TWI376729B - Pecvd silicon-rich oxide layer for reduced uv charging - Google Patents

Pecvd silicon-rich oxide layer for reduced uv charging Download PDF

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TWI376729B
TWI376729B TW093119381A TW93119381A TWI376729B TW I376729 B TWI376729 B TW I376729B TW 093119381 A TW093119381 A TW 093119381A TW 93119381 A TW93119381 A TW 93119381A TW I376729 B TWI376729 B TW I376729B
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Taiwan
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layer
gate
oxide
dielectric
interlayer dielectric
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TW093119381A
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TW200507073A (en
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Minh Van Ngo
Mark T Ramsbey
Tazrien Kamal
Pei Yuan Gao
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Spansion Llc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/314—Inorganic layers
    • H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
    • H01L21/31604—Deposition from a gas or vapour
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
    • H01L21/76834—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers formation of thin insulating films on the sidewalls or on top of conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66825—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a floating gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
  • Formation Of Insulating Films (AREA)

Description

1376729 九、發明說明： 【發明所屬之技術領域】 本發明係關於製造具有高可靠度之半導體裝置之方 法’及所獲得的半導體裝置。本發明對於製造具有減少紫、-外線（UV) δ己彳,¾胞（ce 11)充電之微小型化快閃記惊體事置^' 別具有可應用性。 【先前技術】 在D嘗試滿足持續增加微小型化需求方面，遭遇到各式 各樣的問題，尤其是在製造譬如像是電子可拭除可程式唯 讀記憶體（EEPROM)裝置之快閃記憶體裝置之非揮發性半導 體時，更是如此。繼續要求微小型化，導致製造出包含具 有閘極寬度大約G. 13微米及其以下以及間隔開小間隙大、 約〇.. 3微米及更小閘極結構之電晶體之快閃記憔體妒置。 依照習知之實際製作方面’氧化物侧壁間隔件；成‘閘極 堆豐之側表面，而第一層間（lnterlayer)電介質⑽。）沉 積在閘極結構上，充滿於該結構間隙之間。 、當急速發展微小型化時’發生了各種可靠度之問題 尤其像是EEPROM裝置尺寸縮小成深次微米之範圍時更是 如此’譬如於生產線之後端製程（back end line ^cessing)期間之紫外線充電，像是沉積、金屬蝕刻和^ =aSS1Vati〇n)、尤其是於電漿處理期間是如此。於此！ =期間產生之紫外線㈣造成快閃記憶體裝置之不希$ 的备、外線充電並伴隨g* PP +两 雪*主s b 思1限毛壓〇0之增加。經過紫外線充 電並表現出增加Vt之記㈣極料以過度程式化（over- 92639 5 1376729 program) ’亦很難予以過度拭除（over_erase)。若增加初 始Vt值’則於拭除狀態和程式化狀態之間具有較小的、 窗口’由此而引發各種可靠度和操作速度之問題。 因此’需要有譬如像是EEPR0M之快閃記憶體裝置之微- ^•化之半導肢裝置’具有改良之可靠度和增加之操作速 度，和需要有效之方法使能製造此等具有減少紫外線記憶 胞充電之裝置。 【發明内容】 本發明之優點為揭示一種製造半導體裝置之方法，尤 其是快閃記憶體半導體裝置’具有改進之可靠度和減少紫 外線記憶胞充電。 本發明之另一優點為提供一種半導體裝置，例如快閃 體半導體裝置’具有改進之可靠度和減少紫外線記憶 胞充電。 以:將提出詳細說明本發明之額外優點和其他特徵結 構’而其部分内容對於熟悉此項技術者而言於檢核下文後 將變得很清楚，並可你音从饱枒下文後 <貫作中^付本發明。可實現並择得 本發明之該等優里上 * 4 士 又寸 良2並特別指出於申請專利範圍中。 F置之方述和其他優點部分係藉由製造半導體 4 a °玄方法包括：在基板上形成且有間栖 、··σ構之電晶體，在該美 八 /诂φ曰碰 土板與閘極之間具有閘極電介質層； 質：上：:二=間電介質層；以及具有在該層間電介 本發明丨.6之富⑦氧化石夕層。 ‘占樣為一種半導體裝置，包括：在基板 92639 6 ⑸6729 極結叙電晶體，在祕板與閘極之間具有閉極 =層’在該電晶體上之層間電介質層；以及在該層間 ::貝之上表面上具有折射率(RI)大於U之富石夕氧化 本發明之各實施例包括形成具有R. !大於i八譬如二 @7至2.0)，而厚度為權埃至_埃之富石夕氧化 曰。本發明之各實施例復包括沉積摻雜硼⑻和磷⑻之矽 酸鹽玻璃⑽SG)作為層間電介質，平面化職層之上表 面’然後藉由於高溫45代至65(rc和於料流率（sn㈣ ⑹灿）115至135每分鐘標準立方公分ο情況下 使用電聚加強化學蒸氣沉積而沉積富碎氧切⑻⑼層。 本發明之各實施職包㈣成於基板上之閘極、结構，包括 随道氧化物、於隨道氧化物上之浮置閘極電極、於浮置閘 極上之包括氧化物/氮化物/氧化物⑽⑴堆疊之多層内插 電”貝（interpoly dielectric)、和於内插電介質上之控 制閘極電極。 由下列之詳細說明，本發明之其他優點對於熟悉此項 技術者而言將變得很清楚，其中本發明之各實施例係僅例 不說明施行本發明之最佳模式。將瞭解到在所有不偏離本 發明之宗旨下對各種明顯的態樣得予修飾。因此，各圖式 本質上為範例性質，而非用來限制。 【實施方式】 本發明藉由提供有效的方法使能製造具有減少紫外線 退化之半導體裝置，而解決了發生於製造半導體裝置中之 92639 7 各種可靠性鬥es ,
—α 。]靖°本發明之實施例包括製造例如EEPROM 之快閃記彳轰@ m 展置’具有明顯減少記憶胞之紫外線充電。 (链根據進订的實驗和研究，發現到於生產線之後端製程 生♦儿積、金屬蝕刻和鈍化、尤其是電漿處理）期間所產 :外、泉輪射’不希望地充電了記憶胞，因此增加記憶 $式化电壓。如此不希望地增加了記憶胞之程式化電 1則：少拭除狀態和程式化狀態之間的Vt窗口。 h a本I月藉由〉儿積對紫外線輻射實質不透光之SiR0層 :^門電』丨貝（即，1LD〇)上’而解決了此等紫外線記憶胞 〗:之問題。SiR0層-般具有R· I·大於1.6，譬如大於 7 ’而例如為1. 7至2. 〇。 本發明糟由於高溫，譬如於溫度4501至550t，而例 於5〇(TC，和於矽烷流率1〇〇至15〇 ，嬖 seem情況下，傕用雷將 ° 電水加強化予蒸氣沉積技術而達成此等 目尔。此種沉積可用❹於阳至^咖流率’例如 180 sccm流率下，而於1 8至2 ? 、 y 歐士丁 .6主2.2托（了〇〇')，例如2.〇托 千f月况下細(行。間距（晶圓知备财也山 > 么 W和軋體噴出之喷頭間之距 沉^ r -大約奶至奶密㈣⑴’例如㈣密爾。 例如ΐηΓ:?仃3至15秒’而得到具# 4°〇埃至600埃， ' 埃厚度之沉積Si獏。此種電漿加強彳b。严 R.i.升高大於u，譬如大於】7 層，而使得 八t U ’而例如為1· 7至2 〇 ; 反之，一般之氧化矽層展現〗 至1.46之R. I.。依照本 92639 8 1376729 發明使用之SiRO膜提供較使用習知製造技術所獲得之w 分佈更緊密之Vt分佈。 第1圖不意地顯示本發明之實施例，其中在基板3〇 ^形成電晶體。基板30可包括摻雜之單晶矽或複數個井或 磊晶層（epitaxial layer)。電晶體可包括在其間具有多層· 内插（0NQ)電介質之雙閘極結構。舉例而言，電晶體可包括 隧道氧化物33、浮置閘極電極34、_堆疊多層内插電介· 質g5、和控制閘極36。金屬矽化物層37A形成於閘極電極 堆豐之上表面，而同時金屬矽化物層37B形成於源極/汲極_ 區域31、32。譬如氧化矽之電介質側壁間隔件38形成於 閘極電極側表面。氮化石夕钱刻終止層39彳沉積於閘極結構 之氧化矽側壁間隔件38上《接著，使用電漿加強化學蒸氣 沉^，沉積多層内插電介質（ILD〇)3〇〇，譬如BpsG層。然 後藉由使用化學機械研磨（CMp)而執行平面化。 依照本發明之實施例，然後沉積Si R0層500於BPSG 層300之上表面。依照本發明之實施例沉積之層表現籲 出R· I.大於1. 6，例如為1. 7至2. 〇，而因此阻隔了於後 續生產線之後端製程期間產生之紫外線輻射到達記憶胞， 並避免增加其程式化電壓。 接著之‘程，包括各向異性姓刻（anis〇tr〇pic etChing)以形成接觸孔400,如虛線所示，通過siR〇層500 寿夕層内插電介質（1[])())3〇〇。3丨只〇層500之存在防止於 此種例如|向異性姓刻期間產生之紫外線輕射造成不希望 的Vt之升同。紫外線不透光SiR0層500亦屏蔽記憶胞不 9 92639 1376729 ===端製程(譬如金屬化、沉積和㈣ 外線輕射。此外，該等記憶胞受屏蔽不受紫外線 ,本發明提供具有改進可靠度之半導體農置，孽如： =加操作速度並減少記憶胞因藉由紫外線輻射㈣度程式 之eep_裝置，並提供可實施之方法。依照本發明 知例’沉積富石夕氧化石夕層於平面化BPSG多層内插電， 2富碎氧切層有效地阻隔於後端製軸 之 化電壓。 避免不希望之增加記憶胞之程式 2明具有製造各種型式半導體裝置之工業可應用 "尤其疋在高積體之半導體裝置方面，呈現出增加電路 ^次微米尺寸，例如，具有高可靠度之大約G.12微米 ;=Γ:Γ。本發明於製造譬如™之快閃記憶體 Ϊ置方面具有工業可應祕，該㈣記憶體裝置具有相當 減少之對記憶胞之紫外線充電。 =述詳細說明中’本發明已參照其特定實施例而作 改二田說明。然而’明顯的可對該實施例作各種之修飾和 2 ’而不會偏離本發明如申請專利範圍 =和範圍。因此，說明書和圖式係相關作例示用： =制用。應瞭解到本發明能夠使用各種之其他實施例和 衣兄並☆夠在其中表示本發明概念之範圍内作各種 和修飾。 又 【圖式簡單說明】 92639 1376729 第1圖示意地顯示本發明之實施例’其中使用了對紫 外線輕射實質不透光的富石夕氧化石夕層於包含EEPROM記憶 胞之半導體裝置。 【主要元件符號說明】 30 33 35 36 38 300 500 基板 31、32源極/汲極區域 隨道氧化物 34 浮置閘極電極 ΟΝΟ堆豐多層内插電介質 37A、37B金屬石夕化物層 39 終止層 400 接觸孔 控制閘極 側壁間隔件 層間電介質（ILD0) SiRO 層 1】 92639

Claims (1)

  1. 申請專利範圍 種製造半導體裝置之方法，該方法包 101年3月2卷辞異養換頁 邱-月~~ mxA ~^一二 ί 在基板（3G)上形成具有間極結構之電晶體’在該基 板（3〇)與該閘極之間具有閘極電介質層（33); 在該電晶體上形成層間電介質（300);以及 在5亥層間電介質(300)之上表面上形成具有折射率 )大；1. 6之田石夕氧化石夕層（5 〇 〇 )，該富石夕氧化石夕 層(500)對紫外線輻射實質不透光，其中，該富石夕氧化 石夕層（5 0 0 )係沉積於： 100至150每分鐘標準立方公分(seem)之矽烷流 率； 165至195 sccm之氧化氮（N2〇)流率； 110至140瓦特之射頻（R.F.)功率； 625至675密爾（mil)之間隔；以及 1. 8至2· 2托（T〇rr)壓力經3至15秒。
    2. 如申清專利範圍第！項之方法，包括形成厚度_埃至 Q 6〇0埃’具有折射率大於U之富石夕氧化石夕層（500)。 3. 如申請專利範圍第1項之方法，包括： 酸鹽玻璃（BPSG) 沉積一層摻雜硼（B)和磷（P)之矽 作為層間電介質（300); 平面化BPSG層（300)之上表面，以及 ”藉由於溫度4501至65(TC使用電裝加強化學蒸氣 沉積而沉積富矽氧化矽層（500)。 4. 如申請專利範圍第1項之方法，其中該閘極結構包括： (修正本)92639 12 1376729 _ 第093119381號專利申請案 101年3月2日修正替換頁 隧道氧化物（33)作為該基板（30)上之該閘極電介 質層； 於該隧道氧化物（33)上之浮置閘極電極（34); 多層内插電介質（35)，包括於浮置閘極（34)上之氧 化物/氮化物/氧化物（0N0)堆疊；以及 於該多層内插電介質（35)上之控制閘極電極 (3 6)，該方法包括： 於該閘極結構之侧表面形成氧化矽側壁間隔件 (38)； 於該閘極堆疊之上表面和該氧化矽側壁間隔件（38) 上形成氮化矽層（39);以及 之後沉積該層間電介質。 13 (修正本)92639
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CN1823414A (zh) 2006-08-23
WO2005010984A2 (en) 2005-02-03

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