JP2012129248A - Alignment device and semiconductor manufacturing equipment having the device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an alignment device and semiconductor manufacturing equipment having the device, capable of increasing throughput.SOLUTION: An alignment device 30 comprises: first to fourth substrate support parts 52a to 52d vertically arranged in a descending order and moving up and down; an advancing and retracting part 56 having first to third suction parts 76a to 76c for rotating first to third substrates, respectively, for entering an alignment position; a base part 64 having a fourth suction part 76d for rotating a fourth substrate; a substrate positioning part 58 having abutted parts on which ends of the first to fourth substrates are abutted, and abutting parts for abutting the first to fourth substrates on the abutted parts; and first to fourth detectors 62a to 62d for detecting notches 92 of the first to fourth substrates, respectively. Any two of the first to fourth substrate support parts 52a to 52d as a first set and the others as a second set move up and down collectively for each set.

Description

  The present invention relates to an alignment apparatus and a semiconductor manufacturing apparatus.

In Patent Document 1, a gripping mechanism that grips an outer peripheral portion of a wafer by an opening / closing operation, a rotation mechanism that rotates a gripping mechanism that grips the wafer, a notch detection sensor that detects an outer peripheral portion of the wafer rotated by the rotation mechanism, , And an alignment apparatus that aligns the wafer at a desired position by the gripping operation of the gripping mechanism and the rotating operation of the rotating mechanism.
In this alignment apparatus, the gripping mechanism includes upper and lower three-layer grip portions of the first layer, the second layer, and the third layer, and the upper and lower three-layer grip portions are configured to be capable of gripping the wafer independently. . The notch detection sensor detects the outer peripheral portion of the wafer held by the first layer or the second layer, and the first sensor detects the outer peripheral portion of the wafer held by the second layer or the third layer. 2 sensors.

JP 2008-300709 A

  An object of the present invention is to provide an alignment apparatus and a semiconductor manufacturing apparatus capable of improving throughput.

The alignment apparatus according to the first invention that meets the above-mentioned object supports the first to fourth substrates carried in, and is arranged in order from the top to the first to fourth substrate support portions,
First to third suction portions for receiving and sucking the first to third substrates from the first to third substrate support portions that descend, respectively, and rotating the sucked first to third substrates. And the first to third suction portions are respectively disposed between the first substrate placed on the first substrate support portion and the second substrate placed on the second substrate support portion. Alignment position between the second substrate and the third substrate placed on the third substrate support, and between the third substrate and the fourth substrate placed on the fourth substrate support Advancing and retracting part to enter,
A fourth suction unit that is provided below the third suction unit that has entered, receives the fourth substrate from the lower fourth substrate support unit, sucks the fourth substrate, and rotates the sucked fourth substrate. A base having
The abutting portion provided in the advance / retreat portion and against which the end portions of the first to fourth substrates are abutted, and the end portions of the first to fourth substrates different from the end portions are in contact with the first to fourth substrates. A substrate positioning unit having an abutting portion for abutting the fourth substrate against the abutted portion and positioning the first to fourth substrates;
Comprising first to fourth detectors for detecting positions of notches provided in the first to fourth substrates, respectively.
Of the first to fourth substrate support portions, any two of the first group and the remaining second group are both moved up and down.

In the alignment apparatus according to the first invention, the advance / retreat portion extends upward from the base portion, and rotates around an axis.
It is preferable that the first to third adsorption portions are respectively provided and have first to third arms fixed to the shaft at a base end portion.

  In the alignment apparatus according to the first invention, the abutted portion includes a first abutted member provided on the first arm and abutted against end portions of the first and second substrates, It is preferable to have a second abutted member provided on the third arm and against which the ends of the third and fourth substrates are abutted.

In the alignment apparatus according to the first invention, the first abutting member includes a first contact portion that contacts an end portion of the first substrate placed on the raised first substrate support portion, and A second contact portion that comes into contact with an end portion of the second substrate mounted on the raised second substrate support portion;
The second abutting member includes a third contact portion that contacts an end portion of the third substrate placed on the raised third substrate support portion, and a raised fourth substrate support portion. It is preferable to have a fourth contact portion that comes into contact with an end portion of the mounted fourth substrate.

In the alignment apparatus according to the first aspect, the abutting portion contacts two end portions different from the end portions to which the first to fourth contact portions of the first to fourth substrates contact, respectively. ,
It is preferable that the said abutting part has the 1st and 2nd abutting member which each contacts one edge part and the other edge part among these two edge parts.

  In the alignment apparatus according to the first aspect, each of the first and second abutting members is a rod-like member that extends upward from the base and advances toward the first to fourth substrates. Preferably there is.

The alignment apparatus which concerns on 1st invention WHEREIN: The said 1st-4th board | substrate support part respectively has the 1st support member which supports the lower surface of the said 1st-4th board | substrate,
It is preferable to have the 2nd support member which supports the lower surface of the said 1st-4th board | substrate in two places different from the place where the said 1st support member supports.

  In the alignment apparatus according to the first aspect of the present invention, it is preferable that the first set is the first and third substrate support portions, and the second set is the second and fourth substrate support portions. .

  In the alignment apparatus according to the first aspect of the present invention, the first set may be the first and fourth substrate support portions, and the second set may be the second and third substrate support portions.

  In the alignment apparatus according to the first aspect of the present invention, the first set may be the first and second substrate support portions, and the second set may be the third and fourth substrate support portions.

In the alignment apparatus according to the first aspect of the present invention, the base portion includes a first driving portion that drives the shaft,
It is preferable to further have a servo motor that rotates the first to fourth suction portions.

In the alignment apparatus according to the first aspect of the present invention, the base includes a second drive unit that moves the first and third substrate support units up and down,
It is preferable to further include a third driving unit that raises and lowers the second and fourth substrate support units.

  In the alignment apparatus according to the first aspect of the present invention, it is preferable that the base portion further includes a fourth drive unit that moves the first and second abutting members, respectively.

The semiconductor manufacturing apparatus according to the second invention that meets the above-described object is arranged in the vertical direction, and can move up and down the first and second end effectors on which the substrate is placed, and the first and second end effectors in the vertical direction. A substrate transfer robot having an elevating mechanism;
An alignment device that aligns each of the substrates carried by the substrate transport robot;
The alignment apparatus supports the loaded substrates as first to fourth substrates, and is arranged in order from the top to the first to fourth substrate support portions,
First to third suction portions for receiving and sucking the first to third substrates from the first to third substrate support portions that descend, respectively, and rotating the sucked first to third substrates. The first to third suction portions are located between the first substrate and the second substrate, respectively, from a retracted position that avoids interference with the first to fourth substrates that are carried in. An advancing / retreating portion for entering an alignment position between the second substrate and the third substrate and between the third substrate and the fourth substrate;
A fourth suction unit that is provided below the third suction unit that has entered, receives the fourth substrate from the lower fourth substrate support unit, sucks the fourth substrate, and rotates the sucked fourth substrate. A base having
The abutting portion provided in the advance / retreat portion and against which the end portions of the first to fourth substrates are abutted, and the end portions of the first to fourth substrates different from the end portions are in contact with the first to fourth substrates. A substrate positioning unit having an abutting portion for abutting the fourth substrate against the abutted portion and positioning the first to fourth substrates;
Comprising first to fourth detectors for detecting the positions of notches provided in the first to fourth substrates, respectively.
A semiconductor manufacturing apparatus in which any one of the first group and the remaining second group out of the first to fourth substrate support parts are moved up and down.

  In the semiconductor manufacturing apparatus according to the second aspect of the present invention, an interval between the first end effector and the second end effector is a first interval between the first substrate support portion and the second substrate support portion. And the second distance between the third substrate support portion and the fourth substrate support portion is set to be substantially the same.

  In the alignment apparatus and the semiconductor manufacturing apparatus according to the present invention, the throughput can be improved as compared with the case where the configuration of the present invention is not provided.

It is explanatory drawing of the semiconductor manufacturing apparatus which has the alignment apparatus which concerns on one embodiment of this invention. It is a perspective view of the alignment apparatus. FIG. 3 is a perspective view of the alignment apparatus viewed from a direction different from that of FIG. 2. It is a top view of the alignment apparatus. It is a front view of the alignment apparatus. It is a rear view of the alignment apparatus. It is a right view of the alignment apparatus. It is a left view of the alignment apparatus. It is a perspective view which shows the state which the 1st-3rd arm of the alignment apparatus moved to the retracted position. It is a perspective view of the alignment apparatus which supported the 1st-4th board | substrate in the state which the 1st-3rd arm of the alignment apparatus moved to the retracted position. It is a perspective view of the alignment apparatus which supported the 1st and 2nd board | substrate in the state which the 1st-3rd arm of the alignment apparatus moved to the alignment position. It is a side view of the to-be-butted member of the alignment apparatus. It is the elements on larger scale which show the 1st-4th notch detection sensor of the alignment apparatus. It is explanatory drawing of the air cylinder provided in the base of the alignment apparatus. It is explanatory drawing of the rotary cylinder and servomotor provided in the base of the alignment apparatus. It is explanatory drawing of the air cylinder provided in the base of the alignment apparatus. It is explanatory drawing which shows typically operation | movement (step S1-S3) of the alignment apparatus. It is explanatory drawing which shows typically operation | movement (steps S4-S6) of the alignment apparatus. It is explanatory drawing which shows typically operation | movement (steps S7-S9) of the alignment apparatus. It is explanatory drawing which shows typically operation | movement (step S10-S12) of the alignment apparatus. It is explanatory drawing which shows typically operation | movement (steps S13-S15) of the alignment apparatus. It is explanatory drawing which shows typically operation | movement (step S16-S18) of the alignment apparatus.

  Next, embodiments of the present invention will be described with reference to the accompanying drawings for understanding of the present invention. In each drawing, portions not related to the description may be omitted.

A semiconductor manufacturing apparatus 10 according to an embodiment of the present invention shown in FIG. 1 includes a substrate transfer robot 20 installed in a front end module 15 and an alignment apparatus 30 according to an embodiment of the present invention.
The substrate transfer robot 20 is, for example, a single-arm horizontal articulated robot having five axes. First and second end effectors 44a and 44b are provided at the front end of the arm 42 of the substrate transfer robot 20 with a spacing P in the vertical direction. Each end effector 44a, 44b can pivot independently about a vertical axis J1 passing through the base end of the end effector 44a, 44b. The substrate transport robot 20 can transport the substrate W on the end effectors 44a and 44b.
The substrate transfer robot 20 has an elevating mechanism 46 and can elevate and lower the first and second end effectors 44a and 44b.
The substrate transfer robot 20 performs a lifting operation and an arm 42 expansion / contraction operation to take out two substrates W from a substrate storage container (not shown) placed on each of the load ports LP1 to LP3. The single substrate W can be supplied to the alignment apparatus 30 at a time.

As shown in FIG. 2, the alignment apparatus 30 is arranged in order from the top, and is capable of supporting the four substrates W supplied from the substrate transport robot 20. 52d is provided. The substrate transfer robot 20 places the two substrates W placed on the end effectors 44a and 44b on the first and second substrate support portions 52a and 52b or the third and fourth substrate support portions 52c and 52d, respectively. (See FIG. 11). Hereinafter, for convenience of description, the substrates W placed on the first to fourth substrate support portions 52a to 52d may be distinguished from each other and referred to as first to fourth substrates W1 to W4 (see FIG. 10).
The alignment apparatus 30 can align the two substrates W placed on the first and second substrate support portions 52a and 52b or the third and fourth substrate support portions 52c and 52d together. The two aligned substrates W are taken out by the substrate transfer robot 20 and transferred to the load lock chambers LL1 and LL2 (see FIG. 1).
The interval between the first substrate support portion 52a and the second substrate support portion 52b is set to be the same as the interval P between the first and second end effectors 44a and 44b. Further, the interval between the third substrate support portion 52c and the fourth substrate support portion 52d is set to be the same as the interval P between the first and second end effectors 44a and 44b. Here, “same” is not exactly the same. In other words, “same” means that a manufacturing error is allowed in design and “substantially the same” (hereinafter the same). Specifically, for example, the interval between the substrate support portions 52a, 52b, 52c, and 52d may be set within a range of ± 10% of the interval P.

  As shown in FIGS. 2 to 8, the alignment apparatus 30 includes first and second lifters 54 a and 54 b, advancing and retracting portions 56, a substrate positioning portion 58, and first to fourth notch detection sensors 62 a and 62 b. 62c and 62d, and a base 64.

The first lifter 54a includes the first and third substrate support portions 52a and 52c and the first elevating shaft 66a, and can be moved up and down. That is, the first lifter 54a can raise and lower the first and third substrates W1 and W3 mounted on the first and third substrate support portions 52a and 52c, respectively.
The second lifter 54b has the second and fourth substrate support portions 52b and 52d and the second lifting shaft 66b, and can be lifted and lowered. That is, the second lifter 54b can raise and lower the second and fourth substrates W2 and W4 mounted on the second and fourth substrate support portions, respectively.
The first to fourth substrate support parts 52a to 52d are, for example, first to fourth left side support members (each example of the first support member) provided on the left side when the alignment device 30 is viewed from the front. ) 52a _{L to} 52d _L and, for example, first to fourth right support members provided on the right side (each example of the second support member) 52a _{R to} 52d _R , respectively.
Each of the first to fourth left support members 52a _{L to} 52d _L is a thin plate-like member having one surface facing upward, and the end portions on the inner side of the apparatus are the first to fourth substrates W1 to W4. It is formed so that it may curve along the outer periphery. The first to fourth left support members 52a _{L to} 52d _L are provided with pads 68 that support the lower surfaces of the peripheral portions of the first to fourth substrates W1 to W4, respectively. The pad 68 protrudes from the left support members 52a _{L to} 52d _L toward the center of the substrate W placed on the pad 68 in plan view. The pad 68 is formed with an inclined upper surface so that the thickness decreases toward the tip.

Each of the first to fourth right support members 52a _{R to} 52d _R is a thin plate-like member having one surface facing upward, and end portions inside the apparatus are first to fourth substrates W1 to W4. It is formed so that it may curve along the outer periphery. The first to fourth right support members 52a _{R to} 52d _R are respectively provided with two pads 68 on which the lower surfaces of the peripheral portions of the first to fourth substrates W1 to W4 are placed. Each pad 68 protrudes from the right support member toward the center of the substrate W placed on the pad 68 in plan view. Each pad 68 is formed with an inclined upper surface so that the thickness decreases toward the tip.
That is, the first to fourth substrates W1 to W4 are supported by the left support members 52a _{L to} 52d _L and the right support members 52a _{R to} 52d _R corresponding to the substrates W1 to W4, respectively. The left support members 52a _{L to} 52d _L support one place on the lower surface of the substrate W, and the right support members 52a _{R to} 52d _R support the other two places on the lower surface of the substrate W.

The first elevating shaft 66a extends upward from the left back corner of the base 64, and extends upward from the right rear corner of the base 64, and 2) the first left elevating shaft 66a _L that elevates and lowers. It consists of two parts of the first right elevating shaft 66a _{R that} moves up and down.
Here, the first left support member 52a _L is fixed to the upper end portion of the first left elevating shaft 66a _L. The third left support member 52c _L is fixed to the lower side of the intermediate portion of the first left lift shaft 66a _L. Accordingly, the first and third left support members 52a _L and 52c _L are both moved up and down.
The first right support member 52a _R is fixed to the upper end portion of the first right elevating shaft 66a _R. The third right support member 52c _R is fixed to the lower side of the intermediate portion of the first right elevating shaft 66a _R. Accordingly, the first and third right support members 52a _R and 52c _R are both moved up and down. The first right elevating shaft 66a _R passes through the second and fourth right support members 52b _R and 52d _R.

The second elevating shaft 66b is 1) a second left elevating shaft 66b _L provided adjacent to the first left elevating shaft 66a _L , extending upward from the base 64 and elevating, and 2) a first right side. It is provided adjacent to the lifting shaft 66a _R , and extends upward from the base 64, and is composed of two parts, a second right lifting shaft 66b _{R that} moves up and down.
Here, the second left support member 52b _L is fixed to the upper end portion of the second left elevating shaft 66b _L. The fourth left support member 52 d _L is fixed to the lower portion of the second left lift shaft 66b _L. Therefore, both the second and fourth left support members 52b _L and 52d _L move up and down.
The second right support member 52b _R is fixed to the upper end portion of the second right lifting shaft 66b _R. The fourth right support member 52d _R is fixed to the lower part of the second right elevating shaft 66b _R. Therefore, both the second and fourth right support members 52b _R and 52d _R move up and down. The second right elevating shaft 66b _R passes through the third right support member 52c _R.

The advancing / retreating portion 56 includes a shaft 70 (see FIGS. 5, 6, and 8) and first to third arms 72a to 72c.
The shaft 70 extends upward from the left corner of the base portion 64 and can rotate around the rotation axis J2. The shaft 70 is hollow, and an internal shaft 74 (see FIG. 15) is provided in the hollow portion. Shaft 70 is provided through the second to fourth left support member _{52b L ~52d} L.
The first to third arms 72a to 72c are respectively arranged in order from the top and extend substantially in the horizontal direction. The base end portions of the first to third arms 72a to 72c are fixed to the shaft 70, respectively. The first to third arms 72a to 72c respectively have first to third suction pads (an example of first to third suction portions) 76a to 76c on the upper surface of the distal end portion. The first to third suction pads 76a to 76c receive the first to third substrates W1 to W3 from the descending first to third substrate support portions 52a to 52c, respectively, and the first to third substrates. The lower surfaces of W1 to W3 can be adsorbed by air, and the adsorbed first to third substrates W1 to W3 can be rotated around the rotation axis J3 intersecting with one surface of the substrates W1 to W3.
The first arm 72a is positioned between the first substrate W1 placed on the raised first substrate support portion 52a and the second substrate W2 placed on the raised second substrate support portion 52b. , Its height position is set. The first arm 72a, together with the other arms, performs an alignment operation of the first substrate W1 from a retreat position (see FIG. 9) that avoids interference with the first substrate W1 carried in by the substrate transport robot 20. It turns around the rotation axis J2 together with the shaft 70 to a position (see FIG. 2). Accordingly, the first suction pad 76a enters between the first substrate W1 placed on the first substrate support portion 52a and the second substrate W2 placed on the second substrate support portion 52b (alignment position). (See FIG. 11).
The second arm 72b is positioned between the second substrate W2 placed on the raised second substrate support portion 52b and the third substrate W3 placed on the raised third substrate support portion 52c. , Its height position is set. Together with the other arms, the second arm 72b pivots around the rotation axis J2 together with the shaft 70 from the retracted position to the alignment position where the second substrate W2 is aligned. Accordingly, the second suction pad 76b enters between the second substrate W2 placed on the second substrate support portion 52b and the third substrate W3 placed on the third substrate support portion 52c (alignment position). Can be made.
The third arm 72c is positioned between the third substrate W3 placed on the raised third substrate support portion 52c and the fourth substrate W4 placed on the raised fourth substrate support portion 52d. , Its height position is set. Together with the other arms, the third arm 72c pivots around the rotation axis J2 together with the shaft 70 from the retracted position to the alignment position where the alignment operation of the third substrate W3 is performed. Accordingly, the third suction pad 76c enters between the third substrate W3 placed on the third substrate support portion 52c and the fourth substrate W4 placed on the fourth substrate support portion 52d (alignment position). Can be made.
That is, the advancing / retreating portion 56 moves the first to third suction pads 76a to 76c to the first substrate W1 placed on the first substrate support portion 52a and the second substrate W2 placed on the second substrate support portion 52b, respectively. Between the second substrate W2 placed on the second substrate support portion 52b and the third substrate W3 placed on the third substrate support portion 52c, and the third substrate placed on the third substrate support portion 52c. Enter the alignment position between the substrate W3 and the fourth substrate W4 mounted on the fourth substrate support 52d from the retracted position that avoids interference with the first to fourth substrates W1 to W4 that are carried in. be able to.

The substrate positioning portion 58 includes first and second butted members 80a and 80b that constitute an example of the abutted portion, and first and second abutting members 82a and 82b that constitute an example of the abutting portion. Have.
The first abutting member 80a is fixed to the first arm 72a via a bracket 83a extending outward in the horizontal direction from the side surface of the central portion in the longitudinal direction of the first arm 72a. The first butted member 80a includes the first and second substrates W1 and W2 in a state where the first and second substrates W1 and W2 are supported by the first and second substrate support portions 52a and 52b, respectively. Each of the first ends of W2 is abutted.
As shown in FIGS. 2 and 12, the first butted member 80 a is a member having a different thickness depending on the position in the vertical direction, and the vertical direction is the longitudinal direction. The first and second substrates of the first butted member 80a in a state where the first ends of the first and second substrates W1 and W2 are respectively butted against the first butted member 80a. The contact portions with W1 and W2 are formed along the outer peripheries of the first and second substrates W1 and W2 (see FIG. 4). The first butted member 80a has, from above, a first contact portion 84a, a first non-contact portion 86a, a second contact portion 84b, and a second non-contact portion 86b. Note that the second non-contact portion 86b may not be provided.
The first contact portion 84a comes into contact with the first end portion of the first substrate W1 supported by the first substrate support portion 52a in the raised position (H1a). The first non-contact portion 86a is formed with a smaller diameter than the first contact portion 84a. Accordingly, the first substrate support 52a is lowered and does not come into contact with the first substrate W1 at the suction position (H1b) sucked by the first suction pad 76a.
The second contact portion 84b comes into contact with the first end portion of the second substrate W2 supported by the second substrate support portion 52b at the raised position (H2a). The second non-contact part 86b is formed with a smaller diameter than the second contact part 84b. Accordingly, the second substrate support 52b is lowered and does not come into contact with the second substrate W2 at the suction position (H2b) sucked by the second suction pad 76b.

The second butted member 80b is fixed to the third arm 72c via a bracket 83b extending in the horizontal direction from the side surface of the third arm 72c. The second butted member 80b is configured such that the third and fourth substrates W3 and W4 are supported by the third and fourth substrate support portions 52c and 52d, respectively. The first ends of W4 are butted against each other.
Since the shape of the second butted member 80b is the same as that of the first butted member 80a, description thereof is omitted. The second butted member 80b includes a third contact portion that comes into contact with an end portion of the third substrate W3 placed on the raised third substrate support portion 52c, and a raised fourth substrate support portion. And a fourth contact portion with which an end portion of the fourth substrate W4 placed on 52d comes into contact.

The first and second abutting members 82a and 82b are in contact with the second and third ends of the first and second substrates W1 and W2, and the first and second substrates W1 and W2 are the first. The first and second substrates W1 and W2 can be positioned by abutting against the abutting member 80a. The first and second butting members 82a and 82b are in contact with the second and third end portions of the third and fourth substrates W3 and W4, and the third and fourth substrates W3 and W4 are brought into contact with each other. The third and fourth substrates W3 and W4 can be positioned by abutting against the second abutting member 80b.
The first and second abutting members 82a and 82b are columnar (bar-shaped) members that extend upward from the base 64, respectively. In a state where the first and second butting members 82a and 82b are in contact with the second and third end portions of the first to fourth substrates W1 to W4, respectively, the first and second butting members 82a. , 82b are in contact with the first to fourth substrates W1 to W4 so as to extend along the outer peripheries of the first to fourth substrates W1 to W4 (see FIG. 4).
The first abutting member 82 a is provided on the right front side of the alignment device 30 when the alignment device 30 is viewed from the front. The second abutting member 82 b is provided on the right rear side of the alignment device 30 when the alignment device 30 is viewed from the front. Both the first and second abutting members 82a and 82b can advance and retract in the left-right direction when viewed from the front. When the first and second butting members 82a and 82b are retracted, they contact the first to fourth substrates W1 to W4 supported by the first to fourth substrate support portions 52a to 52d. Never do. However, when the first and second butting members 82a and 82b advance (when moving to the left in front view), the second and third of the first to fourth substrates W1 to W4. The first to fourth substrates W1 to W4 can be abutted against the first and second butted members 80a and 80b, respectively.
Note that a cutout 88 shown in FIG. 4 is formed in the first to fourth substrate support portions 52a to 52d so as not to interfere with the retracted first and second abutting members 82a and 82b.

First to fourth notch detection sensors (an example of first to fourth detectors) 62a to 62b shown in FIGS. 5 to 7 and FIG. 13 are provided on the first to fourth substrates W1 to W4, respectively. The position of a notch (an example of a notch) 92 (see FIG. 10) can be detected.
Each of the first to fourth notch detection sensors 62a to 62d is configured by, for example, an optical transmission type sensor. Since the optical transmission type sensor is smaller than the CCD line sensor, it is possible to provide corresponding notch detection sensors 62a to 62d for the first to fourth substrates W1 to W4, respectively. . The light projectors 94a and the light receivers 94b of the first to fourth notch detection sensors 62a to 62d are respectively rotated by first to fourth suction pads 76a to 76d between the light projector 94a and the light receiver 94b. The four substrates W1 to W4 are fixed to the support column 102 via first to fourth fixing plates 96a to 96d so that the end portions of the four substrates W1 to W4 are positioned. The first to fourth fixing plates 96a to 96d are further provided with first to fourth substrate presence / absence sensors 97a to 97d for detecting the presence / absence of a substrate. Each of the first to fourth substrate presence / absence sensors 97a to 97d is constituted by, for example, an optical transmission type sensor.
Here, each of the first to fourth fixing plates 96a to 96d includes a first protruding member 98a to which the light receiver 94b is fixed and a second protruding member 98b to which the projector 94a is fixed. The first and second projecting members 98a and 98b are plate-like members, respectively, and are arranged so that their longitudinal directions are parallel to each other.
The first and third fixing plates 96a and 96c are provided with first and second protrusions in order to avoid interference with the end effectors 44a and 44b and the substrate W carried into the alignment apparatus 30 by the end effectors 44a and 44b. The members 98a and 98b are fixed to the support column 102 so that the longitudinal direction thereof faces obliquely downward. For the same reason, the second and fourth fixing plates 96a and 96c are fixed to the column 102 so that the longitudinal directions of the first and second projecting members 98a and 98b are obliquely upward.

  The base 64 is fixed to the installation surface. As shown in FIG. 5, the base portion 64 has a fourth suction pad 76d (an example of a fourth suction portion) on the upper surface side of the base portion 64 and below the entered third suction pad 76c. ing. The fourth suction pad 76d receives the fourth substrate W4 from the lower fourth substrate support 52d, sucks the lower surface of the fourth substrate W4 by air, and moves the sucked fourth substrate W4 around the rotation axis J3. Can be rotated.

As shown in FIG. 14, air cylinders (an example of second and third drive units) 104a and 104b are provided inside the base 64, respectively.
The air cylinder 104a lifts and lowers the member 106a fixed to the lower ends of the first left lifting shaft 66a _L and the first right lifting shaft 66a _R , and the first left lifting shaft 66a _L and the first right lifting shaft 66a. _Raise and lower _R together.
The air cylinder 104b raises and lowers the member 106b fixed to the lower ends of the second left lifting shaft 66b _L and the second right lifting shaft 66b _R , and the second left lifting shaft 66b _L and the second right lifting shaft 66b. _Raise and lower _R together.

Further, as shown in FIG. 15, a rotary cylinder (an example of a first drive unit) 108 and a servo motor 110 are provided inside the base portion 64.
The rotary cylinder 108 rotates the shaft 70 to which the first to third arms 72a to 72c are fixed around the rotation axis J2 via a drive mechanism 112 such as a belt transmission mechanism. That is, the first to third arms 72a to 72c are turned by the rotary cylinder 108.
The servo motor 110 rotates an internal shaft 74 provided inside the shaft 70 around the rotation axis J2 via a drive mechanism 114 such as a belt transmission mechanism. The internal shaft 74 rotates pulleys 118 provided at the base ends of the first to third arms 72 a to 72 c, and rotates the first to third suction pads 76 a to 76 c via the belt 119. In addition, the servo motor 110 rotates the fourth suction pad 76 d provided on the upper surface side of the base portion 64 via the drive mechanism 120. As described above, the first to fourth suction pads 76a to 76d are rotationally driven by one servo motor.
In addition, the adsorption states (adsorption or non-adsorption) of the first to fourth adsorption pads 76a to 76d are controlled by the first to fourth solenoid valves 113a to 113d, respectively. That is, the suction state of each of the first to fourth suction pads 76a to 76d is independently controlled.

In addition, as shown in FIG. 16, an air cylinder (an example of a fourth drive unit) 122 is provided inside the base portion 64.
The air cylinder 122 moves the first and second butting members 82a and 82b forward and backward by moving the member 124 fixed to the lower ends of the first and second butting members 82a and 82b in the left-right direction.

Next, the operation of the alignment apparatus 30 will be described. The alignment apparatus 30 operates according to the following steps and can align the substrate W.
(Step S1)
The first to third arms 72a to 72c are in the retracted position. The first and second lifters 54a and 54b are in the raised position.
For example, the substrate transfer robot 20 takes out the first and second substrates W1 and W2 from the substrate storage container placed on the load port LP1. The substrate transport robot 20 carries in the first and second substrates W1 and W2 placed on both end effectors 44a and 44b from the front of the alignment apparatus 30, and enters the first and second substrate support portions 52a and 52b, respectively. (See the left figure in FIG. 17A). The first and second substrates W1 and W2 are supported at three points by pads 68, respectively. That the first and second substrates W1 and W2 are supported by the first and second substrate supporting portions 52a and 52b by the first and second substrate presence / absence sensors 97a and 97b (see FIG. 13), respectively. It is confirmed.
Thereafter, the substrate transport robot 20 takes out the third and fourth substrates W3 and W4 from the substrate storage container of the load port LP1, for example. However, when the aligned third and fourth substrates W3 and W4 are placed on the third and fourth substrate support portions 52c and 52d, the substrate transport robot 20 first places the substrates W3 and W4 on the substrate. For example, after transporting to the load lock chambers LL1 and LL2, respectively, the third and fourth substrates W3 and W4 are taken out from the substrate storage container of the load port LP1.

(Step S2)
The rotary cylinder 108 (see FIG. 15) provided on the base 64 of the alignment apparatus 30 is driven. The first to third arms 72a to 72c rotate and enter the alignment position from the retracted position (see the central view of FIG. 17A). The first and second suction pads 76a and 76b are located below the first and second substrates W1 and W2, respectively. At this time, depending on the positions of the first and second substrates W1 and W2 mounted on the first and second substrate support portions 52a and 52b, the first and second contacts of the first abutted member 80a. The first ends of the first and second substrates W1 and W2 are in contact with the portions 84a and 84b (see FIG. 12), respectively, and the first and second substrates W1 and W2 slide and move on the pad 68. There is a case.
Next, the air cylinder 122 is driven, and the first and second abutting members 82a and 82b advance toward the first and second substrates W1 and W2. The first and second butting members 82a and 82b are in contact with the second and third ends of the first and second substrates W1 and W2, respectively. The first and second substrates W1 and W2 slide on the pad 68 and abut against the first abutting member 80a. The first substrate W1 includes 1) a first abutting member 82a, 2) a second abutting member 82b, and 3) a first contact portion 84a provided on the first abutting member 80a (FIG. 12), the first substrate W1 is positioned. The second substrate W2 includes 1) a first abutting member 82a, 2) a second abutting member 82b, and 3) a second contact portion 84b provided on the first abutting member 80a (FIG. 12), the second substrate W2 is positioned.
After positioning the first and second substrates W1, W2, the first and second abutting members 82a, 82b move backward.

(Step S3)
The air cylinders 104a and 104b are respectively driven, and the first and second lifters 54a and 54b are respectively lowered. The first and second substrates W1, W2 supported by the first and second substrate support portions 52a, 52b are respectively connected to the first and second arms 72a, 72b (first and second suction pads 76a, 76b) (see the right figure in FIG. 17A). The first ends of the transferred first and second substrates W1 and W2 are respectively separated downward from the first and second contact portions 84a and 84b provided on the first abutting member 80a. (See the two-dot chain line shown in FIG. 12). The first and second solenoid valves 113a and 113b cause the first and second substrates W1 and W2 to be adsorbed by the first and second suction pads 76a and 76b.

(Step S4)
The servo motor 110 (see FIG. 15) is driven, and the first and second suction pads 76a and 76b rotate. At that time, the third and fourth suction pads 76c and 76d rotate in a state where nothing is sucked. The first and second substrates W1, W2 sucked by the first and second suction pads 76a, 76b rotate. The first and second notch detection sensors 62a and 62b output first and second signals corresponding to the positions of the notches 92 of the first and second substrates W1 and W2, respectively. Based on the first and second signals and the rotational position information output from the encoder of the servo motor 110, the positions of the notches 92 provided on the first and second substrates W1 and W2 are the first and second positions. Each is acquired as alignment information (see the left figure of FIG. 17B).
Next, based on the first alignment information, the first suction pad 76a rotates by an angle θ1 so that the position of the notch 92 of the first substrate W1 becomes a predetermined position. That is, the alignment operation for the first substrate W1 is performed. At this time, since the first suction pad 76a rotates by the angle θ1, the second substrate W2 also rotates by the angle θ1. The third and fourth suction pads 76c and 76d rotate by an angle θ1 in a state where nothing is sucked.

(Step S5)
The air suction of the first suction pad 76a is released. The first lifter 54a is raised, and the first substrate support 52a receives the first substrate W1 from the first suction pad 76a.
That is, the first substrate W1 is supported by the first substrate support 52a, and the second substrate W2 is attracted to the second suction pad 76b (see the central view of FIG. 17B).
As the first lifter 54a is raised, the third substrate support 52c is also raised.

(Step S6)
Based on the second alignment information obtained in step S4 and the angle θ1, the second suction pad 76b is angled so that the position of the notch 92 of the second substrate W2 becomes a predetermined position. It rotates θ2. That is, the alignment operation related to the second substrate W2 is performed (see the right diagram in FIG. 17B). The first, third and fourth suction pads 76a, 76c and 76d also rotate by an angle θ2.

(Step S7)
The air suction of the second suction pad 76b is released. The second lifter 54b is raised, and the second substrate support 52b receives the second substrate W2 from the second suction pad 76b. As the second lifter 54b is raised, the fourth substrate support portion 52d is also raised. That is, the first and second substrates W1 and W2 are supported by the first and second substrate support portions 52a and 52b, respectively (see the left diagram in FIG. 17C).

(Step S8)
The rotary cylinder 108 is driven. The first to third arms 72a to 72c rotate and move from the alignment position to the retracted position (see the central view of FIG. 17C).

(Step S9)
The substrate transport robot 20 that has taken out the third and fourth substrates W3 and W4 from the substrate storage container in step S1 described above carries the third and fourth substrates W3 and W4 from the front of the alignment apparatus 30. These are placed on the third and fourth substrate support portions 52c and 52d, respectively (see the right side of FIG. 17C). The alignment apparatus 30 is in the state shown in FIG.

(Step S10)
The substrate transfer robot 20 takes out the first and second substrates W1 and W2 that have been aligned (see the left diagram in FIG. 17D). The substrate transfer robot 20 transfers the taken first and second substrates W1 and W2 to, for example, load lock chambers LL1 and LL2. Thereafter, the substrate transfer robot 20 takes out two more substrates from, for example, the substrate storage container placed on the load port LP2.

(Step S11)
The rotary cylinder 108 (see FIG. 15) provided on the base 64 of the alignment apparatus 30 is driven. The first to third arms 72a to 72c rotate and enter the alignment position from the retracted position (see the central view of FIG. 17D). The third suction pad 76c is located below the third substrate W3. The fourth substrate W4 is located above the fourth suction pad 76d. At this time, depending on the positions of the third and fourth substrates W3 and W4 mounted on the third and fourth substrate support portions 52c and 52d, the third and fourth contacts of the second abutting member 80b. In some cases, the first ends of the third and fourth substrates W3 and W4 are in contact with each other, and the third and fourth substrates W3 and W4 slide on the pad 68 in some cases.
Next, the air cylinder 122 is driven, and the first and second butting members 82a and 82b advance toward the third and fourth substrates W3 and W4. The first and second butting members 82a and 82b are in contact with the second and third end portions of the third and fourth substrates W3 and W4, respectively. The third and fourth substrates W3 and W4 slide on the pad 68 and abut against the second abutting member 80b. The third substrate W3 has three points: 1) a first abutting member 82a, 2) a second abutting member 82b, and 3) a third contact portion provided on the second abutting member 80b. And the third substrate W3 is positioned. The fourth substrate W4 has three points: 1) the first abutting member 82a, 2) the second abutting member 82b, and 3) the fourth contact portion provided on the second abutting member 80b. And the fourth substrate W4 is positioned.
After positioning the third and fourth substrates W3 and W4, the first and second abutting members 82a and 82b move backward.

(Step S12)
The air cylinders 104a and 104b are respectively driven, and the first and second lifters 54a and 54b are respectively lowered. The third and fourth substrates W3 and W4 supported by the third and fourth substrate support portions 52c and 52d are respectively connected to the third arm 72c and the base portion 64 (third and fourth suction pads 76c and 76d). It is delivered (see the right figure in FIG. 17D). The first end portions of the transferred third and fourth substrates W3 and W4 are respectively separated from the third and fourth contact portions provided on the second abutting member 80b downward. Become. The third and fourth solenoid valves 113c and 113d cause the third and fourth substrates W3 and W4 to be adsorbed by the third and fourth suction pads 76c and 76d.

(Step S13)
The servo motor 110 is driven, and the third and fourth suction pads 76c and 76d rotate. At that time, the first and second suction pads 76a and 76b rotate in a state where nothing is sucked. The third and fourth substrates W3, W4 sucked by the third and fourth suction pads 76c, 76d rotate. The third and fourth notch detection sensors 62c and 62d output third and fourth signals corresponding to the positions of the notches 92 of the third and fourth substrates W3 and W4, respectively. Based on the third and fourth signals and the rotational position information output from the encoder of the servo motor 110, the positions of the notches 92 provided on the third and fourth substrates W3 and W4 are the third and fourth. Each is acquired as alignment information (see the left figure of FIG. 17E).
Next, based on the third alignment information, the third suction pad 76c rotates by an angle θ3 so that the position of the notch 92 of the third substrate W3 becomes a predetermined position. That is, the alignment operation for the third substrate W3 is performed. At this time, since the third suction pad 76c rotates by an angle θ3, the fourth substrate W4 also rotates by an angle θ3. The first and second suction pads 76a and 76b rotate by an angle θ3 in a state where nothing is sucked.

(Step S14)
The air suction of the third suction pad 76c is released. The first lifter 54a is raised, and the third substrate support 52c receives the third substrate W3 from the third suction pad 76c.
That is, the third substrate W3 is supported by the third substrate support portion 52c, and the fourth substrate W4 is sucked by the fourth suction pad 76d (see the central view of FIG. 17E).
As the first lifter 54a is raised, the first substrate support 52a is also raised.

(Step S15)
Based on the third alignment information obtained in step S13 and the angle θ3, the fourth suction pad 76d has an angle so that the position of the notch 92 of the fourth substrate W4 becomes a predetermined position. Rotate θ4. That is, the alignment operation related to the fourth substrate W4 is performed (see the right diagram in FIG. 17E). The first to third suction pads 76a to 76c also rotate by an angle θ4.

(Step S16)
The air suction of the fourth suction pad 76d is released. The second lifter 54b is raised, and the fourth substrate support 52d receives the four substrates W4 from the fourth suction pad 76c. In addition, the 2nd board | substrate support part 52b also raises with the raise of the 2nd lifter 54b. That is, the third and fourth substrates W3 and W4 are supported by the third and fourth substrate support portions 52c and 52d, respectively (see the left diagram in FIG. 17F).

(Step S17)
The rotary cylinder 108 is driven. The first to third arms 72a to 72c rotate and move from the alignment position to the retracted position (see the central view of FIG. 17F).

(Step S18)
The substrate transport robot 20 that has taken out two new substrates from the substrate storage container in the above-described step S10 carries these two substrates from the front of the alignment apparatus 30, and supports the first and second substrates, respectively. Place them on the parts 52a and 52b (see the right figure in FIG. 17F).

(Step S19)
The substrate transfer robot 20 takes out the third and fourth substrates W3 and W4 that have been aligned. The substrate transport robot 20 transports the taken third and fourth substrates W3 and W4 to, for example, the load lock chambers LL1 and LL2.

Thereafter, the above steps are repeated to align the substrate W. Note that the steps may be executed in parallel instead of sequentially if possible.
As described above, since the substrates W are aligned two by two, the throughput of the alignment apparatus 30 is improved as compared with the case where the configuration of the present embodiment is not provided.

  In addition, this invention is not limited to the above-mentioned embodiment, The change in the range which does not change the summary of this invention is possible. For example, a case where the invention is configured by combining some or all of the above-described embodiments and modifications is also included in the technical scope of the present invention.

  The first lifter moves up and down the first and fourth substrate support portions as the first set, and the second lifter moves up and down the second and third substrate support portions as the second set. May be.

  Also, the first lifter moves up and down the first and second substrate support portions as the first set, and the second lifter moves up and down the third and fourth substrate support portions as the second set. You may comprise. However, in this case, the pitch between the end effectors of the substrate transport robot is set so that the substrate W can be placed on the first and third substrate support portions or the second and fourth substrate support portions. .

The advancing / retreating part turns to enter the alignment position. For example, the advance / retreat part may move straight and enter the alignment position.
The first drive unit may be a motor.
The second to fourth drive units are not limited to air cylinders, but may be solenoids.

  The notch provided in the substrate is not limited to the notch, and may be an orientation flat. However, when the cutout is an orientation flat, the positioning portion is configured to contact the substrate at four points so that the substrate can be positioned stably.

  In the above-described embodiment, the interval between the first substrate support portion 52a and the second substrate support portion 52b is set to be the same as the interval P between the first and second end effectors 44a and 44b. However, they are not necessarily the same. However, from the viewpoint of further improving the throughput, the interval between the first substrate support portion 52a and the second substrate support portion 52b is made equal to the interval P between the first and second end effectors 44a and 44b. Is preferred.

10: Semiconductor manufacturing apparatus, 15: Front end module, 20: Substrate transfer robot, 30: Alignment apparatus, 42: Arm, 44a: First end effector, 44b: Second end effector, 46: Lifting mechanism, 52a: First substrate support, 52b: second substrate support, 52c: third substrate support, 52d: fourth substrate support, 52a _L : first left support member, 52a _R : first Right support member, 52b _L : second left support member, 52b _R : second right support member, 52c _L : third left support member, 52c _R : third right support member, 52d _L : fourth Left support member, 52d _R : fourth right support member, 54a: first lifter, 54b: second lifter, 56: advance / retreat part, 58: substrate positioning part, 62a: first notch detection sensor, 62 b: second notch detection sensor, 62c: third notch detection sensor, 62d: fourth notch detection sensor, 64: base, 66a: first lifting shaft, 66b: second lifting shaft, 66a _L : First left lifting shaft, 66a _R : first right lifting shaft, 66b _L : second left lifting shaft, 66b _R : second right lifting shaft, 68: pad, 70: shaft, 72a: first Arm, 72b: second arm, 72c: third arm, 74: internal shaft, 76a: first suction pad, 76b: second suction pad, 76c: third suction pad, 76d: fourth Suction pad, 80a: first abutted member, 80b: second abutted member, 82a: first abutting member, 82b: second abutting member, 83a, 83b: bracket, 4a: first contact portion, 84b: second contact portion, 86a: first non-contact portion, 86b: second non-contact portion, 88: notch, 92: notch, 94a: projector, 94b: light reception 96a: first fixing plate, 96b: second fixing plate, 96c: third fixing plate, 96d: fourth fixing plate, 97a: first substrate presence / absence sensor, 97b: second substrate presence / absence Sensor, 97c: third substrate presence sensor, 97d: fourth substrate presence sensor, 98a: first projecting member, 98b: second projecting member, 102: support column, 104a, 104b: air cylinder, 106a, 106b : Member, 108: rotary cylinder, 110: servo motor, 112: drive mechanism, 113a: first solenoid valve, 113b: second solenoid valve, 113c: third solenoid valve, 113d: fourth Solenoid valve, 114: drive mechanism, 118: pulley, 119: belt, 120: drive mechanism, 122: air cylinder, 124: member, LL1, LL2: load lock chamber, LP1, LP2, LP3: load port, W: substrate , W1: substrate, W2: substrate, W3: substrate, W4: substrate

Claims (15)

First to fourth substrate support portions that respectively support the first to fourth substrates that are carried in, and are arranged in order from the top and bottom, and
First to third suction portions for receiving and sucking the first to third substrates from the first to third substrate support portions that descend, respectively, and rotating the sucked first to third substrates. And the first to third suction portions are respectively disposed between the first substrate placed on the first substrate support portion and the second substrate placed on the second substrate support portion. Alignment position between the second substrate and the third substrate placed on the third substrate support, and between the third substrate and the fourth substrate placed on the fourth substrate support Advancing and retracting part to enter,
A fourth suction unit that is provided below the third suction unit that has entered, receives the fourth substrate from the lower fourth substrate support unit, sucks the fourth substrate, and rotates the sucked fourth substrate. A base having
The abutting portion provided in the advance / retreat portion and against which the end portions of the first to fourth substrates are abutted, and the end portions of the first to fourth substrates different from the end portions are in contact with the first to fourth substrates. A substrate positioning unit having an abutting portion for abutting the fourth substrate against the abutted portion and positioning the first to fourth substrates;
Comprising first to fourth detectors for detecting the positions of notches provided in the first to fourth substrates, respectively.
An alignment apparatus in which any two of the first group and the remaining second group out of the first to fourth substrate support parts move up and down. The alignment apparatus according to claim 1, wherein the advance / retreat portion extends upward from the base portion and rotates around an axis.
The alignment apparatus which has the 1st-3rd arm provided with the said 1st-3rd adsorption | suction part, respectively, and is fixed to the said shaft at a base end part.   The alignment apparatus according to claim 2, wherein the abutted portion includes a first abutted member provided on the first arm and abutted against end portions of the first and second substrates, and the first abutted member. An alignment apparatus comprising: a second abutted member provided on the arm of 3 and abutted against end portions of the third and fourth substrates. 4. The alignment apparatus according to claim 3, wherein the first abutting member is lifted with a first contact portion that contacts an end portion of the first substrate placed on the raised first substrate support portion. A second contact portion that comes into contact with an end portion of the second substrate placed on the second substrate support portion,
The second abutting member includes a third contact portion that contacts an end portion of the third substrate placed on the raised third substrate support portion, and a raised fourth substrate support portion. An alignment apparatus comprising: a fourth contact portion in contact with an end portion of the fourth substrate placed thereon. 5. The alignment device according to claim 4, wherein the abutting portion contacts two end portions different from the end portions to which the first to fourth contact portions of the first to fourth substrates contact,
The abutting portion is an alignment apparatus having first and second abutting members that are in contact with one end and the other end of the two ends, respectively.   6. The alignment apparatus according to claim 5, wherein each of the first and second abutting members is a rod-shaped member that extends upward from the base and advances toward the first to fourth substrates. Alignment device. The alignment apparatus according to claim 1, wherein the first to fourth substrate support portions are respectively a first support member that supports a lower surface of the first to fourth substrates. ,
The alignment apparatus which has a 2nd support member which supports the lower surface of the said 1st-4th board | substrate in two places different from the place where the said 1st support member supports.   6. The alignment apparatus according to claim 2, wherein the first set is the first and third substrate support portions, and the second set is the second and fourth substrates. 7. An alignment device which is a support part.   6. The alignment apparatus according to claim 1, wherein the first set is the first and fourth substrate support portions, and the second set is the second and third substrates. 7. An alignment device which is a support part.   6. The alignment apparatus according to claim 1, wherein the first set is the first and second substrate support portions, and the second set is the third and fourth substrates. 7. An alignment device which is a support part. The alignment apparatus according to claim 8, wherein the base portion includes a first driving portion that drives the shaft;
An alignment apparatus further comprising: a servo motor that rotates the first to fourth suction portions. 12. The alignment apparatus according to claim 11, wherein the base portion includes a second drive unit that moves the first and third substrate support units up and down.
An alignment apparatus further comprising: a third driving unit for moving up and down the second and fourth substrate support units.   13. The alignment apparatus according to claim 12, wherein the base portion further includes a fourth drive unit that moves the first and second abutting members, respectively. A first and second end effector disposed in the vertical direction and on which a substrate is placed; a substrate transfer robot having a lifting mechanism capable of moving the first and second end effectors in the vertical direction;
An alignment device that aligns each of the substrates carried by the substrate transport robot;
The alignment apparatus supports the loaded substrates as first to fourth substrates, and is arranged in order from the top to the first to fourth substrate support portions,
First to third suction portions for receiving and sucking the first to third substrates from the first to third substrate support portions that descend, respectively, and rotating the sucked first to third substrates. The first to third suction portions are located between the first substrate and the second substrate, respectively, from a retracted position that avoids interference with the first to fourth substrates that are carried in. An advancing / retreating portion for entering an alignment position between the second substrate and the third substrate and between the third substrate and the fourth substrate;
A fourth suction unit that is provided below the third suction unit that has entered, receives the fourth substrate from the lower fourth substrate support unit, sucks the fourth substrate, and rotates the sucked fourth substrate. A base having
The abutting portion provided in the advance / retreat portion and against which the end portions of the first to fourth substrates are abutted, and the end portions of the first to fourth substrates different from the end portions are in contact with the first to fourth substrates. A substrate positioning unit having an abutting portion for abutting the fourth substrate against the abutted portion and positioning the first to fourth substrates;
Comprising first to fourth detectors for detecting the positions of notches provided in the first to fourth substrates, respectively.
A semiconductor manufacturing apparatus in which any one of the first group and the remaining second group out of the first to fourth substrate support parts are moved up and down.   15. The semiconductor manufacturing apparatus according to claim 14, wherein a distance between the first end effector and the second end effector is a first distance between the first substrate support portion and the second substrate support portion. A semiconductor manufacturing apparatus set to be substantially the same as a second distance between the third substrate support portion and the fourth substrate support portion.

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