TWI373385B - - Google Patents

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Publication number
TWI373385B
TWI373385B TW099127906A TW99127906A TWI373385B TW I373385 B TWI373385 B TW I373385B TW 099127906 A TW099127906 A TW 099127906A TW 99127906 A TW99127906 A TW 99127906A TW I373385 B TWI373385 B TW I373385B
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TW
Taiwan
Prior art keywords
punching
manufacturing
hollow
wall
core socket
Prior art date
Application number
TW099127906A
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English (en)
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TW201043357A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to TW099127906A priority Critical patent/TW201043357A/zh
Priority to JP2010200719A priority patent/JP2012044129A/ja
Priority to US12/885,573 priority patent/US20120043067A1/en
Priority to DE202010008604U priority patent/DE202010008604U1/de
Priority to KR1020100093182A priority patent/KR20120018039A/ko
Publication of TW201043357A publication Critical patent/TW201043357A/zh
Priority to DE102011000230A priority patent/DE102011000230A1/de
Application granted granted Critical
Publication of TWI373385B publication Critical patent/TWI373385B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/20—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/42—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being both outside and inside the tubular element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49377—Tube with heat transfer means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Geometry (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Extrusion Of Metal (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Forging (AREA)

Description

1373385 j如第五圖至第七圖或第八圖至第十圖），再針對該中空 官體10的管體外壁進行複數道的沖削加工，使管體外壁被 中肖j形成具有咼岔度且垂直相鄰分佈的複數個夾溝槽12 ( ^第十一圖至第十三圖或第十四圖至第十六圖實施例）， 藉此構成政熱器的核心管座1 〇〇，進而利用所述高密度分 佈的夾溝槽12逐一匹配各散熱片2〇〇形成緊密壓置的嵌插 夾置（如第十七圖或第十八圖）’以此組成一具有高密度 散熱片的散熱器30〇(如第十九圖或第二十圖）。 依上述本發明的製造方法，其實施步驟依序為： (1) 、準備預先定量的鋁錠胚料1; (2) ”利用上述疋置的链錠胚料1，先通過擠壓模具的擠 壓成型，進而形成一具有一端封閉面11的中空管體10 (3) 、再針對上述中空管體1〇的管體外壁進行複數道的沖 削加工，使管體外壁被沖削形成具有高密度且垂直相 鄰分佈的複數個夾溝槽12，以此構成一核心管座1〇〇 〇 如第二圖所示，本發明針對中空管體10外壁的沖削加 工，其加工作業係可包含：粗沖、細沖及精沖等多道工序 ’使中空官體10的外壁通過不同的沖削刀具，所述粗沖是 在中空管體10外壁上預先沖削出預定數量且初具模型的槽 體，所述細沖工序是將粗沖成型的槽體進行再一次沖削^ ，近預定尺寸的槽，最後通過精沖工序將前述槽修正成預 疋尺寸的夾溝槽12，於粗沖後再經過一次以上的細沖與一 次以上的精沖等序’而沖削完成具高密度分佈的複數個 1373385 4 夹溝槽12 ’其整體製造更為簡化且非常快速，故非常適合 β實施力胃作業進行量產，並可有效降低成本。 上述本發明於擠壓成型的工序時，係可於中空管體1〇 的内壁預設成型複數個柱狀體13 (如第五圖至第七圖或第 八圖至第十圖實施例），並在通過沖削加工後，再針對所 述的複數個柱狀體13進行鑽孔加工，以分別開設形成複數 個鎖孔14 (如第十一圖或第十四圖實施例所示），以提供 - 依附元件之鎖固定位；同理可知，本發明實施時，係可依 • 據不同的需求，而在中空管體10的封閉面11也開設一個以 上的鎖孔，用以提供依附元件之鎖固定位。 本發明於擠壓成型所實施的中空管體1〇，其大小或外 觀形狀並無限制必要，例如第五圖至第七圖係實施為圓形 管體，而第八圖至第十圖所示則實施為方形管體，而同理 可知’該中空管體1〇自亦可實施為其它任意形狀。 又，所述用以適配嵌插夾置於核心管座100的複數個散 熱片200 ’其大小或外觀形狀亦同樣並無限制必要，惟以能 • 夠與夾溝槽12形成緊密夾置的嵌插結合即為已足。 如附圖所示’本發明所沖削加工的複數個夾溝槽12， 其溝槽形狀係可視實際需求而定，並無限制必要，如圖實 • 施例圖所揭’各夾溝槽12均可沖削形成具有第一凸部121 與第一凸部122，該第一凸部121可於下壓變形後配合第二 凸部122共同夾住散熱片200，使散熱片2〇〇與核心管座1〇〇 結合更為穩固（如第十八圖）。 依上述各種實施例所揭，僅係本發明技術内容的例舉 說明’其並非用以限定本案的技術範圍，舉凡涉及等效應 7 ~十四圖為本發明第二實施例通過沖削加J1與鑽孔加 卫後^/成方形核心管座的成型立體圖。 弟十五圖為第十四圖的斷面圖。 弟十六圖為第十四_上視圖。 圖為本發明第—實施例與散熱片於結合前的局 部示意圖。 第十八圖為本發明第—實施例與散熱片於結合後的局 部示意圖。 第十九圖為本發明以第一實施例與匹配散熱片所組成 具有高密度散熱片的散熱器立體圖。 第二十圖為本發明以第二實施例與匹配散熱片所組成 具有高密度散熱片的散熱器立體圖。 11 封閉面 12 夾溝槽 200 散熱片 13 柱狀體 121 第一凸部 【主要元件符號說明】 1 鋁錠胚料 10 中空管體 100 核心管座 300散熱器 14鎖孔 122第二凸部

Claims (1)

1373385 七、申請專利範圍： 1、 一種散熱器核心管座的製造方法，其實施步驟依序包 . 括： ； (1 )、準備預先定量的鋁錠胚料； (2 )、利用上述定量的鋁錠胚料，先通過擠壓模具的 擠壓成型，進而形成一具有一端封閉面的中空管 體； (3 )、再針對上述中空管體的管體外壁進行複數道的 沖削加工，使管體外壁被沖削形成具有高密度且 3 垂直相鄰分佈的複數個夾溝槽，以此構成一散熱 器的核心管座。 2、 如申請專利範圍第1項所述散熱器核心管座的製造方 法，該沖削加工係包含：粗沖、細沖及精沖等多道工 序，使中空管體的外壁通過不同的沖削刀具，於粗沖 後再經過一次以上的細沖與一次以上的精沖等工序。 3、 如申請專利範圍第1項所述散熱器核心管座的製造方 法，該定量的鋁錠胚料於擠壓成型時，係在中空管體 D 的内壁預設成型複數個柱狀體。 4、 如申請專利範圍第3項所述散熱器核心管座的製造方 法，該t空管體在通過沖削加工後，並在複數個柱狀 體進行鑽孔加工而開設複數個鎖孔。 5、 如申請專利範圍第1項所述散熱器核心管座的製造方 法，該中空管體在通過沖削加工後，並針對中空管體 的封閉面開設一個以上的鎖孔。 6、 如申請專利範圍第1項所述散熱器核心管座的製造方 10
TW099127906A 2010-08-20 2010-08-20 Core tube base for heat radiator and method for manufacturing the same TW201043357A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
TW099127906A TW201043357A (en) 2010-08-20 2010-08-20 Core tube base for heat radiator and method for manufacturing the same
JP2010200719A JP2012044129A (ja) 2010-08-20 2010-09-08 排熱器のコアチューブ座及びその製造方法
US12/885,573 US20120043067A1 (en) 2010-08-20 2010-09-20 Heat sink core member and its fabrication procedure
DE202010008604U DE202010008604U1 (de) 2010-08-20 2010-09-22 Kühlkörper-Kernelement
KR1020100093182A KR20120018039A (ko) 2010-08-20 2010-09-27 히트 싱크 코어 부재 및 그 제조 방법
DE102011000230A DE102011000230A1 (de) 2010-08-20 2011-01-20 Kühlkörper-Kernelement und dessen Herstellungsverfahren

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099127906A TW201043357A (en) 2010-08-20 2010-08-20 Core tube base for heat radiator and method for manufacturing the same

Publications (2)

Publication Number Publication Date
TW201043357A TW201043357A (en) 2010-12-16
TWI373385B true TWI373385B (zh) 2012-10-01

Family

ID=43993224

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099127906A TW201043357A (en) 2010-08-20 2010-08-20 Core tube base for heat radiator and method for manufacturing the same

Country Status (5)

Country Link
US (1) US20120043067A1 (zh)
JP (1) JP2012044129A (zh)
KR (1) KR20120018039A (zh)
DE (2) DE202010008604U1 (zh)
TW (1) TW201043357A (zh)

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Publication number Priority date Publication date Assignee Title
CN102527758B (zh) * 2012-01-20 2014-12-03 东莞汉旭五金塑胶科技有限公司 散热器铝底座的挤压成型模具及其制法
CN103296812B (zh) * 2012-03-05 2017-02-08 德昌电机(深圳)有限公司 马达定子及具有该定子的马达
CN102699632B (zh) * 2012-06-04 2014-07-09 宁波安拓实业有限公司 一种减震器衬套毛坯的制造工艺
CN103406737B (zh) * 2013-08-21 2017-02-22 安徽鸿路钢结构(集团)股份有限公司 双角度圆管柱组装工法
US11134618B2 (en) * 2016-08-30 2021-10-05 Current Lighting Solutions, Llc Luminaire including a heat dissipation structure
US11313631B2 (en) * 2020-07-07 2022-04-26 Hfc Industry Limited Composite heat sink having anisotropic heat transfer metal-graphite composite fins

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JP3453612B2 (ja) * 1994-12-22 2003-10-06 昭和電工株式会社 ピンフィンヒートシンクの製造方法
JP3597640B2 (ja) * 1996-05-24 2004-12-08 蛇の目ミシン工業株式会社 ヒートシンク製造方法
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JP3158105U (ja) * 2009-11-26 2010-03-18 崇賢 ▲黄▼ 電子素子の放熱構造体

Also Published As

Publication number Publication date
DE202010008604U1 (de) 2011-05-12
KR20120018039A (ko) 2012-02-29
TW201043357A (en) 2010-12-16
US20120043067A1 (en) 2012-02-23
JP2012044129A (ja) 2012-03-01
DE102011000230A1 (de) 2012-02-23

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