KR20170120345A - Substrate transfer robot, equipment front-end module using the same, and method for transferring substrate using the same - Google Patents

Abstract

The substrate transfer robot includes a base portion capable of moving linearly in a horizontal direction, a body portion rotatable with respect to the base portion and movable in a vertical direction, first and second movable bodies disposed on the body portion, A second arm portion is provided. The substrate transfer robot is used in the front end module of the equipment. By using the substrate transfer robot, the substrate can be quickly processed in the front end module of the apparatus as compared with the conventional one.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate transfer robot, a front end module and a substrate transfer method using the same,

The present invention relates to a substrate transfer robot, and more particularly, to a robot for transferring a substrate such as a wafer, a device front end module using the same, and a substrate transfer method using a substrate transfer robot in an equipment front end module.

The productivity improvement in the field of semiconductor or flat panel display manufacturing can be achieved by increasing the number of substrates processed per unit time. Accordingly, clustered equipment is provided so that a plurality of process modules in one transfer module can be performed in a substrate processing apparatus having a plurality of stages of manufacturing processes. In recent years, in order to process a larger number of processes in one substrate processing apparatus, two process modules are connected in parallel to perform one manufacturing process at the same time. In this case, if the transfer module is formed into a regular polygonal polyhedron as in the prior art, the stroke of the substrate transfer robot for transferring the substrate in the transfer module becomes unnecessarily long and the possibility of vibration or the like increases. In addition, the footprint occupied by the transfer module is unnecessarily increased (see 100 'in Fig. 12).

As one method for solving such a problem, there is a form in which the shape of the transfer module is not a regular polygon but a polyhedron having a long length (hereinafter referred to as "three-dimensional polyhedron"). In order to transport a substrate from this type of transfer module, the substrate transfer robot generally has to move horizontally. However, a driving device for horizontal movement, such as a linear guide, is highly likely to generate foreign matter. Since the substrate processing process is often performed mainly in an atmosphere in which the concentration of foreign matter is extremely low, it is difficult to use such a driving device in the transfer module.

Japanese Patent Laid-Open Publication No. 2014-0133534 discloses a substrate processing apparatus having a transfer module in the form of a three-dimensional polyhedron. In this apparatus, the substrate transfer robot does not move horizontally but has an arm that rotates about a fixed point. However, such a substrate transfer robot is limited in the angle that the end effector can take, and at the same time, it is difficult to bring two substrates into two process modules arranged in parallel.

In addition, when two process steps are performed in the process module, it is possible to reduce the time required for the entire substrate to be transferred simultaneously in two units. For this purpose, it is preferable that not only the transfer module but also two substrates are transferred simultaneously in the front end module of the apparatus.

KR 2014-0133534 A

SUMMARY OF THE INVENTION It is an object of the present invention to provide an equipment front end module for use in a substrate processing apparatus having a plurality of process modules arranged in parallel by two at a time.

According to one aspect of the present invention, there is provided a substrate transfer robot comprising: a base portion that is linearly movable in a horizontal direction; A body portion disposed on the base portion, the body portion being rotatable with respect to the base portion and movable in a vertical direction; And a first arm portion disposed on the body portion and capable of linearly transferring the substrate along a horizontal direction; And a second arm portion disposed on the body portion, the second arm portion being disposed symmetrically with respect to the rotation axis of the body portion, the second arm portion being capable of linearly transferring the substrate along a horizontal direction.

According to another aspect of the present invention there is provided an equipment front end module coupled to a substrate processing apparatus via a load lock module, the apparatus front end module comprising a substrate to be processed in the substrate processing apparatus or a substrate processed in the substrate processing apparatus, One or more load ports for connection to a front opening unified pod (FOUP); A cooling buffer portion for cooling the processed substrates from the loadlock module prior to transferring the processed substrates to a FOUP housing a processed substrate coupled to the load port; And an apparatus front end module including the substrate transfer robot described above.

According to another aspect of the present invention, there is provided a method of transferring a substrate from an equipment front end module having the above-described substrate transfer robot and connected to a substrate processing apparatus through a load lock module, Withdrawing two substrates to be processed from a front opening unified pod (FOUP) receiving the substrate to be processed by the substrate transfer robot by the substrate transfer robot; (b) providing the two substrates to be processed by the substrate transfer robot to the load lock module; (c) the two processed substrates withdrawn in step (b) are transferred to and cooled in the cooling buffer unit by the substrate transfer robot; And (d) transferring the two processed substrates cooled in step (c) to a FOUP containing a substrate processed by the substrate transfer robot.

According to the present invention, there is provided an equipment front end module used in a substrate processing apparatus having a plurality of process modules arranged in parallel by two.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a semiconductor manufacturing apparatus having an equipment front end module according to the present invention; Fig.
2 is a view showing a substrate processing apparatus in the semiconductor manufacturing apparatus shown in Fig.
Fig. 3 is a view showing a substrate transfer robot used in the substrate processing apparatus shown in Fig. 2. Fig.
FIG. 4 is a diagram showing an equipment front end module in the semiconductor manufacturing apparatus shown in FIG. 1. FIG.
5 is a view showing a substrate transfer robot according to the present invention used in the equipment front end module shown in Fig.
6 is a view showing the drive system of the substrate transfer robot shown in Fig.
7 is a view showing another example of the drive system of the substrate transfer robot shown in Fig.
8 is a view showing the end effector structure of the substrate transfer robot shown in Fig.
9 is a schematic view illustrating a process of transferring a substrate in an equipment front end module according to the present invention.
10 is a view schematically showing a substrate transfer process in a conventional equipment front end module.
11 is a view showing various examples of the substrate processing apparatus shown in Fig. 2. Fig.
12 is a view showing a substrate processing apparatus provided with a non-constant-angle transfer module and a substrate processing apparatus having a regular multi-angle transfer module.

An equipment front end module (EFEM) according to the present invention forms a part of a semiconductor manufacturing apparatus together with a substrate processing apparatus. Hereinafter, a semiconductor manufacturing apparatus will be described in order to facilitate understanding of the present invention, and the equipment front end module according to the present invention will be described together.

Fig. 1 shows a semiconductor manufacturing apparatus 1 in which an equipment front end module according to the present invention is used. The semiconductor manufacturing apparatus 1 includes a substrate processing apparatus 100 in which a manufacturing process for a substrate is performed and an apparatus front end module (not shown) for supplying a substrate to the substrate processing apparatus 100 or recovering a substrate on which the manufacturing process is completed 200 are shown.

The substrate processing apparatus 100 includes a plurality of process modules 110 in which a semiconductor manufacturing process is performed. In the illustrated embodiment, the process module has a form in which two process modules are arranged in parallel. For convenience of description, the process module will be described as one process module. The substrate processing apparatus 100 further includes a transfer module 120 having a polyhedral shape and having a plurality of process modules 110 attached to the respective sides of the polyhedron one by one, a load lock module 130 attached to a side surface of the transfer module 120, And a first substrate transfer robot 140 transferring a substrate between the two process modules 110 or between the process module 110 and the load lock module 130.

The apparatus front end module 200 is connected via the substrate processing apparatus 100 and the load lock module 130. The equipment front end module 200 includes a plurality of front open unified pods (FOUPs) for receiving substrates processed in the substrate processing apparatus 100 or a substrate to be processed in the substrate processing apparatus 100, A load port 210, a substrate aligning device 220 for aligning the substrate to be processed before feeding it from the FOUP to the load lock module 130, a substrate aligning device 220 for aligning the substrate processed in the substrate processing apparatus 100 before cooling to the FOUP A cooling buffer unit, and a second substrate transfer robot 240 for transferring the substrate therebetween.

The substrate processing apparatus 100 is shown in Fig.

The transfer module 120 of the substrate processing apparatus 100 has a polygonal shape having an irregular polygonal shape. The transfer module 120 shown by way of example in FIG. 2 is a hexagonal polyhedron. One process module 110 or one load lock module 130 is connected to each side of the transfer module 120. Thus, the length of each side of the transfer module 120 depends on the size of the process module 110 or the load lock module 130. The inner space of the transfer module 120 is kept sealed against the outside, and is kept in a vacuum state or filled with an inert gas if necessary. Accordingly, when the substrate is provided inside the transfer module 120 or the substrate is discharged therefrom, the load lock module 130 is passed. The inner space of the transfer module 110 maintains a cleanliness of a predetermined level or more because the substrate on which the manufacturing process is performed is transferred.

In the illustrated example, the same manufacturing process may be performed at the same time or different manufacturing processes may be performed on two substrates disposed in each process module 110. The same manufacturing process is preferably performed for each substrate disposed within one process module 110. The size of the internal space of the process module 110 and thus the size of the process module 110 depends on the size of the substrate processed in the manufacturing process. Also, it may vary depending on the type of manufacturing process performed in the process module 110.

The load lock module 130 has at least two chambers, and preferably four chambers. When four chambers are provided, it is preferable that the internal space of the load lock module 130 is divided into two in the horizontal direction and further divided into two in the vertical direction. In the two lower chambers, a substrate to be processed, that is, a substrate provided inside the substrate processing apparatus 100 is waiting, and the upper two chambers are provided with processed substrates, that is, The substrate that has undergone the manufacturing process waits. Or simply as two chambers above and below, and two chambers may be placed in the upper and lower chambers.

The first substrate transfer robot 140 is disposed inside the transfer module 120 and transfers the substrate between the two process modules 110 or between the process module 110 and the load lock module 130. Each of the process modules 110 and the load lock module 130 is attached to the side surface of the transfer module 120 having the irregular polygonal shape so that the first substrate transfer robot 140 transfers the process module 110 and the load lock module It is necessary to have a structure capable of transporting the substrate despite such spatial arrangement of the substrates. 3, the first substrate transfer robot 140 includes an eccentric arm 142 having one end rotatably fixed, a body 144 rotatably disposed on the other end of the eccentric arm 142, And two arm portions 146 installed on the body portion and capable of transporting the substrate in a horizontal direction perpendicular to the rotation axis of the body portion and in a direction perpendicular to the rotation axis of the body portion.

The remaining portions of the first substrate transfer robot 140 excluding the eccentric arm 142 may be those of the transfer robots disclosed in Japanese Patent No. 1534524 and Patent No. 1535068, filed and registered by the present applicant. The transfer robot disclosed in the above documents is provided with a body portion rotatable with respect to a vertical rotation axis and a body portion which is arranged symmetrically with respect to the rotation axis of the body portion and is capable of transferring the substrate in a straight line along the horizontal direction and in a direction perpendicular to the rotation axis of the body portion And a pair of arm portions. In the case where the transfer module has a regular polyhedron shape, the process modules disposed on each side of the transfer module are arranged radially with respect to the center point of the regular polygon. Therefore, if the rotary shaft of the body of the transfer robot disclosed in the above documents is disposed at the center point of the transfer module, the substrate can be carried in / out of each process module. However, when the transfer module 120 has a non-regular polyhedron shape, the process module 110 is not arranged radially with respect to any particular point. Accordingly, interference may occur to the process module 110 which is not disposed radially with respect to the rotation axis of the body portion, so that the substrate may not be carried in or out. Also, even if the substrate can be loaded / unloaded to the process module 110, the substrate may be misaligned, making it difficult to carry out the manufacturing process.

In order to solve the above-mentioned problems, the first substrate transfer robot in the illustrated example additionally has an eccentric arm 142 in contrast to the transfer robot disclosed in the above documents. One end of the eccentric arm 142 is rotatably fixed at one point in the transfer module 120. The body 144 of the substrate transfer robot 140 is rotatably connected to the other end of the eccentric arm 142. An arm portion 146 is provided on the body portion 144. The arm portion 146 has a pair of arms symmetrical with respect to the central axis of the body portion 144 and is provided with a pair of arms which are linearly or vertically .

The arm portion 146 may be provided vertically. In this case, the substrate transfer robot 140 is provided with a first arm portion disposed below and a pair of second arm portions disposed above the first arm portion. 1) transferring the substrate from the chamber of the first process module or the load lock module, 2) transferring the substrate from the second process module to the substrate processing apparatus 100, , 3) bringing the substrate taken out from the first process module or the load lock module into the second process module 110 in step 1). That is, in the step 2), the substrate transfer robot 140 grasps four substrates at the same time.

The length of the eccentric arm 142 and the point at which one end of the eccentric arm 142 is rotatably fixed within the transfer module 120 is set such that the arm 146 can transfer the substrate to all the process modules 110 , That is, the length through which the arm is to be extended, is minimized. Each arm of the arm portion 146 is formed of a plurality of links and an end effector. In a state in which each arm contracts toward the body portion 144, the link of the arm protrudes outward from the body portion 144. In this state, when the body portion 144 rotates, the link of the arm should not interfere with the inner wall of the transfer module 120. That is, each side of the non-regular polyhedron in the design of the transfer module 120 should be arranged so as not to interfere with the substrate transfer robot 140. The dimension of each component of the substrate transfer robot 140 that meets these design conditions and the position of each side of the transfer module 120 have an influence on each other and, as a result, are determined through the trial and error method. In the illustrated example, although the transfer module 120 is shown as being bilaterally symmetrical, it need not necessarily be symmetrical in the left and right direction, and the transfer module 120 may be mounted on the transfer robot 120 in a range satisfying the above-described design conditions for the substrate transfer robot 140 and the transfer module 120 In any case, it can be in any form.

Figure 4 shows an equipment front end module (EFEM). The equipment front end module 200 includes at least one load port 210 for connection to a front opening unified pod (FOUP) that receives a substrate to be processed or a processed substrate, A cooling buffer unit for cooling the processed substrates, and a second substrate transfer robot 240 for transferring the substrate to be processed and the processed substrate in the equipment front end module.

The load port 210 keeps the FOUP holding the substrate processed in the above-described substrate processing apparatus 100 or the substrate processing apparatus 100 connected. A plurality of such load ports 210 may be provided, and at least two load ports may be provided, that is, a load port connected to the FOUP accommodating the substrate to be processed and a load port connected to the FOUP accommodating the processed substrate. In the FOUP, a plurality of substrates to be processed or processed substrates are maintained in a laminated state.

The substrate alignment device 220 aligns the substrate to be processed before feeding it to the substrate processing apparatus 100 via the load lock module 130. In the illustrated example, the substrate processing apparatus 100 can perform the same manufacturing process for two substrates at the same time, so that the substrate aligning apparatus 220 also has a structure for aligning two sheets at the same time. In this case, it is not always necessary to make the width of the substrate aligning device 220 larger than twice the substrate diameter, and if the substrates are arranged in a partially overlapping arrangement when viewed from above by varying the height of the aligned substrates, The width of the substrate aligning device 220 can be reduced.

The cooling buffer unit allows the substrate processed in the substrate processing apparatus 100 to be taken out of the load lock module 130 and cooled before being transferred to the FOUP. In order to reduce the floor area occupied by the equipment, the cooling buffer portion may be disposed above the substrate alignment device 220. The cooling buffer section may have a space for accommodating two substrates to be cooled and an empty space for two substrates to be newly carried. In the illustrated example, since the cooling buffer unit has a space for a total of four substrates in this way, two substrates newly taken out from the load lock module 130 are carried into the empty space of the cooling buffer unit, It is possible to carry out the other two substrates that are being cooled in the conventional manner.

The second substrate transfer robot 240 transfers the processed substrate or the substrate to be processed between the FOUP connected to the load port 210, the substrate alignment device 220, the load lock module 130, and the cooling buffer unit. 5, the second substrate transfer robot 240 includes a base portion 242 capable of rectilinear motion, a body portion 244 rotatably and vertically movably installed on the base portion 242, And an arm portion 244 disposed on the body portion 242 and capable of linearly transferring the substrate along the horizontal direction.

The base portion 242 of the second substrate transfer robot 240 is movable linearly along the horizontal direction. For example, a driving means (not shown) such as a linear guide can be used for linear movement of the base portion 242. [ Since the equipment front end module 200 often operates in a state in which the inner space is not sealed and exposed to the atmosphere, a driving means with relatively low cleanliness can be used. The body portion 244 is disposed on the base portion 242 and is rotatable with respect to the base portion 242 and transportable in the vertical direction.

The arm portion 244 of the second substrate transfer robot 240 is disposed on the body portion 242 and has a first arm and a second arm. In the illustrated example, the first arm and the second arm are formed to be symmetrical with respect to the rotational axis of the body portion 242. Therefore, one arm will be described below. Each arm has four links sequentially connected and one end effector for supporting the substrate. More specifically, each arm includes a first link member 2441 having one end rotatably connected to the body portion 242, one end rotatably connected to the other end of the first link member 2441 A second link member 2442 interlocked with the first link member, a third link member 2443 whose one end is rotatably connected to the other end of the second link member 2442, A fourth link member 2444 rotatably connected to the other end of the fourth link member 2443 and interlocked with the third link member 2443, and an end effector 2445 connected to the other end of the fourth link member 2443 .

The driving means for driving each arm is formed as shown in Fig. The first driving device 2446 is connected to one end of the first link member 2441 and drives the first link member 2441 and the second link member 2442 associated therewith. The second driving device 2447 is connected to the other end of the third link member 2443 and drives the third link member 2443 and the fourth link member 2444 associated therewith. The interlocking between the link members can be made by a belt, a chain, or other conventional transmission means, and in the illustrated example the belt is used as the transmission means. 7, if the first driving device 2446 and the second driving device 2447 are both provided at one end of the first link member 2441, the interference between the link members is advantageous. However, The rigidity of the belt for transmitting the torque of the drive unit is weakened, so that vibration during driving can be increased. Therefore, in the illustrated example, the other end of the third link member 2443, which is relatively unlikely to cause interference problems, that is, the end of the third link member 2443 connected to the fourth link member 2444 Respectively.

The substrates gripped by the arms are preferably formed so as to be arranged at positions overlapping each other at a predetermined interval in the vertical direction. For example, as shown in Fig. 8, a part of the end effector 2445b of the second arm may be formed to enter the groove provided in the end effector 2445a of the first arm. Accordingly, the substrate gripped by the end effector of the first arm is disposed above the substrate gripped by the end effector of the second arm at a predetermined interval.

As described above, in order to allow the substrates placed on the substrate aligning device 220 to be disposed at positions overlapping each other, the alignment operation of one substrate is performed at a position higher than the alignment operation of the other substrate by a predetermined interval. Since the substrate gripped by the end effector of the first arm of the second substrate transfer robot 240 can be arranged at a position higher than the substrate gripped by the end effector of the second arm by a predetermined distance, In the present invention,

Hereinafter, the substrate transfer process in the semiconductor manufacturing apparatus 1 will be described. The process of the transferring process will be described first in the apparatus front end module 200, and then the process in the substrate processing apparatus 100 will be described.

First, the process in the equipment front end module 200 will be described with reference to FIGS. 9 and 10. FIG. FIG. 9 shows a substrate transfer process in the apparatus front end module 200 according to the present invention, and FIG. 10 shows a substrate transfer process in the conventional equipment front end module 200.

The two substrates W1 and W2 to be processed by the second substrate transfer robot 240 are taken out from the FOUP (LPM4) connected to one of the load ports of the equipment front end module 200. [ The first arm of the second substrate transfer robot 240 grasps the substrate at a position spaced by a predetermined distance relative to the second arm and the end effector of the first arm and the end effector of the second arm move to a position When the first arm and the second arm are arranged at this position, two adjacent substrates W1 and W2 can be simultaneously drawn out from the substrates stacked in the vertical direction on the FOUP (LPM4). The extracted two substrates W1 and W2 are transferred to the substrate aligning device 220 by the second substrate transfer robot 240. [ In the substrate aligning device 220, the aligning portion corresponding to the first arm is provided at a high position at a predetermined interval with respect to the aligning portion corresponding to the second arm. Thus, the substrate held by the first arm and the substrate held by the second arm are simultaneously placed in the alignment portion of the substrate aligning device 220. Thereafter, the two substrates W1 and W2 are aligned by the substrate aligning device 220, respectively. Since the two alignment portions are different in height from each other, alignment can be made in a state in which a part of the substrate is overlapped. Thus, as described above, the width of the substrate aligning device 220 can be reduced by an overlap degree. The two substrates W1 and W2 having been subjected to the aligning process are transferred from the aligning portion by the second substrate transfer robot 220 and transferred to the A spaces L / L A1 and L / L2 of the load lock module 130, L A2). The height difference between the first arm and the second arm is the same as the height difference between the corresponding alignment portions, so that they are lifted at the same time.

Two substrates W3 and W4 having been manufactured by the substrate processing apparatus 100 are transferred to the B spaces L / L B1 and L / L B2 of the load lock module 130. The two substrates W3 and W4 placed in the B space (L / L B1, L / L B2) of the load lock module 130 are heated through the manufacturing process. The two substrates W3 and W4 are carried out from the B spaces (L / L B1 and L / L B2) of the load lock module 130 by the second substrate transfer robot 240, do. In the cooling buffer portion, the substrates to be cooled are stacked in a vertical direction at a predetermined interval. Since the first arm and the second arm of the second substrate transfer robot 240 are different in height from each other and each end effector can be arranged so that the substrates are overlapped with each other, The substrates W3 and W4 are placed in the cooling buffer unit. Then, the other two substrates W5 and W6 sufficiently cooled in the cooling buffer unit by the second substrate transfer robot 240 are taken out of the cooling buffer unit. The two cooled substrates W5 and W6 taken out are then accommodated in a FOUP (LPM2) that receives substrates processed by the second substrate transfer robot 240. [ Also in this case, the height difference between the first arm and the second arm is used.

The apparatus alignment unit 220 may not be required depending on the type of the front end module 200 of the apparatus. In this case, the process related to the substrate aligning device 220 is omitted during the above process. That is, the substrates W1 and W2 to be processed are brought into the space A of the load lock module 130 immediately after they are taken out from the FOUP (LPM4). Thereafter, the heated substrates W3 and W4, which are placed in the space B of the load lock module 130 after the manufacturing process, are carried out. The unloaded substrates W3 and W4 are carried into the cooling buffer section, and the cooled substrates W5 and W6 in the cooling buffer section are carried out. The substrates W5 and W6 taken out from the cooling buffer portion are housed in a FOUP (LPM2) that receives processed substrates.

In contrast to the substrate transfer process in the conventional equipment front end module shown in FIG. 10, the distance by which the second substrate transfer robot moves is greatly reduced, thereby reducing the time required for the manufacturing process as a whole.

Next, the transfer of the substrate in the substrate processing apparatus 100 is performed as follows:

Two substrates transferred into the space A of the load lock module 130 by the second substrate transfer robot 240 are carried out of the load lock module 130 by the first substrate transfer robot 140. Next, the first substrate transfer robot 140 transfers two substrates from the first process module in which the first manufacturing process is performed, to the first process module in which the first manufacturing process is completed. The first substrate transfer robot 140 has a first arm portion symmetrical to the left and right and a second arm portion disposed above the first arm portion. Thus, for example, in a state in which the first arm part grips two substrates transferred from the load lock module 130, two substrates can be taken out from the first process module by using the second arm part. Next, two substrates held by the first arm portion are brought into the first process module. In the state where two substrates transferred from the first process module are gripped by the second arm portion, two substrates, from which the second manufacturing process is completed, are carried out from the second process module by the empty first arm portion. Then, two substrates held by the first arm portion are brought into the second process module for the second manufacturing process. This is the last process module in this order. The two substrates carried out from the last process module are in a state in which all of the manufacturing processes to be performed in the substrate processing apparatus have been performed. Therefore, the load lock module 130 is brought into the B space.

Thereafter, the processed substrate transferred into the B space is transferred to the cooling buffer unit by the second substrate transfer robot 240 of the apparatus front end module 200, and when the cooling is completed, the processed substrate is transferred to the FOUP in which the processed substrate is accommodated .

Although the present invention has been described in detail based on the embodiments shown in the accompanying drawings, it is apparent that various modifications are possible without departing from the scope of the present invention. Nothing in this specification is intended to limit the scope of the present invention to the scope of the appended claims. The above-described embodiments are for illustrative purposes and are not intended to exclude having other embodiments.

For example, although the illustrated embodiment has been described on the basis of a transfer module having a hexagonal polyhedron shape, the present invention is not limited to this and can be applied to various polyhedrons. 11, a transfer module 100a having a hexagonal polyhedron form and a transfer module 100b having an octagonal polyhedron form are illustrated in addition to the transfer module 100 having a hexagonal polyhedron form.

1: Semiconductor manufacturing apparatus
100: substrate processing apparatus
110: Process module
120: Transfer module
130: Load lock module
140: first substrate transfer robot
200: Equipment front module
210: load port
220: substrate alignment device
240: second substrate transfer robot

Claims (8)

A base portion capable of linear movement in a horizontal direction;
A body portion disposed on the base portion, the body portion being rotatable with respect to the base portion and movable in a vertical direction; And
A first arm portion disposed on the body portion and capable of linearly transferring the substrate along a horizontal direction; And
A second arm portion disposed on the body portion in symmetry with the first arm portion with respect to the rotation axis of the body portion and capable of linearly transferring the substrate along a horizontal direction,
And a substrate transfer robot.
The method according to claim 1,
Each of the arm portions includes four link members sequentially connected to each other and one end effector for supporting the substrate
And the substrate transfer robot.
[3] The apparatus according to claim 2,
A first link member having one end rotatably connected to the body portion;
A second link member having one end rotatably connected to the other end of the first link member and interlocking with the first link member;
A third link member having one end rotatably connected to the other end of the second link member;
A fourth link member having one end rotatably connected to the other end of the third link member and interlocking with the third link member;
An end effector connected to the other end of the fourth link member;
A first driving device connected to the one end of the first link member and driving the first link member and the second link member interlocked with the first link member; And
And a second driving device connected to the other end of the third link member and driving the third link member and the fourth link member interlocked with the third link member
And the substrate transfer robot.
The method according to claim 1,
The first arm portion and the second arm portion are formed so that the substrates gripped by the respective arm portions can be arranged at positions overlapping each other at a predetermined interval in the vertical direction
And the substrate transfer robot.
An equipment front end module connected to the substrate processing apparatus through a load lock module,
At least one load port for connecting with a front opening unified pod (FOUP) for receiving a substrate to be processed in the substrate processing apparatus or a substrate processed in the substrate processing apparatus;
A cooling buffer portion for cooling the processed substrates from the loadlock module prior to transferring the processed substrates to a FOUP housing a processed substrate coupled to the load port; And
The substrate transfer robot according to any one of claims 1 to 4,
The equipment front end module, including.
The method of claim 5,
A substrate alignment device for simultaneously aligning two substrates to be processed before being supplied to the substrate processing apparatus via the load lock module,
Further comprising: a device front end module.
A method of transferring a substrate from an equipment front end module having the substrate transfer robot according to any one of claims 1 to 4 and connected to a substrate processing apparatus through a load lock module,
(a) withdrawing two substrates to be processed from a front opening unified pod (FOUP) receiving a substrate to be processed in the substrate processing apparatus by the substrate transfer robot;
(b) providing the two substrates to be processed by the substrate transfer robot to the load lock module;
(c) withdrawing two processed substrates processed in the substrate processing apparatus by the substrate transfer robot from the load lock module;
(d) the two processed substrates taken out from the step (b) are transferred to and cooled in the cooling buffer unit by the substrate transfer robot; And
(e) the two processed substrates cooled in step (c) are transferred to a FOUP housing a substrate processed by the substrate transfer robot
Wherein the substrate transfer module comprises:
8. The method of claim 7, further comprising, between step (a) and step (b)
Wherein the two substrates to be processed are aligned simultaneously by the substrate aligning device
Further comprising the step of: transferring the substrate to the front end module.

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