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Application filed by Teckon Ind CorpfiledCriticalTeckon Ind Corp
Priority to TW094122703ApriorityCriticalpatent/TW200704336A/en
Publication of TW200704336ApublicationCriticalpatent/TW200704336A/en
This invention relates to a method of low-pressure injection molding PCB protection casing, which utilizes low injection pressure and low molding temperature, causing no damage to the electronic components and wiring, to directly inject and thus cover a PCB so that a protection casing for protecting the PCB and the electronic components and wiring carried thereon is formed.
TW094122703A2005-07-052005-07-05Method of low-pressure injection molding for PCB protection casing
TW200704336A
(en)