DE19528632A1 - Control unit consisting of at least two housing parts - Google Patents

Control unit consisting of at least two housing parts

Info

Publication number
DE19528632A1
DE19528632A1 DE19528632A DE19528632A DE19528632A1 DE 19528632 A1 DE19528632 A1 DE 19528632A1 DE 19528632 A DE19528632 A DE 19528632A DE 19528632 A DE19528632 A DE 19528632A DE 19528632 A1 DE19528632 A1 DE 19528632A1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
housing
filler
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19528632A
Other languages
German (de)
Inventor
Harald Dr Ing Dr Cuntz
Peter Dipl Ing Jares
Dieter Dipl Phys Karr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19528632A priority Critical patent/DE19528632A1/en
Priority to US08/952,020 priority patent/US6084776A/en
Priority to KR10-1998-0700724A priority patent/KR100418148B1/en
Priority to PCT/DE1996/001212 priority patent/WO1997006658A1/en
Priority to DE59601566T priority patent/DE59601566D1/en
Priority to JP53683196A priority patent/JP4112614B2/en
Priority to EP96921898A priority patent/EP0842594B1/en
Priority to ES96921898T priority patent/ES2131949T3/en
Publication of DE19528632A1 publication Critical patent/DE19528632A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cookers (AREA)

Abstract

In an electric controller, the supporting surface (28) of the housing bottom (26) on the printed circuit board (10) is larger than the supporting surface of the lid (18) of the controller housing. A filler (34) with good thermal conductivity and adherence is arranged between the bearing surface (28) of the housing bottom (26) and the printed circuit board (10). The filler adheres to both the lower side (25) of the printed circuit board (10) and the bearing surface (28) of the housing bottom (26). The power components (14) with high heat losses are located in the area of the bearing surface (28) of the housing bottom (26). This design of the controller allows heat losses from the power components (14) to be very effectively outwardly dissipated.

Description

Die Erfindung geht aus von einem Steuergerät bestehend aus mindestens zwei Gehäuseteilen nach der Gattung des Hauptanspruchs. Bei einem zum Beispiel aus dem DE- Gbm 92 00 624.8 bekannten Steuergerät wird eine Leiterplatte zwischen zwei Gehäuseteilen, d. h. einem Gehäusedeckel und einem Gehäuseboden mit Hilfe von Verschraubungen fest eingesetzt. Der Gehäusedeckel und der Gehäuseboden sind aus gut wärmeleitendem Material hergestellt. Um die Verlustwärme der auf der Leiterplatte angeordneten Leistungsbauelemente über die Gehäuseteile abführen zu können, ist die Leiterplatte mit einer wärmeleitenden Schicht, zum Beispiel einer Kupferkaschierung, einer Zinnschicht oder einer wärmeleitenden Paste versehen.The invention is based on a control unit at least two housing parts according to the genus of Main claim. For example, from the DE Gbm 92 00 624.8 known control unit becomes a printed circuit board between two housing parts, d. H. a housing cover and a housing base with the help of screw connections used. The case cover and the case bottom are made of good heat-conducting material. To the heat loss the power components arranged on the circuit board to be able to dissipate through the housing parts is the Printed circuit board with a thermally conductive layer, for example a copper cladding, a tin layer or one heat-conducting paste.

Insbesondere neuartige Leistungsbauelemente haben aber eine so hohe Verlustleistung, die mit Hilfe der herkömmlichen wärmeleitenden Schicht und des bisherigen konstruktiven Aufbaus nur sehr schwer nach außen abgeleitet werden können. Bei anderen Steuergerätekonzepten wird zur Wärmeableitung die Unterseite des die Leistungsbauelemente tragenden Substrats vollständig mit einer wärmeableitenden Schicht versehen. Dadurch kann diese Seite der Leiterplatte nicht mehr mit Leistungsbauelementen bestückt werden, wodurch sich ein Flächenmehrbedarf und somit eine hohe Kostenentwicklung ergibt.Novel ones in particular Power components have such a high one Power loss using the conventional thermally conductive layer and the previous constructive Structure can be very difficult to derive to the outside. Other control unit concepts use heat dissipation the underside of the power components Substrate completely with a heat-dissipating layer Mistake. This means that this side of the circuit board cannot  are more equipped with power components, which makes an additional space requirement and thus a high cost development results.

Vorteile der ErfindungAdvantages of the invention

Das erfindungsgemäße Steuergerät mit den kennzeichnenden Merkmalen des Hauptanspruchs hat demgegenüber den Vorteil, daß aufgrund der erfindungsgemäßen Kombination eines neuartigen Klebers und des konstruktiven Aufbaus eine relativ hohe Verlustwärme abgeleitet werden kann. Bis auf den Auflagebereich der Leiterplatte auf dem einen Gehäuseteil kann die Leiterplatte in einfacher Weise auf beiden Seiten mit Bauelementen bestückt werden. Als Leiterplatten können weiterhin Standardplatinen verwendet werden. Der Kleber selbst wird nur auf einem Gehäuseteil aufgebracht, so daß der herkömmliche Fertigungsprozeß nur geringfügig abgeändert werden muß. Bereits nach dem Aufbringen des Klebers, d. h. vor seiner Aushärtung, hat der Kleber eine so hohe Haftfähigkeit, daß er das eine Gehäuseteil und die Leiterplatte fixiert bzw. die Teile miteinander justiert werden können. Durch die Kombination des neuartigen Klebers und der Abänderung der Konstruktion eines Gehäuseteils wird die Wärmeableitung gegenüber den bisher bekannten Systemen nahezu verdoppelt. Dadurch kann die Leiterplatte auch mit Leistungsbauelementen mit sehr hoher Verlustwärme und somit hoher Leistungsdichte bestückt werden. Auch wird eine elektrische Isolation von der Leiterplatte zu den Gehäuseteilen hin gewährleistet. Durch die beidseitige Bestückung der Leiterplatte mit Bauelementen ist eine optimale Flächenausnutzung und eine Kostenminimierung möglich.The control device according to the invention with the characteristic In contrast, features of the main claim have the advantage that due to the combination of the invention novel adhesive and the constructional structure relatively high heat loss can be derived. Until the contact area of the circuit board on one Housing part can be the circuit board in a simple manner components on both sides. As Printed circuit boards can still use standard boards will. The adhesive itself is only on one part of the housing applied so that the conventional manufacturing process only needs to be changed slightly. Already after Applying the adhesive, d. H. before curing, the Adhesive so high that it is one Housing part and the circuit board fixed or the parts can be adjusted with each other. Through the combination of the new type of glue and the modification of the construction of a housing part is the heat dissipation compared to previously known systems almost doubled. This can the circuit board also with power components with very high heat loss and thus high power density will. Electrical insulation from the PCB to the housing parts guaranteed. By equipping the circuit board with components on both sides is an optimal use of space and one Cost minimization possible.

Weitere Vorteile und vorteilhafte Weiterbildungen ergeben sich aus der Beschreibung und der Zeichnung.Further advantages and advantageous further developments result itself from the description and the drawing.

Zeichnungdrawing

Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung dargestellt und in der nachfolgenden Beschreibung näher erläutert. Die einzige Figur zeigt einen Schnitt durch eine schematische Darstellung eines Teils eines Steuergeräts.An embodiment of the invention is in the drawing shown and in the following description explained. The only figure shows a section through a schematic representation of part of a control unit.

Beschreibung des AusführungsbeispielsDescription of the embodiment

Das elektrische Schalt- oder Steuergerät hat eine Leiterplatte 10, auf deren Oberseite 11 eine elektronische Schaltung aufgebracht ist, von der nur ein elektronisches Bauelement 14, das Verlustwärme bei Betrieb abgibt, dargestellt ist. In der Zeichnung ist dieses als SMD- Bauelement (Surface Mounted Device) ausgeführt. In nicht dargestellter Weise ist die Leiterplatte 10 in herkömmlicher Weise mit einer Steckerleiste verbunden.The electrical switching or control device has a printed circuit board 10 , on the top 11 of which an electronic circuit is applied, of which only one electronic component 14 , which emits heat loss during operation, is shown. In the drawing, this is designed as an SMD component (Surface Mounted Device). In a manner not shown, the circuit board 10 is connected in a conventional manner to a connector strip.

Die Oberseite 11 der Leiterplatte 10 wird von einem wannenförmigen Gehäusedeckel 18 abgedeckt. Bis auf den Bereich der Steckerleiste hat der Gehäusedeckel an seinen Seitenwänden 21 einen durchgehenden, kragenförmigen Rand 22, der auf dem äußeren Bereich der Leiterplatte 10 aufliegt. Die Leiterplatte 10 ist dazu im Bereich ihrer Außenränder frei von Schaltungsbauteilen und Leiterbahnen.The top 11 of the circuit board 10 is covered by a trough-shaped housing cover 18 . Except for the region of the connector strip, the housing cover has a continuous, collar-shaped edge 22 on its side walls 21 , which lies on the outer region of the printed circuit board 10 . For this purpose, the circuit board 10 is free of circuit components and conductor tracks in the region of its outer edges.

Der durchgehende Rand 22 hat eine parallel zu den jeweiligen Seitenwänden 21 verlaufende, abgewinkelte Kante 23, die die Stirnseiten der Leiterplatte 10 umfaßt. Diese abgewinkelte Kante 23 kann an ihrer Unterseite 24 bündig mit der Unterseite 25 der Leiterplatte 10 abschließen oder wie in der Zeichnung dargestellt, über die Leiterplatte 10 hinausragen. The continuous edge 22 has an angled edge 23 which runs parallel to the respective side walls 21 and which encompasses the end faces of the printed circuit board 10 . This angled edge 23 can be flush on its underside 24 with the underside 25 of the printed circuit board 10 or, as shown in the drawing, protrude beyond the printed circuit board 10 .

Die Unterseite 25 der Leiterplatte 10 wird von einem ebenfalls wannenförmigen Gehäuseboden 26 umfaßt, dessen Seitenwände 27 einen durchgehenden, kragenförmigen Rand 28 haben, der auf dem äußeren Bereich der Unterseite 25 der Leiterplatte 10 anliegt. Der Rand 28 schließt hierbei mit der Kante 23 des Gehäusedeckels 18 bündig ab, so daß die Leiterplatte 10 zwischen dem Gehäusedeckel 18 und dem Gehäuseboden 26 eingeschlossen ist. Die Ränder 22, 28 des Gehäusedeckels 18 und des Gehäusebodens 26 haben mehrere fluchtende Bohrungen 29, die auch die Leiterplatte 10 durchdringen, und in die Schrauben 30 eingesetzt sind, die den Gehäusedeckel 18, die Leiterplatte 10 und den Gehäuseboden 26 fest miteinander verbinden. Anstelle der Verschraubung vom Gehäusedeckel 18, Leiterplatte 10 und Gehäuseboden 26 können diese auch durch Kleben, Löten, Bördeln, Nieten, mittels Rastelementen oder anderen Verbindungstechniken fest miteinander verbunden sein. Der Gehäusedeckel 18 und der Gehäuseboden 26 sind vorzugsweise aus einem gut wärmeleitenden Material gefertigt.The underside 25 of the printed circuit board 10 is surrounded by a likewise trough-shaped housing base 26 , the side walls 27 of which have a continuous, collar-shaped edge 28 which bears on the outer region of the underside 25 of the printed circuit board 10 . The edge 28 is flush with the edge 23 of the housing cover 18 , so that the circuit board 10 is enclosed between the housing cover 18 and the housing base 26 . The edges 22 , 28 of the housing cover 18 and the housing base 26 have a plurality of aligned bores 29 which also penetrate the printed circuit board 10 and are inserted into the screws 30 which firmly connect the housing cover 18 , the printed circuit board 10 and the housing base 26 to one another. Instead of screwing the housing cover 18 , printed circuit board 10 and housing base 26 , these can also be firmly connected to one another by gluing, soldering, flanging, riveting, by means of latching elements or other connection techniques. The housing cover 18 and the housing base 26 are preferably made of a highly thermally conductive material.

Erfindungsgemäß ist die Auflagefläche, d. h. der Rand 28 des Gehäusebodens 26 größer als die Auflagefläche, d. h. der Rand 22 des Gehäusedeckels 18 oder umgekehrt. Die Auflagefläche des Gehäusebodens auf der Leiterplatte, d. h. der Rand 28 ist hierbei so groß, daß auf der darüberliegenden Seite der Leiterplatte 10 mindestens die Leistungsbauelemente 14 mit der größten Verlustwärme angeordnet werden können.According to the invention, the contact surface, ie the edge 28 of the housing base 26, is larger than the contact surface, ie the edge 22 of the housing cover 18 or vice versa. The contact surface of the housing base on the circuit board, ie the edge 28 is so large that at least the power components 14 with the greatest heat loss can be arranged on the overlying side of the circuit board 10 .

Würde man bei dem oben beschriebenen, bisher bekannten Steuergeräten nur die Auflagefläche, d. h. den Rand 28 des Gehäusebodens 26 vergrößern, und die bisher bekannten wärmeableitenden Schichten auf der Unterseite der Leiterplatte 10 beibehalten, so könnte dies zu einer Verschlechterung der Ableitung der Verlustwärme von den Leistungsbauelementen nach außerhalb des Gehäuses führen. Ist die Leiterplatte 10 zwischen dem Gehäusedeckel 18 und dem Gehäuseboden 26 mit Hilfe der Verschraubung 30 fest eingeklemmt, so kann sich aufgrund der Verschraubung 30 zwischen dem Rand 28 und der Unterseite 25 der Leiterplatte 10 ein keilförmiger Spalt ausbilden. Dieser keilförmige Spalt wird ausgehend von der Verschraubung 30 zu den Seitenwänden 27 des Gehäusebodens 26 hin immer größer. Je größer dieser Spalt ist, desto schlechter ist die Wärmeableitung zwischen dem Leistungsbauelement und den Gehäuseteilen 18 und 26. Diener Spalt kann erfindungsgemäß durch die Verwendung eines Füllstoffs mit thermisch gut leitenden und sowohl an der Unterseite 25 der Leiterplatte 10 und dem Rand 28 des Gehäusebodens 26 haftenden Füllstoffs 34 ausgeglichen werden. Wesentlich hierbei ist, daß dieser Füllstoff 34 so hohe haftende Eigenschaften aufweist, daß er beim Zusammenbau, d. h. wenn die Verschraubung 30 durchgeführt wird, sowohl an der Unterseite 25 der Leiterplatte 10, als auch am Rand 28 über die gesamte Länge des Randes 28, d. h. insbesondere seiner Auflagefläche haften bleibt, so daß die gute thermische Leitfähigkeit zwischen der Leiterplatte 10 und dem Gehäuseboden 26 bestehen bleibt. Um die Leitfähigkeit durch die Leiterplatte 10 hindurch zu verbessern sind in der Leiterplatte 10 insbesondere unterhalb des Leistungsbauelements 14 Durchkontaktierungen 35 ausgebildet, die auch in bekannter Weise mit wärmeleitenden Materialien ausgefüllt sein können.If only the contact surface, ie the edge 28 of the housing base 26, were to be enlarged in the previously known control devices described above, and the previously known heat-dissipating layers on the underside of the printed circuit board 10 were to be maintained, this could lead to a deterioration in the dissipation of the heat loss from the power components lead outside the housing. If the circuit board 10 is firmly clamped between the housing cover 18 and the housing base 26 with the aid of the screw connection 30 , a wedge-shaped gap can form due to the screw connection 30 between the edge 28 and the underside 25 of the circuit board 10 . This wedge-shaped gap becomes larger and larger starting from the screw connection 30 to the side walls 27 of the housing base 26 . The larger this gap, the worse the heat dissipation between the power component and the housing parts 18 and 26 . According to the invention, the gap can be compensated for by using a filler with filler 34 which is thermally highly conductive and adheres to both the underside 25 of the printed circuit board 10 and the edge 28 of the housing base 26 . It is essential here that this filler 34 has such high adhesive properties that, when assembled, ie when the screw connection 30 is carried out, both on the underside 25 of the printed circuit board 10 and on the edge 28 over the entire length of the edge 28 , ie in particular its support surface remains adherent, so that the good thermal conductivity between the printed circuit board 10 and the housing base 26 remains. In order to improve the conductivity through the printed circuit board 10 , through-contacts 35 are formed in the printed circuit board 10, in particular below the power component 14 , which can also be filled with heat-conducting materials in a known manner.

Als Füllstoffe 34 können im Handel erhältliche Klebstoff- Filme mit wärmeleitfähigen Eigenschaften verwendet werden. Diese Filme sind sowohl elektrisch isolierend, als auch wärmeleitend. Diese Klebstoffe ermöglichen dann eine direkte Verklebung der Leiterplatte 10 auf dem Rand 28 des Gehäusebodens 26. Mit diesen Klebstoff-Filmen ist eine schnelle und einfache Verarbeitung bei Raumtemperatur möglich, wobei sich eine sofortige Verbindung der Oberflächen ergibt. Der Klebstoff-Film besitzt eine gute Anfangsklebkraft, um die beiden Bauteile bereits in ihrer Position zu halten. Anschließend muß der Kleber aushärten. Durch Druck und/oder Erwärmung kann die Endklebekraft schneller erreicht werden, da durch diese zusätzliche Maßnahme ein besseres Fließverhalten der Klebebänder erzielt wird.Commercially available adhesive films with thermally conductive properties can be used as fillers 34 . These films are both electrically insulating and thermally conductive. These adhesives then enable the circuit board 10 to be glued directly to the edge 28 of the housing base 26 . With these adhesive films, quick and easy processing at room temperature is possible, resulting in an immediate connection of the surfaces. The adhesive film has a good initial adhesive force in order to hold the two components in position. The adhesive must then harden. The final adhesive strength can be achieved more quickly by pressure and / or heating, since this additional measure improves the flow behavior of the adhesive tapes.

Als Kleber eignet sich zum Beispiel die von der Firma 3M unter der Handelsbezeichnung ScotchTM 9882, 9885, 9890 vertriebenen Klebebänder.Suitable adhesives are, for example, the adhesive tapes sold by 3M under the trade name Scotch TM 9882, 9885, 9890.

Alternativ können auch sog. temperaturaushärtende Zweikomponentenklebesysteme eingesetzt werden. Hierbei handelt es sich um eine Mischung aus einem Härter und Silikonharz, die untereinander unter Temperaturerhöhung verbunden werden.Alternatively, so-called temperature-curing Two-component adhesive systems are used. Here is a mixture of a hardener and Silicone resin intertwined with increasing temperature get connected.

Verwendet man als Füllstoff 34 einen Kleber, so erhält man eine starre Verbindung zwischen der Leiterplatte 10 und dem Gehäuseboden 26. Es ist aber auch denkbar, als Füllstoff ein elastisches Material zu verwenden, das die oben beschriebenen Eigenschaften, d. h. die wärmeleitfähigen Eigenschaften und die haftenden Eigenschaften aufweist. Die elektrisch isolierenden Eigenschaften können zum Beispiel durch Einlegen von isolierenden Schichten in die elastische Masse oder durch entsprechende Leiterplattenkonstruktion erreicht werden. Wird als Füllstoff 34, elastisches Material verwendet, so ist eine Bewegung entsprechend dem oben erwähnten Spalt möglich. Dabei wird aber ständig der thermisch leitfähige Kontakt zwischen der Leiterplatte 10 und dem Rand 28 des Gehäusebodens 26 aufrechterhalten.If an adhesive is used as the filler 34 , a rigid connection is obtained between the printed circuit board 10 and the housing base 26 . However, it is also conceivable to use an elastic material as the filler which has the properties described above, ie the thermally conductive properties and the adhesive properties. The electrically insulating properties can be achieved, for example, by inserting insulating layers into the elastic mass or by means of a corresponding printed circuit board construction. If elastic material is used as the filler 34 , a movement corresponding to the above-mentioned gap is possible. However, the thermally conductive contact between the circuit board 10 and the edge 28 of the housing base 26 is constantly maintained.

Der Rand 28 des Gehäusebodens 26 kann als umlaufender Rand gleichmäßig an allen Seiten des Gehäusebodens 26 ausgebildet sein. Er ist hierbei mindestens so groß, daß die Leistungsbauelemente 14 mit der höchsten Verlustwärme sich im Bereich des Rands 28 befinden können. Es ist aber auch möglich, den Rand 28 nur an einigen Stellen, an denen sich die Leistungsbauelemente mit der sehr hohen Verlustwärme befinden, größer als die Auflagefläche des Gehäusedeckels auszubilden, so daß Inseln auf der Unterseite 25 der Leiterplatte 10 entstehen. In allen Fällen können herkömmlich bekannte Leiterplatten 10 verwendet werden.The edge 28 of the housing base 26 can be formed as a circumferential edge evenly on all sides of the housing base 26 . It is at least so large that the power components 14 with the highest heat loss can be in the area of the edge 28 . However, it is also possible to design the edge 28 larger than the contact surface of the housing cover only at some points where the power components with the very high heat loss are, so that islands are formed on the underside 25 of the printed circuit board 10 . Conventionally known circuit boards 10 can be used in all cases.

Claims (7)

1. Steuergerät, bestehend aus mindestens zwei Gehäuseteilen (18, 26) und mindestens einem mit Leistungsbauelementen (14) bestückten Leiterplatte (10), wobei die Leiterplatte(n) (10) zwischen Gehäuseteilen (18, 26) am Randbereich eingespannt ist und die Leiterplatte (10) eine Schicht (34) aus wärmeleitendem Material aufweist, dadurch gekennzeichnet, daß die Auflagefläche (28) eines ersten Gehäuseteils (26) auf der Leiterplatte (10) wenigstens im Bereich der am Rand der Leiterplatte (10) befindlichen Leistungsbauelemente (14) größer ist als die Auflagefläche (22) eines zweiten Gehäuseteils (18), daß die Schicht (34) sich zwischen der Leiterplatte (10) und dem ersten Gehäuseteil (26) befindet und daß die Schicht ein Füllstoff (34) mit thermisch gut leitenden und an der Leiterplatte (10) und dem ersten Gehäuseteil (26) haftenden Eigenschaften ist.1.Control device consisting of at least two housing parts ( 18 , 26 ) and at least one circuit board ( 10 ) equipped with power components ( 14 ), the circuit board (s) ( 10 ) being clamped between housing parts ( 18 , 26 ) at the edge region and the Printed circuit board ( 10 ) has a layer ( 34 ) of heat-conducting material, characterized in that the bearing surface ( 28 ) of a first housing part ( 26 ) on the printed circuit board ( 10 ) at least in the area of the power components ( 14 ) located on the edge of the printed circuit board ( 10 ) ) is larger than the bearing surface ( 22 ) of a second housing part ( 18 ), that the layer ( 34 ) is between the circuit board ( 10 ) and the first housing part ( 26 ) and that the layer is a filler ( 34 ) with good thermal conductivity and has adhesive properties on the printed circuit board ( 10 ) and the first housing part ( 26 ). 2. Steuergerät nach Anspruch 1, dadurch gekennzeichnet, daß am Rand der Leiterplatte (10) im Bereich der Auflagefläche (28) des ersten Gehäuseteils (26) die Leistungsbauelemente (14) mit der größten Verlustwärme angeordnet sind. 2. Control device according to claim 1, characterized in that the power components ( 14 ) with the greatest heat loss are arranged on the edge of the circuit board ( 10 ) in the region of the bearing surface ( 28 ) of the first housing part ( 26 ). 3. Steuergerät nach Anspruch 1 und/oder 2, dadurch gekennzeichnet, daß der Füllstoff bei Druckbeaufschlagung aushärtet.3. Control device according to claim 1 and / or 2, characterized characterized in that the filler when pressurized hardens. 4. Steuergerät nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß der Füllstoff (34) nach dem Aushärten elastische Eigenschaften hat.4. Control device according to one of claims 1 to 3, characterized in that the filler ( 34 ) has elastic properties after curing. 5. Steuergerät nach Anspruch 1 und/oder 2, dadurch gekennzeichnet, daß der Füllstoff (34) aus zwei Komponenten besteht und bei Druckbeaufschlagung aushärtet.5. Control device according to claim 1 and / or 2, characterized in that the filler ( 34 ) consists of two components and cures when pressurized. 6. Steuergerät nach Anspruch 1 und/oder 2, dadurch gekennzeichnet, daß der Füllstoff (34) aus zwei Komponenten besteht und bei Temperaturbeaufschlagung aushärtet.6. Control device according to claim 1 and / or 2, characterized in that the filler ( 34 ) consists of two components and cures when exposed to temperature. 7. Steuergerät nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, daß das erste Gehäuseteil (26), die Leiterplatte (10) und das zweiten Gehäuseteil (18) fest miteinander verbunden sind.7. Control device according to one of claims 1 to 6, characterized in that the first housing part ( 26 ), the printed circuit board ( 10 ) and the second housing part ( 18 ) are firmly connected.
DE19528632A 1995-08-04 1995-08-04 Control unit consisting of at least two housing parts Withdrawn DE19528632A1 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE19528632A DE19528632A1 (en) 1995-08-04 1995-08-04 Control unit consisting of at least two housing parts
US08/952,020 US6084776A (en) 1995-08-04 1996-07-06 Control device, consisting of at least two housing parts
KR10-1998-0700724A KR100418148B1 (en) 1995-08-04 1996-07-06 Control device formed by two or more casing parts
PCT/DE1996/001212 WO1997006658A1 (en) 1995-08-04 1996-07-06 Controller with a housing made of at least two parts
DE59601566T DE59601566D1 (en) 1995-08-04 1996-07-06 CONTROL UNIT CONSISTING OF AT LEAST TWO HOUSING PARTS
JP53683196A JP4112614B2 (en) 1995-08-04 1996-07-06 Control device comprising at least two casing parts
EP96921898A EP0842594B1 (en) 1995-08-04 1996-07-06 Controller with a housing made of at least two parts
ES96921898T ES2131949T3 (en) 1995-08-04 1996-07-06 CONTROL COMPOSED AT LEAST OF TWO BODIES

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19528632A DE19528632A1 (en) 1995-08-04 1995-08-04 Control unit consisting of at least two housing parts

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DE19528632A1 true DE19528632A1 (en) 1997-02-06

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DE19528632A Withdrawn DE19528632A1 (en) 1995-08-04 1995-08-04 Control unit consisting of at least two housing parts
DE59601566T Expired - Lifetime DE59601566D1 (en) 1995-08-04 1996-07-06 CONTROL UNIT CONSISTING OF AT LEAST TWO HOUSING PARTS

Family Applications After (1)

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US (1) US6084776A (en)
EP (1) EP0842594B1 (en)
JP (1) JP4112614B2 (en)
KR (1) KR100418148B1 (en)
DE (2) DE19528632A1 (en)
ES (1) ES2131949T3 (en)
WO (1) WO1997006658A1 (en)

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EP2328390A3 (en) * 2009-11-19 2011-09-07 STILL GmbH Converter with a cooling unit
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US9756717B2 (en) 2013-03-07 2017-09-05 Continental Automotive Gmbh Electronic, optoelectronic, or electric arrangement
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US10939567B2 (en) 2017-05-04 2021-03-02 Bayerische Motoren Werke Aktiengesellschaft Electronic module using board lacquer to reinforce the circuit board to the unit housing
DE202019103915U1 (en) * 2019-07-16 2020-10-19 Liebherr-Elektronik Gmbh Display device

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JPH11509977A (en) 1999-08-31
KR100418148B1 (en) 2004-06-30
WO1997006658A1 (en) 1997-02-20
EP0842594A1 (en) 1998-05-20
ES2131949T3 (en) 1999-08-01
JP4112614B2 (en) 2008-07-02
DE59601566D1 (en) 1999-05-06
EP0842594B1 (en) 1999-03-31
KR19990036059A (en) 1999-05-25
US6084776A (en) 2000-07-04

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