983-08-02 Honeywell Information Systems, Inc. Integrated circuit chip package with improved cooling means
DE3146504A1 (en) * 1981-11-24 1983-06-01 Siemens AG, 1000 Berlin und 8000 München COOLING CONCEPT FOR MODULES WITH HIGH LOSS PERFORMANCE
US4628407A (en) * 1983-04-22 1986-12-09 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
US4993148A (en) * 1987-05-19 1991-02-19 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a circuit board
DE4031733A1 (en) * 1990-10-06 1992-04-09 Bosch Gmbh Robert MULTIPLE LAYER HYBRID WITH POWER COMPONENTS
US5181167A (en) * 1991-12-02 1993-01-19 Sun Microsystems, Inc. Stacking heatpipe for three dimensional electronic packaging
US5220487A (en) * 1992-01-27 1993-06-15 International Business Machines Corporation Electronic package with enhanced heat sinking
DE69225896T2 (en) * 1992-12-15 1998-10-15 Sgs Thomson Microelectronics Carrier for semiconductor packages
US5513070A (en) * 1994-12-16 1996-04-30 Intel Corporation Dissipation of heat through keyboard using a heat pipe
DE19506664A1 (en) * 1995-02-25 1996-02-29 Bosch Gmbh Robert Electric control apparatus for vehicle IC engine electromechanical mechanism
DE19528632A1 (en) * 1995-08-04 1997-02-06 Bosch Gmbh Robert Control unit consisting of at least two housing parts
DE19601649A1 (en) * 1996-01-18 1997-07-24 Telefunken Microelectron Electronic component heat extracting apparatus for e.g. electronics of motor vehicle
DE19654353A1 (en) * 1996-12-24 1998-06-25 Bosch Gmbh Robert Mounting arrangement of a semiconductor device on a circuit board
JP2914342B2 (en) * 1997-03-28 1999-06-28 日本電気株式会社 Cooling structure of integrated circuit device
SE9702593D0 (en) * 1997-07-04 1997-07-04 Electrolux Ab Device on a circuit board
DE19736962B4 (en) * 1997-08-25 2009-08-06 Robert Bosch Gmbh Arrangement, comprising a carrier substrate for power devices and a heat sink and method for producing the same

Also Published As

Publication number Publication date
EP1049362A3 (en) 2001-07-11
PT1049362E (en) 2006-09-29
ES2265828T3 (en) 2007-03-01
ATE328466T1 (en) 2006-06-15
EP1049362A2 (en) 2000-11-02
DE19919781A1 (en) 2000-11-09
EP1049362B1 (en) 2006-05-31
DE50012842D1 (en) 2006-07-06

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