TWI355220B - Circuit board structure - Google Patents

Circuit board structure Download PDF

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Publication number
TWI355220B
TWI355220B TW097126624A TW97126624A TWI355220B TW I355220 B TWI355220 B TW I355220B TW 097126624 A TW097126624 A TW 097126624A TW 97126624 A TW97126624 A TW 97126624A TW I355220 B TWI355220 B TW I355220B
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Taiwan
Prior art keywords
circuit board
board structure
dimensional
line pattern
circuit
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TW097126624A
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English (en)
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TW201004516A (en
Inventor
Cheng Po Yu
Han Pei Huang
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Unimicron Technology Corp
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Priority to TW097126624A priority Critical patent/TWI355220B/zh
Priority to US12/260,096 priority patent/US20100006327A1/en
Publication of TW201004516A publication Critical patent/TW201004516A/zh
Priority to US13/301,812 priority patent/US8436254B2/en
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Publication of TWI355220B publication Critical patent/TWI355220B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09163—Slotted edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Description

1355220 九、發明說明： 【發明所屬之技術領域】 本發明係有關於電路板技術領域，特別是有關於一種具有立 . 體電路結構的電路板以及其製作方法。 【先前技術】 • 如熟習該項技藝者所知，電路板是各種電子產品中的主要部 件’用來承載各種電子元件’例如晶片、電阻、f料等。電路 板上有多層的導線，用來連結這些電子元件。 隨著電子產品朝輕薄短小發展，在各種不同的應用場合中， 例如’無線通訊領域、攜帶型電子產品、汽車儀表板等等，電路 板往往被置放於有限的產品内部空間中，或者是另透過排線及模 籲組化的接頭’將電子產品的電子元件外接至電路板，例如汽車儀 表板或者設有電子舰財姑。此時，若是能財效利用基材 献模域_表_立體線路柄，減少猶較用，如此將 此更有效的糊產品内部空間，大幅增減計彈性。然而，習知 =電路板雜_在平錄_膠基滅鋪基板上形成二維的 導線圖案，而無法製作出三度空間的立體線路。 【發明内容】

Claims (1)

1355220 十、申請專利範圍： 100年9月23日修正替換頁 1. 一種電路板結構，包含有： 一電路板主體；以及
區射出成型的立體電路元件，至少包·該電路板主體的部分 妹媳其中該立體電路几件具有一模塑本體，其為非平板的立體 ’在賴塑本_至少—外表平社，形成有—第一立體線 θ案’其透過一導電穿孔與該電路板主體上的-接觸塾電連接。 如申請專郷圍第1項所述之電路板結構，其中該電路板主 體包含硬板、軟板、軟硬複合板或軟硬結合板。 如申請專利範圍第1項所述之電路板結構，其中該電^^板主 體包含兩層板或兩層以上之多層板。 如申請專利範圍第丨項所述之電路板結構，其中該電路板主 體包含一核心層。 如申請專利範圍第1項所述之電路板結構，其中該模塑本體 由塑性材料所構成，包括工程塑膠或者陶瓷。 如申請專職圍第5項所述之電路板結構，其中該工程塑膠 選自於由聚碳酸酯樹脂(p〇lycarb〇n&te，pc)、丙烯-丁二稀-苯乙 (acrylonitrile-butadiene-styrene copolymer, ABS 15 1355220 7. 8. 9. 10. 11. 12. 100年9月23曰修正替換頁 copolymer)、聚對苯二曱酸乙二黯(polyettiylene terephthalate, PET)樹脂、聚對苯二曱酸丁二醋(polybutylene terephthalate， PBT)樹脂、液晶高分子(LCP)、聚醯胺6(polyamide6, PA6)、 尼龍(Nylon)、共聚聚曱醛(POM)、聚笨疏醚(pps)及環狀烯烴 共聚尚分子(COC)所組成的群組。 如申5月專利乾圍第5項所述之電路板結構，其中該工程塑膠 包含觸媒顆粒。 如申喷專利範圍第7項所述之電路板結構，其中該觸媒顆粒 包含氧化銅、氮化紹顆粒或把金屬顆粒。 如申請專利範圍第7項所述之電路板結構，其中該觸媒顆粒 選自於由猛、絡、把、銅、紹以及麵所組成的群組。 如申請專利翻第i項所述之電路板結構，其中該電路板主 =第-面上形成有-共面的第—線路圖案，該電路板主體 的弟-面上形成有—共面的苐二線路圖案。 ==項所述之電路板結構，其中該第-線路 路圖案。 歹1且該換塑本體部分覆蓋住該第-線
如申請專機㈣㈣所叙電顿结構，其找模塑本 體 畚 16 1355220 邊緣與該祕圖案的邊緣切齊。一 13.圍第!項所述之電路板結構，其中該電路板主 體上具有一第二立體線路圖案。 14· 一種電路板結構的製作方法，包含有： 提供一電路板主體；
_===r酬恤，構成, 立體線路圖案，構 在模塑本體之至少一外表平面上形成一第一 成一立體電路元件。 15. —種電路板結構的製作方法，包含有： 提供一電路板主體； 利用射出成型物料將該電路板主體至少部分包覆，構成一包覆 於该電路板主體上的模塑本體；以及 將該模塑本體包覆在該電路板主體後，在模塑本體上形成一第 一立體線路圖案，構成一立體電路元件。 16·如申5月專利範圍第14或15項所述之電路板結構，其中該模 』本體係_低射丨壓力或低細溫度將射丨成型物料直接 射出而成。 17 17 L100年9月23曰修正替換頁 •如申相專利範圍第14或15項所述之電路' 路板主體包含硬板、軟板、軟硬複合板或軟硬結合板。 18·如申請專利範圍第14或15項所述之電路板結構，其中該電 路板主體包含兩層板、或兩層以上之多層板。 19.如申請專利範圍第14或15項所述之電路板結構，其中該電 路板主體包含一核心層。 20.如申請專利範圍第14或15項所述之電路板結構，其中該模 塑本體由塑性材料所構成，包括工程塑膠或者陶堯。 21.如申凊專利範圍第20項所述之電路板結構，其中該工程塑膠 選自於由聚碳酸酯樹脂(polycarbonate，PC)、丙烯-丁二稀-苯乙 烯共聚合物（acrylonitrile-butadiene-styrene copolymer，ABS copolymer)、聚對苯二甲酸乙二酯(p〇lyethyleneterephthalate， PET)^月曰、t對;φ；—甲酸丁一酉旨(polybutylene terephthalate, 1>31')樹月日、液日日向分子(1^^)、聚酿胺6^〇1丫&11^€16 6，？八6)、 尼龍(Nylon)、共聚聚甲醛(POM)、聚苯硫醚(pps)及環狀烯烴 共聚高分子(COC)所組成的群組^ 22，如申請專利範圍第20項所述之電路板結構，其中該工程塑膠 包含觸媒顆粒。 $ 18 1355220 100年9月23日修正替換百 —''' ---^ 23.如I請專利範圍第22項所述之電路板結構，其中賴媒顆粒 包含氧化鋼、氮化鋁顆粒或鈀金屬顆粒。 =申請專利範圍第π項所述之電路板結構，其中該觸媒顆粒 選自於由盆、鉻、銘、銅、銘以及靖組成的群組。 25.如申請專利範圍m或I5項所述之電路板結構，其中該電 路板主體的第-面上形成有一共面的第一線路圖案，該電路 板主體的第—面上形成有-共面的第二線路圖案。 26·如申請專利範圍第25項所述之電路板結構，其中該第一線路 圖案呈矩形鱗列_，且賴鉢體部分覆蓋健第一線 路圖案。 27·如申料利範圍第25項所述之電路板結構，其巾該模塑本體 邊緣與該第-線路圖案的邊緣切齊。 28. 如申明專利乾圍第M或^所述之電路板結構，其中該電路 板主體上具有—第二立體線路圖案。 29. 如申。月專利耗圍第^或^項所述之電路板結構，其中該第 -立體線路圖案係、利用雷射直接成型技術(1繼血如 g’ S) Μ 細集成加工技術(mjcr〇sc〇pic integrated 19 1355220 _ 100年9月23日修正替換頁 processing technology, MIPTEC)或雙料射出成型技術(two-shot molding)形成。 Η—、圖式：
20 22 13-55220
10b ^ 第2C圖 IJ55220
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第3C圖 13-55220 «
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第4B圖 c S ) 1355220
322a
第5B圖
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US13/301,812 US8436254B2 (en) 2008-07-14 2011-11-22 Method of fabricating circuit board structure

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US8436254B2 (en) 2013-05-07

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