TWI357162B - - Google Patents
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- Publication number
- TWI357162B TWI357162B TW096126033A TW96126033A TWI357162B TW I357162 B TWI357162 B TW I357162B TW 096126033 A TW096126033 A TW 096126033A TW 96126033 A TW96126033 A TW 96126033A TW I357162 B TWI357162 B TW I357162B
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- electrode
- current
- semiconductor
- semiconductor layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006243691A JP2008066554A (ja) | 2006-09-08 | 2006-09-08 | 半導体発光素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200824151A TW200824151A (en) | 2008-06-01 |
| TWI357162B true TWI357162B (https=) | 2012-01-21 |
Family
ID=39288981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096126033A TW200824151A (en) | 2006-09-08 | 2007-07-17 | Semiconductor light-emitting device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2008066554A (https=) |
| KR (1) | KR100914110B1 (https=) |
| TW (1) | TW200824151A (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2234182B1 (en) | 2007-12-28 | 2016-11-09 | Nichia Corporation | Semiconductor light emitting element and method for manufacturing the same |
| JP5150367B2 (ja) * | 2008-05-27 | 2013-02-20 | 東芝ディスクリートテクノロジー株式会社 | 発光装置及びその製造方法 |
| TWI424587B (zh) * | 2008-06-30 | 2014-01-21 | Luxtaltek Corp | Light emitting diodes with nanoscale surface structure and embossing molds forming nanometer scale surface structures |
| JP5687858B2 (ja) * | 2010-07-30 | 2015-03-25 | スタンレー電気株式会社 | 半導体発光装置 |
| JP5736930B2 (ja) * | 2011-04-19 | 2015-06-17 | 日亜化学工業株式会社 | 半導体発光素子 |
| JP2013183032A (ja) * | 2012-03-02 | 2013-09-12 | Toshiba Corp | 半導体発光素子 |
| CN103887418B (zh) * | 2012-12-22 | 2017-06-30 | 赛恩倍吉科技顾问(深圳)有限公司 | 发光芯片组合 |
| JP6287317B2 (ja) * | 2013-02-28 | 2018-03-07 | 日亜化学工業株式会社 | 半導体発光素子 |
| JP2014229648A (ja) * | 2013-05-20 | 2014-12-08 | シャープ株式会社 | 半導体発光素子 |
| WO2015156123A1 (ja) * | 2014-04-07 | 2015-10-15 | 旭化成イーマテリアルズ株式会社 | 光学基材及びその製造方法、並びに、積層体、レジスト剥離液 |
| JP7354943B2 (ja) | 2020-07-03 | 2023-10-03 | 信越半導体株式会社 | 接合型半導体受光素子及び接合型半導体受光素子の製造方法 |
| JP7413941B2 (ja) * | 2020-07-03 | 2024-01-16 | 信越半導体株式会社 | 接合型半導体素子及び接合型半導体素子の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0818100A (ja) * | 1994-06-24 | 1996-01-19 | Showa Denko Kk | 化合物半導体発光ダイオード |
| DE19943406C2 (de) | 1999-09-10 | 2001-07-19 | Osram Opto Semiconductors Gmbh | Lichtemissionsdiode mit Oberflächenstrukturierung |
| US7102175B2 (en) * | 2003-04-15 | 2006-09-05 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light-emitting device and method for fabricating the same |
| JP2006049855A (ja) * | 2004-06-28 | 2006-02-16 | Matsushita Electric Ind Co Ltd | 半導体発光素子およびその製造方法 |
| JP4371029B2 (ja) * | 2004-09-29 | 2009-11-25 | サンケン電気株式会社 | 半導体発光素子およびその製造方法 |
-
2006
- 2006-09-08 JP JP2006243691A patent/JP2008066554A/ja active Pending
-
2007
- 2007-07-17 TW TW096126033A patent/TW200824151A/zh not_active IP Right Cessation
- 2007-08-23 KR KR1020070084788A patent/KR100914110B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR100914110B1 (ko) | 2009-08-27 |
| JP2008066554A (ja) | 2008-03-21 |
| KR20080023116A (ko) | 2008-03-12 |
| TW200824151A (en) | 2008-06-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |