TWI366069B - Photosensitive resin composition and spacer for liquid crystal panel - Google Patents

Photosensitive resin composition and spacer for liquid crystal panel

Info

Publication number
TWI366069B
TWI366069B TW096143749A TW96143749A TWI366069B TW I366069 B TWI366069 B TW I366069B TW 096143749 A TW096143749 A TW 096143749A TW 96143749 A TW96143749 A TW 96143749A TW I366069 B TWI366069 B TW I366069B
Authority
TW
Taiwan
Prior art keywords
spacer
liquid crystal
resin composition
crystal panel
photosensitive resin
Prior art date
Application number
TW096143749A
Other languages
English (en)
Other versions
TW200823600A (en
Inventor
Kimitaka Morio
Hiroaki Takeuchi
Masatoshi Maeda
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200823600A publication Critical patent/TW200823600A/zh
Application granted granted Critical
Publication of TWI366069B publication Critical patent/TWI366069B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Liquid Crystal (AREA)
TW096143749A 2006-11-22 2007-11-19 Photosensitive resin composition and spacer for liquid crystal panel TWI366069B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006316280A JP4833040B2 (ja) 2006-11-22 2006-11-22 感光性樹脂組成物及び液晶パネル用スペーサ

Publications (2)

Publication Number Publication Date
TW200823600A TW200823600A (en) 2008-06-01
TWI366069B true TWI366069B (en) 2012-06-11

Family

ID=39547161

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096143749A TWI366069B (en) 2006-11-22 2007-11-19 Photosensitive resin composition and spacer for liquid crystal panel

Country Status (4)

Country Link
JP (1) JP4833040B2 (zh)
KR (1) KR100911076B1 (zh)
CN (1) CN101196688B (zh)
TW (1) TWI366069B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5279353B2 (ja) * 2008-06-09 2013-09-04 東京応化工業株式会社 感光性樹脂組成物、感光性樹脂積層体およびパターン形成方法
TWI501027B (zh) * 2008-11-18 2015-09-21 Sumitomo Chemical Co Photosensitive resin composition and display device
KR101717784B1 (ko) * 2009-03-31 2017-03-17 도쿄 오카 고교 가부시키가이샤 감광성 수지 조성물 및 액정 패널
WO2013089403A1 (ko) * 2011-12-13 2013-06-20 주식회사 동진쎄미켐 포토레지스트 조성물
KR102025099B1 (ko) * 2011-12-13 2019-09-25 주식회사 동진쎄미켐 포토레지스트 조성물
JP5327345B2 (ja) * 2012-02-23 2013-10-30 東レ株式会社 ネガ型感光性樹脂組成物、硬化膜、およびタッチパネル用部材。
JP6042544B2 (ja) 2012-08-27 2016-12-14 エルジー・ケム・リミテッド 光配向性共重合体、これを用いた光学異方性フィルムおよびその製造方法
WO2014035116A1 (ko) * 2012-08-27 2014-03-06 주식회사 엘지화학 광배향성 공중합체, 이를 이용한 광학 이방성 필름 및 이의 제조 방법
JP5476490B2 (ja) * 2013-01-18 2014-04-23 東京応化工業株式会社 感光性樹脂組成物、感光性樹脂積層体およびパターン形成方法
JP5890337B2 (ja) * 2013-02-13 2016-03-22 東京応化工業株式会社 感放射線性樹脂組成物、絶縁膜、及び表示装置
TWI656407B (zh) * 2014-06-20 2019-04-11 日商大阪有機化學工業股份有限公司 感光性組合物及其硬化膜
KR102206495B1 (ko) 2015-03-26 2021-01-21 동우 화인켐 주식회사 착색 감광성 수지 조성물
KR102450387B1 (ko) 2015-05-13 2022-10-04 롬엔드하스전자재료코리아유한회사 네거티브형 감광성 수지 조성물 및 이를 이용한 절연막
WO2017001039A1 (en) * 2015-06-30 2017-01-05 Merck Patent Gmbh Polymerisable liquid crystal material and polymerised liquid crystal film
KR101886991B1 (ko) 2017-01-20 2018-08-10 동우 화인켐 주식회사 감광성 수지 조성물, 이를 사용하여 제조된 블랙 매트릭스, 컬럼 스페이서 또는 블랙 컬럼 스페이서를 포함하는 컬러필터, 및 상기 컬러필터를 포함하는 표시장치
CN115960303A (zh) * 2022-12-30 2023-04-14 阜阳欣奕华材料科技有限公司 具有热交联结构的树脂及其制备方法、光敏性树脂组合物、微透镜及其制备方法和光学设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10319597A (ja) * 1997-05-23 1998-12-04 Mitsubishi Electric Corp 感光性シリコーンラダー系樹脂組成物、この樹脂組成物にパターンを転写するパターン転写方法および上記樹脂組成物を用いた半導体装置
JPH11161138A (ja) * 1997-11-26 1999-06-18 Toppan Printing Co Ltd ホログラム記録用媒体及びホログラムの製造方法
JP3509612B2 (ja) * 1998-05-29 2004-03-22 日立化成デュポンマイクロシステムズ株式会社 感光性重合体組成物、レリーフパターンの製造法及び電子部品
JP2000035670A (ja) * 1998-07-21 2000-02-02 Sumitomo Chem Co Ltd 着色感光性樹脂組成物
JP3426531B2 (ja) * 1998-10-30 2003-07-14 日立化成デュポンマイクロシステムズ株式会社 感光性重合体組成物、レリーフパターンの製造法及び電子部品
JP4462679B2 (ja) * 1999-03-30 2010-05-12 旭化成イーマテリアルズ株式会社 シリコン系カップリング剤及びその用途
JP3680128B2 (ja) * 2000-07-04 2005-08-10 富士フイルムエレクトロニクスマテリアルズ株式会社 感放射線硬化性組成物
JP4560222B2 (ja) * 2001-02-28 2010-10-13 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
US20040161619A1 (en) * 2002-12-12 2004-08-19 Arch Specialty Chemicals, Inc. Process for producing a heat resistant relief structure
JP4315010B2 (ja) * 2004-02-13 2009-08-19 Ｊｓｒ株式会社 感放射線性樹脂組成物、表示パネル用スペーサーおよび表示パネル
JP2005283914A (ja) * 2004-03-29 2005-10-13 Fuji Photo Film Co Ltd 着色感光性樹脂組成物、フォトマスク作製材料、フォトマスク及びその製造方法
JP4586623B2 (ja) * 2005-04-28 2010-11-24 日立化成工業株式会社 感光性樹脂組成物及び感光性エレメント、並びにスペーサーの製造方法
KR100731325B1 (ko) * 2005-06-23 2007-06-25 주식회사 삼양이엠에스 음성 레지스트 조성물

Also Published As

Publication number Publication date
CN101196688B (zh) 2012-05-30
JP4833040B2 (ja) 2011-12-07
JP2008129463A (ja) 2008-06-05
KR100911076B1 (ko) 2009-08-06
TW200823600A (en) 2008-06-01
KR20080046560A (ko) 2008-05-27
CN101196688A (zh) 2008-06-11

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