WO2013094717A1 - Substrate processing device - Google Patents

Substrate processing device Download PDF

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Publication number
WO2013094717A1
WO2013094717A1 PCT/JP2012/083183 JP2012083183W WO2013094717A1 WO 2013094717 A1 WO2013094717 A1 WO 2013094717A1 JP 2012083183 W JP2012083183 W JP 2012083183W WO 2013094717 A1 WO2013094717 A1 WO 2013094717A1
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WO
WIPO (PCT)
Prior art keywords
substrate
horizontally
transport mechanism
transport
transfer arm
Prior art date
Application number
PCT/JP2012/083183
Other languages
French (fr)
Japanese (ja)
Inventor
真士 若林
Original Assignee
東京エレクトロン株式会社
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Filing date
Publication date
Application filed by 東京エレクトロン株式会社 filed Critical 東京エレクトロン株式会社
Publication of WO2013094717A1 publication Critical patent/WO2013094717A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1615—Programme controls characterised by special kind of manipulator, e.g. planar, scara, gantry, cantilever, space, closed chain, passive/active joints and tendon driven manipulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40301—Scara, selective compliance assembly robot arm, links, arms in a plane
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Definitions

  • the present invention relates to a substrate processing apparatus having a transfer mechanism for transferring a substrate to a plurality of vacuum processing chambers connected to a common vacuum transfer chamber.
  • a substrate used for the production of a semiconductor device has a large processing surface (surface on which a semiconductor device is formed) so that a larger number of semiconductor devices can be produced collectively.
  • a substrate processing apparatus that can cope with the expansion of the processing surface, that is, the increase in the diameter of the substrate is being studied.
  • a vacuum processing chamber for processing a substrate in a vacuum environment As a general substrate processing apparatus for processing such a substrate, a vacuum processing chamber for processing a substrate in a vacuum environment, and a transfer that connects the vacuum processing chambers and realizes transfer of the substrate in a vacuum environment.
  • a substrate processing apparatus including a vacuum transfer chamber having a mechanism is known (for example, see Patent Document 1).
  • SCARA robot capable of transporting in the horizontal direction while holding a substrate
  • SCARA is an abbreviation for Selective Compliance Assembly Robot Arm.
  • a SCARA robot has a configuration in which a plurality of transfer arms are connected to each other so as to transmit a driving force such as a link mechanism at the end portions of the SCARA robots, thereby stacking transfer arms that enable a turning operation.
  • the SCARA robot can move in the vertical direction and rotate around the turning drive shaft (turning axis) by the up-and-down turning drive mechanism directly connected to the end of the lowest transfer arm.
  • the end of the uppermost transfer arm is provided with, for example, a fork-shaped pick for placing the substrate.
  • one transport arm can horizontally fold or extend (extend / contract) a plurality of transport arms by swinging horizontally with respect to another transport arm at the end thereof. In this way, the SCARA robot can horizontally move the pick on which the substrate is placed to a desired position by the individual expansion and contraction and turning operations of each transfer arm. As a result, the SCARA robot can transfer the substrate. Can do.
  • the position of the substrate is adjusted to an optimum position for substrate processing before being transferred into the transfer chamber by an alignment mechanism (orienter) provided in the substrate processing apparatus. If this occurs, the substrate is processed without maintaining the optimum position for substrate processing in the processing chamber.
  • an alignment mechanism aligner
  • An object of the present invention is to prevent a positional deviation of a substrate by controlling the transport mechanism so that a centrifugal force is not generated on the substrate transported by the transport mechanism when the transport mechanism rotates horizontally. It is to provide a processing apparatus.
  • a substrate processing apparatus comprising a transfer chamber having a transfer mechanism capable of horizontally extending and retracting, and a plurality of processing chambers arranged around the transfer chamber
  • the transport mechanism expands and contracts in the horizontal direction and / or swings to move the substrate horizontally to transport to each processing chamber, and when the transport mechanism swings horizontally, the transport mechanism
  • a substrate processing apparatus characterized in that a turning axis of a turning operation is made coincident with a center of gravity of the substrate to be transported.
  • the transport mechanism includes a plurality of stacked transport arm portions and a placement portion attached to an end of the uppermost transport arm portion, and the placement portion places the substrate.
  • the one transfer arm unit is connected to the other transfer arm unit at the end and horizontally pivots with respect to the other transfer arm unit to expand and contract the transfer mechanism, and
  • the arm portion pivots horizontally around the pivot axis at the end portion to cause the transport mechanism to pivot horizontally, and when the transport mechanism pivots horizontally, the transport mechanism is the lowest transport arm. It is preferable that the swivel axis at the end of the part coincides with the center of gravity of the substrate to be transported.
  • the transport mechanism when the substrate is transported from one processing chamber to another processing chamber, the transport mechanism is horizontally contracted to unload the substrate from the one processing chamber and to horizontally support the substrate.
  • the swivel axis is moved to coincide with the center of gravity of the substrate, and the substrate is swung horizontally around the swivel axis together with the substrate so that the substrate is directly opposed to the other processing chamber and further horizontally expanded to It is preferable to carry the substrate into another processing chamber.
  • the apparatus further includes a plurality of transfer mechanisms, wherein the plurality of transfer mechanisms are stacked in the transfer chamber, and the one transfer mechanism transfers the substrate, the first horizontal moving surface, and the other transfer mechanism. Is preferably separated from the second horizontal moving surface for transporting the substrate in the vertical direction.
  • the swivel axes of the plurality of transport mechanisms coincide with each other, and an observation device for observing the surface state of the substrate is disposed immediately above the swivel axes.
  • the other transport mechanism when the one transport mechanism performs a swivel operation with the swivel axis of the one transport mechanism and the center of gravity of the one substrate transported by the one transport mechanism, the other transport mechanism Preferably, the other substrate transported by the other transport mechanism is not superposed on the one substrate that performs a turning operation when the plurality of transport mechanisms are viewed along the vertical direction.
  • the substrate is preferably a semiconductor wafer having a diameter of 450 mm.
  • the transport mechanism when the transport mechanism that horizontally moves the substrate by the telescopic swivel operation in the horizontal direction and transports the substrate to each processing chamber performs the swivel operation horizontally, the transport mechanism is the substrate to be transported with the swivel axis of the swivel operation. Therefore, no centrifugal force is generated on the conveyed substrate. Thereby, it is possible to prevent the positional deviation of the substrate when the transport mechanism turns horizontally.
  • FIG. 1 is a plan view schematically showing a configuration of a substrate processing apparatus according to a first embodiment of the present invention. It is a top view which shows the structure of the SCARA robot in FIG. It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. It is a top view which shows the structure of the 1st modification of the SCARA robot of FIG. It is a top view which shows the structure of the 2nd modification of the SCARA robot of FIG.
  • FIG. 1 shows roughly the structure of the substrate processing apparatus which concerns on the 2nd Embodiment of this invention. It is a top view which shows the structure of the two SCARA robots in FIG. It is a side view which shows the structure of the two SCARA robots in FIG. It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. It is a top view which shows the structure of the 1st modification of the two SCARA robots of FIG.
  • FIG. 10B is a plan view of the cover in FIG. 10A in the configuration of the second modification of the two SCARA robots in FIG. 7. It is a top view which shows the structure of the 3rd modification of the two SCARA robots of FIG. It is a side view which shows the structure of the 3rd modification of the two SCARA robots of FIG. It is a top view which shows the structure of the 4th modification of the two SCARA robots of FIG.
  • FIG. 1 is a plan view schematically showing a configuration of a substrate processing apparatus according to the present embodiment. Note that the transfer chamber 11 of the substrate processing apparatus 10 is shown with a lid removed for the sake of explanation.
  • a substrate processing apparatus 10 includes a transfer chamber 11 having an octagonal shape in plan view, and five processing chambers 12 arranged radially around the transfer chamber 11 and connected to the transfer chamber 11.
  • a loader module 14 connected to the transfer chamber 11 through two load lock chambers 13 is provided.
  • the inside of the transfer chamber 11 is kept in a vacuum.
  • a SCARA robot 15 transfer mechanism that carries a substrate W having a diameter of 450 mm, for example, a semiconductor wafer W is mounted, and the inside of each processing chamber 12 is kept in a vacuum. Then, the substrate W is accommodated inside and a desired plasma process, for example, a plasma etching process is performed on the substrate W.
  • the loader module 14 has three load ports 16 on the opposite side of the transfer chamber 11, and further has an alignment mechanism 17.
  • Each load port 16 is loaded with a carrier for storing a predetermined number of substrates, for example, a FOUP (FOUP) (not shown), and a transfer arm (not shown) built in the loader module 14 is provided for each hoop and alignment.
  • the substrate is transferred between the mechanism 17 and the load lock chamber 13.
  • the loader module 14 is maintained at atmospheric pressure.
  • the alignment mechanism 17 adjusts the position of the substrate carried in by the transfer arm.
  • the load lock chamber 13 is configured to be switchable between a vacuum and an atmospheric pressure. When the load lock chamber 13 communicates with the loader module 14, the load lock chamber 13 has an atmospheric pressure.
  • the load lock chamber 13 When the load lock chamber 13 communicates with the transfer chamber 11, the load lock chamber 13 is loaded. The inside of the lock chamber 13 is evacuated. Although not shown, a gate valve is disposed between each unit (the transfer chamber 11, the processing chamber 12, the load lock chamber 13, the loader module 14, the load port 16, and the alignment mechanism 17), and the gate valve is necessary. Open and close according to
  • FIG. 2 is a plan view showing the configuration of the SCARA robot in FIG.
  • the SCARA robot 15 arranged on the base 18 includes a lower transfer arm 19 (lowest arm portion), an upper transfer arm 20 (arm portion), and a fork-shaped pick 21 (mounting portion). And have.
  • the lower transfer arm 19, the upper transfer arm 20, and the pick 21 are arranged in this order from the lower side, and one end 19 a of the lower transfer arm 19 is connected to the base 18 so as to be able to turn horizontally.
  • one end 20 a of the upper transfer arm 20 is connected to the other end 19 b of the lower transfer arm 19 so as to be able to turn horizontally, and the pick 21 is attached to the other end 20 b of the upper transfer arm 20.
  • the pick 21 places a substrate W (indicated by a broken line in the figure).
  • the lower transfer arm 19 pivots horizontally around the one end 19a with respect to the base 18, and at the same time, the upper transfer arm 20 pivots horizontally around the one end 20a with respect to the lower transfer arm 19.
  • the entire SCARA robot 15 can be expanded and contracted horizontally along the arrow in the figure.
  • only the lower transfer arm 19 turns horizontally around the one end 19a, thereby turning the entire SCARA robot 15 horizontally. Accordingly, the substrate W placed on the pick 21 attached to the other end 20 b of the upper transfer arm 20 is moved in the transfer chamber 11.
  • the center of gravity of the substrate W placed on the pick 21 is set to the rotation axis, specifically, the rotation axis at the one end 19a of the lower transfer arm 19.
  • the center of gravity of the pivot axis and the substrate W at the one end 19 a of the lower transfer arm 19 is indicated by a barycenter symbol 22.
  • 3A to 3D are diagrams for explaining a transfer sequence by the SCARA robot of FIG.
  • the SCARA robot 15 transports the substrate W from one processing chamber 12 to another processing chamber 12.
  • the SCARA robot 15 rotates the lower transfer arm 19 horizontally with respect to the base 18 around one end 19a, and at the same time, the upper transfer arm 20 with respect to the lower transfer arm 19 around the one end 20a.
  • the substrate W is contracted horizontally and unloaded from one processing chamber 12 (not shown) along the arrow in the drawing (FIG. 3A), and the unloaded substrate W is directed to the base 18.
  • the swivel axis 22 at one end 19a of the lower transfer arm 19 is made to coincide with the center of gravity 22 of the substrate W (FIG. 3B).
  • the SCARA robot 15 turns only the lower transfer arm 19 horizontally around the turning shaft 22 at one end 19a, for example, turns 90 ° horizontally horizontally.
  • the substrate W together with the pick 21 is made to face another processing chamber 12 (not shown) (FIG. 3C).
  • the SCARA robot 15 swings the lower transfer arm 19 horizontally with respect to the base 18 around the one end 19a, and at the same time, the upper transfer arm 20 with respect to the lower transfer arm 19 and the one end 20a.
  • the substrate W is horizontally extended along the arrow in the figure, and the substrate W is carried into another processing chamber 12 (FIG. 3D).
  • the SCARA robot 15 having the stacked lower transfer arm 19, the upper transfer arm 20, and the pick 21 attached to the other end 20b of the upper transfer arm 20 is provided.
  • the SCARA robot 15 aligns the turning shaft 22 at the end 19a of the lower transfer arm 19 with the center of gravity 22 of the substrate W to be transferred, so that centrifugal force acts on the substrate W to be transferred. do not do. Thereby, the position shift of the board
  • the SCARA robot 15 in the substrate processing apparatus 10 described above is not limited to a stack of two transfer arms.
  • the lower transfer arm 23, the intermediate transfer arm 24, and the upper transfer arm 25 may be used.
  • a SCARA robot 26 that sequentially overlaps the pick 21 may be used.
  • one end 23a of the lower transfer arm 23 is connected to the base 18 so as to be able to turn horizontally, and one end 24a of the intermediate transfer arm 24 is turned horizontally to the other end 23b of the lower transfer arm 23.
  • the upper transfer arm 25 is connected to the other end 24b of the intermediate transfer arm 24 so as to be horizontally pivotable.
  • the pick 21 is attached to the other end 25b of the upper transfer arm 25.
  • the lower transfer arm 23, the intermediate transfer arm 24, and the upper transfer arm 25 cooperate with each other to rotate horizontally, thereby expanding and contracting the entire SCARA robot 26 horizontally. Only the robot 23 pivots horizontally around the one end 23a, so that the entire SCARA robot 26 pivots horizontally.
  • the turning axis when turning as a whole as a whole, the turning axis, specifically, the turning axis at one end 23a of the lower transfer arm 23, as shown in FIG. Match the center of gravity of the substrate W. Note that the center of gravity of the turning shaft and the substrate W at the one end 23 a of the lower transfer arm 23 is indicated by a center of gravity symbol 22.
  • frog-leg robot a frog-leg type robot (hereinafter referred to as “frog-leg robot”) may be used.
  • the frog-leg robot 27 shown in FIG. 5 has a base 28 that can be rotated horizontally, a pair of telescopic transport arms 29 and 30, and a pick 21.
  • Each of the pair of transport arms 29 and 30 has one end. 29a, 30a is connected to the base 28, and the pick 21 is attached to the other ends 29b, 30b of the pair of transfer arms 29, 30.
  • the pair of transfer arms 29, 30 extend and contract in cooperation with each other, so that the entire frog-leg robot 27 extends and contracts horizontally, and the base 28 rotates, so that the entire frog-leg robot 27 is expanded. Rotate horizontally.
  • the turning axis specifically, the rotation axis of the base 28 is coincident with the center of gravity of the substrate W placed on the pick 21.
  • the rotational axis of the base 28 and the center of gravity of the substrate W are indicated by a center of gravity symbol 31.
  • FIG. 6 is a plan view schematically showing the configuration of the substrate processing apparatus according to the present embodiment.
  • the substrate processing apparatus 32 includes two SCARA robots 33 and 34 built in the transfer chamber 11 and a substrate elevator 41.
  • the SCARA robots 33 and 34 are stacked on each other.
  • FIG. 7A and 7B are diagrams showing the configuration of the two SCARA robots in FIG. 6, FIG. 7A is a plan view, and FIG. 7B is a side view.
  • the SCARA robots 33 and 34 have the same configuration as the SCARA robot 15 and are arranged on the same base 35.
  • the lower transfer arm 36 and the upper transfer arm 37 cooperate with each other to rotate horizontally, thereby expanding and contracting the entire SCARA robot 33 horizontally, and only the lower transfer arm 36 has one end 36a. As a result, the entire SCARA robot 33 is turned horizontally. As a result, the substrate W placed on the pick 21 attached to the other end 37 b of the upper transfer arm 37 is moved in the transfer chamber 11.
  • the turning axis specifically, the turning axis at one end 36 a of the lower transfer arm 36 is used as the substrate W placed on the pick 21.
  • Match the center of gravity Note that the center of gravity of the pivot axis and the substrate W at the one end 36 a of the lower transfer arm 36 is indicated by a center of gravity symbol 38.
  • the lower transfer arm 39 and the upper transfer arm 40 cooperate with each other to perform a horizontal turning operation, whereby the entire SCARA robot 34 is expanded and contracted horizontally, and only the lower transfer arm 39 has one end 39a. As a result, the entire SCARA robot 34 is turned horizontally. As a result, the substrate W placed on the pick 21 attached to the other end 40 b of the upper transfer arm 40 is moved in the transfer chamber 11.
  • the turning axis when turning horizontally as a whole, the turning axis, specifically, the turning axis at the one end 39a of the lower transfer arm 39 is made to coincide with the center of gravity of the substrate W placed on the pick 21.
  • the lower transfer arm 36, the lower transfer arm 39, the upper transfer arm 40, the pick 21 of the SCARA robot 34, the upper transfer arm 37, and the pick 21 of the SCARA robot 33 from the lower side.
  • the members are arranged apart from each other in the vertical direction so that they do not interfere with each other when they rotate horizontally. Accordingly, the first substrate transport surface 42 (shown by a thick line) in which the pick 21 of the SCARA robot 33 transports the substrate W and the second substrate transport surface 43 (indicated by a bold line in the figure) on which the pick 21 of the SCARA robot 34 transports the substrate W ( It is separated from the vertical direction).
  • Each processing chamber 12 is provided with a gate 44 (indicated by a one-dot chain line in the drawing) at a position corresponding to the first substrate transfer surface 42 or the second substrate transfer surface 43.
  • the lower transfer arm 36 and the lower transfer arm 39 are arranged so that the turning axis at one end 36a of the lower transfer arm 36 and the turning axis at one end 39a of the lower transfer arm 39 coincide. Are superimposed. Therefore, the turning axes of the SCARA robot 33 and SCARA robot 34 also coincide.
  • an observation device 42 for observing the surface state of the substrate W for example, a camera, is disposed immediately above the turning axes of the SCARA robots 33 and 34.
  • the elevator 41 delivers the substrate W between the SCARA robot 33 and the SCARA robot 34. For example, after the elevator 41 receives the substrate W from the SCARA robot 34, the elevator 41 raises the substrate W from the second substrate transfer surface 43 to the first substrate transfer surface 42, and passes the substrate to the SCARA robot 33. After receiving the substrate W from the SCARA robot 33, the substrate W is lowered from the first substrate transport surface 42 to the second substrate transport surface 43, and the substrate W is transferred to the SCARA robot 34.
  • the elevator 41 uses pusher pins or the like provided so as to be able to protrude from the elevator 41 for raising and lowering the substrate W.
  • 8A to 8D are diagrams for explaining a transfer sequence by the SCARA robot of FIGS. 7A and 7B.
  • the SCARA robot 33 transports the substrate W from one processing chamber 12 to another processing chamber 12.
  • the SCARA robot 33 causes the lower transfer arm 36 and the upper transfer arm 37 to cooperate with each other and rotate horizontally, thereby contracting horizontally and drawing the substrate W from one processing chamber 12 (not shown). Unloading is carried out along the middle arrow (FIG. 8A), and the unloaded substrate W is moved toward the base 35 so that the turning shaft 38 at one end 36a of the lower transfer arm 36 coincides with the center of gravity 38 of the substrate W (see FIG. 8). 8B).
  • the SCARA robot 33 turns only the lower transfer arm 36 horizontally around the turning shaft 38 at one end 36a, for example, turns 45 ° horizontally horizontally.
  • the substrate W together with the pick 21 is made to face another processing chamber 12 (not shown).
  • the rod 45 (see FIG. 7B) connecting the lower transfer arm 36 and the upper transfer arm 37 may interfere with the lower transfer arm 39 or the upper transfer arm 40 of the SCARA robot 34.
  • the SCARA robot 34 extends in accordance with the movement of the SCARA robot 33 along the white arrow in the figure, and moves the lower transfer arm 39 and the upper transfer arm 40 away from the rod 45 (FIG. 8C). ).
  • the SCARA robot 33 causes the lower transfer arm 36 and the upper transfer arm 37 to cooperate with each other to rotate horizontally, thereby extending horizontally along the arrow in the figure to extend the substrate W to the other processing chamber 12. (Fig. 8D).
  • the SCARA robot 34 While the SCARA robot 33 transports the substrate W from one processing chamber 12 to the other processing chamber 12, the SCARA robot 34 is configured so that the substrate W transported by the SCARA robot 34 and the substrate W transported by the SCARA robot 33 are in the vertical direction.
  • the substrate W is moved by rotating the lower transfer arm 39 and the upper transfer arm 40 horizontally so that they do not overlap when the SCARA robots 33 and 34 are viewed along.
  • the SCARA robot 34 moves the substrate W transported by the SCARA robot 34. Move away from the pivot axis 38. Thereby, it is possible to prevent the foreign matter peeled off from the substrate W transported by the SCARA robot 33 from dropping and adhering to the substrate W transported by the SCARA robot 34.
  • the SCARA robot 33 when the SCARA robot 33 swings horizontally, the SCARA robot 33 moves the center of gravity of the substrate W transported on the swivel shaft 38 at the end 36a of the lower transport arm 36. 38, and when the SCARA robot 34 rotates horizontally, the SCARA robot 34 matches the center of gravity of the substrate W to be transferred with the rotation axis at the end 39a of the lower transfer arm 39. Centrifugal force does not act on the substrate W. Thereby, it is possible to prevent the substrate W from being displaced when the SCARA robot 33 and the SCARA robot 34 are turned horizontally.
  • the SCARA robots 33 and 34 are stacked in the transfer chamber 11, so that the footprint of the transfer chamber 11 can be reduced.
  • the SCARA robot 34 is disposed so as to be sandwiched between the lower transfer arm 36 and the upper transfer arm 37 in the vertical direction.
  • the SCARA robot 33 and SCARA robot 34 are arranged in a different form.
  • 40 and the pick 21 of the SCARA robot 34 may be arranged in this order.
  • the members are arranged apart from each other in the vertical direction so that they do not interfere with each other when they rotate horizontally.
  • the upper transfer arm 37 of the SCARA robot 33 and the substrate W transferred by the SCARA robot 33 may interfere with the rod 46 connecting the lower transfer arm 39 and the upper transfer arm 40 of the SCARA robot 34.
  • the SCARA robot 34 extends in accordance with the movement of the SCARA robot 33 and moves the lower transfer arm 39 and the upper transfer arm 40 away from the rod 46.
  • the SCARA robot 33 is picked toward the substrate W transferred by the SCARA robot 34.
  • 21 and the upper transfer arm 37 may be peeled off and fall off.
  • the entire surface of the pick 21 is placed on the pick 21 of the SCARA robot 34 as shown in FIGS. 10A and 10B.
  • a cover 47 may be provided.
  • the number of SCARA robots to be stacked is not limited to two, and may be three or more.
  • SCARA robots 49, 50, and 51 are stacked on the base 48. May be. Also in this case, when each SCARA robot 49, 50, 51 rotates horizontally, the rotation axis 52 and the center of gravity 52 of the substrate W to be transported coincide with each other. Further, the turning axes 52 of the SCARA robots 49, 50, 51 coincide with each other.

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Abstract

A substrate processing device, which is capable of preventing a substrate from shifting when a transfer mechanism swivels horizontally, is provided. The substrate processing device (10) is provided with: a transfer chamber (11) having a SCARA robot (15) that freely extends, retracts and swivels horizontally; and five processing chambers (12) that are positioned around the transfer chamber (11). The SCARA robot (15) moves a substrate (W) horizontally and transfers said substrate (W) to each processing chamber (12) by retracting or extending and/or swiveling in the horizontal direction. When the SCARA robot (15) swivels horizontally, the SCARA robot (15) synchronizes the center of gravity (22) of the substrate (W) being transferred with the pivot (22) of the swivel operation.

Description

基板処理装置Substrate processing equipment
　本発明は、共通の真空搬送室に接続された複数の真空処理室へ基板を搬送する搬送機構を有する基板処理装置に関する。 The present invention relates to a substrate processing apparatus having a transfer mechanism for transferring a substrate to a plurality of vacuum processing chambers connected to a common vacuum transfer chamber.
　半導体デバイスの作成に用いられる基板には、より沢山の半導体デバイスが一括して作成できるように大きな処理面（半導体デバイスが形成される面）を有することが要望されている。現在では、処理面の拡大、すなわち、基板の大口径化に対応できるような基板処理装置の検討がされている。このような基板を処理するための一般的な基板処理装置として、真空環境下で基板を処理する真空処理室と、各真空処理室を接続し且つ真空環境下での基板の搬送を実現する搬送機構を有する真空搬送室とを備える基板処理装置が知られている（例えば、特許文献１参照。）。 It is desired that a substrate used for the production of a semiconductor device has a large processing surface (surface on which a semiconductor device is formed) so that a larger number of semiconductor devices can be produced collectively. At present, a substrate processing apparatus that can cope with the expansion of the processing surface, that is, the increase in the diameter of the substrate is being studied. As a general substrate processing apparatus for processing such a substrate, a vacuum processing chamber for processing a substrate in a vacuum environment, and a transfer that connects the vacuum processing chambers and realizes transfer of the substrate in a vacuum environment. A substrate processing apparatus including a vacuum transfer chamber having a mechanism is known (for example, see Patent Document 1).
　このような搬送機構としては基板を保持した状態で水平方向の搬送が可能なスカラ（ＳＣＡＲＡ）ロボット（以下、「スカラロボット」という。）が一般的である。ＳＣＡＲＡとはＳｅｌｅｃｔｉｖｅ　Ｃｏｍｐｌｉａｎｃｅ　Ａｓｓｅｍｂｌｙ　Ｒｏｂｏｔ　Ａｒｍの略称である。スカラロボットは、一般的に、複数の搬送アームが互いの端部においてリンク機構等駆動力を伝達するように接続されることで旋回動作を可能とした搬送アームを積み重ねた構成を有する。また、スカラロボットは、最下位の搬送アームの端部と直結した上下旋回駆動機構により、鉛直方向への移動及び旋回駆動軸（旋回軸）回りの回転動作も可能である。最上位の搬送アームの端部は、基板を載置するための、例えばフォーク状のピックを備えている。さらに、スカラロボットでは、１つの搬送アームがその端部において他の搬送アームに対して水平に旋回動作することによって複数の搬送アームをまとめて畳み込む又は伸展すること（伸縮動作）ができる。このようにして、スカラロボットは、各搬送アームの個々の伸縮、旋回動作によって、基板を載置するピックを所望の位置に水平に移動することができ、結果としてスカラロボットは基板を搬送することができる。 As such a transport mechanism, a SCARA robot (hereinafter referred to as “SCARA robot”) capable of transporting in the horizontal direction while holding a substrate is generally used. SCARA is an abbreviation for Selective Compliance Assembly Robot Arm. In general, a SCARA robot has a configuration in which a plurality of transfer arms are connected to each other so as to transmit a driving force such as a link mechanism at the end portions of the SCARA robots, thereby stacking transfer arms that enable a turning operation. Further, the SCARA robot can move in the vertical direction and rotate around the turning drive shaft (turning axis) by the up-and-down turning drive mechanism directly connected to the end of the lowest transfer arm. The end of the uppermost transfer arm is provided with, for example, a fork-shaped pick for placing the substrate. Further, in the SCARA robot, one transport arm can horizontally fold or extend (extend / contract) a plurality of transport arms by swinging horizontally with respect to another transport arm at the end thereof. In this way, the SCARA robot can horizontally move the pick on which the substrate is placed to a desired position by the individual expansion and contraction and turning operations of each transfer arm. As a result, the SCARA robot can transfer the substrate. Can do.
特開２００４−６６６５号公報JP 2004-6665 A
　しかしながら、上述した基板の大口径化は、基板の質量の増加を伴うため、スカラロボットが基板を搬送する際に当該基板に作用する慣性力、特にスカラロボットが水平に旋回動作する際に基板に作用する遠心力が増す。基板がピック上に単に載置されている場合において基板とピックとの接触面に生ずる摩擦力よりも遠心力が上回る時に、基板がピックに対して移動する、つまり位置ずれが生ずる。 However, since the above-mentioned increase in the substrate diameter is accompanied by an increase in the mass of the substrate, the inertial force acting on the substrate when the SCARA robot transports the substrate, particularly when the SCARA robot rotates horizontally, The acting centrifugal force increases. When the substrate is simply placed on the pick, when the centrifugal force exceeds the frictional force generated on the contact surface between the substrate and the pick, the substrate moves relative to the pick, that is, misalignment occurs.
　通常、基板の位置は基板処理装置が備える位置合わせ機構（オリエンタ）によって搬送室に搬入される前に、基板処理のための最適な位置に調整されるため、搬送室においてピックに対する基板の位置ずれが生ずると、処理室において基板処理のための最適な位置が保たれないまま基板に処理が施される。 Usually, the position of the substrate is adjusted to an optimum position for substrate processing before being transferred into the transfer chamber by an alignment mechanism (orienter) provided in the substrate processing apparatus. If this occurs, the substrate is processed without maintaining the optimum position for substrate processing in the processing chamber.
　本発明の目的は、搬送機構が水平に旋回する際に当該搬送機構によって搬送される基板に遠心力を生じさせないように搬送機構を制御することで、基板の位置ずれを防止することができる基板処理装置を提供することにある。 An object of the present invention is to prevent a positional deviation of a substrate by controlling the transport mechanism so that a centrifugal force is not generated on the substrate transported by the transport mechanism when the transport mechanism rotates horizontally. It is to provide a processing apparatus.
　上記目的を達成するために、本発明によれば、水平に伸縮旋回動作可能な搬送機構を有する搬送室と、該搬送室の周りに配置された複数の処理室とを備える基板処理装置において、前記搬送機構は水平方向に伸縮動作し、及び／又は旋回動作することで基板を水平に移動させて各前記処理室へ搬送し、前記搬送機構が水平に旋回動作する際、前記搬送機構は前記旋回動作の旋回軸を前記搬送される基板の重心と一致させることを特徴とする基板処理装置が提供される。 To achieve the above object, according to the present invention, in a substrate processing apparatus comprising a transfer chamber having a transfer mechanism capable of horizontally extending and retracting, and a plurality of processing chambers arranged around the transfer chamber, The transport mechanism expands and contracts in the horizontal direction and / or swings to move the substrate horizontally to transport to each processing chamber, and when the transport mechanism swings horizontally, the transport mechanism There is provided a substrate processing apparatus characterized in that a turning axis of a turning operation is made coincident with a center of gravity of the substrate to be transported.
　本発明において、前記搬送機構は積み重ねられた複数の搬送アーム部と、最上位の前記搬送アーム部の端部に取り付けられた載置部とを有し、前記載置部は前記基板を載置し、一の前記搬送アーム部は、端部において他の前記搬送アーム部と接続されて他の前記搬送アーム部に対して水平に旋回動作することによって前記搬送機構を伸縮させ、最下位の前記腕部は、端部における旋回軸を中心に水平に旋回動作することによって前記搬送機構を水平に旋回動作させ、前記搬送機構が水平に旋回動作する際、前記搬送機構は最下位の前記搬送アーム部の端部における旋回軸を前記搬送される基板の重心と一致させることが好ましい。 In the present invention, the transport mechanism includes a plurality of stacked transport arm portions and a placement portion attached to an end of the uppermost transport arm portion, and the placement portion places the substrate. The one transfer arm unit is connected to the other transfer arm unit at the end and horizontally pivots with respect to the other transfer arm unit to expand and contract the transfer mechanism, and The arm portion pivots horizontally around the pivot axis at the end portion to cause the transport mechanism to pivot horizontally, and when the transport mechanism pivots horizontally, the transport mechanism is the lowest transport arm. It is preferable that the swivel axis at the end of the part coincides with the center of gravity of the substrate to be transported.
　本発明において、前記基板を一の前記処理室から他の前記処理室へ搬送する際、前記搬送機構は、水平に緊縮して前記基板を一の前記処理室から搬出し、前記基板を水平に移動させて前記旋回軸と前記基板の重心と一致させ、前記基板とともに前記旋回軸を中心として水平に旋回動作して前記基板を他の前記処理室へ正対させ、さらに水平に伸長して前記基板を他の前記処理室へ搬入することが好ましい。 In the present invention, when the substrate is transported from one processing chamber to another processing chamber, the transport mechanism is horizontally contracted to unload the substrate from the one processing chamber and to horizontally support the substrate. The swivel axis is moved to coincide with the center of gravity of the substrate, and the substrate is swung horizontally around the swivel axis together with the substrate so that the substrate is directly opposed to the other processing chamber and further horizontally expanded to It is preferable to carry the substrate into another processing chamber.
　本発明において、複数の前記搬送機構をさらに備え、前記搬送室において複数の前記搬送機構は積み重ねられ、一の前記搬送機構が前記基板を搬送する第１の水平移動面と、他の前記搬送機構が前記基板を搬送する第２の水平移動面とは鉛直方向に関して離間することが好ましい。 In the present invention, the apparatus further includes a plurality of transfer mechanisms, wherein the plurality of transfer mechanisms are stacked in the transfer chamber, and the one transfer mechanism transfers the substrate, the first horizontal moving surface, and the other transfer mechanism. Is preferably separated from the second horizontal moving surface for transporting the substrate in the vertical direction.
　本発明において、前記複数の搬送機構の旋回軸は一致し、前記旋回軸の直上に前記基板の表面状態を観測する観測装置が配されることが好ましい。 In the present invention, it is preferable that the swivel axes of the plurality of transport mechanisms coincide with each other, and an observation device for observing the surface state of the substrate is disposed immediately above the swivel axes.
　本発明において、一の前記搬送機構が当該一の前記搬送機構の旋回軸と当該一の前記搬送機構が搬送する一の前記基板の重心とを一致させて旋回動作する際、他の前記搬送機構は当該他の前記搬送機構が搬送する他の前記基板を、鉛直方向に沿って前記複数の搬送機構を眺めた場合、旋回動作する一の前記基板に重ね合わせないことが好ましい。 In the present invention, when the one transport mechanism performs a swivel operation with the swivel axis of the one transport mechanism and the center of gravity of the one substrate transported by the one transport mechanism, the other transport mechanism Preferably, the other substrate transported by the other transport mechanism is not superposed on the one substrate that performs a turning operation when the plurality of transport mechanisms are viewed along the vertical direction.
　本発明において、前記基板は直径が４５０ｍｍの半導体ウエハであることが好ましい。 In the present invention, the substrate is preferably a semiconductor wafer having a diameter of 450 mm.
　本発明によれば、水平方向の伸縮旋回動作によって基板を水平に移動させて各処理室へ搬送する搬送機構が水平に旋回動作する際に、搬送機構は旋回動作の旋回軸と搬送される基板の重心とを一致させるので、当該搬送される基板には遠心力が生じない。これにより、搬送機構が水平に旋回する際の基板の位置ずれを防止することができる。 According to the present invention, when the transport mechanism that horizontally moves the substrate by the telescopic swivel operation in the horizontal direction and transports the substrate to each processing chamber performs the swivel operation horizontally, the transport mechanism is the substrate to be transported with the swivel axis of the swivel operation. Therefore, no centrifugal force is generated on the conveyed substrate. Thereby, it is possible to prevent the positional deviation of the substrate when the transport mechanism turns horizontally.
本発明の第１の実施の形態に係る基板処理装置の構成を概略的に示す平面図である。1 is a plan view schematically showing a configuration of a substrate processing apparatus according to a first embodiment of the present invention. 図１におけるスカラロボットの構成を示す平面図である。It is a top view which shows the structure of the SCARA robot in FIG. 図２のスカラロボットによる搬送シーケンスを説明するための図である。It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. 図２のスカラロボットによる搬送シーケンスを説明するための図である。It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. 図２のスカラロボットによる搬送シーケンスを説明するための図である。It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. 図２のスカラロボットによる搬送シーケンスを説明するための図である。It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. 図２のスカラロボットの第１の変形例の構成を示す平面図である。It is a top view which shows the structure of the 1st modification of the SCARA robot of FIG. 図２のスカラロボットの第２の変形例の構成を示す平面図である。It is a top view which shows the structure of the 2nd modification of the SCARA robot of FIG. 本発明の第２の実施の形態に係る基板処理装置の構成を概略的に示す平面図である。It is a top view which shows roughly the structure of the substrate processing apparatus which concerns on the 2nd Embodiment of this invention. 図６における２つのスカラロボットの構成を示す平面図である。It is a top view which shows the structure of the two SCARA robots in FIG. 図６における２つのスカラロボットの構成を示す側面図である。It is a side view which shows the structure of the two SCARA robots in FIG. 図７のスカラロボットによる搬送シーケンスを説明するための図である。It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. 図７のスカラロボットによる搬送シーケンスを説明するための図である。It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. 図７のスカラロボットによる搬送シーケンスを説明するための図である。It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. 図７のスカラロボットによる搬送シーケンスを説明するための図である。It is a figure for demonstrating the conveyance sequence by the SCARA robot of FIG. 図７の２つのスカラロボットの第１の変形例の構成を示す平面図である。It is a top view which shows the structure of the 1st modification of the two SCARA robots of FIG. 図７の２つのスカラロボットの第１の変形例の構成を示す側面図である。It is a side view which shows the structure of the 1st modification of the two SCARA robots of FIG. 図７の２つのスカラロボットの第２の変形例の構成を示す側面図である。It is a side view which shows the structure of the 2nd modification of the two SCARA robots of FIG. 図７の２つのスカラロボットの第２の変形例の構成において、図１０Ａにおけるカバーの平面図である。FIG. 10B is a plan view of the cover in FIG. 10A in the configuration of the second modification of the two SCARA robots in FIG. 7. 図７の２つのスカラロボットの第３の変形例の構成を示す平面図である。It is a top view which shows the structure of the 3rd modification of the two SCARA robots of FIG. 図７の２つのスカラロボットの第３の変形例の構成を示す側面図である。It is a side view which shows the structure of the 3rd modification of the two SCARA robots of FIG. 図７の２つのスカラロボットの第４の変形例の構成を示す平面図である。It is a top view which shows the structure of the 4th modification of the two SCARA robots of FIG.
　以下、本発明の実施の形態について図面を参照しながら説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
　まず、本発明の第１の実施の形態に係る基板処理装置について説明する。 First, the substrate processing apparatus according to the first embodiment of the present invention will be described.
　図１は、本実施の形態に係る基板処理装置の構成を概略的に示す平面図である。なお、基板処理装置１０の搬送室１１は説明のために蓋が取り外された状態で示される。 FIG. 1 is a plan view schematically showing a configuration of a substrate processing apparatus according to the present embodiment. Note that the transfer chamber 11 of the substrate processing apparatus 10 is shown with a lid removed for the sake of explanation.
　図１において、基板処理装置１０は、平面視八角形を呈する搬送室１１と、該搬送室１１の周りに放射状に配置されて該搬送室１１に接続される５つの処理室１２と、間に２つのロードロック室１３を介して搬送室１１と接続されるローダーモジュール１４とを備える。 In FIG. 1, a substrate processing apparatus 10 includes a transfer chamber 11 having an octagonal shape in plan view, and five processing chambers 12 arranged radially around the transfer chamber 11 and connected to the transfer chamber 11. A loader module 14 connected to the transfer chamber 11 through two load lock chambers 13 is provided.
　搬送室１１は内部が真空に保たれ、例えば、直径が４５０ｍｍの基板Ｗ、例えば、半導体ウエハＷを搬送するスカラロボット１５（搬送機構）を搭載し、各処理室１２は内部が真空に保たれ、基板Ｗを内部に収容して該基板Ｗに所望のプラズマ処理、例えば、プラズマエッチング処理を施す。 The inside of the transfer chamber 11 is kept in a vacuum. For example, a SCARA robot 15 (transfer mechanism) that carries a substrate W having a diameter of 450 mm, for example, a semiconductor wafer W is mounted, and the inside of each processing chamber 12 is kept in a vacuum. Then, the substrate W is accommodated inside and a desired plasma process, for example, a plasma etching process is performed on the substrate W.
　ローダーモジュール１４は搬送室１１の反対側において３つのロードポート１６を有し、さらに、位置合わせ機構１７を有する。各ロードポート１６には所定枚数の基板を収容するキャリア、例えば、フープ（ＦＯＵＰ）（図示しない）が載置され、ローダーモジュール１４に内蔵される搬送アーム（図示しない）は、各フープ、位置合わせ機構１７及びロードロック室１３の間において基板を搬送する。ローダーモジュール１４内は大気圧に保たれる。位置合わせ機構１７は搬送アームによって搬入された基板の位置を調整する。ロードロック室１３は内部を真空及び大気圧に切り換え可能に構成され、ローダーモジュール１４と連通する場合には、ロードロック室１３の内部は大気圧となり、搬送室１１と連通する場合には、ロードロック室１３の内部は真空となる。なお、図示しないが、各ユニット（搬送室１１、処理室１２、ロードロック室１３、ローダーモジュール１４、ロードポート１６及び位置合わせ機構１７）の間にはゲートバルブが配置され、該ゲートバルブは必要に応じて開閉動作を行う。 The loader module 14 has three load ports 16 on the opposite side of the transfer chamber 11, and further has an alignment mechanism 17. Each load port 16 is loaded with a carrier for storing a predetermined number of substrates, for example, a FOUP (FOUP) (not shown), and a transfer arm (not shown) built in the loader module 14 is provided for each hoop and alignment. The substrate is transferred between the mechanism 17 and the load lock chamber 13. The loader module 14 is maintained at atmospheric pressure. The alignment mechanism 17 adjusts the position of the substrate carried in by the transfer arm. The load lock chamber 13 is configured to be switchable between a vacuum and an atmospheric pressure. When the load lock chamber 13 communicates with the loader module 14, the load lock chamber 13 has an atmospheric pressure. When the load lock chamber 13 communicates with the transfer chamber 11, the load lock chamber 13 is loaded. The inside of the lock chamber 13 is evacuated. Although not shown, a gate valve is disposed between each unit (the transfer chamber 11, the processing chamber 12, the load lock chamber 13, the loader module 14, the load port 16, and the alignment mechanism 17), and the gate valve is necessary. Open and close according to
　図２は、図１におけるスカラロボットの構成を示す平面図である。 FIG. 2 is a plan view showing the configuration of the SCARA robot in FIG.
　図２において、基台１８に配置されたスカラロボット１５は、下側搬送アーム１９（最下位の腕部）と、上側搬送アーム２０（腕部）と、フォーク状のピック２１（載置部）とを有する。スカラロボット１５では、下方から下側搬送アーム１９、上側搬送アーム２０及びピック２１の順で重ねるように配置され、下側搬送アーム１９の一端１９ａは基台１８へ水平に旋回動作を可能に接続され、上側搬送アーム２０の一端２０ａは下側搬送アーム１９の他端１９ｂへ水平に旋回動作が可能に接続され、ピック２１は上側搬送アーム２０の他端２０ｂへ取り付けられる。ピック２１は基板Ｗ（図中破線で示す）を載置する。 In FIG. 2, the SCARA robot 15 arranged on the base 18 includes a lower transfer arm 19 (lowest arm portion), an upper transfer arm 20 (arm portion), and a fork-shaped pick 21 (mounting portion). And have. In the SCARA robot 15, the lower transfer arm 19, the upper transfer arm 20, and the pick 21 are arranged in this order from the lower side, and one end 19 a of the lower transfer arm 19 is connected to the base 18 so as to be able to turn horizontally. Then, one end 20 a of the upper transfer arm 20 is connected to the other end 19 b of the lower transfer arm 19 so as to be able to turn horizontally, and the pick 21 is attached to the other end 20 b of the upper transfer arm 20. The pick 21 places a substrate W (indicated by a broken line in the figure).
　スカラロボット１５では、基台１８に対して下側搬送アーム１９が一端１９ａを中心に水平に旋回すると同時に、下側搬送アーム１９に対して上側搬送アーム２０が一端２０ａを中心に水平に旋回動作することにより、スカラロボット１５全体を図中矢印に沿って水平に伸縮動作可能とする。また、下側搬送アーム１９のみが一端１９ａを中心に水平に旋回することにより、スカラロボット１５全体を水平に旋回動作させる。これにより、上側搬送アーム２０の他端２０ｂへ取り付けられたピック２１に載置された基板Ｗを搬送室１１内において移動させる。 In the SCARA robot 15, the lower transfer arm 19 pivots horizontally around the one end 19a with respect to the base 18, and at the same time, the upper transfer arm 20 pivots horizontally around the one end 20a with respect to the lower transfer arm 19. By doing so, the entire SCARA robot 15 can be expanded and contracted horizontally along the arrow in the figure. Further, only the lower transfer arm 19 turns horizontally around the one end 19a, thereby turning the entire SCARA robot 15 horizontally. Accordingly, the substrate W placed on the pick 21 attached to the other end 20 b of the upper transfer arm 20 is moved in the transfer chamber 11.
　本実施の形態におけるスカラロボット１５は、全体として水平に旋回動作する際、旋回軸、具体的には下側搬送アーム１９の一端１９ａにおける旋回軸を、ピック２１に載置された基板Ｗの重心と一致させる。なお、図中において、下側搬送アーム１９の一端１９ａにおける旋回軸及び基板Ｗの重心は重心記号２２で示される。 When the SCARA robot 15 according to the present embodiment rotates horizontally as a whole, the center of gravity of the substrate W placed on the pick 21 is set to the rotation axis, specifically, the rotation axis at the one end 19a of the lower transfer arm 19. To match. In the drawing, the center of gravity of the pivot axis and the substrate W at the one end 19 a of the lower transfer arm 19 is indicated by a barycenter symbol 22.
　図３Ａ乃至図３Ｄは、図２のスカラロボットによる搬送シーケンスを説明するための図である。このシーケンスでは、スカラロボット１５が基板Ｗを一の処理室１２から他の処理室１２へ搬送する。 3A to 3D are diagrams for explaining a transfer sequence by the SCARA robot of FIG. In this sequence, the SCARA robot 15 transports the substrate W from one processing chamber 12 to another processing chamber 12.
　まず、スカラロボット１５は、基台１８に対して下側搬送アーム１９を一端１９ａを中心に水平に旋回動作させると同時に、下側搬送アーム１９に対して上側搬送アーム２０を一端２０ａを中心に水平に旋回動作させることにより、水平に緊縮して一の処理室１２（図示しない）から基板Ｗを図中矢印に沿って搬出し（図３Ａ）、搬出された基板Ｗを基台１８へ向けて移動させて下側搬送アーム１９の一端１９ａにおける旋回軸２２を基板Ｗの重心２２と一致させる（図３Ｂ）。 First, the SCARA robot 15 rotates the lower transfer arm 19 horizontally with respect to the base 18 around one end 19a, and at the same time, the upper transfer arm 20 with respect to the lower transfer arm 19 around the one end 20a. By horizontally swiveling, the substrate W is contracted horizontally and unloaded from one processing chamber 12 (not shown) along the arrow in the drawing (FIG. 3A), and the unloaded substrate W is directed to the base 18. The swivel axis 22 at one end 19a of the lower transfer arm 19 is made to coincide with the center of gravity 22 of the substrate W (FIG. 3B).
　次いで、スカラロボット１５は、下側搬送アーム１９のみを一端１９ａにおける旋回軸２２を中心に水平に旋回動作させる、例えば、時計回りに水平に９０°だけ旋回させる。これにより、ピック２１とともに基板Ｗを他の処理室１２（図示しない）へ正対させる（図３Ｃ）。 Next, the SCARA robot 15 turns only the lower transfer arm 19 horizontally around the turning shaft 22 at one end 19a, for example, turns 90 ° horizontally horizontally. As a result, the substrate W together with the pick 21 is made to face another processing chamber 12 (not shown) (FIG. 3C).
　次いで、スカラロボット１５は、基台１８に対して下側搬送アーム１９を、一端１９ａを中心に水平に旋回動作させると同時に、下側搬送アーム１９に対して上側搬送アーム２０を、一端２０ａを中心に水平に旋回動作させることにより、図中矢印に沿って水平に伸展して基板Ｗを他の処理室１２へ搬入する（図３Ｄ）。 Next, the SCARA robot 15 swings the lower transfer arm 19 horizontally with respect to the base 18 around the one end 19a, and at the same time, the upper transfer arm 20 with respect to the lower transfer arm 19 and the one end 20a. By rotating horizontally around the center, the substrate W is horizontally extended along the arrow in the figure, and the substrate W is carried into another processing chamber 12 (FIG. 3D).
　本実施の形態に係る基板処理装置１０によれば、積み重ねられた下側搬送アーム１９、上側搬送アーム２０と、上側搬送アーム２０の他端２０ｂに取り付けられたピック２１とを有するスカラロボット１５が水平に旋回動作する際、スカラロボット１５は下側搬送アーム１９の端部１９ａにおける旋回軸２２を搬送される基板Ｗの重心２２と一致させるので、当該搬送される基板Ｗには遠心力が作用しない。これにより、スカラロボット１５が水平に旋回動作する際の基板Ｗの位置ずれを防止することができる。 According to the substrate processing apparatus 10 according to the present embodiment, the SCARA robot 15 having the stacked lower transfer arm 19, the upper transfer arm 20, and the pick 21 attached to the other end 20b of the upper transfer arm 20 is provided. When horizontally turning, the SCARA robot 15 aligns the turning shaft 22 at the end 19a of the lower transfer arm 19 with the center of gravity 22 of the substrate W to be transferred, so that centrifugal force acts on the substrate W to be transferred. do not do. Thereby, the position shift of the board | substrate W at the time of the SCARA robot 15 turning horizontally can be prevented.
　上述した基板処理装置１０におけるスカラロボット１５は、２つの搬送アームを積み重ねたものに限られず、例えば、図４に示すように、下側搬送アーム２３と、中間搬送アーム２４と、上側搬送アーム２５と、ピック２１とを順に重ねるスカラロボット２６を代わりに用いてもよい。このスカラロボット２６では、下側搬送アーム２３の一端２３ａは基台１８へ水平に旋回動作が可能に接続され、中間搬送アーム２４の一端２４ａは下側搬送アーム２３の他端２３ｂへ水平に旋回動作が可能に接続され、上側搬送アーム２５の一端２５ａは中間搬送アーム２４の他端２４ｂへ水平に旋回動作可能に接続され、ピック２１は上側搬送アーム２５の他端２５ｂへ取り付けられる。 The SCARA robot 15 in the substrate processing apparatus 10 described above is not limited to a stack of two transfer arms. For example, as shown in FIG. 4, the lower transfer arm 23, the intermediate transfer arm 24, and the upper transfer arm 25. Alternatively, a SCARA robot 26 that sequentially overlaps the pick 21 may be used. In this SCARA robot 26, one end 23a of the lower transfer arm 23 is connected to the base 18 so as to be able to turn horizontally, and one end 24a of the intermediate transfer arm 24 is turned horizontally to the other end 23b of the lower transfer arm 23. The upper transfer arm 25 is connected to the other end 24b of the intermediate transfer arm 24 so as to be horizontally pivotable. The pick 21 is attached to the other end 25b of the upper transfer arm 25.
　スカラロボット２６では、下側搬送アーム２３、中間搬送アーム２４及び上側搬送アーム２５が互いに協働して水平に旋回動作することにより、スカラロボット２６全体を水平に伸縮させ、また、下側搬送アーム２３のみが一端２３ａを中心に水平に旋回動作することにより、スカラロボット２６全体を水平に旋回動作させる。 In the SCARA robot 26, the lower transfer arm 23, the intermediate transfer arm 24, and the upper transfer arm 25 cooperate with each other to rotate horizontally, thereby expanding and contracting the entire SCARA robot 26 horizontally. Only the robot 23 pivots horizontally around the one end 23a, so that the entire SCARA robot 26 pivots horizontally.
　スカラロボット２６でも、全体として水平に旋回動作する際には、図４に示すように、旋回軸、具体的には下側搬送アーム２３の一端２３ａにおける旋回軸を、ピック２１に載置された基板Ｗの重心と一致させる。なお、下側搬送アーム２３の一端２３ａにおける旋回軸及び基板Ｗの重心は重心記号２２で示される。 In the SCARA robot 26 as well, when turning as a whole as a whole, the turning axis, specifically, the turning axis at one end 23a of the lower transfer arm 23, as shown in FIG. Match the center of gravity of the substrate W. Note that the center of gravity of the turning shaft and the substrate W at the one end 23 a of the lower transfer arm 23 is indicated by a center of gravity symbol 22.
　また、搬送機構としてスカラロボットを用いる必要はなく、フロッグレッグ型のロボット（以下、「フロッグレッグロボット」という。）を用いてもよい。図５に示すフロッグレッグロボット２７は水平に回転動作が可能な基台２８と、伸縮自在の一対の搬送アーム２９，３０と、ピック２１とを有し、一対の搬送アーム２９，３０はそれぞれ一端２９ａ，３０ａにおいて基台２８に接続され、ピック２１は一対の搬送アーム２９，３０の他端２９ｂ，３０ｂに取り付けられる。 Further, it is not necessary to use a SCARA robot as a transport mechanism, and a frog-leg type robot (hereinafter referred to as “frog-leg robot”) may be used. The frog-leg robot 27 shown in FIG. 5 has a base 28 that can be rotated horizontally, a pair of telescopic transport arms 29 and 30, and a pick 21. Each of the pair of transport arms 29 and 30 has one end. 29a, 30a is connected to the base 28, and the pick 21 is attached to the other ends 29b, 30b of the pair of transfer arms 29, 30.
　フロッグレッグロボット２７では、一対の搬送アーム２９，３０が互いに協働して伸縮することにより、フロッグレッグロボット２７全体を水平に伸縮させ、基台２８が回転することにより、フロッグレッグロボット２７全体を水平に旋回動作させる。 In the frog-leg robot 27, the pair of transfer arms 29, 30 extend and contract in cooperation with each other, so that the entire frog-leg robot 27 extends and contracts horizontally, and the base 28 rotates, so that the entire frog-leg robot 27 is expanded. Rotate horizontally.
　フロッグレッグロボット２７では、全体として水平に旋回動作する際、図５に示すように、旋回軸、具体的には基台２８の回転軸を、ピック２１に載置された基板Ｗの重心と一致させる。なお、基台２８の回転軸及び基板Ｗの重心は重心記号３１で示される。 In the frog-leg robot 27, as shown in FIG. 5, when turning as a whole, the turning axis, specifically, the rotation axis of the base 28 is coincident with the center of gravity of the substrate W placed on the pick 21. Let The rotational axis of the base 28 and the center of gravity of the substrate W are indicated by a center of gravity symbol 31.
　次に、本発明の第２の実施の形態に係る基板処理装置を詳述する。 Next, the substrate processing apparatus according to the second embodiment of the present invention will be described in detail.
　図６は、本実施の形態に係る基板処理装置の構成を概略的に示す平面図である。 FIG. 6 is a plan view schematically showing the configuration of the substrate processing apparatus according to the present embodiment.
　本実施の形態は、その構成、作用が上述した第１の実施の形態と基本的に同じであるので、重複した構成、作用については説明を省略し、以下に異なる構成、作用についての説明を行う。 Since the configuration and operation of this embodiment are basically the same as those of the first embodiment described above, the description of the overlapping configuration and operation will be omitted, and the description of the different configuration and operation will be described below. Do.
　図６において、基板処理装置３２は、搬送室１１に内蔵される２つのスカラロボット３３，３４と、基板エレベータ４１とを備える。スカラロボット３３，３４は互いに積み重ねられて配置される。 6, the substrate processing apparatus 32 includes two SCARA robots 33 and 34 built in the transfer chamber 11 and a substrate elevator 41. The SCARA robots 33 and 34 are stacked on each other.
　図７Ａ及び図７Ｂは、図６における２つのスカラロボットの構成を示す図であり、図７Ａは平面図であり、図７Ｂは側面図である。 7A and 7B are diagrams showing the configuration of the two SCARA robots in FIG. 6, FIG. 7A is a plan view, and FIG. 7B is a side view.
　図７Ａ及び図７Ｂにおいて、スカラロボット３３，３４はそれぞれスカラロボット１５と同様の構成を有し、同じ基台３５に配置される。 7A and 7B, the SCARA robots 33 and 34 have the same configuration as the SCARA robot 15 and are arranged on the same base 35.
　スカラロボット３３では、下側搬送アーム３６及び上側搬送アーム３７が互いに協働して水平に旋回動作することにより、スカラロボット３３全体を水平に伸縮させ、また、下側搬送アーム３６のみが一端３６ａを中心に水平に旋回動作することにより、スカラロボット３３全体を水平に旋回動作させる。これにより、上側搬送アーム３７の他端３７ｂへ取り付けられたピック２１に載置された基板Ｗを搬送室１１内において移動させる。 In the SCARA robot 33, the lower transfer arm 36 and the upper transfer arm 37 cooperate with each other to rotate horizontally, thereby expanding and contracting the entire SCARA robot 33 horizontally, and only the lower transfer arm 36 has one end 36a. As a result, the entire SCARA robot 33 is turned horizontally. As a result, the substrate W placed on the pick 21 attached to the other end 37 b of the upper transfer arm 37 is moved in the transfer chamber 11.
　スカラロボット３３でも、全体として水平に旋回動作する際、図７Ａに示すように、旋回軸、具体的には下側搬送アーム３６の一端３６ａにおける旋回軸を、ピック２１に載置された基板Ｗの重心と一致させる。なお、下側搬送アーム３６の一端３６ａにおける旋回軸及び基板Ｗの重心は重心記号３８で示される。 In the SCARA robot 33 as a whole, when turning horizontally as shown in FIG. 7A, the turning axis, specifically, the turning axis at one end 36 a of the lower transfer arm 36 is used as the substrate W placed on the pick 21. Match the center of gravity. Note that the center of gravity of the pivot axis and the substrate W at the one end 36 a of the lower transfer arm 36 is indicated by a center of gravity symbol 38.
　スカラロボット３４では、下側搬送アーム３９及び上側搬送アーム４０が互いに協働して水平に旋回動作することにより、スカラロボット３４全体を水平に伸縮させ、また、下側搬送アーム３９のみが一端３９ａを中心に水平に旋回動作することにより、スカラロボット３４全体を水平に旋回動作させる。これにより、上側搬送アーム４０の他端４０ｂへ取り付けられたピック２１に載置された基板Ｗを搬送室１１内において移動させる。 In the SCARA robot 34, the lower transfer arm 39 and the upper transfer arm 40 cooperate with each other to perform a horizontal turning operation, whereby the entire SCARA robot 34 is expanded and contracted horizontally, and only the lower transfer arm 39 has one end 39a. As a result, the entire SCARA robot 34 is turned horizontally. As a result, the substrate W placed on the pick 21 attached to the other end 40 b of the upper transfer arm 40 is moved in the transfer chamber 11.
　スカラロボット３４でも、全体として水平に旋回動作する際、旋回軸、具体的には下側搬送アーム３９の一端３９ａにおける旋回軸を、ピック２１に載置された基板Ｗの重心と一致させる。 In the SCARA robot 34 as well, when turning horizontally as a whole, the turning axis, specifically, the turning axis at the one end 39a of the lower transfer arm 39 is made to coincide with the center of gravity of the substrate W placed on the pick 21.
　スカラロボット３３，３４では、鉛直方向に関し、下方から下側搬送アーム３６、下側搬送アーム３９、上側搬送アーム４０、スカラロボット３４のピック２１、上側搬送アーム３７及びスカラロボット３３のピック２１がこの順で配置され、各部材が水平に旋回動作する際に互いに干渉しないように、鉛直方向に関して互いに離間して配置される。したがって、スカラロボット３３のピック２１が基板Ｗを搬送する第１の基板搬送面４２（図中太線で示す）と、スカラロボット３４のピック２１が基板Ｗを搬送する第２の基板搬送面４３（図中太線で示す）とは鉛直方向に関して離間する。これにより、スカラロボット３３が搬送する基板Ｗと、スカラロボット３４が搬送する基板Ｗとが衝突することがない。なお、処理室１２の各々には第１の基板搬送面４２又は第２の基板搬送面４３に対応する位置にゲート４４（図中一点鎖線で示す）が設けられる。 In the SCARA robots 33 and 34, with respect to the vertical direction, the lower transfer arm 36, the lower transfer arm 39, the upper transfer arm 40, the pick 21 of the SCARA robot 34, the upper transfer arm 37, and the pick 21 of the SCARA robot 33 from the lower side. Arranged in order, the members are arranged apart from each other in the vertical direction so that they do not interfere with each other when they rotate horizontally. Accordingly, the first substrate transport surface 42 (shown by a thick line) in which the pick 21 of the SCARA robot 33 transports the substrate W and the second substrate transport surface 43 (indicated by a bold line in the figure) on which the pick 21 of the SCARA robot 34 transports the substrate W ( It is separated from the vertical direction). Thereby, the board | substrate W which the SCARA robot 33 conveys, and the board | substrate W which the SCARA robot 34 conveys do not collide. Each processing chamber 12 is provided with a gate 44 (indicated by a one-dot chain line in the drawing) at a position corresponding to the first substrate transfer surface 42 or the second substrate transfer surface 43.
　また、スカラロボット３３，３４では、下側搬送アーム３６の一端３６ａにおける旋回軸と下側搬送アーム３９の一端３９ａにおける旋回軸とが一致するように、下側搬送アーム３６及び下側搬送アーム３９が重ねられる。したがって、スカラロボット３３及びスカラロボット３４の旋回軸も一致する。そして、スカラロボット３３，３４の旋回軸の直上に基板Ｗの表面状態を観測する観測装置４２、例えば、カメラが配置される。これにより、スカラロボット３３，３４が旋回軸と基板Ｗの重心とを一致させる際に、観測装置４２によって基板Ｗの表面状態を観測することができる。すなわち、１つの観測装置４２で、スカラロボット３３，３４が搬送する基板Ｗの表面状態を観測することができ、もって、基板処理装置３２の構造を簡素化することができる。 In the SCARA robots 33 and 34, the lower transfer arm 36 and the lower transfer arm 39 are arranged so that the turning axis at one end 36a of the lower transfer arm 36 and the turning axis at one end 39a of the lower transfer arm 39 coincide. Are superimposed. Therefore, the turning axes of the SCARA robot 33 and SCARA robot 34 also coincide. Then, an observation device 42 for observing the surface state of the substrate W, for example, a camera, is disposed immediately above the turning axes of the SCARA robots 33 and 34. Thereby, when the SCARA robots 33 and 34 match the turning axis and the center of gravity of the substrate W, the surface state of the substrate W can be observed by the observation device 42. That is, the surface state of the substrate W transported by the SCARA robots 33 and 34 can be observed with one observation device 42, and thus the structure of the substrate processing device 32 can be simplified.
　エレベータ４１は、スカラロボット３３及びスカラロボット３４の間で基板Ｗを受け渡す。例えば、エレベータ４１はスカラロボット３４から基板Ｗを受け取った後、基板Ｗを第２の基板搬送面４３から第１の基板搬送面４２へ上昇させて該基板をスカラロボット３３へと渡し、また、スカラロボット３３から基板Ｗを受け取った後、基板Ｗを第１の基板搬送面４２から第２の基板搬送面４３へ下降させて該基板Ｗをスカラロボット３４へと渡す。なお、エレベータ４１は基板Ｗの上昇、下降に該エレベータ４１から突出自在に設けられたプッシャーピン等を用いる。 The elevator 41 delivers the substrate W between the SCARA robot 33 and the SCARA robot 34. For example, after the elevator 41 receives the substrate W from the SCARA robot 34, the elevator 41 raises the substrate W from the second substrate transfer surface 43 to the first substrate transfer surface 42, and passes the substrate to the SCARA robot 33. After receiving the substrate W from the SCARA robot 33, the substrate W is lowered from the first substrate transport surface 42 to the second substrate transport surface 43, and the substrate W is transferred to the SCARA robot 34. The elevator 41 uses pusher pins or the like provided so as to be able to protrude from the elevator 41 for raising and lowering the substrate W.
　図８Ａ乃至図８Ｄは、図７Ａ及び図７Ｂのスカラロボットによる搬送シーケンスを説明するための図である。このシーケンスでは、スカラロボット３３が基板Ｗを一の処理室１２から他の処理室１２へ搬送する。 8A to 8D are diagrams for explaining a transfer sequence by the SCARA robot of FIGS. 7A and 7B. In this sequence, the SCARA robot 33 transports the substrate W from one processing chamber 12 to another processing chamber 12.
　まず、スカラロボット３３は、下側搬送アーム３６及び上側搬送アーム３７を互いに協働させて水平に旋回動作させることにより、水平に緊縮して一の処理室１２（図示しない）から基板Ｗを図中矢印に沿って搬出し（図８Ａ）、搬出された基板Ｗを基台３５へ向けて移動させて下側搬送アーム３６の一端３６ａにおける旋回軸３８を基板Ｗの重心３８と一致させる（図８Ｂ）。 First, the SCARA robot 33 causes the lower transfer arm 36 and the upper transfer arm 37 to cooperate with each other and rotate horizontally, thereby contracting horizontally and drawing the substrate W from one processing chamber 12 (not shown). Unloading is carried out along the middle arrow (FIG. 8A), and the unloaded substrate W is moved toward the base 35 so that the turning shaft 38 at one end 36a of the lower transfer arm 36 coincides with the center of gravity 38 of the substrate W (see FIG. 8). 8B).
　次いで、スカラロボット３３は、下側搬送アーム３６のみを一端３６ａにおける旋回軸３８を中心に水平に旋回動作させる、例えば、時計回りに水平に４５°だけ旋回させる。これにより、ピック２１とともに基板Ｗを他の処理室１２（図示しない）へ正対させる。このとき、場合によっては、下側搬送アーム３６及び上側搬送アーム３７を接続するロッド４５（図７Ｂ参照）がスカラロボット３４の下側搬送アーム３９や上側搬送アーム４０と干渉するおそれがあるが、スカラロボット３４は、干渉を避けるために、例えば、図中白抜き矢印に沿ってスカラロボット３３の移動に合わせて伸長し、下側搬送アーム３９や上側搬送アーム４０をロッド４５から遠ざける（図８Ｃ）。 Next, the SCARA robot 33 turns only the lower transfer arm 36 horizontally around the turning shaft 38 at one end 36a, for example, turns 45 ° horizontally horizontally. As a result, the substrate W together with the pick 21 is made to face another processing chamber 12 (not shown). At this time, in some cases, the rod 45 (see FIG. 7B) connecting the lower transfer arm 36 and the upper transfer arm 37 may interfere with the lower transfer arm 39 or the upper transfer arm 40 of the SCARA robot 34. In order to avoid interference, for example, the SCARA robot 34 extends in accordance with the movement of the SCARA robot 33 along the white arrow in the figure, and moves the lower transfer arm 39 and the upper transfer arm 40 away from the rod 45 (FIG. 8C). ).
　次いで、スカラロボット３３は、下側搬送アーム３６及び上側搬送アーム３７を互いに協働させて水平に旋回動作させることにより、図中矢印に沿って水平に伸長して基板Ｗを他の処理室１２へ搬入する（図８Ｄ）。 Next, the SCARA robot 33 causes the lower transfer arm 36 and the upper transfer arm 37 to cooperate with each other to rotate horizontally, thereby extending horizontally along the arrow in the figure to extend the substrate W to the other processing chamber 12. (Fig. 8D).
　スカラロボット３３が基板Ｗを一の処理室１２から他の処理室１２へ搬送する間、スカラロボット３４は、当該スカラロボット３４が搬送する基板Ｗとスカラロボット３３が搬送する基板Ｗとが鉛直方向に沿ってスカラロボット３３，３４を眺めた場合において重ならないように下側搬送アーム３９や上側搬送アーム４０を水平に旋回動作させて基板Ｗを移動させる。例えば、スカラロボット３３が下側搬送アーム３６の一端３６ａにおける旋回軸３８を基板Ｗの重心３８と一致させて水平に旋回動作する際、スカラロボット３４は、当該スカラロボット３４が搬送する基板Ｗを旋回軸３８から遠ざける。これにより、スカラロボット３３が搬送する基板Ｗから剥離した異物が、スカラロボット３４が搬送する基板Ｗへ向けて落下して付着するのを防止することができる。 While the SCARA robot 33 transports the substrate W from one processing chamber 12 to the other processing chamber 12, the SCARA robot 34 is configured so that the substrate W transported by the SCARA robot 34 and the substrate W transported by the SCARA robot 33 are in the vertical direction. The substrate W is moved by rotating the lower transfer arm 39 and the upper transfer arm 40 horizontally so that they do not overlap when the SCARA robots 33 and 34 are viewed along. For example, when the SCARA robot 33 swings horizontally with the swivel axis 38 at one end 36 a of the lower transfer arm 36 aligned with the center of gravity 38 of the substrate W, the SCARA robot 34 moves the substrate W transported by the SCARA robot 34. Move away from the pivot axis 38. Thereby, it is possible to prevent the foreign matter peeled off from the substrate W transported by the SCARA robot 33 from dropping and adhering to the substrate W transported by the SCARA robot 34.
　本実施の形態に係る基板処理装置３２によれば、スカラロボット３３が水平に旋回動作する際、スカラロボット３３は下側搬送アーム３６の端部３６ａにおける旋回軸３８を搬送される基板Ｗの重心３８と一致させ、また、スカラロボット３４が水平に旋回動作する際、スカラロボット３４は下側搬送アーム３９の端部３９ａにおける旋回軸を搬送される基板Ｗの重心と一致させるので、当該搬送される基板Ｗには遠心力が作用しない。これにより、スカラロボット３３やスカラロボット３４が水平に旋回動作する際に基板Ｗに位置ずれが生ずることを防止することができる。 According to the substrate processing apparatus 32 according to the present embodiment, when the SCARA robot 33 swings horizontally, the SCARA robot 33 moves the center of gravity of the substrate W transported on the swivel shaft 38 at the end 36a of the lower transport arm 36. 38, and when the SCARA robot 34 rotates horizontally, the SCARA robot 34 matches the center of gravity of the substrate W to be transferred with the rotation axis at the end 39a of the lower transfer arm 39. Centrifugal force does not act on the substrate W. Thereby, it is possible to prevent the substrate W from being displaced when the SCARA robot 33 and the SCARA robot 34 are turned horizontally.
　また、基板処理装置３２では、スカラロボット３３，３４が搬送室１１内において互いに積み重ねて配置されるので、搬送室１１のフットプリントを削減することができる。 Further, in the substrate processing apparatus 32, the SCARA robots 33 and 34 are stacked in the transfer chamber 11, so that the footprint of the transfer chamber 11 can be reduced.
　上述した基板処理装置３２では、鉛直方向に関してスカラロボット３４がスカラロボット３３の下側搬送アーム３６及び上側搬送アーム３７に挟まれるように配置されたが、スカラロボット３３及びスカラロボット３４の配置形態はこれに限られず、例えば、図９Ａ及び図９Ｂに示すように、鉛直方向に関し、下方から下側搬送アーム３６、下側搬送アーム３９、上側搬送アーム３７、スカラロボット３３のピック２１、上側搬送アーム４０及びスカラロボット３４のピック２１の順で配置されてもよい。この場合も、各部材が水平に旋回動作する際に互いに干渉しないように、鉛直方向に関して互いに離間して配置される。 In the substrate processing apparatus 32 described above, the SCARA robot 34 is disposed so as to be sandwiched between the lower transfer arm 36 and the upper transfer arm 37 in the vertical direction. However, the SCARA robot 33 and SCARA robot 34 are arranged in a different form. For example, as shown in FIGS. 9A and 9B, the lower transfer arm 36, the lower transfer arm 39, the upper transfer arm 37, the pick 21 of the SCARA robot 33, and the upper transfer arm from below in the vertical direction. 40 and the pick 21 of the SCARA robot 34 may be arranged in this order. Also in this case, the members are arranged apart from each other in the vertical direction so that they do not interfere with each other when they rotate horizontally.
　なお、この場合には、スカラロボット３３の上側搬送アーム３７やスカラロボット３３が搬送する基板Ｗが、スカラロボット３４の下側搬送アーム３９及び上側搬送アーム４０を接続するロッド４６と干渉するおそれがあるが、スカラロボット３４は、干渉を避けるために、スカラロボット３３の移動に合わせて伸長し、下側搬送アーム３９や上側搬送アーム４０をロッド４６から遠ざける。 In this case, the upper transfer arm 37 of the SCARA robot 33 and the substrate W transferred by the SCARA robot 33 may interfere with the rod 46 connecting the lower transfer arm 39 and the upper transfer arm 40 of the SCARA robot 34. However, in order to avoid interference, the SCARA robot 34 extends in accordance with the movement of the SCARA robot 33 and moves the lower transfer arm 39 and the upper transfer arm 40 away from the rod 46.
　また、上述した基板処理装置３２では、第２の基板搬送面４３が第１の基板搬送面４２よりも下方に位置するため、スカラロボット３４によって搬送される基板Ｗへ向けてスカラロボット３３のピック２１や上側搬送アーム３７に付着した異物が剥がれて落下する可能性があるが、これに対応して、図１０Ａ及び図１０Ｂに示すように、スカラロボット３４のピック２１に該ピック２１の全面を覆うカバー４７を設けてもよい。これにより、スカラロボット３３のピック２１や上側搬送アーム３７から落下する異物をカバー４７で受け止めることでき、もって、スカラロボット３４によって搬送される基板Ｗへ異物が付着するのを防止することができる。 In the substrate processing apparatus 32 described above, since the second substrate transfer surface 43 is positioned below the first substrate transfer surface 42, the SCARA robot 33 is picked toward the substrate W transferred by the SCARA robot 34. 21 and the upper transfer arm 37 may be peeled off and fall off. Correspondingly, the entire surface of the pick 21 is placed on the pick 21 of the SCARA robot 34 as shown in FIGS. 10A and 10B. A cover 47 may be provided. As a result, foreign matter falling from the pick 21 and the upper transfer arm 37 of the SCARA robot 33 can be received by the cover 47, so that the foreign matter can be prevented from adhering to the substrate W transferred by the SCARA robot 34.
　また、重ねられるスカラロボットの数も２つに限られず、３つ以上であってもよい、例えば、図１１Ａ及び図１１Ｂに示すように、基台４８上にスカラロボット４９，５０，５１が重ねられてもよい。この場合も、各スカラロボット４９，５０，５１は水平に旋回動作する際、旋回軸５２と搬送する基板Ｗの重心５２とを一致させる。また、各スカラロボット４９，５０，５１の旋回軸５２は互いに一致する。 Further, the number of SCARA robots to be stacked is not limited to two, and may be three or more. For example, as shown in FIGS. 11A and 11B, SCARA robots 49, 50, and 51 are stacked on the base 48. May be. Also in this case, when each SCARA robot 49, 50, 51 rotates horizontally, the rotation axis 52 and the center of gravity 52 of the substrate W to be transported coincide with each other. Further, the turning axes 52 of the SCARA robots 49, 50, 51 coincide with each other.
　さらに、搬送室１１内に複数のスカラロボットを配置する場合、複数のスカラロボットを必ず重ねる必要はなく、例えば、図１２に示すように、搬送室１１内において２つのスカラロボット５３，５４を水平に並べて配置してもよい。 Further, when a plurality of SCARA robots are arranged in the transfer chamber 11, it is not always necessary to superimpose a plurality of SCARA robots. For example, as shown in FIG. May be arranged side by side.
　以上、本発明について、上記各実施の形態を用いて説明したが、本発明は上記各実施の形態に限定されるものではない。 As mentioned above, although this invention was demonstrated using said each embodiment, this invention is not limited to said each embodiment.
　本出願は、２０１１年１２月２０日に出願された日本出願第２０１１−２７８４３７号に基づく優先権を主張するものであり、当該日本出願に記載された全内容を本出願に援用する。 This application claims priority based on Japanese Patent Application No. 2011-278437 filed on December 20, 2011, the entire contents of which are incorporated in this application.
Ｗ　基板
１０　基板処理装置
１１　搬送室
１２　処理室
１５，２６，２７，３３，３４，４９，５０，５１，５３，５４　スカラロボット
１９，２３，３６，３９　下側搬送アーム
２０，２５，３７，４０　上側搬送アーム
２１　ピック
２２　旋回軸（重心）
２９，３０　アーム
４２　第１の基板搬送面
４３　第２の基板搬送面 W substrate 10 substrate processing apparatus 11 transfer chamber 12 process chambers 15, 26, 27, 33, 34, 49, 50, 51, 53, 54 SCARA robots 19, 23, 36, 39 Lower transfer arms 20, 25, 37, 40 Upper transfer arm 21 Pick 22 Rotation axis (center of gravity)
29, 30 Arm 42 First substrate transfer surface 43 Second substrate transfer surface

Claims (7)

  1. 　水平に伸縮旋回動作可能な搬送機構を有する搬送室と、該搬送室の周りに配置された複数の処理室とを備える基板処理装置において、
    　前記搬送機構は水平方向に伸縮動作し、及び／又は旋回動作することで基板を水平に移動させて各前記処理室へ搬送し、
    　前記搬送機構が水平に旋回動作する際、前記搬送機構は前記旋回動作の旋回軸を前記搬送される基板の重心と一致させることを特徴とする基板処理装置。     In a substrate processing apparatus comprising a transfer chamber having a transfer mechanism capable of horizontally extending and rotating, and a plurality of processing chambers arranged around the transfer chamber,
    The transport mechanism is expanded and contracted in the horizontal direction and / or swiveled to move the substrate horizontally and transport it to each processing chamber,
    The substrate processing apparatus according to claim 1, wherein when the transport mechanism swings horizontally, the transport mechanism aligns the swing axis of the swing operation with the center of gravity of the transported substrate.
  2. 　前記搬送機構は積み重ねられた複数の搬送アーム部と、最上位の前記搬送アーム部の端部に取り付けられた載置部とを有し、前記載置部は前記基板を載置し、
    　一の前記搬送アーム部は、端部において他の前記搬送アーム部と接続されて他の前記搬送アーム部に対して水平に旋回動作することによって前記搬送機構を伸縮させ、
    　最下位の前記腕部は、端部における旋回軸を中心に水平に旋回動作することによって前記搬送機構を水平に旋回動作させ、
    　前記搬送機構が水平に旋回動作する際、前記搬送機構は最下位の前記搬送アーム部の端部における旋回軸を前記搬送される基板の重心と一致させることを特徴とする請求項１記載の基板処理装置。     The transport mechanism has a plurality of stacked transport arm units and a mounting unit attached to an end of the uppermost transport arm unit, and the mounting unit mounts the substrate,
    One of the transfer arm units is connected to the other transfer arm unit at the end and horizontally swings with respect to the other transfer arm unit to expand and contract the transfer mechanism.
    The lowermost arm portion performs a swiveling operation on the transport mechanism horizontally by swiveling horizontally around the swivel axis at the end,
    2. The substrate according to claim 1, wherein when the transport mechanism swings horizontally, the transport mechanism aligns a swing axis at an end portion of the lowest transport arm portion with a center of gravity of the transported substrate. Processing equipment.
  3. 　前記基板を一の前記処理室から他の前記処理室へ搬送する際、前記搬送機構は、水平に緊縮して前記基板を一の前記処理室から搬出し、前記基板を水平に移動させて前記旋回軸と前記基板の重心と一致させ、前記基板とともに前記旋回軸を中心として水平に旋回動作して前記基板を他の前記処理室へ正対させ、さらに水平に伸長して前記基板を他の前記処理室へ搬入することを特徴とする請求項１記載の基板処理装置。 When transporting the substrate from one processing chamber to the other processing chamber, the transport mechanism is horizontally contracted to unload the substrate from the one processing chamber and move the substrate horizontally to move the substrate. A swiveling axis and the center of gravity of the substrate coincide with each other, and the substrate is swung horizontally around the swiveling axis together with the substrate so that the substrate is directly opposed to the other processing chamber, and is further horizontally extended to move the substrate to another substrate The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is carried into the processing chamber.
  4. 　複数の前記搬送機構をさらに備え、前記搬送室において複数の前記搬送機構は積み重ねられ、一の前記搬送機構が前記基板を搬送する第１の水平移動面と、他の前記搬送機構が前記基板を搬送する第２の水平移動面とは鉛直方向に関して離間することを特徴とする請求項１記載の基板処理装置。 A plurality of transport mechanisms, the transport mechanisms being stacked in the transport chamber, wherein one transport mechanism transports the substrate; and the other transport mechanism transports the substrate. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is separated from the second horizontal moving surface to be conveyed in the vertical direction.
  5. 　前記複数の搬送機構の旋回軸は一致し、前記旋回軸の直上に前記基板の表面状態を観測する観測装置が配されることを特徴とする請求項４記載の基板処理装置。 5. The substrate processing apparatus according to claim 4, wherein the plurality of transport mechanisms have the same turning axis, and an observation device for observing the surface state of the substrate is disposed immediately above the turning axis.
  6. 　一の前記搬送機構が当該一の前記搬送機構の旋回軸と当該一の前記搬送機構が搬送する一の前記基板の重心とを一致させて旋回動作する際、他の前記搬送機構は当該他の前記搬送機構が搬送する他の前記基板を、鉛直方向に沿って前記複数の搬送機構を眺めた場合、旋回動作する一の前記基板に重ね合わせないことを特徴とする請求項４記載の基板処理装置。 When the one transport mechanism performs a swivel operation with the swivel axis of the one transport mechanism and the center of gravity of the one substrate transported by the one transport mechanism, the other transport mechanism 5. The substrate processing according to claim 4, wherein when the plurality of transport mechanisms are viewed along a vertical direction, the other substrate transported by the transport mechanism is not superimposed on the one substrate that rotates. apparatus.
  7. 　前記基板は直径が４５０ｍｍの半導体ウエハであることを特徴とする請求項１記載の基板処理装置。 2. The substrate processing apparatus according to claim 1, wherein the substrate is a semiconductor wafer having a diameter of 450 mm.
PCT/JP2012/083183 2011-12-20 2012-12-17 Substrate processing device WO2013094717A1 (en)

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