TWI371652B - - Google Patents
Info
- Publication number
- TWI371652B TWI371652B TW094136565A TW94136565A TWI371652B TW I371652 B TWI371652 B TW I371652B TW 094136565 A TW094136565 A TW 094136565A TW 94136565 A TW94136565 A TW 94136565A TW I371652 B TWI371652 B TW I371652B
- Authority
- TW
- Taiwan
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Materials For Photolithography (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004306116 | 2004-10-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200619843A TW200619843A (en) | 2006-06-16 |
TWI371652B true TWI371652B (zh) | 2012-09-01 |
Family
ID=36203032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094136565A TW200619843A (en) | 2004-10-20 | 2005-10-19 | Semiconductor wafer and semiconductor device |
Country Status (8)
Country | Link |
---|---|
US (1) | US7915467B2 (zh) |
EP (1) | EP1804291A4 (zh) |
JP (1) | JPWO2006043617A1 (zh) |
KR (1) | KR20070068387A (zh) |
CN (1) | CN100481404C (zh) |
SG (1) | SG156657A1 (zh) |
TW (1) | TW200619843A (zh) |
WO (1) | WO2006043617A1 (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
UY30892A1 (es) | 2007-02-07 | 2008-09-02 | Smithkline Beckman Corp | Inhibidores de la actividad akt |
JP4765951B2 (ja) * | 2007-02-08 | 2011-09-07 | Jsr株式会社 | 絶縁膜を有する大型シリコンウエハおよびその製造方法 |
US7999354B2 (en) * | 2007-06-12 | 2011-08-16 | Sumitomo Bakelite Company, Ltd. | Resin composition, filling material, insulating layer and semiconductor device |
JP5520590B2 (ja) | 2009-10-06 | 2014-06-11 | 富士フイルム株式会社 | パターン形成方法、化学増幅型レジスト組成物及びレジスト膜 |
CN105440540A (zh) | 2010-09-02 | 2016-03-30 | 默克专利股份有限公司 | 用于电子器件的夹层 |
PL2721106T3 (pl) | 2011-06-17 | 2021-03-08 | Materia, Inc. | Promotory przyczepności i modyfikatory żelowania dla kompozycji do metatezy olefin |
EP2814855B1 (en) * | 2012-02-15 | 2017-07-26 | Merck Patent GmbH | Planarization layer for organic electronic devices |
US9196559B2 (en) * | 2013-03-08 | 2015-11-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Directly sawing wafers covered with liquid molding compound |
US10224258B2 (en) * | 2013-03-22 | 2019-03-05 | Applied Materials, Inc. | Method of curing thermoplastics with microwave energy |
JP6318637B2 (ja) * | 2014-01-17 | 2018-05-09 | 日立金属株式会社 | 高硬度材料のマルチワイヤソーによる切断方法 |
WO2015141525A1 (ja) * | 2014-03-20 | 2015-09-24 | 住友ベークライト株式会社 | 感光性樹脂組成物、および電子装置 |
WO2016035615A1 (ja) * | 2014-09-03 | 2016-03-10 | 株式会社ダイセル | 塗布型絶縁膜形成用組成物 |
KR102083654B1 (ko) * | 2016-07-29 | 2020-03-02 | 주식회사 엘지화학 | 고리형 올레핀계 공중합체 및 이의 제조 방법 |
KR20220061267A (ko) * | 2016-10-19 | 2022-05-12 | 세키스이가가쿠 고교가부시키가이샤 | 유기 el 표시 소자용 봉지제 |
KR102392859B1 (ko) * | 2016-10-19 | 2022-04-29 | 세키스이가가쿠 고교가부시키가이샤 | 유기 el 표시 소자용 봉지제 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2931297A1 (de) | 1979-08-01 | 1981-02-19 | Siemens Ag | Waermebestaendige positivresists und verfahren zur herstellung waermebestaendiger reliefstrukturen |
JPS6446862A (en) | 1987-08-18 | 1989-02-21 | Fujitsu Ltd | Bus controller |
JP3393453B2 (ja) | 1994-02-02 | 2003-04-07 | ジェイエスアール株式会社 | 光半導体の封止方法 |
JP4754039B2 (ja) * | 1997-06-20 | 2011-08-24 | 日本ゼオン株式会社 | 電子部品オーバーコート材 |
JPH11271973A (ja) * | 1998-01-19 | 1999-10-08 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた半導体素子 |
JP2003075125A (ja) * | 2001-09-06 | 2003-03-12 | Okamoto Machine Tool Works Ltd | ウエハの厚み測定方法および厚み測定装置 |
JP2003209104A (ja) * | 2002-01-15 | 2003-07-25 | Hitachi Chemical Dupont Microsystems Ltd | 半導体装置及びその材料 |
JP2003268188A (ja) * | 2002-03-19 | 2003-09-25 | Jsr Corp | 半導体装置およびその製造方法 |
US7022790B2 (en) * | 2002-07-03 | 2006-04-04 | Sumitomo Bakelite Company, Ltd. | Photosensitive compositions based on polycyclic polymers |
CN101095082B (zh) * | 2003-02-20 | 2012-08-08 | 普罗梅鲁斯有限责任公司 | 光致抗蚀剂组合物用的溶解速率改性剂 |
JP2004285129A (ja) * | 2003-03-19 | 2004-10-14 | Nippon Zeon Co Ltd | 感光性ポリイミド前駆体、感光性ポリイミド樹脂組成物、及び該樹脂組成物を用いた半導体素子の製造方法 |
US7875686B2 (en) * | 2004-08-18 | 2011-01-25 | Promerus Llc | Polycycloolefin polymeric compositions for semiconductor applications |
TW200628981A (en) * | 2004-09-29 | 2006-08-16 | Sumitomo Bakelite Co | Semiconductor device |
-
2005
- 2005-10-19 TW TW094136565A patent/TW200619843A/zh not_active IP Right Cessation
- 2005-10-20 US US11/665,543 patent/US7915467B2/en not_active Expired - Fee Related
- 2005-10-20 KR KR1020077008935A patent/KR20070068387A/ko not_active Application Discontinuation
- 2005-10-20 SG SG200906968-3A patent/SG156657A1/en unknown
- 2005-10-20 WO PCT/JP2005/019275 patent/WO2006043617A1/ja active Application Filing
- 2005-10-20 JP JP2006543052A patent/JPWO2006043617A1/ja active Pending
- 2005-10-20 EP EP05795609A patent/EP1804291A4/en not_active Withdrawn
- 2005-10-20 CN CNB2005800359865A patent/CN100481404C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1804291A4 (en) | 2010-09-01 |
EP1804291A1 (en) | 2007-07-04 |
SG156657A1 (en) | 2009-11-26 |
TW200619843A (en) | 2006-06-16 |
CN101044617A (zh) | 2007-09-26 |
US7915467B2 (en) | 2011-03-29 |
JPWO2006043617A1 (ja) | 2008-05-22 |
WO2006043617A1 (ja) | 2006-04-27 |
CN100481404C (zh) | 2009-04-22 |
KR20070068387A (ko) | 2007-06-29 |
US20080090176A1 (en) | 2008-04-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |