TWI379132B - - Google Patents

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Publication number
TWI379132B
TWI379132B TW097145963A TW97145963A TWI379132B TW I379132 B TWI379132 B TW I379132B TW 097145963 A TW097145963 A TW 097145963A TW 97145963 A TW97145963 A TW 97145963A TW I379132 B TWI379132 B TW I379132B
Authority
TW
Taiwan
Prior art keywords
substrate
chamber
bonding
loading
degassing
Prior art date
Application number
TW097145963A
Other languages
English (en)
Chinese (zh)
Other versions
TW200947076A (en
Inventor
Takuya Kaizu
Hiroaki Takeda
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Publication of TW200947076A publication Critical patent/TW200947076A/zh
Application granted granted Critical
Publication of TWI379132B publication Critical patent/TWI379132B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Liquid Crystal (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW097145963A 2007-12-03 2008-11-27 Liquid crystal panel assembly system TW200947076A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007312182A JP5104257B2 (ja) 2007-12-03 2007-12-03 基板貼り合せシステム

Publications (2)

Publication Number Publication Date
TW200947076A TW200947076A (en) 2009-11-16
TWI379132B true TWI379132B (fr) 2012-12-11

Family

ID=40870100

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097145963A TW200947076A (en) 2007-12-03 2008-11-27 Liquid crystal panel assembly system

Country Status (4)

Country Link
JP (1) JP5104257B2 (fr)
KR (1) KR101052846B1 (fr)
CN (1) CN101576688B (fr)
TW (1) TW200947076A (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416207B (zh) * 2010-01-07 2013-11-21 Discovery High Technology Co Ltd 一種基板貼合方法
KR101247900B1 (ko) * 2010-02-23 2013-03-26 가부시키가이샤 히타치플랜트테크놀로지 액정 기판 접합 시스템
CN103698916B (zh) * 2013-12-23 2016-05-25 苏州博众精工科技有限公司 一种流水线式lcd组装设备
JP6619762B2 (ja) * 2017-03-27 2019-12-11 平田機工株式会社 製造システムおよび製造方法
CN111725118A (zh) * 2020-06-19 2020-09-29 北京七星华创集成电路装备有限公司 翻转装置
CN112731697B (zh) * 2021-01-04 2022-09-27 河北光兴半导体技术有限公司 液晶显示面板的加工系统及其加工方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07183354A (ja) * 1993-12-24 1995-07-21 Tokyo Electron Ltd 基板の搬送システム及び基板の搬送方法
JP3535044B2 (ja) * 1999-06-18 2004-06-07 株式会社 日立インダストリイズ 基板の組立て装置とその方法、及び液晶パネルの製造方法
US6298685B1 (en) * 1999-11-03 2001-10-09 Applied Materials, Inc. Consecutive deposition system
JP3596492B2 (ja) * 2001-08-08 2004-12-02 松下電器産業株式会社 ボンディング方法
JP2003110001A (ja) 2001-10-01 2003-04-11 Shinko Electric Co Ltd 搬入出装置
US7027122B2 (en) * 2002-03-12 2006-04-11 Lg.Philips Lcd Co., Ltd. Bonding apparatus having compensating system for liquid crystal display device and method for manufacturing the same
JP2006154166A (ja) * 2004-11-29 2006-06-15 Seiko Epson Corp 電気光学装置の貼り合わせ装置及び方法
JP4165554B2 (ja) * 2005-10-26 2008-10-15 株式会社日立プラントテクノロジー 基板貼合装置
JP4760457B2 (ja) * 2006-03-13 2011-08-31 株式会社日立プラントテクノロジー 基板貼り合せ装置

Also Published As

Publication number Publication date
CN101576688A (zh) 2009-11-11
JP5104257B2 (ja) 2012-12-19
CN101576688B (zh) 2011-03-30
KR20090057901A (ko) 2009-06-08
KR101052846B1 (ko) 2011-08-01
JP2009139392A (ja) 2009-06-25
TW200947076A (en) 2009-11-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees