TWI370851B - - Google Patents
Info
- Publication number
- TWI370851B TWI370851B TW100118935A TW100118935A TWI370851B TW I370851 B TWI370851 B TW I370851B TW 100118935 A TW100118935 A TW 100118935A TW 100118935 A TW100118935 A TW 100118935A TW I370851 B TWI370851 B TW I370851B
- Authority
- TW
- Taiwan
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010196226A JP4837785B1 (ja) | 2010-09-01 | 2010-09-01 | インジウムターゲット及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201211290A TW201211290A (en) | 2012-03-16 |
| TWI370851B true TWI370851B (ko) | 2012-08-21 |
Family
ID=45418225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100118935A TW201211290A (en) | 2010-09-01 | 2011-05-31 | Indium target and production method for same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4837785B1 (ko) |
| KR (1) | KR101205264B1 (ko) |
| TW (1) | TW201211290A (ko) |
| WO (1) | WO2012029364A1 (ko) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4948634B2 (ja) | 2010-09-01 | 2012-06-06 | Ｊｘ日鉱日石金属株式会社 | インジウムターゲット及びその製造方法 |
| JP5254290B2 (ja) * | 2010-09-01 | 2013-08-07 | Ｊｘ日鉱日石金属株式会社 | インジウムターゲット及びその製造方法 |
| JP5140169B2 (ja) | 2011-03-01 | 2013-02-06 | Ｊｘ日鉱日石金属株式会社 | インジウムターゲット及びその製造方法 |
| JP5291754B2 (ja) * | 2011-04-15 | 2013-09-18 | 三井金属鉱業株式会社 | 太陽電池用スパッタリングターゲット |
| JP5026611B1 (ja) | 2011-09-21 | 2012-09-12 | Ｊｘ日鉱日石金属株式会社 | 積層構造体及びその製造方法 |
| JP5074628B1 (ja) | 2012-01-05 | 2012-11-14 | Ｊｘ日鉱日石金属株式会社 | インジウム製スパッタリングターゲット及びその製造方法 |
| JP2013227632A (ja) * | 2012-04-26 | 2013-11-07 | Ulvac Japan Ltd | インジウムターゲット及びその製造方法 |
| KR20140054169A (ko) | 2012-08-22 | 2014-05-08 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 인듐제 원통형 스퍼터링 타깃 및 그 제조 방법 |
| JP6021596B2 (ja) * | 2012-11-14 | 2016-11-09 | Ｊｘ金属株式会社 | インジウムスパッタリングターゲット及びその製造方法 |
| JP5855319B2 (ja) | 2013-07-08 | 2016-02-09 | Jx日鉱日石金属株式会社 | スパッタリングターゲット及び、それの製造方法 |
| JP6602550B2 (ja) * | 2014-04-28 | 2019-11-06 | 株式会社アライドマテリアル | スパッタリングターゲット用材料 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57185973A (en) * | 1981-05-07 | 1982-11-16 | Mitsui Mining & Smelting Co Ltd | Production of target for sputtering |
| JP4992843B2 (ja) * | 2008-07-16 | 2012-08-08 | 住友金属鉱山株式会社 | インジウムターゲットの製造方法 |
-
2010
- 2010-09-01 JP JP2010196226A patent/JP4837785B1/ja active Active
-
2011
- 2011-05-20 KR KR1020127015360A patent/KR101205264B1/ko active IP Right Grant
- 2011-05-20 WO PCT/JP2011/061684 patent/WO2012029364A1/ja active Application Filing
- 2011-05-31 TW TW100118935A patent/TW201211290A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012029364A1 (ja) | 2012-03-08 |
| KR101205264B1 (ko) | 2012-11-27 |
| KR20120081633A (ko) | 2012-07-19 |
| JP2012052194A (ja) | 2012-03-15 |
| JP4837785B1 (ja) | 2011-12-14 |
| TW201211290A (en) | 2012-03-16 |