TWI372586B - Capacitor-embedded substrate and method of manufacturing the same - Google Patents

Capacitor-embedded substrate and method of manufacturing the same

Info

Publication number
TWI372586B
TWI372586B TW097130669A TW97130669A TWI372586B TW I372586 B TWI372586 B TW I372586B TW 097130669 A TW097130669 A TW 097130669A TW 97130669 A TW97130669 A TW 97130669A TW I372586 B TWI372586 B TW I372586B
Authority
TW
Taiwan
Prior art keywords
capacitor
manufacturing
same
embedded substrate
embedded
Prior art date
Application number
TW097130669A
Other languages
English (en)
Other versions
TW200915937A (en
Inventor
Tomoharu Fujii
Masahiro Sunohara
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200915937A publication Critical patent/TW200915937A/zh
Application granted granted Critical
Publication of TWI372586B publication Critical patent/TWI372586B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/236—Terminals leading through the housing, i.e. lead-through
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
TW097130669A 2007-09-12 2008-08-12 Capacitor-embedded substrate and method of manufacturing the same TWI372586B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007236663A JP4912992B2 (ja) 2007-09-12 2007-09-12 キャパシタ内蔵基板及びその製造方法

Publications (2)

Publication Number Publication Date
TW200915937A TW200915937A (en) 2009-04-01
TWI372586B true TWI372586B (en) 2012-09-11

Family

ID=40431597

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097130669A TWI372586B (en) 2007-09-12 2008-08-12 Capacitor-embedded substrate and method of manufacturing the same

Country Status (4)

Country Link
US (1) US8405953B2 (zh)
JP (1) JP4912992B2 (zh)
KR (1) KR101414751B1 (zh)
TW (1) TWI372586B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010027833A1 (de) * 2010-04-15 2011-10-20 E.G.O. Elektro-Gerätebau GmbH Kochgefäß, Heizeinrichtung und Kochsystem
FR2961345A1 (fr) * 2010-06-10 2011-12-16 St Microelectronics Tours Sas Circuit integre passif
JP5732357B2 (ja) * 2011-09-09 2015-06-10 新光電気工業株式会社 配線基板、及び半導体パッケージ
CN102573292B (zh) * 2012-01-04 2014-07-23 桂林电子科技大学 一种内埋置电阻器的印刷电路板及其制造方法
CN102548211B (zh) * 2012-01-04 2015-03-11 桂林电子科技大学 一种内埋置电容器的印刷电路板及其制造方法
US9159718B2 (en) * 2013-03-08 2015-10-13 Taiwan Semiconductor Manufacturing Co., Ltd. Switched capacitor structure
US9293521B2 (en) * 2012-03-02 2016-03-22 Taiwan Semiconductor Manufacturing Co., Ltd. Concentric capacitor structure
US9380705B2 (en) * 2013-03-14 2016-06-28 Analog Devices, Inc. Laterally coupled isolator devices
CN107852830A (zh) * 2015-08-11 2018-03-27 株式会社村田制作所 电容器内置基板的制造方法
US10164614B2 (en) 2016-03-31 2018-12-25 Analog Devices Global Unlimited Company Tank circuit and frequency hopping for isolators
US10184189B2 (en) 2016-07-18 2019-01-22 ECSI Fibrotools, Inc. Apparatus and method of contact electroplating of isolated structures
JP7181406B2 (ja) * 2019-02-18 2022-11-30 長江存儲科技有限責任公司 新規性のあるキャパシタ構造およびそれを形成する方法
US11031373B2 (en) 2019-03-29 2021-06-08 International Business Machines Corporation Spacer for die-to-die communication in an integrated circuit

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4153988A (en) * 1977-07-15 1979-05-15 International Business Machines Corporation High performance integrated circuit semiconductor package and method of making
JPH11204727A (ja) * 1998-01-07 1999-07-30 Toshiba Corp 半導体装置およびその製造方法
KR100512688B1 (ko) * 2003-11-21 2005-09-07 대덕전자 주식회사 캐패시터 내장형 인쇄 회로 기판 제조 방법
JP4387231B2 (ja) * 2004-03-31 2009-12-16 新光電気工業株式会社 キャパシタ実装配線基板及びその製造方法
JP2006005233A (ja) * 2004-06-18 2006-01-05 Shinko Electric Ind Co Ltd キャパシタ、キャパシタ内蔵基板、およびキャパシタの製造方法
JP4575071B2 (ja) * 2004-08-02 2010-11-04 新光電気工業株式会社 電子部品内蔵基板の製造方法
KR100632554B1 (ko) 2004-12-30 2006-10-11 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조방법
KR100867038B1 (ko) * 2005-03-02 2008-11-04 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조방법
KR100716810B1 (ko) * 2005-03-18 2007-05-09 삼성전기주식회사 블라인드 비아홀을 구비한 커패시터 내장형 인쇄회로기판및 그 제조 방법
US7640655B2 (en) * 2005-09-13 2010-01-05 Shinko Electric Industries Co., Ltd. Electronic component embedded board and its manufacturing method
JP2007110017A (ja) * 2005-10-17 2007-04-26 Shinko Electric Ind Co Ltd キャパシタ内蔵基板及びその製造方法
JP4720462B2 (ja) 2005-11-30 2011-07-13 パナソニック株式会社 フレキシブル回路基板およびその製造方法
KR100735339B1 (ko) * 2006-12-29 2007-07-04 삼성전기주식회사 박막 캐패시터 내장형 배선 기판의 제조방법
US7886414B2 (en) * 2007-07-23 2011-02-15 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing capacitor-embedded PCB

Also Published As

Publication number Publication date
KR20090027569A (ko) 2009-03-17
US8405953B2 (en) 2013-03-26
TW200915937A (en) 2009-04-01
JP4912992B2 (ja) 2012-04-11
JP2009070969A (ja) 2009-04-02
KR101414751B1 (ko) 2014-07-04
US20090067116A1 (en) 2009-03-12

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