TW200704336A - Method of low-pressure injection molding for PCB protection casing - Google Patents

Method of low-pressure injection molding for PCB protection casing

Info

Publication number
TW200704336A
TW200704336A TW094122703A TW94122703A TW200704336A TW 200704336 A TW200704336 A TW 200704336A TW 094122703 A TW094122703 A TW 094122703A TW 94122703 A TW94122703 A TW 94122703A TW 200704336 A TW200704336 A TW 200704336A
Authority
TW
Taiwan
Prior art keywords
low
protection casing
injection molding
pcb
pressure injection
Prior art date
Application number
TW094122703A
Other languages
Chinese (zh)
Inventor
Bo-Yao Zhang
Original Assignee
Teckon Ind Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teckon Ind Corp filed Critical Teckon Ind Corp
Priority to TW094122703A priority Critical patent/TW200704336A/en
Publication of TW200704336A publication Critical patent/TW200704336A/en

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

This invention relates to a method of low-pressure injection molding PCB protection casing, which utilizes low injection pressure and low molding temperature, causing no damage to the electronic components and wiring, to directly inject and thus cover a PCB so that a protection casing for protecting the PCB and the electronic components and wiring carried thereon is formed.
TW094122703A 2005-07-05 2005-07-05 Method of low-pressure injection molding for PCB protection casing TW200704336A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094122703A TW200704336A (en) 2005-07-05 2005-07-05 Method of low-pressure injection molding for PCB protection casing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094122703A TW200704336A (en) 2005-07-05 2005-07-05 Method of low-pressure injection molding for PCB protection casing

Publications (1)

Publication Number Publication Date
TW200704336A true TW200704336A (en) 2007-01-16

Family

ID=57910588

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094122703A TW200704336A (en) 2005-07-05 2005-07-05 Method of low-pressure injection molding for PCB protection casing

Country Status (1)

Country Link
TW (1) TW200704336A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8436254B2 (en) 2008-07-14 2013-05-07 Unimicron Technology Corp. Method of fabricating circuit board structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8436254B2 (en) 2008-07-14 2013-05-07 Unimicron Technology Corp. Method of fabricating circuit board structure

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