KR950022305U - Thin plate printed circuit board fixing device - Google Patents
Thin plate printed circuit board fixing deviceInfo
- Publication number
- KR950022305U KR950022305U KR2019930031730U KR930031730U KR950022305U KR 950022305 U KR950022305 U KR 950022305U KR 2019930031730 U KR2019930031730 U KR 2019930031730U KR 930031730 U KR930031730 U KR 930031730U KR 950022305 U KR950022305 U KR 950022305U
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- printed circuit
- fixing device
- thin plate
- board fixing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
- H05K7/1405—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by clips or resilient members, e.g. hooks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019930031730U KR200159188Y1 (en) | 1993-12-31 | 1993-12-31 | Supporting structure for thin printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019930031730U KR200159188Y1 (en) | 1993-12-31 | 1993-12-31 | Supporting structure for thin printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950022305U true KR950022305U (en) | 1995-07-28 |
KR200159188Y1 KR200159188Y1 (en) | 1999-10-15 |
Family
ID=19374681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019930031730U KR200159188Y1 (en) | 1993-12-31 | 1993-12-31 | Supporting structure for thin printed circuit board |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR200159188Y1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200467390Y1 (en) * | 2009-10-22 | 2013-06-12 | 이은혜 | A supplementary carrier for producing a semi-conductor |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5245571B2 (en) * | 2008-06-26 | 2013-07-24 | 富士通株式会社 | Semiconductor device manufacturing method, semiconductor device manufacturing apparatus, and pin |
-
1993
- 1993-12-31 KR KR2019930031730U patent/KR200159188Y1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200467390Y1 (en) * | 2009-10-22 | 2013-06-12 | 이은혜 | A supplementary carrier for producing a semi-conductor |
Also Published As
Publication number | Publication date |
---|---|
KR200159188Y1 (en) | 1999-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20060619 Year of fee payment: 8 |
|
LAPS | Lapse due to unpaid annual fee |