SG140556A1 - Integrated circuit system having strained transistor - Google Patents
Integrated circuit system having strained transistorInfo
- Publication number
- SG140556A1 SG140556A1 SG200706053-6A SG2007060536A SG140556A1 SG 140556 A1 SG140556 A1 SG 140556A1 SG 2007060536 A SG2007060536 A SG 2007060536A SG 140556 A1 SG140556 A1 SG 140556A1
- Authority
- SG
- Singapore
- Prior art keywords
- integrated circuit
- circuit system
- strained transistor
- wafer
- formation layer
- Prior art date
Links
- 230000015572 biosynthetic process Effects 0.000 abstract 3
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 230000004048 modification Effects 0.000 abstract 1
- 238000012986 modification Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823807—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the channel structures, e.g. channel implants, halo or pocket implants, or channel materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823864—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate sidewall spacers, e.g. double spacers, particular spacer material or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
- H01L29/7843—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate the means being an applied insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
INTEGRATED CIRCUIT SYSTEM HAVING STRAINED TRANSISTOR An integrated circuit system is provided including forming a circuit element on a wafer, forming a stress formation layer on the wafer, protecting a portion of the stress formation layer, and irradiating the wafer for modification of a stress value of an unprotected portion of the stress formation layer.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/465,799 US20080044967A1 (en) | 2006-08-19 | 2006-08-19 | Integrated circuit system having strained transistor |
Publications (1)
Publication Number | Publication Date |
---|---|
SG140556A1 true SG140556A1 (en) | 2008-03-28 |
Family
ID=39101853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200706053-6A SG140556A1 (en) | 2006-08-19 | 2007-08-17 | Integrated circuit system having strained transistor |
Country Status (2)
Country | Link |
---|---|
US (1) | US20080044967A1 (en) |
SG (1) | SG140556A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7790540B2 (en) * | 2006-08-25 | 2010-09-07 | International Business Machines Corporation | Structure and method to use low k stress liner to reduce parasitic capacitance |
US7629273B2 (en) * | 2006-09-19 | 2009-12-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for modulating stresses of a contact etch stop layer |
US8274115B2 (en) * | 2008-03-19 | 2012-09-25 | Globalfoundries Singapore Pte. Ltd. | Hybrid orientation substrate with stress layer |
US20090289280A1 (en) * | 2008-05-22 | 2009-11-26 | Da Zhang | Method for Making Transistors and the Device Thereof |
US8999863B2 (en) * | 2008-06-05 | 2015-04-07 | Globalfoundries Singapore Pte. Ltd. | Stress liner for stress engineering |
DE102009039420A1 (en) * | 2009-08-31 | 2011-03-03 | GLOBALFOUNDRIES Dresden Module One Ltd. Liability Company & Co. KG | Strain adjustment in strained dielectric materials of semiconductor devices by stress relaxation based on radiation |
DE102009039521B4 (en) * | 2009-08-31 | 2018-02-15 | Globalfoundries Dresden Module One Llc & Co. Kg | Improved filling conditions in an exchange gate process using a tensioned topcoat |
CN102024760B (en) * | 2009-09-18 | 2012-10-31 | 中芯国际集成电路制造(上海)有限公司 | Method for manufacturing semiconductor device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6803270B2 (en) * | 2003-02-21 | 2004-10-12 | International Business Machines Corporation | CMOS performance enhancement using localized voids and extended defects |
US6882025B2 (en) * | 2003-04-25 | 2005-04-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Strained-channel transistor and methods of manufacture |
US6881635B1 (en) * | 2004-03-23 | 2005-04-19 | International Business Machines Corporation | Strained silicon NMOS devices with embedded source/drain |
US7053400B2 (en) * | 2004-05-05 | 2006-05-30 | Advanced Micro Devices, Inc. | Semiconductor device based on Si-Ge with high stress liner for enhanced channel carrier mobility |
DE102004026149B4 (en) * | 2004-05-28 | 2008-06-26 | Advanced Micro Devices, Inc., Sunnyvale | A method of producing a semiconductor device having transistor elements with voltage-inducing etch stop layers |
US20060105106A1 (en) * | 2004-11-16 | 2006-05-18 | Applied Materials, Inc. | Tensile and compressive stressed materials for semiconductors |
US7442597B2 (en) * | 2005-02-02 | 2008-10-28 | Texas Instruments Incorporated | Systems and methods that selectively modify liner induced stress |
-
2006
- 2006-08-19 US US11/465,799 patent/US20080044967A1/en not_active Abandoned
-
2007
- 2007-08-17 SG SG200706053-6A patent/SG140556A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20080044967A1 (en) | 2008-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG140556A1 (en) | Integrated circuit system having strained transistor | |
TW200739972A (en) | Light-emitting device and method for manufacturing the same | |
EP1950177A4 (en) | Semiconductor thin film, method for producing same, and thin film transistor | |
GB0816666D0 (en) | Semiconductor field effect transistor and method for fabricating the same | |
HK1117270A1 (en) | Substrate and method of fabricating the same, and semiconductor device and method of fabricating the same | |
TW200733315A (en) | A semiconductor device and a manufacturing method thereof | |
GB0821002D0 (en) | Compound semiconductor epitaxial substrate and method for producing the same | |
TW200715708A (en) | Electronic substrate, manufacturing method for electronic substrate, and electronic device | |
TW200707678A (en) | Die package with asymmetric leadframe connection | |
TW200618110A (en) | Method of forming a transistor having a dual layer dielectric | |
EP2075847A4 (en) | Silicon carbide semiconductor device and method for fabricating the same | |
SG155152A1 (en) | Integrated circuit system employing resistance altering techniques | |
GB2434687B (en) | Thin film transistor array substrate system and method for manufacturing | |
TW200616105A (en) | Integrated low-k hard mask | |
SG149753A1 (en) | Integrated circuit shield structure and method of fabrication thereof | |
TW200740277A (en) | An active illumination apparatus and fabrication method thereof | |
SG161183A1 (en) | Integrated circuit system employing stress-engineered layers | |
GB2441701B (en) | Method for forming organic semiconductor film, organic semiconductor film, and organic thin film transistor | |
TW200717585A (en) | Manufacturing method for electronic substrate, manufacturing method for electro-optical device, and manufacturing method for electronic device | |
EP2023387A4 (en) | Semiconductor device, electronic parts module, and method for manufacturing the semiconductor device | |
TW200742099A (en) | Silicon carbon germanium (SiCGe) substrate for a group III nitride-based device | |
TW200741863A (en) | Method and device for depositing a protective layer during an etching procedure | |
TWI320599B (en) | Semiconductor device, method of fabricating the same, and patterning mask utilized by the method | |
TW200744202A (en) | Image sensor and methods of fabricating the same | |
EP2160754A4 (en) | Method for selectively forming symmetrical or asymmetrical features using a symmetrical photomask during fabrication of a semiconductor device and electronic systems including the semiconductor device |