TWI361122B - - Google Patents

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Publication number
TWI361122B
TWI361122B TW97144641A TW97144641A TWI361122B TW I361122 B TWI361122 B TW I361122B TW 97144641 A TW97144641 A TW 97144641A TW 97144641 A TW97144641 A TW 97144641A TW I361122 B TWI361122 B TW I361122B
Authority
TW
Taiwan
Prior art keywords
vibration
ultrasonic
amplitude
bonding
amplifier
Prior art date
Application number
TW97144641A
Other languages
English (en)
Chinese (zh)
Other versions
TW201000238A (en
Inventor
Nobuyuki Aoyagi
Kohei Seyama
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW201000238A publication Critical patent/TW201000238A/zh
Application granted granted Critical
Publication of TWI361122B publication Critical patent/TWI361122B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
TW97144641A 2008-06-30 2008-11-19 Bonding device TW201000238A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008169797A JP4314313B1 (ja) 2008-06-30 2008-06-30 ボンディング装置

Publications (2)

Publication Number Publication Date
TW201000238A TW201000238A (en) 2010-01-01
TWI361122B true TWI361122B (https=) 2012-04-01

Family

ID=41036723

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97144641A TW201000238A (en) 2008-06-30 2008-11-19 Bonding device

Country Status (5)

Country Link
US (1) US8800843B2 (https=)
JP (1) JP4314313B1 (https=)
CN (1) CN102077334B (https=)
TW (1) TW201000238A (https=)
WO (1) WO2010001500A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580503B (zh) * 2014-03-14 2017-05-01 華祥股份有限公司 接合裝置
TWI580504B (zh) * 2014-05-09 2017-05-01 華祥股份有限公司 接合裝置

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101417252B1 (ko) * 2012-02-24 2014-07-08 엘지이노텍 주식회사 카메라 모듈의 기판 접합 장치
JP5960292B2 (ja) * 2013-01-15 2016-08-02 日産自動車株式会社 接合状態検査方法
WO2017109990A1 (ja) * 2015-12-25 2017-06-29 株式会社カイジョー ワイヤボンディング装置
JP6316340B2 (ja) * 2016-06-02 2018-04-25 株式会社カイジョー ボンディング装置、ボンディング方法及びボンディング制御プログラム
KR102206867B1 (ko) * 2016-09-07 2021-01-25 가부시키가이샤 신가와 와이어 본딩 장치
JP7008370B2 (ja) * 2018-07-11 2022-02-14 株式会社新川 ワイヤボンディング装置
CN112585732B (zh) * 2018-08-06 2024-10-11 株式会社新川 接合头
CN109702315B (zh) * 2018-12-27 2024-05-03 东莞市鸿振超声波设备有限公司 一种利用位置与压力触发的超声波控制电路及焊接方法
US11901329B2 (en) * 2019-06-17 2024-02-13 Kaijo Corporation Wire bonding method and wire bonding apparatus
JP7577501B2 (ja) * 2020-10-07 2024-11-05 株式会社東芝 超音波接合装置、制御装置及び制御方法
KR102622020B1 (ko) * 2021-02-22 2024-01-08 가부시키가이샤 신가와 와이어 본딩 장치
JP7209416B1 (ja) * 2021-06-14 2023-01-20 株式会社新川 超音波ホーンおよび半導体装置の製造装置
JP7343941B2 (ja) * 2021-06-17 2023-09-13 株式会社新川 超音波複合振動装置および半導体装置の製造装置
US11691214B2 (en) * 2021-10-17 2023-07-04 Shinkawa Ltd. Ultrasound horn
US11798911B1 (en) * 2022-04-25 2023-10-24 Asmpt Singapore Pte. Ltd. Force sensor in an ultrasonic wire bonding device
JP2024011603A (ja) * 2022-07-15 2024-01-25 株式会社新川 半導体装置の製造装置および製造方法
NL2033279B1 (en) 2022-10-11 2024-04-26 Canon Kk Bonding tool for connecting a printhead unit to an FPC
US20240116126A1 (en) * 2022-10-11 2024-04-11 Asmpt Singapore Pte. Ltd. Ultrasonic transducer operable at multiple resonant frequencies
US20240116127A1 (en) * 2022-10-11 2024-04-11 Asmpt Singapore Pte. Ltd. Ultrasonic transducer operable at multiple resonant frequencies
JP7510203B2 (ja) * 2022-11-08 2024-07-03 株式会社新川 クランプ装置並びにその制御方法及び制御プログラム
JP7592331B2 (ja) * 2023-03-22 2024-12-02 株式会社新川 ワイヤボンディング装置及び該装置の較正方法
WO2025105065A1 (ja) * 2023-11-15 2025-05-22 株式会社新川 キャピラリを交換する方法及びワイヤボンディング装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2705423B2 (ja) * 1992-01-24 1998-01-28 株式会社日立製作所 超音波接合装置及び品質モニタリング方法
JPH10256320A (ja) * 1997-03-12 1998-09-25 Toshiba Mechatronics Kk 半導体製造装置
WO2004073914A1 (en) * 1999-11-10 2004-09-02 Asm Technology Singapore Pte Ltd. Force sensing apparatus
US6279810B1 (en) * 2000-02-23 2001-08-28 Asm Assembly Automation Ltd Piezoelectric sensor for measuring bonding parameters
JP3818932B2 (ja) * 2002-03-04 2006-09-06 株式会社カイジョー ワイヤボンディング装置
JP4679454B2 (ja) * 2006-07-13 2011-04-27 株式会社新川 ワイヤボンディング装置
CN100556602C (zh) * 2007-12-24 2009-11-04 哈尔滨工业大学 超声波辅助激光钎焊或激光钎熔焊的方法
JP5206224B2 (ja) 2008-08-21 2013-06-12 横浜ゴム株式会社 空気入りタイヤ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580503B (zh) * 2014-03-14 2017-05-01 華祥股份有限公司 接合裝置
TWI580504B (zh) * 2014-05-09 2017-05-01 華祥股份有限公司 接合裝置

Also Published As

Publication number Publication date
US8800843B2 (en) 2014-08-12
US20110155789A1 (en) 2011-06-30
TW201000238A (en) 2010-01-01
CN102077334B (zh) 2013-05-01
WO2010001500A1 (ja) 2010-01-07
JP4314313B1 (ja) 2009-08-12
JP2010010510A (ja) 2010-01-14
CN102077334A (zh) 2011-05-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees