TWI371652B - - Google Patents

Info

Publication number
TWI371652B
TWI371652B TW094136565A TW94136565A TWI371652B TW I371652 B TWI371652 B TW I371652B TW 094136565 A TW094136565 A TW 094136565A TW 94136565 A TW94136565 A TW 94136565A TW I371652 B TWI371652 B TW I371652B
Authority
TW
Taiwan
Application number
TW094136565A
Other languages
Chinese (zh)
Other versions
TW200619843A (en
Inventor
Junya Kusunoki
Takashi Hirano
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of TW200619843A publication Critical patent/TW200619843A/zh
Application granted granted Critical
Publication of TWI371652B publication Critical patent/TWI371652B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • H10W74/40—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • H10W74/137—
    • H10W74/47—

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)
  • Formation Of Insulating Films (AREA)
TW094136565A 2004-10-20 2005-10-19 Semiconductor wafer and semiconductor device TW200619843A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004306116 2004-10-20

Publications (2)

Publication Number Publication Date
TW200619843A TW200619843A (en) 2006-06-16
TWI371652B true TWI371652B (OSRAM) 2012-09-01

Family

ID=36203032

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094136565A TW200619843A (en) 2004-10-20 2005-10-19 Semiconductor wafer and semiconductor device

Country Status (8)

Country Link
US (1) US7915467B2 (OSRAM)
EP (1) EP1804291A4 (OSRAM)
JP (1) JPWO2006043617A1 (OSRAM)
KR (1) KR20070068387A (OSRAM)
CN (1) CN100481404C (OSRAM)
SG (1) SG156657A1 (OSRAM)
TW (1) TW200619843A (OSRAM)
WO (1) WO2006043617A1 (OSRAM)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
UY30892A1 (es) 2007-02-07 2008-09-02 Smithkline Beckman Corp Inhibidores de la actividad akt
JP4765951B2 (ja) * 2007-02-08 2011-09-07 Ｊｓｒ株式会社 絶縁膜を有する大型シリコンウエハおよびその製造方法
WO2008153082A1 (ja) * 2007-06-12 2008-12-18 Sumitomo Bakelite Company Limited 樹脂組成物、埋め込み材、絶縁層および半導体装置
JP5520590B2 (ja) 2009-10-06 2014-06-11 富士フイルム株式会社 パターン形成方法、化学増幅型レジスト組成物及びレジスト膜
EP2676978B1 (en) * 2010-09-02 2015-06-24 Merck Patent GmbH Interlayer for electronic devices
US10457597B2 (en) * 2011-06-17 2019-10-29 Materia, Inc. Adhesion promoters and gel-modifiers for olefin metathesis compositions
WO2013120581A1 (en) * 2012-02-15 2013-08-22 Merck Patent Gmbh Planarization layer for organic electronic devices
US9196559B2 (en) * 2013-03-08 2015-11-24 Taiwan Semiconductor Manufacturing Company, Ltd. Directly sawing wafers covered with liquid molding compound
US10224258B2 (en) * 2013-03-22 2019-03-05 Applied Materials, Inc. Method of curing thermoplastics with microwave energy
JP6318637B2 (ja) * 2014-01-17 2018-05-09 日立金属株式会社 高硬度材料のマルチワイヤソーによる切断方法
JPWO2015141525A1 (ja) * 2014-03-20 2017-04-06 住友ベークライト株式会社 感光性樹脂組成物、および電子装置
DE112015004031T5 (de) * 2014-09-03 2017-06-01 Daicel Corporation Zusammensetzung zum bilden eines überzugsartigen isolierfilms
KR102083654B1 (ko) * 2016-07-29 2020-03-02 주식회사 엘지화학 고리형 올레핀계 공중합체 및 이의 제조 방법
KR102392859B1 (ko) * 2016-10-19 2022-04-29 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제
KR20220061267A (ko) * 2016-10-19 2022-05-12 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제
CN120731398A (zh) * 2023-02-21 2025-09-30 默克专利股份有限公司 具高电子亲和力的经受体取代的euv pag

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2931297A1 (de) * 1979-08-01 1981-02-19 Siemens Ag Waermebestaendige positivresists und verfahren zur herstellung waermebestaendiger reliefstrukturen
JPS6446862A (en) 1987-08-18 1989-02-21 Fujitsu Ltd Bus controller
JP3393453B2 (ja) 1994-02-02 2003-04-07 ジェイエスアール株式会社 光半導体の封止方法
WO1998059004A1 (fr) * 1997-06-20 1998-12-30 Nippon Zeon Co., Ltd. Materiau de protection de composants electroniques
JPH11271973A (ja) * 1998-01-19 1999-10-08 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた半導体素子
US6872456B2 (en) * 2001-07-26 2005-03-29 Dow Corning Corporation Siloxane resins
JP2003075125A (ja) * 2001-09-06 2003-03-12 Okamoto Machine Tool Works Ltd ウエハの厚み測定方法および厚み測定装置
JP2003209104A (ja) * 2002-01-15 2003-07-25 Hitachi Chemical Dupont Microsystems Ltd 半導体装置及びその材料
JP2003268188A (ja) * 2002-03-19 2003-09-25 Jsr Corp 半導体装置およびその製造方法
US7022790B2 (en) * 2002-07-03 2006-04-04 Sumitomo Bakelite Company, Ltd. Photosensitive compositions based on polycyclic polymers
EP1597627A4 (en) * 2003-02-20 2008-01-09 Promerus Llc RESOLUTION SPEED MODULATORS FOR PHOTORESISTAL COMPOSITIONS
JP2004285129A (ja) 2003-03-19 2004-10-14 Nippon Zeon Co Ltd 感光性ポリイミド前駆体、感光性ポリイミド樹脂組成物、及び該樹脂組成物を用いた半導体素子の製造方法
US7875686B2 (en) * 2004-08-18 2011-01-25 Promerus Llc Polycycloolefin polymeric compositions for semiconductor applications
TW200628981A (en) * 2004-09-29 2006-08-16 Sumitomo Bakelite Co Semiconductor device

Also Published As

Publication number Publication date
US7915467B2 (en) 2011-03-29
KR20070068387A (ko) 2007-06-29
US20080090176A1 (en) 2008-04-17
TW200619843A (en) 2006-06-16
EP1804291A4 (en) 2010-09-01
CN100481404C (zh) 2009-04-22
EP1804291A1 (en) 2007-07-04
SG156657A1 (en) 2009-11-26
WO2006043617A1 (ja) 2006-04-27
JPWO2006043617A1 (ja) 2008-05-22
CN101044617A (zh) 2007-09-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees