TWI372174B - Thermal setting type die bonding film and die-donding film - Google Patents
Thermal setting type die bonding film and die-donding filmInfo
- Publication number
- TWI372174B TWI372174B TW098128567A TW98128567A TWI372174B TW I372174 B TWI372174 B TW I372174B TW 098128567 A TW098128567 A TW 098128567A TW 98128567 A TW98128567 A TW 98128567A TW I372174 B TWI372174 B TW I372174B
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- die
- donding
- setting type
- thermal setting
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- Engineering & Computer Science (AREA)
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- Computer Hardware Design (AREA)
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- Chemical Kinetics & Catalysis (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
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JP2009159125A JP4939574B2 (ja) | 2008-08-28 | 2009-07-03 | 熱硬化型ダイボンドフィルム |
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JP5680330B2 (ja) * | 2010-04-23 | 2015-03-04 | 株式会社東芝 | 半導体装置の製造方法 |
JP6013709B2 (ja) * | 2010-06-08 | 2016-10-25 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法 |
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2009
- 2009-07-03 JP JP2009159125A patent/JP4939574B2/ja not_active Expired - Fee Related
- 2009-08-20 CN CN2009101659759A patent/CN101661909B/zh not_active Expired - Fee Related
- 2009-08-25 TW TW098128567A patent/TWI372174B/zh not_active IP Right Cessation
- 2009-08-27 KR KR20090079502A patent/KR20100027014A/ko not_active Application Discontinuation
- 2009-08-28 US US12/549,739 patent/US8143106B2/en not_active Expired - Fee Related
-
2011
- 2011-02-07 KR KR1020110010576A patent/KR101549281B1/ko not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
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KR20100027014A (ko) | 2010-03-10 |
US20120135242A1 (en) | 2012-05-31 |
CN101661909A (zh) | 2010-03-03 |
KR20110019408A (ko) | 2011-02-25 |
US8580617B2 (en) | 2013-11-12 |
JP4939574B2 (ja) | 2012-05-30 |
TW201016821A (en) | 2010-05-01 |
CN101661909B (zh) | 2011-04-27 |
JP2010080921A (ja) | 2010-04-08 |
US20100055842A1 (en) | 2010-03-04 |
KR101549281B1 (ko) | 2015-09-01 |
US8143106B2 (en) | 2012-03-27 |
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