TW201004546A - Ceramic substrate structure and method thereof with heat dissipation function - Google Patents
Ceramic substrate structure and method thereof with heat dissipation function Download PDFInfo
- Publication number
- TW201004546A TW201004546A TW97125176A TW97125176A TW201004546A TW 201004546 A TW201004546 A TW 201004546A TW 97125176 A TW97125176 A TW 97125176A TW 97125176 A TW97125176 A TW 97125176A TW 201004546 A TW201004546 A TW 201004546A
- Authority
- TW
- Taiwan
- Prior art keywords
- ceramic substrate
- ceramic
- recess
- solder
- heat dissipation
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 84
- 239000000758 substrate Substances 0.000 title claims abstract description 77
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 54
- 229910052751 metal Inorganic materials 0.000 claims abstract description 54
- 229910000679 solder Inorganic materials 0.000 claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 229910052763 palladium Inorganic materials 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 2
- 235000021419 vinegar Nutrition 0.000 description 2
- 239000000052 vinegar Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005363 electrowinning Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97125176A TW201004546A (en) | 2008-07-04 | 2008-07-04 | Ceramic substrate structure and method thereof with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97125176A TW201004546A (en) | 2008-07-04 | 2008-07-04 | Ceramic substrate structure and method thereof with heat dissipation function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201004546A true TW201004546A (en) | 2010-01-16 |
| TWI354531B TWI354531B (cs) | 2011-12-11 |
Family
ID=44825910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97125176A TW201004546A (en) | 2008-07-04 | 2008-07-04 | Ceramic substrate structure and method thereof with heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201004546A (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI398596B (zh) * | 2010-11-08 | 2013-06-11 | Jia-Shing Wong | LED lamp module of the process |
-
2008
- 2008-07-04 TW TW97125176A patent/TW201004546A/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI398596B (zh) * | 2010-11-08 | 2013-06-11 | Jia-Shing Wong | LED lamp module of the process |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI354531B (cs) | 2011-12-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101299908B (zh) | 用于制造具有嵌入式元件的印刷电路板的方法 | |
| TWI294757B (en) | Circuit board with a through hole wire, and forming method thereof | |
| JP4789671B2 (ja) | 発光素子用配線基板ならびに発光装置 | |
| CN107123601B (zh) | 一种高散热器件封装结构和板级制造方法 | |
| JP2014503997A (ja) | 電子デバイス、その製作方法、及び電子デバイスを備えているプリント基板 | |
| CN108550566B (zh) | 基于纳米银焊膏的SiC器件三维堆叠互连结构及制备方法 | |
| KR101986855B1 (ko) | 발광 부품용 회로와 그 제조 방법 | |
| TW201041496A (en) | A manufacturing method of circuit board module equipped with heat sink, and its product | |
| CN103874345B (zh) | 一种利用陶瓷基片制作多层微波电路的方法 | |
| JP2006066519A (ja) | 発光素子用配線基板ならびに発光装置 | |
| JP2006041230A (ja) | 発光素子用配線基板ならびに発光装置 | |
| JP5212359B2 (ja) | 多層配線基板及びその製造方法 | |
| JP6787692B2 (ja) | 配線基板 | |
| CN111132476A (zh) | 双面线路散热基板的制备方法 | |
| CN112786455A (zh) | 一种嵌入式封装模块化制备方法 | |
| CN108878630A (zh) | 一种led倒装芯片封装器件结构及制备方法 | |
| JP6010333B2 (ja) | 配線基板および電子装置 | |
| CN101635285A (zh) | 具有散热功能的陶瓷基板结构及其制造方法 | |
| JP2012114183A (ja) | セラミック多層基板 | |
| JP2006128229A (ja) | 複合多層基板 | |
| JP2006128265A (ja) | 発光素子用配線基板ならびに発光装置 | |
| TW201205731A (en) | Substrate with built-in electronic component, and composite module | |
| JP2012084786A (ja) | Ｌｅｄパッケージ | |
| TWI354531B (cs) | ||
| CN104853518A (zh) | 印刷电路板及其制造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |