201002590 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種用於搬運例如基板之類物體的搬運設備、 具有該搬運設備之搬運室以及包含該搬運設備之真空處理系統。 【先前技術】 通常，真空處理系統包含用以進行真空處理之處理室，以及 安裝於處理室之一側的搬運室，此搬運室用以接收外部之基板， ί 將搬運室之壓力從大氣壓狀態減少至真空狀態並於隨後將基板搬 運至處理至中，並且用於將基板從處理室中取出，將搬運室之壓 力從真空狀態增加至大氣壓狀態並於隨後將基板搬運至外部。 搬運室中安財-對搬賴！I人，且這兩碰韻器人可交 替地執行基板交換製程，即：對處理室與搬運室中基板的取出及 引入製程。 當與處理室交換基板及與外部交換基板時，此搬運室可交替 地實現大减狀態與衫狀態。這裡，_將搬運室巾的壓力從 大氣壓狀態轉換至真錄態或從真空狀態轉換至大氣壓狀態的時 間（在下文中將被稱為壓力轉換時間〇將依據搬運室之内部容 積的大小而變化。 在基板鼓哺訂’由_大絲之贿室具有相對較大 ^谷積，因此會導致湖耗域淡 因此 增加。並且降低= 而要—種能夠縮小搬運室之内部容積的方法。 5 201002590 【發明内容】 因此，鑒於以上的問題’本發明之一目的在於提供一種能夠 縮小-對搬運模組所占空間之搬運設備、具有該搬運設備之搬運 室以及包含該搬運設備之真空處理系統。 本發明之另一目的在於提供一種能夠於搬運設備安裝時藉由 縮小具有-雌運獅之搬運設備的絲郎細透過縮小搬運 室之内部容積進而大大減少㈣機_之搬運設備、具有該搬 運設備之搬運室以及包含該搬運設備之真空處理系統。 為了實現本發_這些及其讀點且依照本發明之目的，現 對本發明作具體化和概括性地描述，本發騎提供之—種搬運設 肴係ls .第-搬運模組，此第一搬運模組包含：用以支撐待 搬運之物體的第—手柄，肋透過旋轉而線性移動第—手柄藉以 5待搬j之物體的第—旋轉f單元，及用以旋轉驅動第一旋轉 ’單7L之第—驅動軸；以及與第—搬運模組間隔設置的第二搬運 模組，此第-I、富4 ，、罘一搬運模組包含：用以支撐待搬運之物體的第二手 X透過轉而線性移動第二手柄藉以搬運待搬運之物體的 第二旋轉臂嚴i „_ 軸，其中〜 及用以旋轉驅動第二旋轉臂單元之第二驅動 ,, 疋轉#單元之轉動區域與第二旋轉臂單元之轉動區 场相互重疊。201002590 VI. Field of the Invention: [Technical Field] The present invention relates to a conveying apparatus for conveying an object such as a substrate, a conveying chamber having the conveying apparatus, and a vacuum processing system including the conveying apparatus. [Prior Art] Generally, a vacuum processing system includes a processing chamber for performing vacuum processing, and a transfer chamber mounted on one side of the processing chamber for receiving an external substrate, and 395 the pressure of the transfer chamber from an atmospheric pressure state The vacuum state is reduced and the substrate is then transported to the process, and the substrate is removed from the process chamber, the pressure of the transfer chamber is increased from a vacuum state to an atmospheric pressure state, and the substrate is subsequently transported to the outside. In the handling room, Ancai - on the move! I, and the two vibrators can alternately perform the substrate exchange process, that is, the removal and introduction of the substrate in the processing chamber and the transfer chamber. When the substrate is exchanged with the processing chamber and the substrate is exchanged with the outside, the transfer chamber can alternately achieve a large reduction state and a shirt state. Here, the time during which the pressure of the carrying towel is switched from the atmospheric pressure state to the true recording state or from the vacuum state to the atmospheric pressure state (hereinafter referred to as the pressure conversion time 〇 will vary depending on the size of the internal volume of the transfer chamber). In the substrate drum feeding 'by the _ Da Si's bribe chamber has a relatively large ^ valley, so it will lead to a decrease in the lake's consumption area, and reduce = and need to - a method that can reduce the internal volume of the handling room. 5 201002590 SUMMARY OF THE INVENTION Therefore, in view of the above problems, an object of the present invention is to provide a transfer device capable of reducing the space occupied by a transport module, a transfer chamber having the transfer device, and a vacuum processing system including the transfer device. Another object of the present invention is to provide a handling device capable of greatly reducing the internal capacity of a transporting device by reducing the internal volume of the transporting device when the handling device is installed, thereby greatly reducing the (4) machine. The handling room of the equipment and the vacuum processing system including the handling equipment. In order to realize the present invention In accordance with the purpose of the present invention, the present invention is embodied and described in detail, and is provided by the present invention. The first transport module includes: for supporting the to-be-handled The first handle of the object, the rib is linearly moved by the rotation, the first handle of the object to be moved by the first rotation unit, and the first drive shaft for rotating the first rotation 'single 7L; a second transport module disposed at intervals of the transport module, the first-th, fourth, and fourth transport modules include: a second hand X for supporting an object to be transported, and a linear movement of the second handle a second rotating arm for transporting the object to be transported, wherein the second driving of the second rotating arm unit is rotated, and the rotating region of the unit and the rotating portion of the second rotating arm unit The fields overlap each other.
本發明之^ g _ V ,乃—方面還提供了一種搬運設備，係包含：第一搬 逆機态人，壯笙 —手柄，、—搬運機器人包含：用以支撐待搬運之物體的第 、及用以透過旋轉而線性移動第一手柄藉以搬運待搬運 201002590 之物體的第一旋轉臂單元；及盥第一 的第二手柄’以及用以透過旋轉而線性移動第二二== =之物體的第二旋射單元，其巾第—旋轉臂單元與第二 臂早兀係於第一搬運機器人與第二搬運機器人之間轉動疋 =一旋轉臂單对包含：第—連接部分，係安裝成以使得並 =轉定心第一驅動軸;以及第二連接部分，係與第-連接 f ^另—側連接11以透過與第—連接部分相互配合峨轉，此 疒連接部分用以支料—手柄，並且第二旋轉臂單元J含此 第連接部分，係安裳成以使得其一側可旋轉定心第二驅動轴； =及第二連接部分’係與第—連接部分之另_側連接藉以透過與 第-連接部分相互配合而旋轉’此第二連接部分㈣支撐第 柄。 第-手柄與第二手柄可分馳安裝朗叫止與待搬運之物 i 體相干擾。 第—手柄可包含以支撐待搬運之物體的支撐部分；與第 =旋轉臂單元相連接的接合部分；以及誠將接合部分與支撐部 刀相互連接並可通過由第二手柄所搬運之物體的連接部分。 第手柄與第二手柄可沿著第一驅動軸之方向被安裝成彼此 具有不同的高度。 第一驅動軸與第二驅動軸可由單獨的驅動單元獨立地加以驅 動，也可由一個驅動單元旋轉驅動。 7 201002590 為了實現本發明的這些及其它優點且依照本發明之目的，在 此對本發明作具體化和概括性地描述，本發明還提供了一種具有 上述搬運設備之搬運室。 此搬運室可進一步包含壓力控制器，用以將搬運室内的壓力 從大氣壓狀態降低至真空狀態，或者將搬運室内的壓力從真空狀 態增高至大氣壓狀態，藉以搬運待搬運之物體。 搬運室可包含：升降裝置，此升降裝置包含複數個安褒成可 上下移動的升降插腳藉以上下移動由第—或第二手柄支撐的待搬 運之物體；以及-個或多個上下鶴單元，係用以上下驅動升降 插腳。並且，搬運室還可包含校準器用以調整安裝於第一或第二 手柄之上的待搬運之物體的安裝位置。 為了實現本發明的這些及其它優點且依照本發明之目的，在 此對本發明作具體化和概括性地描述，本發明還提供了—種真空 處理系統，係包含：用於對待搬運之晶圓或基板進行真空處理: 處理室；以及連接至處理室之搬運室。 本發明之搬運設備具有如下優點： —第-’由於第-與第二搬運模组之第—與第二旋射單元可 於第-與第二搬運模組之間轉動，因此可使搬運設備之安装空間 最小化。皿’钱運設備讀運錄具有最顿内部The invention also provides a handling device, which comprises: a first moving machine, a strong-handle, and a handling robot comprising: a body for supporting an object to be transported, And a first rotating arm unit for linearly moving the first handle by rotation to carry the object to be transported 201002590; and a first second handle 'and an object for linearly moving the second two === through rotation The second rotating unit has a towel-rotating arm unit and a second arm that are rotated between the first carrying robot and the second carrying robot. 疋=One rotating arm single pair includes: a first connecting portion, is installed The first connecting portion is coupled to the first connecting portion, and the second connecting portion is connected to the first connecting portion and the second connecting portion 11 for transmitting and aligning with the first connecting portion, wherein the connecting portion is used for supporting Material-handle, and the second rotating arm unit J includes the first connecting portion, so that one side thereof can rotate and center the second driving shaft; = and the second connecting portion 'and the first connecting portion _ side connection to pass through with the first - even The connecting portions cooperate with each other to rotate 'this second connecting portion (4) supports the handle. The first handle and the second handle can be separated and installed to interfere with the object to be transported. a first handle may include a support portion for supporting an object to be transported; an engaging portion coupled to the third rotating arm unit; and an engaging member that is interconnected with the supporting portion knife and receivable by the second handle Connect the part. The first handle and the second handle are mounted to have different heights from each other along the direction of the first drive shaft. The first drive shaft and the second drive shaft may be independently driven by a separate drive unit or may be rotationally driven by a drive unit. 7 201002590 In order to achieve these and other advantages of the present invention and in accordance with the purpose of the present invention, the present invention is embodied and broadly described. The present invention also provides a handling chamber having the above described handling apparatus. The transfer chamber may further include a pressure controller for reducing the pressure in the transfer chamber from the atmospheric pressure state to the vacuum state, or increasing the pressure in the transfer chamber from the vacuum state to the atmospheric pressure state, thereby carrying the object to be transported. The moving chamber may include: a lifting device including a plurality of ampoules that can be moved up and down to move the object to be transported by the first or second handle to move the object; and one or more upper and lower crane units. It is used to drive the lifting pins up and down. Also, the transfer chamber may include a calibrator for adjusting the mounting position of the object to be handled mounted on the first or second handle. In order to achieve these and other advantages of the present invention and in accordance with the present invention, the present invention is embodied and broadly described herein. The present invention also provides a vacuum processing system comprising: a wafer for handling Or the substrate is vacuum treated: a processing chamber; and a transfer chamber connected to the processing chamber. The handling device of the present invention has the following advantages: - the first - the first and the second transfer unit can be rotated between the first and second transfer modules, thereby enabling the handling device The installation space is minimized. The dish’s money operation equipment has the best internal
在使搬運室⑽容積最小化的情況下，壓力轉換時間將被縮 短，進而縮短整個基板處理所需的時間。因此，可使生產率提高。 此外’由於絲錢運設備的搬運室具有縮小_部容I 201002590 因而可降低其製造成本。如此便可解決當透過具有較大的内部容 積之搬運室搬運基板時所產生之習知的困難。 本發明之前述及其他的目的、特徵、形態及優點將結合圖示 部分在如下的本發明之詳細說明中更清楚地加以闡述。 【實施方式】 現在，將結合附圖對本發明進行詳細描述。 以下，將結合附圖所示之實例對本發明之較佳實施例進行詳 細地說明。 在下文中，本發明之搬運設備、具有該搬運設備之搬運室以 及包含該搬運設備之真空處理系統將被更加詳細地加 以說明。 本發明之真空處理系統係用以在真空狀態執行預定的處理製 程，例如對晶圓或基板2 ’如液晶顯示器（LCD)面板之玻璃基板 之表面所進行的侧製程’或者於晶圓或基板2之表面上沈積具 有預定之特性的錫膜之製程。 A空處理系統包含：用以對晶圓或基板2進行真空處理的處 理室4,以及連接至處理室4之一側的用以在處理室4與外界之間 搬運基板2之搬運室1〇。 搬運室10可以沿-條直線的形式連接至處理室4藉以順暢地 搬運基板2。 在搬運室10之中，安裝有用於搬運基板2之搬運設備藉以將 基板2引入搬運室10或從搬運室1〇中取出。並且，搬運室ι〇配 置有複數個閘Η 12’閘Η 12可由連接至處理室4或外界的閘門閥 9 201002590 (附圖中未示出）開啟或關閉。 並且，搬運室可以配置成將壓力從大氣壓狀態降低至真空狀 態藉以於真空狀態下將基板2搬運至處理室4等處，或者可配置 成將壓力從真空狀態升高至大氣壓狀態藉以於大氣壓狀態下將基 板2從處理室4中取出至外界。 搬運室10可包含有：用於控制搬運室1〇之内的壓力以用於 父換基板2之壓力控制器（附圖中未示出），用以上下移動基板2 之升降裝置（附圖中未示出），以及用於矯正基板2之校準器（附 圖中未示出）。 為了搬運基板2，壓力控制器可配置成將搬運室⑴之内部壓 力從大氣壓狀_小至真錄態，或者可配置祕搬運室1〇之内 部壓力從真空狀態增高至域驗態。並且，此壓力控制器可包 含有用於供應氣體至搬運室1〇中的氣體供應裳置（附圖中未示 出），以及用於將搬運室K)之_氣體排出的排氣裳置（附圖中 未示出）。 升降裝置可包含有：複數個安裝成可上下移動之升降插腳 (附圖中未不出）藉以上下移動由第一手柄32或第二手柄幻所 支撐的基板2 ’此升降插腳稍後再作說明；以及—個或多個用以上 下驅動升降插腳之上下驅動單元（_中未示出）。 校準器__整安裝於第—手柄32或第二手柄&之上的 基板2之安裝位置，且此校鞋可具有不同的結構。 、 搬運設備係用以搬運基板2，並可_設計具有不同的結構。 10 201002590 此搬運设備可包含一個或多個用於搬運基板2之搬運模组。 此搬運設備可實施為由一個搬運模組所組成的單個形式。伸 此搬運設備係較佳地實施為由一對搬運模組所組成的成對形式藉 以順暢地將基板2與處理室4内的基板進行交換，或更加迅速^ 將基板2搬運至處理室4。 更具體而言，此搬運設備包含：安裝於搬運室1〇之一側的第 一搬運模組30，及安裝於搬運室10之另一側的第二搬運模組4〇。 f 第一搬運模組30與第二搬運模組4〇可具有任意之結構以便 搬運基板2。然而，其更優選為可使搬運室1〇之尺寸最小化之鲈 構。 在下文中，將對使搬運室10之尺寸最小化的第一搬運模組3〇 與苐一搬運模組40進行更加詳細的說明。 第一搬運模組30可包含··用以支撐基板2之第一手柄％，及 用以透過第-驅動單元36之第一驅動軸37之旋轉而線性移動第 i 一手柄32藉以搬運基板2之第一旋轉臂單元34。 第一手柄32係用以沿不變的方向線性移動基板2。並且第一 手柄32可固定地安裝於第一旋轉臂單元34上或可旋轉地連接至 第一旋轉臂單元34藉以順暢地搬運基板2。而且，第一手柄& 可透過動力傳輸部分，例如皮帶&皮帶輪以及齒輪組而連接至第 一旋轉臂單元34。 即使所安裝的第一搬運模組30與第二搬運模組4〇彼此接 近，藉以使搬運設備之安裝空間最小化，但第一手柄32係較佳地 11 201002590 配置成可避免與第二搬運模組40所搬運之基板2相干擾。 請參考「第6圖」及「第7圖」’第一手柄32可包含：用以 支撐基板2的支撐部分32A ;設置於支撐部分32A之下方並與之 間隔一定距離且連接至第一旋轉臂單元34的接合部分32B ;以及 用以使接合部分32B與支撐部分32A相互連接並且通過藉由第二 搬運模組40之第二手柄42所搬運之基板2的連接部分32c。 基於上述這些構造，由第一搬運模組30之第一手柄32所搬 運之基板2係於第一手柄32之支撐部分32A之上線性移動，而由 第二搬運模組4〇之第二手柄42所搬運之基板2係在支撐部分32 a 與設置於第一手柄32之支撐部分32A之下方的接合部分32B之 間線性移動。由於高度不同，第一及第二搬運模組3〇、4〇以及由 第一及第二搬運模組3〇、40所搬運之基板2可避免相互干擾。 富構造為相異地設置第一及第二手柄32、42之高度藉以防止 基板2相互干擾時，第一驅動單元36可配置成具有不同於第二驅 動單元46之高度。 為了穩定地支撐基板2，第一手柄32之支撐部分32a係較佳 地成形為長於接合部分32B。並且，為了防摘後將加以說明的 與第二搬频⑽之第二手柄42相干H手柄&之接合部 分32B係較佳地成形為短於第一手柄％之支擇部分32八。也就是 說’第-手柄32可成形為具有‘u，形且開口朝向第二搬運模組 之截面形狀。並且，第—手柄32之支撐部分32Α可成形為長於第 一手柄32之接合部分mb。 12 201002590 為了防止由第—搬運模組30所搬運之基板2與第一及第二搬 運^组3G、4G相互干擾，第—手柄32可較佳地連接至第一旋轉 臂早兀34，也就是稍後將加以制的第—旋轉臂單元％之第二連 接部分34B之上側。 第方疋轉臂單70 34可具有任意之構造以便線性移動基板2， 並且將對其較佳實例作如下說明。 〜第一旋轉臂單元34可包含：連接至第-驅動轴37藉以旋轉 ^第.驅動軸37之第一連接部分34A;以及連接至第一連接部 分34A之另一側藉以透過與第一連接部分34A相互配合而可轉動 亚用以支擇第-手柄32之第二連接部分34b。 驅 时第方疋轉臂單几％之第一連接部分34A可直接連接至第一專 動早70 36’也可藉由驅動力傳送器等部件連接至第一驅動單元In the case of minimizing the volume of the transfer chamber (10), the pressure conversion time will be shortened, thereby shortening the time required for the entire substrate processing. Therefore, productivity can be improved. In addition, the manufacturing cost of the handling room of the silk money transporting machine can be reduced by reducing the size of the container I 201002590. This solves the conventional difficulties that arise when the substrate is transported through the transfer chamber having a large internal volume. The above and other objects, features, aspects and advantages of the present invention will become more apparent from [Embodiment] Now, the present invention will be described in detail with reference to the accompanying drawings. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Hereinafter, the carrying device of the present invention, the transfer chamber having the transfer device, and the vacuum processing system including the transfer device will be described in more detail. The vacuum processing system of the present invention is used to perform a predetermined processing process in a vacuum state, such as a side process performed on a wafer or substrate 2 such as a surface of a glass substrate of a liquid crystal display (LCD) panel, or on a wafer or substrate. A process of depositing a tin film having a predetermined characteristic on the surface of 2. The A-space processing system includes: a processing chamber 4 for vacuum processing the wafer or substrate 2, and a transfer chamber 1 connected to one side of the processing chamber 4 for transporting the substrate 2 between the processing chamber 4 and the outside. . The transfer chamber 10 can be connected to the process chamber 4 in a straight line to smoothly carry the substrate 2. In the transfer chamber 10, a transfer device for transporting the substrate 2 is attached to introduce or remove the substrate 2 into the transfer chamber 10. Further, the transfer chamber 〇 is provided with a plurality of gates 12'. The shutter 12 can be opened or closed by a gate valve 9 201002590 (not shown in the drawings) connected to the process chamber 4 or the outside. Moreover, the transfer chamber may be configured to reduce the pressure from the atmospheric pressure state to the vacuum state to transport the substrate 2 to the processing chamber 4 or the like in a vacuum state, or may be configured to raise the pressure from the vacuum state to the atmospheric pressure state for the atmospheric pressure state. The substrate 2 is taken out from the processing chamber 4 to the outside. The transfer chamber 10 may include: a pressure controller for controlling the pressure inside the transfer chamber 1 for the parent to change the substrate 2 (not shown in the drawing), and a lifting device for moving the substrate 2 up and down (Fig. Not shown), and a calibrator for correcting the substrate 2 (not shown in the drawings). In order to carry the substrate 2, the pressure controller may be configured to increase the internal pressure of the transfer chamber (1) from an atmospheric pressure to a true recording state, or the internal pressure of the configurable transfer chamber may be increased from a vacuum state to a domain test state. And, the pressure controller may include a gas supply skirt for supplying gas into the transfer chamber 1 (not shown in the drawing), and an exhaust gas for discharging the gas of the transfer chamber K) ( Not shown in the drawing). The lifting device may include: a plurality of lifting pins mounted to be movable up and down (not shown in the drawing). The substrate 2 supported by the first handle 32 or the second handle is moved by the above movement. Description; and one or more of the lower drive unit (not shown in the upper part) for driving the lifting pin up and down. The aligner is mounted to the mounting position of the substrate 2 above the first handle 32 or the second handle & and the school shoe can have a different structure. The handling equipment is used to transport the substrate 2 and can be designed to have a different structure. 10 201002590 This handling device may contain one or more handling modules for handling the substrate 2. The handling device can be implemented in a single form consisting of a handling module. The carrying device is preferably implemented in a paired form consisting of a pair of transport modules to smoothly exchange the substrate 2 with the substrate in the processing chamber 4, or to transport the substrate 2 to the processing chamber 4 more quickly. . More specifically, the transporting apparatus includes a first transport module 30 attached to one side of the transport chamber 1 and a second transport module 4A attached to the other side of the transport chamber 10. f The first transport module 30 and the second transport module 4 can have any structure for carrying the substrate 2. However, it is more preferably a structure which minimizes the size of the transfer chamber 1〇. Hereinafter, the first transport module 3A and the first transport module 40 which minimize the size of the transport chamber 10 will be described in more detail. The first handling module 30 can include a first handle % for supporting the substrate 2 and a linear movement of the first handle 32 for transmitting the substrate 2 through the rotation of the first driving shaft 37 of the first driving unit 36. The first rotating arm unit 34. The first handle 32 is used to linearly move the substrate 2 in a constant direction. And the first handle 32 can be fixedly mounted on the first rotating arm unit 34 or rotatably connected to the first rotating arm unit 34 to smoothly carry the substrate 2. Moreover, the first handle & is connectable to the first swivel arm unit 34 through a power transmitting portion such as a belt & pulley and a gear set. Even if the installed first transport module 30 and the second transport module 4 are close to each other, thereby minimizing the installation space of the transport device, the first handle 32 is preferably 11 201002590 configured to avoid the second transport The substrate 2 carried by the module 40 interferes. Please refer to "Fig. 6" and "Fig. 7". The first handle 32 may include: a support portion 32A for supporting the substrate 2; disposed below and spaced apart from the support portion 32A and connected to the first rotation The engaging portion 32B of the arm unit 34; and the connecting portion 32c for interconnecting the engaging portion 32B and the supporting portion 32A and passing through the substrate 2 carried by the second handle 42 of the second handling module 40. Based on the above configurations, the substrate 2 carried by the first handle 32 of the first handling module 30 is linearly moved over the support portion 32A of the first handle 32, and the second handle is moved by the second handling module 4 The substrate 2 carried by 42 is linearly moved between the support portion 32a and the joint portion 32B provided below the support portion 32A of the first handle 32. Due to the difference in height, the first and second transport modules 3, 4, and the substrate 2 carried by the first and second transport modules 3, 40 can avoid mutual interference. The rich structure is configured to differently set the heights of the first and second handles 32, 42 to prevent the substrates 2 from interfering with each other, and the first driving unit 36 can be configured to have a different height than the second driving unit 46. In order to stably support the substrate 2, the support portion 32a of the first handle 32 is preferably shaped to be longer than the joint portion 32B. Further, the joint portion 32B of the H handle & which is to be described later after the pick-up is coherent with the second handle 42 of the second frequency shifter (10) is preferably formed to be shorter than the cut portion 32 of the first handle %. That is, the 'first handle 32' can be shaped to have a 'u shape and the opening faces the cross-sectional shape of the second handling module. Also, the support portion 32 of the first handle 32 may be formed to be longer than the joint portion mb of the first handle 32. 12 201002590 In order to prevent the substrate 2 transported by the first transport module 30 from interfering with the first and second transport groups 3G, 4G, the first handle 32 can be preferably connected to the first rotating arm early 34, also It is the upper side of the second connecting portion 34B of the first-rotating arm unit % which will be manufactured later. The first turn arm unit 70 34 may have any configuration for linearly moving the substrate 2, and a preferred example thereof will be described below. The first rotating arm unit 34 may include: a first connecting portion 34A connected to the first driving shaft 37 to rotate the driving shaft 37; and the other side connected to the first connecting portion 34A to transmit through the first connection The portions 34A cooperate to rotate to subtly select the second connecting portion 34b of the first handle 32. The first connecting portion 34A of the first tweezer arm can be directly connected to the first responsive early 70 36' or can be connected to the first driving unit by means of a driving force transmitter or the like.
地配=使搬運室1G之尺寸最小化，第—旋轉臂單元％係較佳 成可在第一及第二搬運模組30、40之間轉動。 更、體而έ ’第一旋轉臂單元Μ之轉動區域與第二旋轉臂 凡4之轉動區域可被配置成相互重疊。 Μ之ttT4 ’為了舰衫1G之財最小化轉臂單元 之間的區域置成可在第， 所述，為了圖」中用‘Cl，表示。這裡，如上 34B传、移動基板2，第—旋轉臂單元34之第二連接部分 楚配置成可於「第1圖」中用‘C2,表示的區域中轉動。 疑轉臂早凡34之第二連接部分MB可連接至第一旋轉臂 13 201002590 早7G 34之第一連接部分34A的上侧，藉以防止由第一搬運模組 3〇所搬運之基板2與第一及第二搬運模組30、40相干擾。 第一驅動單幻6可與第-手柄32及第一旋轉臂單^ % _同 安裝於搬運室10之内部，也可絲於搬運室ω之外部下側，藉 以連接至第一旋轉臂單元34之第一連接部分34α。 第二搬運模組4〇具有與第一搬運模組3〇近乎相同的構造。 並且第二搬運模、组4〇可包含：用以支樓基板2之第二手柄犯，以 及可透過第二軸單元46之第二鶴軸47之雜崎性移動第 二手柄42藉以搬運基板2之第二旋轉臂單元44。 較佳地而言，此第二手柄42係配置成不與第一搬運模組％ 所搬運之基板2相干擾。即，第二手柄42可安農成使得第二手柄 42所搬運之基板2能夠觀運至第一搬運餘％所崎之勤反丙2 的下側。 較佳地而言’第二手柄42 _成有·的錢如穩固地支 撐基板2。 與第-手柄32之方式相同，第二手柄42可連接至第二旋轉 臂單元44之上側。 與第-旋轉臂單兀34之方式相同’第二旋轉臂單元私可包 含第一連接部分44Α與第二連接部分44Β藉以於第—及第—搬= 模組30、40之間轉動。第-連接部分44Α係配置成可於「第工 圖」中用‘C3’表示的區域中轉動’且第二連接部分她係配置成 可於「第1圖」中用‘C4’表示的區域中轉動。 14 201002590 為了避免第-及第二旋轉臂單元34、44相互干擾，第一及第 運模組3G、⑽之第—及第二旋轉臂單元34、44之中心之間 的距離（L)可軸有足_長度細防止第—及第二旋轉臂單元 34、44之端部相互接觸。 當第一及第二搬運模組3〇、4〇被安裳成彼此盡最大可能地接 而不相互預時’基板2可觸地被·義，並且搬運室10 可具有最小的尺寸。 這裡m旋轉料元34、44之旋轉h可沿基板2 之搬運方向被設胁不_位置，或可結直於基板 2之搬運方 向的方向上被設置於同一直線上。 在本發明中，第一及第二搬運模組3〇、4〇係分別由第一及第 °動單元36 46單獨地加以驅動。但是，第一及第二驅動轴π、 47可由一個驅動單元加以驅動。 ,在實施為-個‘鶴單元之情況下，驅動單元可配置有離合器 等裝置’用以選擇性地驅動第一驅動軸37或第二驅動轴47。 、用以搬it基板2之搬運設備具有一對安裝空間被最小化的搬 運杈組。此搬運設備可被應用於各種類型的基板處理設備中，這 些基板處理設備係用於需要基板之搬運機以及真空處理系統之基 板處理過程中。 在下文中，將對藉由本發明之搬運設備對基板2所進行之搬 運過程加以說明。 「第1圖」表示了已經被裝配好的基板2從外部搬運至第一 15 201002590 及第二搬槪组3G、4〇之狀況。為了便於錢基板2，基板2係 被安裝於第-及第二手柄32、42中位於上側的一個手柄上。 現在將更加詳細地·與外界，例如魏有減個基板之收 叠相父換基板2之過程。首先，—侧門12係與外界相聯，並且 位於處理室4與搬運室1〇之間的閘門12係由問門闕關閉。而後， 透過升高搬運室1()之内的壓力’將真空狀態變為大氣壓狀態，且 隨後與外界相聯之閘門12被開啟。 一旦與外界相聯之閘門12被開啟，完全經過真空處理之基板 2係透過額外的搬運模組（附圖中未示出）而從處理室4中被取 出。並且，將要進行真空處理之基板2係被安裝於第一及第二手 柄32、42中位於上側的一個手柄上。 一旦搬運室1〇完成與外界交換基板2之過程，與外界相聯之 閘Π 12係被閘門閥再次關閉。接下來，如「第1圖」所示之當搬 運已經被引入搬運室1〇之中的基板2至處理室4之前，搬運室1〇 之内部壓力將被減小至預定的真空狀態，在此狀況下，搬運室1〇 係透過閘門閥而與處理室4及外界相隔絕。 一旦搬運室10之内部壓力達到基本上與處理室4之内部壓力 相等的預定真空壓力時，位於處理室4與搬運室1〇之間的閘門12 將被開啟。因此’搬運室1〇與處理室4將相互聯接。 接著’如「第2圖」及「第3圖」所示，在處理室4中經過 真空處理的基板2將從處理室4中被取出至搬運室1〇。如「第4 圖」及「第5圖」所示，藉由第一搬運模組30所支撐的並且將要 16 201002590 進行真空處理之基板2將從搬運室ι〇被引入至處理室4中。 过裡’弟一及弟一搬運模組30、40可被同時驅動，也可被順 序驅動，或者也可間隔預定的時間而被驅動。 一旦在處理室4中經過真空處理之基板2從處理室4 _被取 出並且將要進行真空處理的基板2被引入至處理室4中，搬運 室1〇將藉由閘門閥而與處理室4及外界相隔絕。在此狀況下，搬 運室H)之⑽動將被增高至大氣壓織，聪後搬運室1〇將 再次進行與外界交換基板2之進程。 雖然本發明以前述之實施例揭露如上，财並侧以限定本 發明。在不脫離本發明之精神和筋 屬本發明之專利伴” 所為之更動與潤飾，均 屬本U之專娜知圍。树_界定 所附之申請專利範圍。 t曼犯㈤明參考 【圖式簡單說明】 第1圖為本發明之搬運設備之平面剖視圖。 第2圖至第5圖分別對應於第1 一 物體的搬運過程。 θ、不了本發明之待搬運之 第6圖為沿著第！圖中的,， 【第7圖綱 【主要元件符號說明】 ·^透現圖。 •基板 •處理室 搬運室 2 ........................... 4…… 10 201002590 12...........................閘門 30...........................第一搬運模組 32...........................第一手柄 32A.........................支撐部分 32B.........................接合部分 32C.........................連接部分 34...........................第一旋轉臂單元 34A.........................第一連接部分 34B.........................第二連接部分 36 ...........................第一驅動單元 37 ...........................第一驅動軸 40...........................第二搬運模組 42...........................第二手柄 44...........................第二旋轉臂單元 44A.........................第一連接部分 44B.........................第二連接部分 46 ...........................第二驅動單元 47 ...........................第二驅動軸 18The ground distribution = minimizes the size of the transfer chamber 1G, and the first rotary arm unit % is preferably rotatable between the first and second transfer modules 30, 40. More specifically, the rotating area of the first rotating arm unit and the rotating area of the second rotating arm can be arranged to overlap each other. Μ ttT4 ’ for the vestibule 1G to minimize the area between the boom units can be set, in the figure, it is indicated by ‘Cl. Here, as described above, the substrate 2 is transferred and moved, and the second connecting portion of the first rotating arm unit 34 is arranged to be rotatable in the region indicated by "C2" in "Fig. 1". The second connecting portion MB of the suspect arm 34 can be connected to the upper side of the first connecting portion 34A of the first rotating arm 13 201002590 7G 34, thereby preventing the substrate 2 carried by the first handling module 3〇 from The first and second handling modules 30, 40 interfere with each other. The first driving single phantom 6 may be installed inside the transfer chamber 10 together with the first handle 32 and the first rotating arm unit, or may be threaded on the outer lower side of the transfer chamber ω to be connected to the first rotating arm unit. The first connecting portion 34α of 34. The second handling module 4 has a configuration that is nearly identical to that of the first handling module 3〇. And the second transporting mold, the group 4 can include: a second handle for the supporting base plate 2, and a second handle 42 movable through the second crane shaft 47 of the second shaft unit 46 to transport the substrate 2 second rotating arm unit 44. Preferably, the second handle 42 is configured not to interfere with the substrate 2 carried by the first handling module %. That is, the second handle 42 can be used to enable the substrate 2 carried by the second handle 42 to be transported to the lower side of the first transport remaining%. Preferably, the second handle 42 has a solid support for the substrate 2. In the same manner as the first handle 32, the second handle 42 can be coupled to the upper side of the second rotary arm unit 44. The second rotating arm unit may include a first connecting portion 44 and a second connecting portion 44 for rotation between the first and first transfer modules 30, 40. The first connecting portion 44 is configured to be rotatable in the area indicated by 'C3' in the "work drawing" and the second connecting portion is configured to be an area which can be represented by 'C4' in the "Fig. 1" Rotate in. 14 201002590 In order to prevent the first and second rotating arm units 34, 44 from interfering with each other, the distance (L) between the centers of the first and third transport modules 3G, (10) and the second rotating arm units 34, 44 may be The shaft has a foot length _ length preventing the ends of the first and second rotating arm units 34, 44 from contacting each other. When the first and second handling modules 3, 4 are spliced to each other as far as possible without mutual pre-time, the substrate 2 can be touched, and the handling chamber 10 can have a minimum size. Here, the rotation h of the m-rotating elements 34, 44 may be set in the direction in which the substrate 2 is transported, or may be set on the same straight line in the direction in which the substrate 2 is transported. In the present invention, the first and second transport modules 3, 4 are individually driven by the first and third moving units 36 46, respectively. However, the first and second drive shafts π, 47 can be driven by a single drive unit. In the case where it is implemented as a 'crane unit, the drive unit may be provided with a device such as a clutch' to selectively drive the first drive shaft 37 or the second drive shaft 47. The transporting apparatus for moving the substrate 2 has a pair of transporting rafts in which the installation space is minimized. This handling apparatus can be applied to various types of substrate processing apparatuses which are used in the substrate processing of a carrier requiring a substrate and a vacuum processing system. Hereinafter, the transportation process of the substrate 2 by the carrying device of the present invention will be described. "Fig. 1" shows the state in which the assembled substrate 2 is transported from the outside to the first 15 201002590 and the second transfer group 3G, 4〇. In order to facilitate the money substrate 2, the substrate 2 is attached to a handle on the upper side of the first and second handles 32, 42. Now, in more detail, the process of replacing the substrate 2 with the outside world, for example, Wei has reduced the substrate. First, the side door 12 is connected to the outside, and the shutter 12 between the processing chamber 4 and the transfer chamber 1 is closed by the door sill. Then, the vacuum state is changed to the atmospheric pressure state by raising the pressure inside the transfer chamber 1 (), and then the gate 12 connected to the outside is opened. Once the gate 12 associated with the outside is opened, the completely vacuum-treated substrate 2 is removed from the processing chamber 4 through an additional handling module (not shown). Further, the substrate 2 to be vacuum-treated is attached to one of the first and second handles 32, 42 on the upper side. Once the transfer chamber 1 has completed the process of exchanging the substrate 2 with the outside world, the gate 12 connected to the outside is closed again by the gate valve. Next, as shown in "Fig. 1", before the substrate 2 having been introduced into the transfer chamber 1 to the processing chamber 4 is transported, the internal pressure of the transfer chamber 1 is reduced to a predetermined vacuum state. In this case, the transfer chamber 1 is separated from the processing chamber 4 and the outside through the gate valve. Once the internal pressure of the transfer chamber 10 reaches a predetermined vacuum pressure substantially equal to the internal pressure of the process chamber 4, the gate 12 between the process chamber 4 and the transfer chamber 1A will be opened. Therefore, the transfer chamber 1 and the processing chamber 4 will be coupled to each other. Next, as shown in "Fig. 2" and "Fig. 3", the substrate 2 subjected to vacuum processing in the processing chamber 4 is taken out from the processing chamber 4 to the transfer chamber 1A. As shown in "Fig. 4" and "Fig. 5", the substrate 2 supported by the first handling module 30 and subjected to vacuum processing at 16 201002590 is introduced into the processing chamber 4 from the transfer chamber. The transport module 30, 40 can be driven at the same time, or can be driven sequentially, or can be driven at predetermined intervals. Once the vacuum-treated substrate 2 in the processing chamber 4 is taken out from the processing chamber 4_ and the substrate 2 to be vacuum-processed is introduced into the processing chamber 4, the transfer chamber 1 will be processed by the gate valve and the processing chamber 4 The outside world is isolated. Under this circumstance, the (10) movement of the transport chamber H) will be increased to the atmospheric pressure weaving, and the rear transfer chamber 1 will again perform the process of exchanging the substrate 2 with the outside. Although the invention has been disclosed above in the foregoing embodiments, the invention is defined by the accompanying claims. The modification and retouching of the patents of the present invention without departing from the spirit and scope of the present invention are all inclusive. The tree _ defines the scope of the patent application attached. t man criminal (five) reference BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan sectional view of the conveying apparatus of the present invention. Fig. 2 to Fig. 5 correspond to the conveying process of the first object, respectively. θ, the sixth drawing of the present invention to be carried is along In the figure!, [Fig. 7 [Description of main component symbols] · ^Transmission diagram. • Substrate • Processing chamber handling room 2 .................. ......... 4...... 10 201002590 12...........................gate 30... .....................The first handling module 32....................... ....first handle 32A.........................Support section 32B.............. ...........joining section 32C.........................connecting section 34........ ...................The first rotating arm unit 34A........................ First connecting portion 34B....................second connecting portion 36 ............... .........the first drive unit 37 ....... ....................First drive shaft 40......................... .. second handling module 42........................ second handle 44........... ................The second rotating arm unit 44A........................The first connection Part 44B.........................Second connection part 46.................. .........the second drive unit 47 ...........................the second drive shaft 18