TWI354531B - - Google Patents
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- Publication number
- TWI354531B TWI354531B TW97125176A TW97125176A TWI354531B TW I354531 B TWI354531 B TW I354531B TW 97125176 A TW97125176 A TW 97125176A TW 97125176 A TW97125176 A TW 97125176A TW I354531 B TWI354531 B TW I354531B
- Authority
- TW
- Taiwan
- Prior art keywords
- ceramic substrate
- ceramic
- recess
- solder
- solderable metal
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 claims description 83
- 239000000758 substrate Substances 0.000 claims description 73
- 239000002184 metal Substances 0.000 claims description 50
- 229910052751 metal Inorganic materials 0.000 claims description 50
- 229910000679 solder Inorganic materials 0.000 claims description 35
- 230000017525 heat dissipation Effects 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 229910052763 palladium Inorganic materials 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001493 electron microscopy Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97125176A TW201004546A (en) | 2008-07-04 | 2008-07-04 | Ceramic substrate structure and method thereof with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97125176A TW201004546A (en) | 2008-07-04 | 2008-07-04 | Ceramic substrate structure and method thereof with heat dissipation function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201004546A TW201004546A (en) | 2010-01-16 |
| TWI354531B true TWI354531B (cs) | 2011-12-11 |
Family
ID=44825910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97125176A TW201004546A (en) | 2008-07-04 | 2008-07-04 | Ceramic substrate structure and method thereof with heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201004546A (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI398596B (zh) * | 2010-11-08 | 2013-06-11 | Jia-Shing Wong | LED lamp module of the process |
-
2008
- 2008-07-04 TW TW97125176A patent/TW201004546A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW201004546A (en) | 2010-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |