TWI369329B - Substrate transfer apparatus and substrate processing apparatus - Google Patents

Substrate transfer apparatus and substrate processing apparatus

Info

Publication number
TWI369329B
TWI369329B TW097148255A TW97148255A TWI369329B TW I369329 B TWI369329 B TW I369329B TW 097148255 A TW097148255 A TW 097148255A TW 97148255 A TW97148255 A TW 97148255A TW I369329 B TWI369329 B TW I369329B
Authority
TW
Taiwan
Prior art keywords
substrate
processing apparatus
substrate processing
transfer apparatus
substrate transfer
Prior art date
Application number
TW097148255A
Other languages
English (en)
Other versions
TW200938466A (en
Inventor
Akira Harada
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200938466A publication Critical patent/TW200938466A/zh
Application granted granted Critical
Publication of TWI369329B publication Critical patent/TWI369329B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31002—Computer controlled agv conveys workpieces between buffer and cell
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Nonlinear Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Conveyors (AREA)
  • Framework For Endless Conveyors (AREA)
  • Intermediate Stations On Conveyors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW097148255A 2008-03-12 2008-12-11 Substrate transfer apparatus and substrate processing apparatus TWI369329B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008062538A JP5300288B2 (ja) 2008-03-12 2008-03-12 基板搬送装置および基板処理装置

Publications (2)

Publication Number Publication Date
TW200938466A TW200938466A (en) 2009-09-16
TWI369329B true TWI369329B (en) 2012-08-01

Family

ID=41104304

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097148255A TWI369329B (en) 2008-03-12 2008-12-11 Substrate transfer apparatus and substrate processing apparatus

Country Status (4)

Country Link
JP (1) JP5300288B2 (zh)
KR (1) KR101268773B1 (zh)
CN (1) CN101533795B (zh)
TW (1) TWI369329B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462215B (zh) * 2010-03-29 2014-11-21 Dainippon Screen Mfg 基板處理裝置、轉換方法、及轉移方法
JP5912455B2 (ja) * 2011-11-28 2016-04-27 日新イオン機器株式会社 基板割れ検出方法および当該基板割れ検出方法に基づくイオンビーム照射装置の運転方法
CN103207541A (zh) * 2012-01-13 2013-07-17 昆山允升吉光电科技有限公司 一种可以选择不同显影段长度的显影机
US9151597B2 (en) * 2012-02-13 2015-10-06 First Solar, Inc. In situ substrate detection for a processing system using infrared detection
DE102012204030B4 (de) * 2012-03-14 2022-06-09 Krones Ag Vorrichtung zur Übergabe von Artikellagen zwischen benachbarten Modulen
KR101939353B1 (ko) * 2012-06-26 2019-01-16 세메스 주식회사 기판 이송 방법
JP5892210B2 (ja) * 2014-08-04 2016-03-23 岩崎電気株式会社 光配向装置
JP2016167475A (ja) * 2015-03-09 2016-09-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6887616B2 (ja) * 2017-05-09 2021-06-16 日本電気硝子株式会社 ガラス板の搬送装置及びガラス板の製造方法
CN108249139B (zh) * 2017-12-29 2019-04-23 英特尔产品（成都）有限公司 用于基板处理设备间基板传送的控制方法、装置及系统
CN108263861B (zh) * 2018-01-29 2020-10-27 东旭光电科技股份有限公司 基板玻璃传送系统以及用于监控基板玻璃传送的方法
CN111341709B (zh) * 2018-12-18 2022-10-21 北京北方华创微电子装备有限公司 基片传输方法、控制模块和基片传输系统
US11401111B2 (en) 2020-01-21 2022-08-02 SK Hynix Inc. Conveyor apparatus and operating method thereof
CN117316830B (zh) * 2023-11-28 2024-02-02 成都高投芯未半导体有限公司 一种半导体封装系统及控制方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016424U (ja) * 1983-07-13 1985-02-04 第一工業株式会社 袋物荷物の自動仕分装置
JP3330441B2 (ja) * 1993-12-24 2002-09-30 川崎製鉄株式会社 鋼板搬送制御方法
JPH09188414A (ja) * 1996-01-10 1997-07-22 Canon Inc コンベア及び該コンベアを用いたワークの搬送方法
JP2000085955A (ja) * 1998-09-09 2000-03-28 Fuji Photo Film Co Ltd シート材の搬送方法
JP2001127492A (ja) * 1999-10-22 2001-05-11 Yamaha Motor Co Ltd プリント基板搬送コンベア速度可変装置
JP2004299850A (ja) * 2003-03-31 2004-10-28 Dainippon Printing Co Ltd 処理方法及び処理装置

Also Published As

Publication number Publication date
CN101533795A (zh) 2009-09-16
JP5300288B2 (ja) 2013-09-25
KR101268773B1 (ko) 2013-05-29
TW200938466A (en) 2009-09-16
CN101533795B (zh) 2011-01-26
KR20090097774A (ko) 2009-09-16
JP2009215030A (ja) 2009-09-24

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MM4A Annulment or lapse of patent due to non-payment of fees