TWI354261B - Integrated displays using nanowire transistors - Google Patents
Integrated displays using nanowire transistors Download PDFInfo
- Publication number
- TWI354261B TWI354261B TW092127033A TW92127033A TWI354261B TW I354261 B TWI354261 B TW I354261B TW 092127033 A TW092127033 A TW 092127033A TW 92127033 A TW92127033 A TW 92127033A TW I354261 B TWI354261 B TW I354261B
- Authority
- TW
- Taiwan
- Prior art keywords
- transistors
- nanowire
- transistor
- pixel
- liquid crystal
- Prior art date
Links
- 239000002070 nanowire Substances 0.000 title claims description 198
- 239000004973 liquid crystal related substance Substances 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 32
- 239000011159 matrix material Substances 0.000 claims description 32
- 239000013078 crystal Substances 0.000 claims description 22
- 239000010408 film Substances 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 21
- 239000010409 thin film Substances 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052732 germanium Inorganic materials 0.000 claims description 10
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000002071 nanotube Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 6
- 239000006096 absorbing agent Substances 0.000 claims description 4
- 229910052681 coesite Inorganic materials 0.000 claims description 4
- 229910052906 cristobalite Inorganic materials 0.000 claims description 4
- 229910052682 stishovite Inorganic materials 0.000 claims description 4
- 229910052905 tridymite Inorganic materials 0.000 claims description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 3
- 239000004576 sand Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 235000006040 Prunus persica var persica Nutrition 0.000 claims 1
- 240000006413 Prunus persica var. persica Species 0.000 claims 1
- 229910000420 cerium oxide Inorganic materials 0.000 claims 1
- 239000013013 elastic material Substances 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000002159 nanocrystal Substances 0.000 claims 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims 1
- 239000002019 doping agent Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 229910021417 amorphous silicon Inorganic materials 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 229910052711 selenium Inorganic materials 0.000 description 3
- 229910052714 tellurium Inorganic materials 0.000 description 3
- RGCKGOZRHPZPFP-UHFFFAOYSA-N alizarin Chemical compound C1=CC=C2C(=O)C3=C(O)C(O)=CC=C3C(=O)C2=C1 RGCKGOZRHPZPFP-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000006121 base glass Substances 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical group [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000002707 nanocrystalline material Substances 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- YBNMDCCMCLUHBL-UHFFFAOYSA-N (2,5-dioxopyrrolidin-1-yl) 4-pyren-1-ylbutanoate Chemical compound C=1C=C(C2=C34)C=CC3=CC=CC4=CC=C2C=1CCCC(=O)ON1C(=O)CCC1=O YBNMDCCMCLUHBL-UHFFFAOYSA-N 0.000 description 1
- 229910017115 AlSb Inorganic materials 0.000 description 1
- 229910015849 BeSiN2 Inorganic materials 0.000 description 1
- 229910015894 BeTe Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910004608 CdSnAs2 Inorganic materials 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 1
- 229910016518 CuGeP3 Inorganic materials 0.000 description 1
- 229910016351 CuSi2P3 Inorganic materials 0.000 description 1
- 229910005542 GaSb Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910005987 Ge3N4 Inorganic materials 0.000 description 1
- 229910005829 GeS Inorganic materials 0.000 description 1
- 229910005866 GeSe Inorganic materials 0.000 description 1
- 229910005900 GeTe Inorganic materials 0.000 description 1
- 229910005939 Ge—Sn Inorganic materials 0.000 description 1
- 229910004262 HgTe Inorganic materials 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910002665 PbTe Inorganic materials 0.000 description 1
- 229910018540 Si C Inorganic materials 0.000 description 1
- 229910008355 Si-Sn Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910021607 Silver chloride Inorganic materials 0.000 description 1
- 229910006453 Si—Sn Inorganic materials 0.000 description 1
- 229910005642 SnTe Inorganic materials 0.000 description 1
- 229910007475 ZnGeP2 Inorganic materials 0.000 description 1
- 229910007707 ZnSnSb2 Inorganic materials 0.000 description 1
- 229910007709 ZnTe Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 238000012821 model calculation Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 239000002127 nanobelt Substances 0.000 description 1
- 239000002073 nanorod Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000002285 radioactive effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- ADZWSOLPGZMUMY-UHFFFAOYSA-M silver bromide Chemical compound [Ag]Br ADZWSOLPGZMUMY-UHFFFAOYSA-M 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- REYHXKZHIMGNSE-UHFFFAOYSA-M silver monofluoride Chemical compound [F-].[Ag+] REYHXKZHIMGNSE-UHFFFAOYSA-M 0.000 description 1
- MBEGFNBBAVRKLK-UHFFFAOYSA-N sodium;iminomethylideneazanide Chemical compound [Na+].[NH-]C#N MBEGFNBBAVRKLK-UHFFFAOYSA-N 0.000 description 1
- 210000000952 spleen Anatomy 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0673—Nanowires or nanotubes oriented parallel to a substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/221—Carbon nanotubes
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13454—Drivers integrated on the active matrix substrate
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/36—Micro- or nanomaterials
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/08—Active matrix structure, i.e. with use of active elements, inclusive of non-linear two terminal elements, in the pixels together with light emitting or modulating elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
- G09G3/3611—Control of matrices with row and column drivers
- G09G3/3648—Control of matrices with row and column drivers using an active matrix
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/02—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change
- G11C13/025—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change using fullerenes, e.g. C60, or nanotubes, e.g. carbon or silicon nanotubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
- H10K19/10—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00 comprising field-effect transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Theoretical Computer Science (AREA)
- Ceramic Engineering (AREA)
- Composite Materials (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Description
(3) (3)1354261 圖〗爲使用TFTs的典型主動式矩陣[CD—主動式矩 陣LCD ]00圖。主動式矩陣LCD ]〇〇包括極化器薄膜 】10'上玻璃基底120'濾色片】30'透明電極】40'液晶 】5 0 '畫素電晶體和軌]6 0、邊緣電子]7 〇 '基座玻璃基底 ]80 '和極化器薄膜]90。畫素電晶體(和軌)1 6〇、邊緣 電子(和軌)〗7 〇、及基座玻璃基底〗8 0可被集體稱作背 板,或在此例中稱作主動式矩陣背板(即透明(前)電極 和液晶不是背板的一部分)。主動式矩陣背板一詞又可用 於意指上述不包括邊緣電子170之元件。這些層的每—個 都夾層在一起以設計出能夠用於例如膝上型電腦顯示器之 LCD顯示器。在此例中’可添加框架以支撐LCD和固定 顯示器於膝上型基座。電路系統被設置用於使膝上型電腦 可通信到L C D以顯示想要的圖形或視訊。 當影像藉由主動式矩陣顯示器100顯示時,使用TFT 和邊緣電子發送電子信號以配置液晶位在適當畫素,使得 沒有光或一點光被透射過畫素。邊緣電子可包括移位暫存 器' 使外部信號與顯示器上的信號相配之位準移位器、及 輸出緩衝器。圖2爲丁FT和邊緣電子的設計圖。圖2包 括一組薄膜行電晶體2 1 0 A到2 1 0 η、一組薄膜列電晶體 2 2 0 Α到2 2 0 η、一組導電行軌2 4 0 Α到2 4 0 η、一組導電列 軌2 5 0 Α到2 5 0 η、一組薄膜畫素電晶體’諸如薄膜畫素 電晶體230等、及一組畫素,諸如畫素260等。薄膜畫素 電晶體,諸如薄膜畫素電晶體23 0等將與每一列和行軌的 交叉點結合。畫素與列和行軌的每一交叉點結合。衋素 -6 - (4) 1354261 2 60提供一畫素例子。如此,例如當畫素23 0被 適當信號被傳送到薄膜行電晶體2 1 0 A、薄膜 220A、和薄膜畫素電晶體260。 現在,可以使用非晶矽薄膜電晶體(a - S i 多晶矽TFT (p-Si或poly-Si TFTs)或塊狀矽電 L C D顯示器中的列、行、及畫素電晶體,和其他 圍的顯示器類型。使用這些電晶體類型對顯示器 個設計上的限制。第一 '自a - S i或ρ ο 1 y _ S i產生 所結合的性能明顯小於使用塊狀矽產生的電晶體 塊狀矽通常不適用於畫素電晶體,因爲許多市面 LCDs或其他顯示器類型尺寸大於用於產生習知 晶體之矽晶圓尺寸,而且對當作畫素面板而言, 矽的成本也太高。另外,因爲LCD基底必須是 的,所以用於製造塊狀矽電晶體的矽晶圓只能夠 射顯示器專用的基底。第二、就列和行電晶體而 和po]y-Si電晶體未具有適合列及行電晶體的性 目前的LCDs或其他顯示類型在面板邊緣四周具 連以使用積體電路中的晶矽(即塊狀矽)電晶體 軌布線到外部電路系統。這些互連增加電路和總 及互連故障率,並且減少製造產量。第三、a_Si Si的極大尺寸增加顯示器的重量。第四 '因爲; 和poly-Si裝置需要極高的溫度,所以透明基底 到相當大限制’只能使用玻璃,如高溫玻璃或石 所需要的是與那些使用塊狀矽基裝置的電路 :定址時, 歹0電晶體 丁F 丁 s) Μ 晶體當作 相當大範 上產生幾 的電晶體 之性能。 上可行的 塊狀矽電 使用塊狀 淸澈透明 被用作反 i 言,a-Si 能,使得 有大量互 將列和行 成複雜性 和 Ρ 〇 1 y -製造a-Si 的選擇受 英。 系統比較 1354261 ⑹ 及電泳顯示器等顯示器技術。 在顯示器內結合使用奈米接線電晶體有許多好處。第 一 '奈米接線電晶體可定位在包括玻璃和塑膠等許多基體 上。結果,可在彈性基底上發展顯示器,開放使用彈性及 /或可滚動顯不器的許多應用。第二、與a-Si及p〇】y-Si TFTs比較時,奈米接線電晶體具有較好的性能,藉以使 與列及行電晶體結合的邊緣電子可整合在列及行軌之間。 此使得顯不器,尤其是LCDs,可增加螢幕尺寸對支托螢 幕的框尺寸之比例,並且減少外部控制電路系統的複雜 性。而且,因爲較大的a-Si及po〗y-Si TFTs容易阻擋許 多反射過或透射過諸如LCD等顯示器的光,所以習知a_ Si及poly-Si TFTs具有不良的昏暗,但是因爲奈米接線 電晶體很小,所以可減少此缺點。就諸如0 L E D s等放射 性顯示器而言’較小的電晶體使直接建構在背板上,而不 是將OLEDs建構在畫素電晶體頂部之較難的處理之 O L E D s可佔據背板區的較大部位。 下文中,參照附圖將詳細說明本發明的其他實施例、 特徵、及優點’與本發明的各種實施例之結構與操作。 【實施方式】 應明白本文中所說明的特定實施是本發明的例子,並 不用於限制本發明的範圍。事實上,爲了簡明目的,本文 並未詳細說明習知電子、製造、半導體裝置、及奈米管、 奈米棒、奈米接線、和奈米帶技術、及其他系統的功能性 -9- (7) (7)1354261 外觀(及操作系統組件的個別組件)。而且,儘管爲所討 論的特定實施提供奈米接線數目和那些奈米接線的間隔, 但是該實施並不用於成爲限制,也是可以使用各種數目的 奈米接線數目和間隔。而且,可改變奈米接線的尺寸和成 分。所說明的實施並不用於成爲限制,而是可以使用各種 尺寸和成分。 如本文中所使用一般,’’奈米接線"一詞通常意指任何 細長的導電或半導電材料,包括至少一橫剖面尺寸小於 5 00 nm、小於]〇〇 nm較佳,並且其寬高比(長:寬)大於 1 0、大於5 0較佳、大於]〇〇更好。此種奈米接線的例子 包括已發表的國際專利申請號碼 WO 02/17362、WO 0 2M 8 70 1、WO 0 1 /03 208中所說明的半導體奈米接線、碳 奈米管、和其他相同尺寸的細長導電或半導電結構。 儘管本文所說明的LCD模型主要根據結合有Si的特 性。但是仍可使用其他類型的奈米接線包括由選自例如 Si, Ges Sn, Se,Te,B,C (包括金剛鑽),P,B-C, B-P(BP6), B-Si, Si-C, Si-Ge, Si-Sn,及 Ge-Sn, SiC, BN/BP/B As, A1N/A1P/A1 As/AlSb, G aN / G a P / G a A s / G a S b, InN/InP/In As/lnSb, BN/BP/B As, A1N/A1P/A1 As/Al Sb, GaN/GaP/GaAs/GaSb, InN/InP/InAs/InSb, ZnO/ZnS/ZnSe/ZnTe, CdS/CdSe/CdTe, HgS/HgSe/HgTe, BeS/BeSe/BeTe/MgS/MgSe, GeS, GeSe, GeTe, SnS, SnSe. SnTe, PbO, PbS, PbSe, PbTe: CuF; CuC], CuBr, Cul, AgF, AgCl, AgBr, Agl5 BeSiN2; CaCN2; ZnGeP2, CdSnAs2; -10 - (8) (8)1354261
ZnSnSb2,CuGeP3: CuSi2P3,(Cu,Ag)(Al,Ga,In, T】;Fe)(s Se, Te)2, Si3N4,Ge3N4: Al2〇35 (Al,Ga,In)2(S5 Se,Te)3 A 12 C 0及兩或多個此種半導體的適當組合之半導體材料所 組成的半導電奈米接線。 在某些觀點中,半導體可包含摻雜劑,包括選自周期 表第ΙΠ族的p型摻雜劑;周期表第V族的η型摻雜劑; 選自Β, Α1,及In的ρ型摻雜劑;選自p, As,及Sb的^趣 摻雜劑;周期表第II族的ρ型摻雜劑;選自Mg,Zn,ed 及Hg的p型摻雜劑;周期表第ιν族的p型摻雜劑;選 自C及Si的p型摻雜劑;或選自si, Ge,Sn,S,Sej Te 的n型摻雜劑。如同精於本技藝之人士所明白的一般,可 使用其他已知的半導體摻雜劑。 另外,奈米接線可包括碳奈米管、或導電或半導電有 機聚合物材料(例如’戊省、及過渡金屬氧化物) 因此’雖然本文整篇說明中所提及的’,奈米接線"一詞 僅爲了圖解說明目的’但是本文中的說明也包含奈米管的 使用。如同本文中所說明的奈米接線一般,能夠以奈米管 的組合/薄膜形成奈米管,可單獨使用與奈米接線組合以 提供本文所說明的特性和優點。此外,如同精於本技藝之 人士所知一般,奈米管無需只包含碳,也可含有諸如硼等 其他材料。 而且,需注意本發明的奈米接線之薄膜可以是"異種" 傳膜,其結合半導體奈米接線及/或奈米管、及/或不同的 奈米接線成分、及/或不同成分及/或結構特性的其任何組 ^ 11 - (10) (10)1354261 到34〇n ' —組列軌35〇a到35〇n '及一組畫素3 60A到 3 6〇Ζ。每—奈米接線行電晶體耦合於沿著自奈米接線行電 晶體延伸出的行軌之一組奈米接線畫素電晶體。例如,奈 米接線行電晶體3 ] 0Α耦合於沿著行軌34〇Α之奈米接線 畫素電晶體3 30 Α, 3 3 0Μ,及33 0S。每一奈米接線列電晶體 對耦1合於沿著自奈米接線列電晶體延伸出的列軌之一組奈 米接線畫素電晶體。例如,奈米接線列電晶體對3 20 Α耦 合於沿著列軌3 5 0 A的一組奈米接線畫素電晶體。奈米接 線畫素電晶體與對應畫素結合。例如,奈米接線畫素電晶 體330A與畫素360 A.結合。 此外’奈米接線邊緣電子(未圖示在圖3 A )可用於 控制奈米接線行、列、及畫素電晶體。奈米接線邊緣電子 也能夠用於驅動現在使用奈米接線製造的行、列、及畫素 電晶體。奈米接線邊緣電子可包括奈米接線移位暫存器、 奈米接線位準栘位器 '及奈米接線緩衝器。奈米接線移位 暫存器意指使用奈米接線電晶體實施的移位暫存器。奈米 接線位準移位器意指使用奈米接線電晶體實施的位準移位 器。奈米接線緩衝器意指使用奈米接線電晶體實施的緩衝 器。可使用奈米接線電晶體實施其他邊緣電子類型。 操作時,當畫素強度改變時,電壓施加到畫素所在的 行之奈米接線行電晶體。畫素所在的列之奈米接線列電晶 體將被接通以使電流流到奈米接線畫素電晶體。當奈米接 線畫素電晶體接通時,電流流經奈米接線畫素電晶體以使 電壓遍及畫素各處,大約與施加於行的電壓相同以產生想 -13 - (11) (11)1354261 要的透過畫素之光強度。 儘管圖3A展示行、列、及畫素電晶體是奈米接線電 晶體的實施例。但是在其他實施例中,奈米接線電晶體和 a-Si或po】y-Si電晶體的任何組合可當作行、列、及畫素 電晶體。例如’在一實施例中,畫素電晶體可以是a_ s i TFTs或p〇ly.Si TFTs及列及行電晶體可以是奈米接線電 晶體。此是相當吸引人的選擇,因爲畫素電晶體的性能需 求相當低’而且能夠以a_ Si TFTs就可輕易達成。在另一 例子中’列電晶體可以是a-Si或poly-Si TFTs,列和畫素 電晶體可以是奈米接線電晶體。在另一例子中,列電晶體 可以是a-Si或poly-Si TFTs,及行和畫素電晶體可以是奈 米接線電晶體。在另一例子中,畫素電晶體和行電晶體可 以是a-Si或poly-Si TFTs,及列電晶體可以是奈米接線電 晶體。 圖3B爲根據本發明的實施例之LCD 3 0 0的一部位 3 90之詳圖。圖3B強調使用奈米接線電晶體之LCD的一 些觀點,即一對奈米接線列電晶體將耦合於每一列軌及每 一畫素具有與它有關的電阻和電容,此對電晶體的設計考 量將產生影響。應注意列及行軌將也具有與它們有關的電 阻和電容’也將對設計標準產生影響。奈米接線列電晶體 3 22及324形成奈米接線列電晶體對3 2 0A ’並且耦合於 在列軌 350A正上方的奈米接線畫素電晶體3 3 0A及 3 3 0 B 〇如同下面更詳細說明的圖5 —般’奈米接線列電晶 體3 2 2及3 2 4用於將諸如奈米接線畫素電晶體33 〇A及 -14 - (12) (12)1354261 3 3 Ο B等奈米接線畫素電晶體接通及斷開。 此外’圖3B爲每~畫素將具有與畫素有關的電容和 電阻之圖。例如,畫素360A包括電容Cled、電容Cs、及 電阻Rud。電容Cled表示與畫素360A內的液晶有關之電 容。電阻Rud表示與與畫素360A內的液晶有關之電阻。 電容C s表示被添加以提高性能之儲存電容。 依據本文中的原則,精於本技藝之人士將能夠把奈米 接線電晶體結合到LCD,而無需過度的實驗。而且,儘管 設計工具使用特定的奈米接線電晶體類型,但是該例子並 不成爲限制。精於本技藝之人士能夠應用本文中的原則和 下文中將討論到的設計工具中所使用的槪念,以利用具有 諸如奈米晶體材料、摻雜、接線數目、和定位等各種特徵 廣泛範圍的奈米接線半導體發展整合性的LCDs或其他顯 不器類型。 本發明人發展奈米接線LCD設計工具以證明使用奈 米接線電晶體當作驅動L C D的畫素內液晶之電子的可行 性。工具包括使用者介面' LCD設計輸入元件、奈米接線 特徵輸入元件、電晶體需求引擎、及奈米接線設計引擎。 使用者介面讓使用者可輸入設計標準和顯示結果。LCD設 計輸入元件收集有關LCD類型的資訊(如LCD尺寸、畫 素密度等)。奈米接線特徵輸入元件收集有關奈米接線特 徵的資訊,包括尺寸、奈米接線晶體材料、摻雜、和相關 性能特徵。電晶體需求引擎產生列、行、及畫素電晶體所 需的性能需求。奈米接線設計引擎接收當作電晶體需求引 -15 - (13) (13)1354261 擎的輸入和輸出並且決定特定脾用w _ & #半& ^ < k用所需的奈米接線電晶體 類型。 奈米接線L C D設計工具袖田·^ =2Jt αα立4 $他用於證明奈米接線電晶體 可用於驅動L C D內的畫素。储函^ θ . 便用該工具也幫助驗證在 LCD內使用奈米接線電晶體的獨特優點。 在分析中,爲奈米接線特徵使用保守的假設。尤其 是,大約典型塊狀砂値的-半之表面移動率(以被使 用當作一標準,適用於說明與摻雜有關的移動率減低之 (M s )對摻雜。摻雜假設乃閘極控制電晶體的電導之通 道中是Na = 10】7/cm3,而無閘控的源極和吸極中是_ = 1 0 19/cm3。通道、源極 '及吸極的長度每—個皆被假設爲 1 0 m。這些假設是保守的,以確保可使用最低成本的平 版印刷術。 此外,假設使用周圍閘極’即意謂閘極接觸圍繞著奈 米接線。而且’假設奈米接線具有核心殼體設計,具有生 長在奈米接線核心周圍的氧化矽及應用在氧化物周圍的閘 極。使用此方法,6 0 n m直徑的矽核心奈米接線假設具有 4〇 nm厚的Si02殻體,使得奈米接線具有14〇 nm總直 徑。最後,假設保守的臨界和驅動電壓,使得臨界電壓 (Vt)假設成兩volts及驅動電壓(Vd)假設成五v〇lts。 a - S i及ρ ο I y · S i電晶體的驅動電壓典型上較高。所使用的 電壓假設與典型上積體電路內所使用的電壓一致。倂入全 文在本文中作爲參照之2 002,9, 30所發表的U. S.臨時申 請案號碼 60/4 1 4,3 2 3 及 2 003, 5; 7 所發表的 60/468,2 7 6 -16 - (14) 1354261 說明奈米接線半導體和提供支持這些俑 注意無需保角閘極及/或保角氧化閘極 板電子。 LCD面板假設是依據現存LCD谊 其是,LCD面板被假設具有60 Hz更 R G B畫素解析度之21英吋對角線的顯 畫素而言,具有三畫素(紅、綠、及藍 大約是1 1 0 μ m及列距大約是3 3 0 /i m ' 設與每一畫素有關。列軌被假設成是1 的鋁(A1 )。列絕緣被假設成由大於0 成。彳T軌也被假設成是]寬及2# 行絕緣被假設成由大於2 y m厚的Si02 參數選擇決定軌的電阻和電容。交替地 電容和電阻在一起的軌電阻和電容決 快,及列、行、及畫素電晶體內所需的 依據這些LCD標準,工具製造定 電晶體的需求之輸出。精於本技藝之人 電晶體尺寸的方法。見例如5 / 4 ,] 9 9 7 期刊第 339-404 頁之 Satoru 丁〇111〗13等_> 整合性薄膜電晶體驅動電路之電晶體& 是,就畫素電晶體而言,模型決定畫 1 · 6 Μ 〇 h m s的接通電阻,並且需要大於 電阻。接通和斷開電阻的決定是根據種 斷開電阻必須是高的以避免畫素內不想 丨設的性能資料。需 仍可製造類似的背 丨板的典型特徵。尤 新率的1024 X 768 示器。就每一 RGB )。因此,行距將 > 一 PF的電容被假 寬及丨以^厚 • 5/im厚的Si02製 m厚的鋁(A1 )。 製成。列和行軌的 ’與畫素和電晶體 定該線可開關的多 性能位準。 義行、列、及畫素 士將知道安排TFT 的資訊顯示器協會 、所發表的"AM LCD 5尺寸安排"。尤其 素電晶體需要低於 835 Gohms的斷開 種因素。尤其是, 要的閃爍作用。爲 -17 - (15) (15)1354261 了避免閃爍,遍及畫素的電容電壓必須慣性滑行在更新 (假設 60 Hz更新率)之間的]6.6ms而沒有明顯的洩 漏。洩漏率是奈米接線畫素電晶體的斷開電阻之函數。 LCD電阻或電晶體中的洩漏將使畫素上的電壓在更新期間 產生變化,引起畫素中不想要的閃爍。就分析目的而言, 假設畫素上的電壓改變不會大於更新之間的1 0%。另一方 面’接通電阻必須足夠低以便使畫素在有效時間內變化》 分解這些標準中的因子可導出上述的接通和斷開電阻。 一旦知道這些電阻,就可決定電晶體所需的奈米接線 數目。工具決定所使用的假設,具有少至只有一奈米接線 的奈米接線畫素電晶體可滿足設計限制。多於一個奈米接 線也可被接受。 圖4爲根據本發明的實施例之L C D內四奈米接線畫 素電晶體圖。如同分析結果所建議一般,圖式圖解說明使 用一接線奈米接線畫素電晶體。所圖不的L C D部位包括 四一接線奈米接線畫素電晶體 41〇A,410B,410C,及 4 1 0 D ;包括綠畫素4 2 0的幾個畫素;列軌4 3 0 ;及行軌 44〇。奈米接線電晶體4 1 0C的一端連接到與綠畫素420結 合之如銦錫氧化物透明導體。銦錫氧化物導體被用於施加 電壓到液晶晶格的一側。奈米接線畫素電晶體的另一端連 接到行軌44〇。在這些連接點之間的一點上,奈米接線畫 素電晶體4 I oc連接到列軌43 0。此連接點充作奈米接線 畫素電晶體4 ] 0C的閘極。基本槪念係施加到列軌43 0的 電壓將奈米fe線靈素電晶體4 ] 0 C接遇和斷開。在其他實 -18 - (16) (16)1354261 施例中,在奈米接線畫素電晶體內可使用大於一的奈米接 線。 分析也爲奈米接線列電晶體產出設計結果,證明使用 奈米接線電晶體當作列電晶體的可行性。使用工具決定列 電晶體的目前設計需求可滿足含至少】5 0奈米接線的奈米 接線電晶體。另一被檢視的考量是一對奈米接線列電晶體 是否安裝在兩列軌之間。模型計算證明成對奈米接線列電 晶體的尺寸明顯小於列軌之間的距離(大約小於4_ 1 0 % )’如此奈米接線電晶體可容易地放置在兩軌之間。 在其他實施例中,可使用較高移動率的奈米接線,如 此每一電晶體需要的奈米接線較少。此外,可依據想要的 畫素尺寸衡量這些數目。 圖5爲根據本發明的實施例之l C D內一對奈米接線 列電晶體圖。圖式包括奈米接線列電晶體5〗〇、奈米接線 列電晶體5 2 0、畫素53〇 '奈米接線畫素電晶體54〇、行 軌5 5 0、列軌5 6 〇、高軌5 7 〇 '閘極軌5 7 2、低軌5 74、及 闊極軌5 7 6。奈米接線列電晶體5 I 〇包括成組奈米接線 5 1 5。同樣地’奈米接線列電晶體52〇包括成組奈米接線 5 2 5。奈米接線列電晶體5;[〇及52〇被用於將奈米接線畫 素電晶體5 4 0接通和斷開。 奈米接線列電晶體5丨〇之成組奈米接線5丨5的—側耦 合於列軌5 6 0 ’而另—側耦合於高軌5 7 〇。高軌5 7 〇連接 到接通電壓。共同充作電晶體閘極的成組奈米接線5 ] 5上 的這些連接之間的每一奈米接線上之點連接到閘極軌 -19 - (17) (17)1354261 5 72 » 奈米接線列電晶體5 2 0之成組奈米接線5 2 5的一側耦 合於列軌5 6 0,而另一側耦合於低軌5 7 4。低軌5 74連接 到接地。共同充作電晶體閘極的成組奈米接線5 2 5上的這 些連接之間的每一奈米接線上之點連接到閘極軌5 76。 當接通奈米接線畫素電晶體5 6 0時,閘極電壓施加在 閘極軌572上以接通奈米接線列電晶體5 ] 0。同時,接地 施加在閘極軌5·76上以斷開奈米接線列電晶體5 2 0。結 果,閘極電壓連接到奈米接線畫素電晶體閘極5 45以接通 奈米接線畫素電晶體54 0。當斷開奈米接線畫素電晶體 5 ] 0時,相反情形發生。自閘極軌5 72去除閘極電壓以斷 開奈米接線列電晶體5 1 0。而且同時,閘極電壓施加到閘 極軌5 7 6以接通奈米接線列電晶體5 2 0。結果,奈米接線 畫素電晶體閘極54 5的閘極電壓被驅動到接地以斷開奈米 接線畫素電晶體5 4 0。 分析也爲奈米接線行電晶體產生設計結果,證明使用 奈米接線電晶體當作行電晶體的可行性。使用工具決定目 前設計需求可滿足含至少3 0 0 0奈米接線的奈米接線電晶 體。行電晶體對奈米接線的需求大於其他電晶體類型,因 爲行電晶體具有較短的充電時間周期及行線具有明顯的電 容量,所以需要具有較低的接通電阻。如同在奈米接線列 電晶體的例芋中一般,工具證明奈米接線電晶體可安裝於 行軌之間。在每一例子中,如上述,奈米晶體材料類型、 摻雜程度 '及其他因素將對符合性能標準所需的特定奈米 -20- (18) (18)1354261 接線數目產生影響。 圖6爲根據本發明的實施例之LCD內兩奈米接線行 電晶體圖。圖式包括奈米接線行電晶體6 ] 〇、奈米接線行 電晶體6 2 0、行軌63 0、視訊軌64 0 '及閘極軌6 5 0。奈米 接線行電晶體6 1 0包括成組奈米接線6 1 5。奈米接線行電 晶體6 1 0可被用於施加電壓到耦合於行軌6 3 〇之奈米接線 畫素電晶體。 奈米接線行電晶體6 ] 0之成組奈米接線6 1 5的一側耦 合於行軌63 0,而另一側耦合於視訊軌64 0。視訊軌640 連接到用於驅動耦合於行軌63 0的奈米接線畫素電晶體之 高電壓。此視訊電壓設定畫素電壓及畫素亮度。共同充作 電晶體閘極的成組奈米接線6 ] 5上的這些連接之間的每一 奈米接線上之點連接到閘極軌6 5 0。閘極軌6 5 0被連接以 控制用於將畫素的行接通和斷開之電路系統。 如同自圖3 A, 3 B , 4,5,及6可觀察到的一般,奈米接 線可被置放在同一方向。即在此例中,所有奈米接線是水 平的,使置放奈米接線在基底上比若奈米接線是在多重方 向中來的容易。2002,9,3 02 002,9, 30所發表的U. S.臨 時申請案號60/4 1 4,323說明達成此定位類型的方法。此 外,根據特定的設計標準,奈米接線可被置放在其他方 向。而且,用於形成畫素、列、或行電晶體的奈米接線數 目將是設計標準的函數,可包括大於兩奈米接線、大於奈 米接線、大於一百奈米接線、及大於一千奈米接線,但並 不侷限於此。 -21 - (19) 1354261 而且,使用奈米接線電晶體的顯示器可被 基座玻璃基底1 80等基座基底上,具有廣泛的 是,基座基底的材料可包括玻璃、塑膠、聚合 金屬、或紙張,但並不侷限於此。此外,基座 特徵可包括透明材料、半透明材料、不透明材 料、極化入射光的材料、不極化入射光的材料 限於此。最後,基座基底的材料可以是”低溫” 化溫度可包括低於5 0 0 °F、低於3 0 0 °F、低於 於1 0 0 °F的溫度,但並不侷限於此。 結論 已陳述本發明的示範性實施例。本發明並 些例子。本文中所陳述的這些例子僅用於圖解 制。精於本技藝之人士根據本文中的原則將可 擇(包括本文所說明的那些之同等物、延伸、 等)。此種其他選擇落在本發明的範圍和精神丨 【圖式簡單說明】 將參照附圖說明本發明。在圖式中,相同 示同一或功能類似的元件。以對應參照號碼中 字表示元件第一次出現的圖式。 圖1爲主動式矩陣LCD圖。
圖2爲用於定位LCD內的畫素之TFT 圖。 形成在諸如 特徵。尤其 物、晶體、 基底的材料 料、有色材 ’但並不侷 材料’其熔 2 00T、低 不局限於這 說明而非限 明白其他選 變化 '偏差 參照號碼表 的最左邊數 和邊緣電子 -22 - (20) 1354261 11 3 A胃根據本發明的實施例之使用奈米接線電晶體 的LCD圖。 11 3 B爲根據本發明的實施例之使用奈米接線電晶體 的LCD之詳細部位圖。 圖4爲根據本發明的實施例之L C D內四奈米接線畫 素電晶體圖。 圖5爲根據本發明的實施例之[CD內一對奈米接線 列電晶體圖。 圖6爲根據本發明的實施例之l C D內兩奈米接線行 電晶體圖。 主要元件對照表 100 主動 110 極化 1 20 上玻 1 3 0 濾色 1 40 透明 1 5 0 液晶 1 60 畫素 1 70 邊緣 1 80 基座 1 90 極化 2 ] 0 A 薄膜 式矩陣液晶顯示器· 器薄膜 璃基底 片 電極 電晶體和軌 電子 玻璃基底 器薄膜 行電晶體 -23- (21)1354261 2 I OB 薄 膜 行 電 晶 體 2 1 OC 薄 膜 行 電 晶 體 2 ] OD 薄 膜 行 電 晶 體 2 1 OE 薄 膜 行 電 晶 體 2 ] On 薄 膜 行 電 晶 體 22 0A 薄 膜 列 電 晶 體 2 2 OB 薄 膜 列 電 晶 體 2 20C 薄 膜 列 電 晶 體 2 20D 薄 膜 列 電 晶 體 220E 薄 膜 列 電 晶 體 2 20F 薄 膜 列 電 晶 體 220n 薄 膜 列 電 晶 體 2 3 0 薄 膜 畫 素 電 晶體 240A 導 電 行 軌 240B 導 電 行 軌 240C 導 電 行 軌 240D 導 電 行 軌 240E 導 電 行 軌 240n 導 電 行 軌 250A 導 電 列 軌 250B 導 電 列 軌 250C 導 電 列 軌 250D 導 電 列 軌 25 0E 導 電 列 軌 -24 (22)1354261 2 5 0η 導 電 列 軌 260 童 里 素 3 00 液 晶 顯 示 器 3 1 0 A 71^ 米 接 線 行 電 晶 體 3 1 OB 六 米 接 線 行 電 晶 體 3 1 OC 太 米 接 線 行 電 晶 體 3 1 On 六 米 接 線 行 電 晶 體 3 20 A 奈 米 接 線 列 電 晶 體 對 3 20B 奈 米 接 線 列 電 晶 體 對 3 2 On 奈 米 接 線 列 電 晶 體 對 3 22 奈 米 接 線 列 電 晶 體 3 24 奈 米 接 線 列 電 晶 體 3 3 0 A 奈 米 接 線 畫 素 電 晶 體 3 3 OB 奈 米 接 線 畫 素 電 晶 體 3 SOM 奈 米 接 線 畫 素 電 晶 體 3 3 0 S 奈 米 接 線 畫 素 電 晶 體 3 3 0Z 奈 米 接 線 畫 素 電 晶 體 3 40 A 導 電 行 軌 340B 導 電 行 軌 340C 導 電 行 軌 3 4 On 導 電 行 軌 3 50A 列軌 3 5 0B 列 軌 3 5 On 列軌 (23)1354261 3 6 0 A 畫素 3 6 0B 畫素 3 6 0Z 畫素 3 90 部位 400 液晶顯不器 4 1 0 A 一接線奈米接線畫素電晶體 4 1 OB 一接線奈米接線畫素電晶體 4 ] OC 一接線奈米接線畫素電晶體 4 1 OD 一接線奈米接線畫素電晶體 420 綠畫素 43 0 列軌 440 行軌 500 液晶顯不器 5 10 奈米接線列電晶體 5 1 5 奈米接線 520 奈米接線列電晶體 525 奈米接線 530 畫素 540 奈米接線畫素電晶體 545 奈米接線畫素電晶體閘極 5 50 行軌 5 60 列軌 5 70 局軌 5 72 鬧極軌 -26 - (24) 低軌 閘極軌 奈米接線行電晶體 奈米接線 奈米接線行電晶體 行軌 視訊軌
電容 電容 電阻
-27 -
Claims (1)
1354261 ’醉?月乡日修正替換頁 附件5A :第092 1 2703 3號申請專利範圍修正本 民國100年8月3日修正 拾、申請專利範圍 / 1. 一種用於顯示器內的主動式矩陣背板,包含: 複數畫素; 至少一複數行電晶體及複數列電晶體, 其中該複數行電晶體內的行電晶體施加電壓遍及複數 畫素電晶體的子集,及 其中該複數列電晶體內的至少兩列電晶體將對應像素 電晶體接通和斷開,及 複數畫素電晶體,其中該複數畫素電晶體內的畫素電 晶體控制該複數畫素內的對應畫素,其中該複數畫素電晶 體內的每一畫素電晶體、該複數行電晶體內的每一行電晶 體、及該複數列電晶體內的每一列電晶體是奈米接線電晶 體’而該奈米接線電晶體包含在該電晶體的第一源極電極 和第一吸極電極之間延伸的複數奈米接線,其中該奈米接 線包括由第一材料所製成的核心以及由第二材料所製成並 配置於該核心附近的殼體層,其中該第一材料在組成上和 該第二材料不同,以及其中每一奈米接線電晶體包含足以 至少以想要的速率充電和放電一畫素之平均奈米接線數。 2·根據申請專利範圍第1項之主動式矩陣背板,其 中每一行奈米接線電晶體包含至少在源極和吸極電極之間 延伸的至少一百奈米接線。 3.根據申請專利範圍第1項之主動式矩陣背板,其 1354261 卜·Ρ月3日修正替換頁 1 中每一列奈米接線電晶體包含至少在源極和吸極電極之間 延伸的至少100奈米接線。 4. 根據申請專利範圍第1項之主動式矩陣背板,另 外包含奈米接線邊緣電子。 5. 根據申請專利範圍第4項之主動式矩陣背板,其 中奈米接線邊緣電子包括奈米接線緩衝器。 6. 根據申請專利範圍第4項之主動式矩陣背板,其 中奈米接線邊緣電子包括奈米接線移位暫存器。 7. 根據申請專利範圍第4項之主動式矩陣背板,其 中奈米接線邊緣電子包括奈米接線位準移位器。 8. 根據申請專利範圍第1項之主動式矩陣背板,其 中顯示器是液晶顯示器。 9. 根據申請專利範圍第1項之主動式矩陣背板,其 中顯示器是有機發光二極體顯示器(OLED)。 10.根據申請專利範圍第9項之主動式矩陣背板,其 _ 中該OLED包括奈米晶體。 11·根據申請專利範圍第1項之主動式矩陣背板,其 中顯示器是電泳顯示器。 I2·根據申請專利範圍第1項之主動式矩陣背板,其 中顯示器是電漿顯示器。 13.根據申請專利範圍第1項之主動式矩陣背板,其 中顯示器是電色顯示器。 1 4.根據申請專利範圍第丨項之主動式矩陣背板,其 中顯示器是微機電(MEMs )顯示器。 1354261 缺⑽3修正替換頁 15. 根據申請專利範圍第1項之主動式矩陣背板,其 中顯示器是微鏡顯示器。 16. 根據申請專利範圍第1項之主動式矩陣背板,其 中顯不器是場發射顯示器。 17. 根據申請專利範圍第16項之主動式矩陣背板, 其中顯示器是奈米管場致放射顯示器。 18. 根據申請專利範圍第丨項之主動式矩陣背板,其 中顯示器是堅硬的。 19. 根據申請專利範圍第丨項之主動式矩陣背板,其 中顯示器是彈性的。 2 0.根據申請專利範圍第1項之主動式矩陣背板,其 中顯示器是非平面的。 21. —種具有基座基底之液晶顯示器,包含: (a) 複數畫素; (b) 複數畫素電晶體,其中該複數畫素電晶體內的 畫素電晶體控制該複數畫素內的對應畫素; (c )複數行電晶體,其中該複數行電晶體內的行電 晶體施加電壓遍及該複數畫素電晶體的子集;及 (d )複數列電晶體,其中該複數列電晶體內的至少 兩列電晶體將對應畫素電晶體接通和斷開,其中(i)該複數 畫素電晶體、(Π)該複數行電晶體、及(iii)該複數列電晶 體的至少其中之一是奈米接線電晶體’而該奈米接線電晶 體包含在該奈米接線電晶體的第一源極電極和第一吸極電 極之間延伸的複數奈米接線,其中該奈米接線包括由第— -3- 1354261 材料所製成的核心以及由第二材料所製成並配置於該核心 附近的殼體層,其中該第一材料在組成上和該第二材料不 同,以及其中每一奈米接線電晶體包含足以至少以想要的 速率充電和放電一畫素之平均奈米接線數。 22. 根據申請專利範圍第21項之液晶顯示器’另外 包含奈米接線邊緣電子。 23. 根據申請專利範圍第22項之液晶顯示器’其中 0 奈米接線邊緣電子包括奈米接線緩衝器。 2 4.根據申請專利範圍第22項之液晶顯示器,其中 奈米接線邊緣電子包括奈米接線移位暫存器。 25. 根據申請專利範圍第22項之液晶顯示器,其中 奈米接線邊緣電子包括奈米接線位準移位器。 26. 根據申請專利範圍第2 1項之液晶顯示器,其中 該複數畫素電晶體內的畫素電晶體、該複數行電晶體內的 行電晶體、及該複數列電晶體內的列電晶體是奈米接線電 φ晶體。 27. 根據申請專利範圍第2 1項之液晶顯示器,其中 (i)該複數畫素電晶體、(Π)該複數行電晶體、及(iii)該複 數列電晶體的至少其中之一是a- S i (非晶矽)薄膜電晶 體。 2 8 .根據申請專利範圍第2 1項之液晶顯示器,其中 (i)該複數畫素電晶體、(ii)該複數行電晶體、及(iii)該複 數列電晶體的至少其中之一是塊狀矽薄膜電晶體。 29.根據申請專利範圍第21項之液晶顯示器,其中 -4- 1354261 /桃?月$日修正替換頁 ⑴該複數畫素電晶體、(Π)該複數行電晶體、及(Ui)該複 數列電晶體的至少其中之一是有機半導體。 3 0 .根據申請專利範圍第2 1項之液晶顯示器,其中 ⑴該複數畫素電晶體、(ii)該複數行電晶體、及(Hi)該複 數列電晶體的至少其中之一是p〇ly-Si (多晶矽)薄膜電 晶體。 3 1 .根據申請專利範圍第21項之液晶顯示器,其中 用於形成電晶體的奈米接線實際上平行排列。 32. 根據申請專利範圍第21項之液晶顯示器,其中 接線實際上以隨機和等向其中之一的方式排列。 33. 根據申請專利範圍第21項之液晶顯示器,其中 奈米接線行電晶體位在行軌之間。 3 4 .根據申請專利範圍第2 1項之液晶顯示器,其中 奈米接線行電晶體位在與行軌同軸。 3 5 .根據申請專利範圍第21項之液晶顯示器,其中 奈米接線列電晶體位在列軌之間。 3 6 ·根據申請專利範圍第2 1項之液晶顯示器,其中 奈米接線列電晶體位在與列軌同軸。 3 7.根據申請專利範圍第2 1項之液晶顯示器,其中 奈米接線電晶體包含連接奈米接線電晶體的源極到吸極電 極之至少十奈米接線。 3 8 .根據申請專利範圍第21項之液晶顯示器,其中 奈米接線電晶體包含連接奈米接線電晶體的源極到吸極電 極之至少一百奈米接線。 -5- 1354261 -- 年f月)日修正替換頁 ~一 - 39.根據申請專利範圍第21項之液晶顯示器,其中 基座基底是彈性材料。 40. 根據申請專利範圍第21項之液晶顯示器,其中 基座基底是具有低於500T熔化溫度之低溫材料。 41. 根據申請專利範圍第21項之液晶顯示器,其中 基座基底是塑膠。 42. 根據申請專利範圍第21項之液晶顯示器,其中 基座基底是半透明材料。 43. —種用於顯示器內之主動式矩陣背板,包含: 複數畫素:及 複數非晶矽畫素電晶體,其中該複數畫素電晶體內的 畫素電晶體控制該複數畫素內的對應畫素;及 複數行電晶體’其中該複數行電晶體內的行電晶體施 加電壓遍及該複數畫素電晶體的子集,及其中該複數畫素 電晶體內的每一行電晶體是奈米接線電晶體,而該奈米接 馨線電晶體包含在該電晶體的第一源極電極接點和第一吸極 電極接點之間延伸的複數奈米接線,其中該奈米接線包括 由第一"材料所製成的核心以及由第二材料所製成並配置於· 該核心附近的殼體層’其中該第~材料在組成上和該第二 材料不同’以及其中每一奈米接線電晶體包含足以至少以 .想要的速率充電和放電一畫素之平均奈米接線數。 44_根據申請專利範圍第1項之主動式矩陣背板,其 中該第一材料包括砂以及該第—材料包括二氧化砂(Si〇2 -6 - 1354261 45. 外包含配 46. 第一材料 47. 中每一奈 伸的至少 月》日修正替換頁j 根據申請專利範圍第1項之主動式矩陣背板,另 置在該殻體層附近的閘極接點。 根據申請專利範圍第2 1項之液晶顯示器,其中該 包括砍以及該第二材料包括二氧化矽(Si〇2)。 根據申請專利範圍第43項之主動式矩陣背板,其 米接線電晶體包含至少在源極和吸極電極之間延 一百奈米接線。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41435902P | 2002-09-30 | 2002-09-30 | |
US41432302P | 2002-09-30 | 2002-09-30 | |
US46827603P | 2003-05-07 | 2003-05-07 | |
US48880103P | 2003-07-22 | 2003-07-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200417947A TW200417947A (en) | 2004-09-16 |
TWI354261B true TWI354261B (en) | 2011-12-11 |
Family
ID=32074643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092127033A TWI354261B (en) | 2002-09-30 | 2003-09-30 | Integrated displays using nanowire transistors |
Country Status (8)
Country | Link |
---|---|
US (2) | US7102605B2 (zh) |
EP (1) | EP1563480A4 (zh) |
JP (1) | JP4669784B2 (zh) |
KR (1) | KR101043578B1 (zh) |
CN (1) | CN102569349A (zh) |
CA (1) | CA2499944A1 (zh) |
TW (1) | TWI354261B (zh) |
WO (1) | WO2004032190A2 (zh) |
Families Citing this family (130)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7454295B2 (en) | 1998-12-17 | 2008-11-18 | The Watereye Corporation | Anti-terrorism water quality monitoring system |
US8958917B2 (en) * | 1998-12-17 | 2015-02-17 | Hach Company | Method and system for remote monitoring of fluid quality and treatment |
US20110125412A1 (en) * | 1998-12-17 | 2011-05-26 | Hach Company | Remote monitoring of carbon nanotube sensor |
US9056783B2 (en) * | 1998-12-17 | 2015-06-16 | Hach Company | System for monitoring discharges into a waste water collection system |
TWI292583B (en) | 2000-08-22 | 2008-01-11 | Harvard College | Doped elongated semiconductor articles, growing such articles, devices including such articles and fabicating such devices |
DE60135775D1 (de) | 2000-12-11 | 2008-10-23 | Harvard College | Vorrichtung enthaltend nanosensoren zur ekennung eines analyten und verfahren zu ihrer herstellung |
US7417782B2 (en) | 2005-02-23 | 2008-08-26 | Pixtronix, Incorporated | Methods and apparatus for spatial light modulation |
US8920619B2 (en) | 2003-03-19 | 2014-12-30 | Hach Company | Carbon nanotube sensor |
US7397455B2 (en) * | 2003-06-06 | 2008-07-08 | Samsung Electronics Co., Ltd. | Liquid crystal display backplane layouts and addressing for non-standard subpixel arrangements |
GB0323285D0 (en) * | 2003-10-04 | 2003-11-05 | Koninkl Philips Electronics Nv | Device and method of making a device having a patterned layer on a flexible substrate |
US20110039690A1 (en) * | 2004-02-02 | 2011-02-17 | Nanosys, Inc. | Porous substrates, articles, systems and compositions comprising nanofibers and methods of their use and production |
US8025960B2 (en) * | 2004-02-02 | 2011-09-27 | Nanosys, Inc. | Porous substrates, articles, systems and compositions comprising nanofibers and methods of their use and production |
US7553371B2 (en) * | 2004-02-02 | 2009-06-30 | Nanosys, Inc. | Porous substrates, articles, systems and compositions comprising nanofibers and methods of their use and production |
US7532194B2 (en) * | 2004-02-03 | 2009-05-12 | Idc, Llc | Driver voltage adjuster |
KR100625999B1 (ko) | 2004-02-26 | 2006-09-20 | 삼성에스디아이 주식회사 | 도너 시트, 상기 도너 시트의 제조방법, 상기 도너 시트를이용한 박막 트랜지스터의 제조방법, 및 상기 도너 시트를이용한 평판 표시장치의 제조방법 |
US6912082B1 (en) * | 2004-03-11 | 2005-06-28 | Palo Alto Research Center Incorporated | Integrated driver electronics for MEMS device using high voltage thin film transistors |
EP1738378A4 (en) * | 2004-03-18 | 2010-05-05 | Nanosys Inc | NANOFIBRE SURFACE BASED CAPACITORS |
CN102004393B (zh) | 2004-04-27 | 2013-05-01 | 伊利诺伊大学评议会 | 用于软光刻法的复合构图设备 |
US7785922B2 (en) | 2004-04-30 | 2010-08-31 | Nanosys, Inc. | Methods for oriented growth of nanowires on patterned substrates |
US20050279274A1 (en) * | 2004-04-30 | 2005-12-22 | Chunming Niu | Systems and methods for nanowire growth and manufacturing |
CN101010780B (zh) | 2004-04-30 | 2012-07-25 | 纳米系统公司 | 纳米线生长和获取的体系和方法 |
US7799699B2 (en) | 2004-06-04 | 2010-09-21 | The Board Of Trustees Of The University Of Illinois | Printable semiconductor structures and related methods of making and assembling |
KR101260981B1 (ko) | 2004-06-04 | 2013-05-10 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 인쇄가능한 반도체소자들의 제조 및 조립방법과 장치 |
US7943491B2 (en) | 2004-06-04 | 2011-05-17 | The Board Of Trustees Of The University Of Illinois | Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp |
US8217381B2 (en) | 2004-06-04 | 2012-07-10 | The Board Of Trustees Of The University Of Illinois | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
US7521292B2 (en) | 2004-06-04 | 2009-04-21 | The Board Of Trustees Of The University Of Illinois | Stretchable form of single crystal silicon for high performance electronics on rubber substrates |
WO2006078281A2 (en) * | 2004-07-07 | 2006-07-27 | Nanosys, Inc. | Systems and methods for harvesting and integrating nanowires |
US7365395B2 (en) * | 2004-09-16 | 2008-04-29 | Nanosys, Inc. | Artificial dielectrics using nanostructures |
US8089152B2 (en) * | 2004-09-16 | 2012-01-03 | Nanosys, Inc. | Continuously variable graded artificial dielectrics using nanostructures |
US8558311B2 (en) | 2004-09-16 | 2013-10-15 | Nanosys, Inc. | Dielectrics using substantially longitudinally oriented insulated conductive wires |
US8154002B2 (en) | 2004-12-06 | 2012-04-10 | President And Fellows Of Harvard College | Nanoscale wire-based data storage |
US7116275B2 (en) | 2005-01-28 | 2006-10-03 | Lockheed Martin Corporation | Operationally reconfigurable array |
US9229222B2 (en) | 2005-02-23 | 2016-01-05 | Pixtronix, Inc. | Alignment methods in fluid-filled MEMS displays |
US9082353B2 (en) | 2010-01-05 | 2015-07-14 | Pixtronix, Inc. | Circuits for controlling display apparatus |
US7271945B2 (en) * | 2005-02-23 | 2007-09-18 | Pixtronix, Inc. | Methods and apparatus for actuating displays |
US9158106B2 (en) | 2005-02-23 | 2015-10-13 | Pixtronix, Inc. | Display methods and apparatus |
US8159428B2 (en) | 2005-02-23 | 2012-04-17 | Pixtronix, Inc. | Display methods and apparatus |
US9261694B2 (en) | 2005-02-23 | 2016-02-16 | Pixtronix, Inc. | Display apparatus and methods for manufacture thereof |
US7742016B2 (en) | 2005-02-23 | 2010-06-22 | Pixtronix, Incorporated | Display methods and apparatus |
US7746529B2 (en) | 2005-02-23 | 2010-06-29 | Pixtronix, Inc. | MEMS display apparatus |
US7755582B2 (en) | 2005-02-23 | 2010-07-13 | Pixtronix, Incorporated | Display methods and apparatus |
US20070205969A1 (en) | 2005-02-23 | 2007-09-06 | Pixtronix, Incorporated | Direct-view MEMS display devices and methods for generating images thereon |
US8519945B2 (en) | 2006-01-06 | 2013-08-27 | Pixtronix, Inc. | Circuits for controlling display apparatus |
US8482496B2 (en) | 2006-01-06 | 2013-07-09 | Pixtronix, Inc. | Circuits for controlling MEMS display apparatus on a transparent substrate |
US7999994B2 (en) | 2005-02-23 | 2011-08-16 | Pixtronix, Inc. | Display apparatus and methods for manufacture thereof |
US8310442B2 (en) | 2005-02-23 | 2012-11-13 | Pixtronix, Inc. | Circuits for controlling display apparatus |
US7675665B2 (en) | 2005-02-23 | 2010-03-09 | Pixtronix, Incorporated | Methods and apparatus for actuating displays |
KR101145146B1 (ko) * | 2005-04-07 | 2012-05-14 | 엘지디스플레이 주식회사 | 박막트랜지스터와 그 제조방법 |
KR101109623B1 (ko) * | 2005-04-07 | 2012-01-31 | 엘지디스플레이 주식회사 | 박막트랜지스터와 그 제조방법. |
US20100227382A1 (en) | 2005-05-25 | 2010-09-09 | President And Fellows Of Harvard College | Nanoscale sensors |
WO2006132659A2 (en) | 2005-06-06 | 2006-12-14 | President And Fellows Of Harvard College | Nanowire heterostructures |
US7927948B2 (en) | 2005-07-20 | 2011-04-19 | Micron Technology, Inc. | Devices with nanocrystals and methods of formation |
EP1750310A3 (en) * | 2005-08-03 | 2009-07-15 | Samsung Electro-Mechanics Co., Ltd. | Omni-directional reflector and light emitting diode adopting the same |
US7575978B2 (en) | 2005-08-04 | 2009-08-18 | Micron Technology, Inc. | Method for making conductive nanoparticle charge storage element |
US7989290B2 (en) | 2005-08-04 | 2011-08-02 | Micron Technology, Inc. | Methods for forming rhodium-based charge traps and apparatus including rhodium-based charge traps |
US7692610B2 (en) * | 2005-11-30 | 2010-04-06 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
JP4500797B2 (ja) * | 2005-12-06 | 2010-07-14 | キヤノン株式会社 | キャパシタと電界効果型トランジスタとを有する回路装置及び表示装置 |
US7608877B2 (en) | 2005-12-06 | 2009-10-27 | Canon Kabushiki Kaisha | Circuit device having capacitor and field effect transistor, and display apparatus therewith |
US7741197B1 (en) | 2005-12-29 | 2010-06-22 | Nanosys, Inc. | Systems and methods for harvesting and reducing contamination in nanowires |
JP2009522197A (ja) * | 2005-12-29 | 2009-06-11 | ナノシス・インコーポレイテッド | パターン形成された基板上のナノワイヤの配向した成長のための方法 |
US7427201B2 (en) * | 2006-01-12 | 2008-09-23 | Green Cloak Llc | Resonant frequency filtered arrays for discrete addressing of a matrix |
US8526096B2 (en) | 2006-02-23 | 2013-09-03 | Pixtronix, Inc. | Mechanical light modulators with stressed beams |
JP4970997B2 (ja) | 2006-03-30 | 2012-07-11 | パナソニック株式会社 | ナノワイヤトランジスタの製造方法 |
JP5060740B2 (ja) * | 2006-05-26 | 2012-10-31 | シャープ株式会社 | 集積回路装置およびその製造方法、ならびに表示装置 |
US7876489B2 (en) | 2006-06-05 | 2011-01-25 | Pixtronix, Inc. | Display apparatus with optical cavities |
GB0611452D0 (en) * | 2006-06-12 | 2006-07-19 | Plastic Logic Ltd | Page refreshing e-reader |
JP2009540333A (ja) | 2006-06-12 | 2009-11-19 | プレジデント アンド フェロウズ オブ ハーバード カレッジ | ナノセンサーおよび関連技術 |
US7554621B2 (en) * | 2006-06-26 | 2009-06-30 | Panasonic Corporation | Nanostructured integrated circuits with capacitors |
WO2008033303A2 (en) | 2006-09-11 | 2008-03-20 | President And Fellows Of Harvard College | Branched nanoscale wires |
JP5409369B2 (ja) * | 2006-10-12 | 2014-02-05 | カンブリオス テクノロジーズ コーポレイション | ナノワイヤベースの透明導電体およびその適用 |
WO2008051362A1 (en) | 2006-10-20 | 2008-05-02 | Pixtronix, Inc. | Light guides and backlight systems incorporating light redirectors at varying densities |
CN101573778B (zh) | 2006-11-07 | 2013-01-02 | 奈米系统股份有限公司 | 用于纳米线生长的系统与方法 |
WO2008127314A1 (en) | 2006-11-22 | 2008-10-23 | President And Fellows Of Harvard College | High-sensitivity nanoscale wire sensors |
US7972875B2 (en) | 2007-01-17 | 2011-07-05 | The Board Of Trustees Of The University Of Illinois | Optical systems fabricated by printing-based assembly |
US9176318B2 (en) | 2007-05-18 | 2015-11-03 | Pixtronix, Inc. | Methods for manufacturing fluid-filled MEMS displays |
US7852546B2 (en) | 2007-10-19 | 2010-12-14 | Pixtronix, Inc. | Spacers for maintaining display apparatus alignment |
WO2008097867A1 (en) * | 2007-02-07 | 2008-08-14 | Green Cloak Llc | Displays including addressable trace structures |
US8183566B2 (en) * | 2007-03-01 | 2012-05-22 | Hewlett-Packard Development Company, L.P. | Hetero-crystalline semiconductor device and method of making same |
US8367506B2 (en) | 2007-06-04 | 2013-02-05 | Micron Technology, Inc. | High-k dielectrics with gold nano-particles |
KR100868941B1 (ko) * | 2007-07-20 | 2008-11-17 | 황장환 | 무촉매 탄소 나노 튜브를 이용한 유기 발광 디스플레이소자 및 그의 제조 방법 |
KR100868940B1 (ko) * | 2007-07-20 | 2008-11-17 | 황장환 | 도핑된 탄소 나노 튜브를 이용한 유기 발광 디스플레이소자 및 그의 제조 방법 |
US8035590B2 (en) * | 2007-11-02 | 2011-10-11 | Sony Corporation | Color liquid crystal display device assembly |
US8273983B2 (en) * | 2007-12-21 | 2012-09-25 | Hewlett-Packard Development Company, L.P. | Photonic device and method of making same using nanowires |
TWI723953B (zh) | 2008-03-05 | 2021-04-11 | 美國伊利諾大學理事會 | 可延展且可折疊的電子裝置 |
GB2459251A (en) | 2008-04-01 | 2009-10-21 | Sharp Kk | Semiconductor nanowire devices |
US8248560B2 (en) | 2008-04-18 | 2012-08-21 | Pixtronix, Inc. | Light guides and backlight systems incorporating prismatic structures and light redirectors |
WO2010005707A1 (en) | 2008-06-16 | 2010-01-14 | The Board Of Trustees Of The University Of Illinois | Medium scale carbon nanotube thin film integrated circuits on flexible plastic substrates |
EP2304802B8 (en) * | 2008-07-18 | 2013-12-04 | Panasonic Corporation | Semiconductor material |
US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
US9289132B2 (en) | 2008-10-07 | 2016-03-22 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
JP5442234B2 (ja) | 2008-10-24 | 2014-03-12 | 株式会社半導体エネルギー研究所 | 半導体装置及び表示装置 |
US8169679B2 (en) | 2008-10-27 | 2012-05-01 | Pixtronix, Inc. | MEMS anchors |
US7884004B2 (en) | 2009-02-04 | 2011-02-08 | International Business Machines Corporation | Maskless process for suspending and thinning nanowires |
TWI671811B (zh) | 2009-05-12 | 2019-09-11 | 美國伊利諾大學理事會 | 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成 |
KR102067922B1 (ko) | 2009-05-19 | 2020-01-17 | 원드 매터리얼 엘엘씨 | 배터리 응용을 위한 나노구조화된 재료 |
WO2010138506A1 (en) | 2009-05-26 | 2010-12-02 | Nanosys, Inc. | Methods and systems for electric field deposition of nanowires and other devices |
US8623288B1 (en) | 2009-06-29 | 2014-01-07 | Nanosys, Inc. | Apparatus and methods for high density nanowire growth |
WO2011038228A1 (en) | 2009-09-24 | 2011-03-31 | President And Fellows Of Harvard College | Bent nanowires and related probing of species |
WO2011041727A1 (en) | 2009-10-01 | 2011-04-07 | Mc10, Inc. | Protective cases with integrated electronics |
US9936574B2 (en) | 2009-12-16 | 2018-04-03 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
US10441185B2 (en) | 2009-12-16 | 2019-10-15 | The Board Of Trustees Of The University Of Illinois | Flexible and stretchable electronic systems for epidermal electronics |
JP6046491B2 (ja) | 2009-12-16 | 2016-12-21 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | コンフォーマル電子機器を使用した生体内での電気生理学 |
BR112012019383A2 (pt) | 2010-02-02 | 2017-09-12 | Pixtronix Inc | Circuitos para controlar aparelho de exibição |
KR20120132680A (ko) | 2010-02-02 | 2012-12-07 | 픽스트로닉스 인코포레이티드 | 저온 실 유체 충전된 디스플레이 장치의 제조 방법 |
CN105496423A (zh) | 2010-03-17 | 2016-04-20 | 伊利诺伊大学评议会 | 基于生物可吸收基质的可植入生物医学装置 |
WO2012097163A1 (en) | 2011-01-14 | 2012-07-19 | The Board Of Trustees Of The University Of Illinois | Optical component array having adjustable curvature |
WO2012158709A1 (en) | 2011-05-16 | 2012-11-22 | The Board Of Trustees Of The University Of Illinois | Thermally managed led arrays assembled by printing |
WO2012166686A2 (en) | 2011-05-27 | 2012-12-06 | Mc10, Inc. | Electronic, optical and/or mechanical apparatus and systems and methods for fabricating same |
WO2012167096A2 (en) | 2011-06-03 | 2012-12-06 | The Board Of Trustees Of The University Of Illinois | Conformable actively multiplexed high-density surface electrode array for brain interfacing |
WO2013089867A2 (en) | 2011-12-01 | 2013-06-20 | The Board Of Trustees Of The University Of Illinois | Transient devices designed to undergo programmable transformations |
KR101963229B1 (ko) | 2011-12-05 | 2019-03-29 | 삼성전자주식회사 | 접을 수 있는 박막 트랜지스터 |
WO2013149181A1 (en) | 2012-03-30 | 2013-10-03 | The Board Of Trustees Of The University Of Illinois | Appendage mountable electronic devices conformable to surfaces |
US9457128B2 (en) | 2012-09-07 | 2016-10-04 | President And Fellows Of Harvard College | Scaffolds comprising nanoelectronic components for cells, tissues, and other applications |
US9786850B2 (en) * | 2012-09-07 | 2017-10-10 | President And Fellows Of Harvard College | Methods and systems for scaffolds comprising nanoelectronic components |
US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
US9134552B2 (en) | 2013-03-13 | 2015-09-15 | Pixtronix, Inc. | Display apparatus with narrow gap electrostatic actuators |
US20160027846A1 (en) * | 2013-04-05 | 2016-01-28 | President And Fellow Of Harvard College | Three-dimensional networks comprising nanoelectronics |
US9379166B2 (en) * | 2014-11-04 | 2016-06-28 | Atom Nanoelectronics, Inc. | Active matrix light emitting diodes display module with carbon nanotubes control circuits and methods of fabrication |
JP2015181166A (ja) * | 2015-04-14 | 2015-10-15 | 株式会社半導体エネルギー研究所 | 表示装置 |
EP3304430A4 (en) | 2015-06-01 | 2019-03-06 | The Board of Trustees of the University of Illionis | MINIATURIZED ELECTRONIC SYSTEMS HAVING WIRELESS POWER CAPACITIES AND NEAR FIELD COMMUNICATION |
BR112017025616A2 (pt) | 2015-06-01 | 2018-08-07 | Univ Illinois | abordagem alternativa à captação de uv |
US10925543B2 (en) | 2015-11-11 | 2021-02-23 | The Board Of Trustees Of The University Of Illinois | Bioresorbable silicon electronics for transient implants |
CN105373259B (zh) * | 2015-12-11 | 2018-11-27 | 上海中航光电子有限公司 | 一种阵列基板、显示面板及显示装置 |
US10117305B2 (en) | 2016-05-09 | 2018-10-30 | Industrial Technology Research Institute | Driving system and method for planar organic electroluminescent device |
KR102702299B1 (ko) * | 2016-10-12 | 2024-09-03 | 삼성디스플레이 주식회사 | 나노 와이어 다발 및 나노 구조물의 제조 방법 |
CN111333103B (zh) * | 2020-04-04 | 2022-03-15 | 南开大学 | 一种数码可控打印izo半导体纳米线的方法 |
CN111393159A (zh) * | 2020-04-04 | 2020-07-10 | 南开大学 | 一种数码可控打印izo纳米线电极的方法 |
CN114647119B (zh) * | 2020-12-18 | 2023-10-13 | 京东方科技集团股份有限公司 | 调光结构和调光设备 |
CN113140452A (zh) * | 2021-04-21 | 2021-07-20 | 北海惠科光电技术有限公司 | 氧化铟锡纳米线及其制备方法和薄膜晶体管 |
Family Cites Families (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6392928A (ja) * | 1986-10-07 | 1988-04-23 | Matsushita Electric Ind Co Ltd | アクテイブ二重マトリクスカラ−液晶表示装置 |
JP2572003B2 (ja) * | 1992-03-30 | 1997-01-16 | 三星電子株式会社 | 三次元マルチチャンネル構造を有する薄膜トランジスタの製造方法 |
US5962863A (en) * | 1993-09-09 | 1999-10-05 | The United States Of America As Represented By The Secretary Of The Navy | Laterally disposed nanostructures of silicon on an insulating substrate |
JP3476241B2 (ja) * | 1994-02-25 | 2003-12-10 | 株式会社半導体エネルギー研究所 | アクティブマトリクス型表示装置の表示方法 |
US5747928A (en) * | 1994-10-07 | 1998-05-05 | Iowa State University Research Foundation, Inc. | Flexible panel display having thin film transistors driving polymer light-emitting diodes |
WO1997049132A1 (en) * | 1996-06-20 | 1997-12-24 | Jeffrey Frey | Light-emitting semiconductor device |
WO1999023530A1 (fr) * | 1997-10-31 | 1999-05-14 | Seiko Epson Corporation | Dispositif electro-optique et appareil electronique |
WO1999053371A1 (en) * | 1998-04-10 | 1999-10-21 | E-Ink Corporation | Electronic displays using organic-based field effect transistors |
US6140993A (en) * | 1998-06-16 | 2000-10-31 | Atmel Corporation | Circuit for transferring high voltage video signal without signal loss |
US6459095B1 (en) * | 1999-03-29 | 2002-10-01 | Hewlett-Packard Company | Chemically synthesized and assembled electronics devices |
US6256767B1 (en) * | 1999-03-29 | 2001-07-03 | Hewlett-Packard Company | Demultiplexer for a molecular wire crossbar network (MWCN DEMUX) |
US6815218B1 (en) * | 1999-06-09 | 2004-11-09 | Massachusetts Institute Of Technology | Methods for manufacturing bioelectronic devices |
CA2372707C (en) * | 1999-07-02 | 2014-12-09 | President And Fellows Of Harvard College | Nanoscopic wire-based devices, arrays, and method of their manufacture |
US6438025B1 (en) * | 1999-09-08 | 2002-08-20 | Sergei Skarupo | Magnetic memory device |
RU2173003C2 (ru) * | 1999-11-25 | 2001-08-27 | Септре Электроникс Лимитед | Способ образования кремниевой наноструктуры, решетки кремниевых квантовых проводков и основанных на них устройств |
KR100360476B1 (ko) * | 2000-06-27 | 2002-11-08 | 삼성전자 주식회사 | 탄소나노튜브를 이용한 나노 크기 수직 트랜지스터 및 그제조방법 |
WO2002003430A2 (en) * | 2000-06-29 | 2002-01-10 | California Institute Of Technology | Aerosol process for fabricating discontinuous floating gate microelectronic devices |
EP1299914B1 (de) * | 2000-07-04 | 2008-04-02 | Qimonda AG | Feldeffekttransistor |
JP3859199B2 (ja) * | 2000-07-18 | 2006-12-20 | エルジー エレクトロニクス インコーポレイティド | カーボンナノチューブの水平成長方法及びこれを利用した電界効果トランジスタ |
DE10036897C1 (de) * | 2000-07-28 | 2002-01-03 | Infineon Technologies Ag | Feldeffekttransistor, Schaltungsanordnung und Verfahren zum Herstellen eines Feldeffekttransistors |
US6447663B1 (en) * | 2000-08-01 | 2002-09-10 | Ut-Battelle, Llc | Programmable nanometer-scale electrolytic metal deposition and depletion |
TWI292583B (en) | 2000-08-22 | 2008-01-11 | Harvard College | Doped elongated semiconductor articles, growing such articles, devices including such articles and fabicating such devices |
US7301199B2 (en) * | 2000-08-22 | 2007-11-27 | President And Fellows Of Harvard College | Nanoscale wires and related devices |
DE60135775D1 (de) * | 2000-12-11 | 2008-10-23 | Harvard College | Vorrichtung enthaltend nanosensoren zur ekennung eines analyten und verfahren zu ihrer herstellung |
US6423583B1 (en) * | 2001-01-03 | 2002-07-23 | International Business Machines Corporation | Methodology for electrically induced selective breakdown of nanotubes |
JP4663139B2 (ja) * | 2001-02-16 | 2011-03-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US6593065B2 (en) * | 2001-03-12 | 2003-07-15 | California Institute Of Technology | Method of fabricating nanometer-scale flowchannels and trenches with self-aligned electrodes and the structures formed by the same |
WO2002080280A1 (en) * | 2001-03-30 | 2002-10-10 | The Regents Of The University Of California | Methods of fabricating nanostructures and nanowires and devices fabricated therefrom |
US7084507B2 (en) * | 2001-05-02 | 2006-08-01 | Fujitsu Limited | Integrated circuit device and method of producing the same |
JP2003017508A (ja) * | 2001-07-05 | 2003-01-17 | Nec Corp | 電界効果トランジスタ |
US6896864B2 (en) * | 2001-07-10 | 2005-05-24 | Battelle Memorial Institute | Spatial localization of dispersed single walled carbon nanotubes into useful structures |
NZ513637A (en) * | 2001-08-20 | 2004-02-27 | Canterprise Ltd | Nanoscale electronic devices & fabrication methods |
JP2005501404A (ja) * | 2001-08-30 | 2005-01-13 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 磁気抵抗装置および電子装置 |
JP2003202834A (ja) * | 2001-10-24 | 2003-07-18 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその駆動方法 |
CN1615537A (zh) * | 2001-12-12 | 2005-05-11 | 宾夕法尼亚州立大学 | 化学反应器模板:牺牲层的制备和模板的应用 |
US7049625B2 (en) * | 2002-03-18 | 2006-05-23 | Max-Planck-Gesellschaft Zur Fonderung Der Wissenschaften E.V. | Field effect transistor memory cell, memory device and method for manufacturing a field effect transistor memory cell |
US6872645B2 (en) * | 2002-04-02 | 2005-03-29 | Nanosys, Inc. | Methods of positioning and/or orienting nanostructures |
US20030189202A1 (en) * | 2002-04-05 | 2003-10-09 | Jun Li | Nanowire devices and methods of fabrication |
US6760245B2 (en) * | 2002-05-01 | 2004-07-06 | Hewlett-Packard Development Company, L.P. | Molecular wire crossbar flash memory |
US7358121B2 (en) * | 2002-08-23 | 2008-04-15 | Intel Corporation | Tri-gate devices and methods of fabrication |
US7115916B2 (en) * | 2002-09-26 | 2006-10-03 | International Business Machines Corporation | System and method for molecular optical emission |
US7051945B2 (en) | 2002-09-30 | 2006-05-30 | Nanosys, Inc | Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites |
US7619562B2 (en) | 2002-09-30 | 2009-11-17 | Nanosys, Inc. | Phased array systems |
US7067867B2 (en) * | 2002-09-30 | 2006-06-27 | Nanosys, Inc. | Large-area nonenabled macroelectronic substrates and uses therefor |
-
2003
- 2003-09-30 CA CA002499944A patent/CA2499944A1/en not_active Abandoned
- 2003-09-30 JP JP2005500327A patent/JP4669784B2/ja not_active Expired - Lifetime
- 2003-09-30 CN CN201210040611XA patent/CN102569349A/zh active Pending
- 2003-09-30 WO PCT/US2003/030636 patent/WO2004032190A2/en active Search and Examination
- 2003-09-30 EP EP03770551A patent/EP1563480A4/en not_active Withdrawn
- 2003-09-30 KR KR1020057005419A patent/KR101043578B1/ko active IP Right Grant
- 2003-09-30 TW TW092127033A patent/TWI354261B/zh not_active IP Right Cessation
- 2003-09-30 US US10/673,669 patent/US7102605B2/en not_active Expired - Lifetime
-
2006
- 2006-07-21 US US11/490,630 patent/US7701428B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2006501689A (ja) | 2006-01-12 |
EP1563480A2 (en) | 2005-08-17 |
WO2004032190A3 (en) | 2005-06-23 |
TW200417947A (en) | 2004-09-16 |
US20060256059A1 (en) | 2006-11-16 |
AU2003279043A1 (en) | 2004-04-23 |
CN102569349A (zh) | 2012-07-11 |
US7102605B2 (en) | 2006-09-05 |
EP1563480A4 (en) | 2010-03-03 |
US20040135951A1 (en) | 2004-07-15 |
CA2499944A1 (en) | 2004-04-15 |
JP4669784B2 (ja) | 2011-04-13 |
KR101043578B1 (ko) | 2011-06-23 |
KR20050053708A (ko) | 2005-06-08 |
US7701428B2 (en) | 2010-04-20 |
WO2004032190A2 (en) | 2004-04-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI354261B (en) | Integrated displays using nanowire transistors | |
TWI764644B (zh) | 顯示裝置及電子裝置 | |
CN1703730A (zh) | 使用纳米线晶体管的集成显示器 | |
CN103811530B (zh) | 柔性有机电致发光装置及其制造方法 | |
Lee et al. | Oxide TFT with multilayer gate insulator for backplane of AMOLED device | |
JP5285024B2 (ja) | 薄膜トランジスタ及びこれを備えた有機電界発光表示装置 | |
US7554621B2 (en) | Nanostructured integrated circuits with capacitors | |
TW201017871A (en) | Display device | |
CN106169480B (zh) | 具有高可靠性金属氧化物半导体材料的薄膜晶体管基板 | |
KR20130041711A (ko) | 표시 장치용 박막 반도체 장치 및 그 제조 방법 | |
Asad et al. | Integration of GaN light-emitting diodes with a-Si: H thin-film transistors for flexible displays | |
CN106505071A (zh) | 薄膜晶体管阵列基板及其制作方法 | |
AU2003279043B2 (en) | Integrated displays using nanowire transistors | |
JPH0151871B2 (zh) | ||
US10263068B2 (en) | Field effect transistor device | |
JP2023534611A (ja) | 電子デバイスのための非線形構成要素を含む回路 | |
KR101128101B1 (ko) | 나노 와이어를 갖는 발광 표시 장치 | |
TW200531612A (en) | Electrostatic discharge protection method for display and device thereof | |
CN106531086A (zh) | 像素电路、显示面板及显示装置 | |
US20080106502A1 (en) | Light-emitting device | |
JPWO2021252934A5 (zh) | ||
GB2498699A (en) | Method of semiconductor element application |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |