KR950022305U - Thin plate printed circuit board fixing device - Google Patents

Thin plate printed circuit board fixing device

Info

Publication number
KR950022305U
KR950022305U KR2019930031730U KR930031730U KR950022305U KR 950022305 U KR950022305 U KR 950022305U KR 2019930031730 U KR2019930031730 U KR 2019930031730U KR 930031730 U KR930031730 U KR 930031730U KR 950022305 U KR950022305 U KR 950022305U
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
fixing device
thin plate
board fixing
Prior art date
Application number
KR2019930031730U
Other languages
Korean (ko)
Other versions
KR200159188Y1 (en
Inventor
장정상
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019930031730U priority Critical patent/KR200159188Y1/en
Publication of KR950022305U publication Critical patent/KR950022305U/en
Application granted granted Critical
Publication of KR200159188Y1 publication Critical patent/KR200159188Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1405—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by clips or resilient members, e.g. hooks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR2019930031730U 1993-12-31 1993-12-31 Supporting structure for thin printed circuit board KR200159188Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930031730U KR200159188Y1 (en) 1993-12-31 1993-12-31 Supporting structure for thin printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930031730U KR200159188Y1 (en) 1993-12-31 1993-12-31 Supporting structure for thin printed circuit board

Publications (2)

Publication Number Publication Date
KR950022305U true KR950022305U (en) 1995-07-28
KR200159188Y1 KR200159188Y1 (en) 1999-10-15

Family

ID=19374681

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930031730U KR200159188Y1 (en) 1993-12-31 1993-12-31 Supporting structure for thin printed circuit board

Country Status (1)

Country Link
KR (1) KR200159188Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200467390Y1 (en) * 2009-10-22 2013-06-12 이은혜 A supplementary carrier for producing a semi-conductor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5245571B2 (en) * 2008-06-26 2013-07-24 富士通株式会社 Semiconductor device manufacturing method, semiconductor device manufacturing apparatus, and pin

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200467390Y1 (en) * 2009-10-22 2013-06-12 이은혜 A supplementary carrier for producing a semi-conductor

Also Published As

Publication number Publication date
KR200159188Y1 (en) 1999-10-15

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Legal Events

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A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20060619

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee